KR20100100407A - Method for electroless plating using the electroless nickel plating solution with excellent corrosion resistance and same - Google Patents
Method for electroless plating using the electroless nickel plating solution with excellent corrosion resistance and same Download PDFInfo
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- KR20100100407A KR20100100407A KR1020090019286A KR20090019286A KR20100100407A KR 20100100407 A KR20100100407 A KR 20100100407A KR 1020090019286 A KR1020090019286 A KR 1020090019286A KR 20090019286 A KR20090019286 A KR 20090019286A KR 20100100407 A KR20100100407 A KR 20100100407A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
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Abstract
Description
본 발명은 내식성이 우수한 무전해 니켈 도금액을 이용한 무전해 도금방법에 관한 것으로, 더욱 상세하게는 도금할 소재를 무전해 니켈 도금한 다음, 내식성 향상을 위해 PTFE(polytetraflouroethylene)을 주성분으로 하는 도금액으로 처리하여 1차 무전해 니켈 도금만으로도 우수한 내식성을 부여할 수 있는 무전해 도금방법에 관한 것이다.The present invention relates to an electroless plating method using an electroless nickel plating solution having excellent corrosion resistance, and more particularly, electroless nickel plating of a material to be plated, and then treated with a plating solution containing PTFE (polytetraflouroethylene) as a main component to improve corrosion resistance. The present invention relates to an electroless plating method capable of imparting excellent corrosion resistance even by primary electroless nickel plating.
도금이란 소재의 표면에 금속을 코팅하는 과정을 말하며 일반적으로 부식을 방지(내식성)하기 위해서나, 내마모성(스크레치에 대한 저항성)을 부여하거나, 고온에서 사용하는 금속을 보호하기 위해서나, 밀착성을 제공하기 위하여 또는 적절한 전기적 성질을 얻기 위하여, 또는 소재에 반사성을 부여하고 외형을 좋게 하기 위하여 등등의 여러 가지 목적을 달성하기 위해 사용한다.Plating refers to the process of coating a metal on the surface of a material and is generally used to prevent corrosion (corrosion resistance), to impart wear resistance (resistance to scratches), to protect metals used at high temperatures, or to provide adhesion. Or to achieve the proper electrical properties, or to achieve a variety of purposes, such as to give the material reflectivity and improve the appearance.
이러한 도금의 대표적인 것으로 무전해 니켈 도금이 있다. 무전해 니켈 도금은 외부 도금 전류에 대한 필요없이 금속 또는 비금속 기질에 니켈 금속 및/또는 니켈/합금 코팅의 연속적인 증착을 제공하는 광범위하게 이용되는 도금 공정이다. 상기 무전해 도금 공정은 적절한 무전해 도금 조건하에서 적절한 니켈 도금조에 소재를 담금으로써 기질에 니켈 코팅의 연속적인 성장을 수반한다. 일반적으로 도금조는 무전해 니켈염과 환원제를 포함한다. 일부 무전해 도금조는 하이포아인산염(hypophosphite) 이온을 환원제로서 사용하며, 공정중에, 하이포아인산염 이온은 오르쏘인산염(orthophosphate) 이온으로 산화되며, 도금조에 있는 니켈 양이온이 환원되어 니켈-인 합금을 원하는 소재 표면에 증착시킴으로서 형성된다.Representative of such plating is electroless nickel plating. Electroless nickel plating is a widely used plating process that provides for the continuous deposition of nickel metal and / or nickel / alloy coatings on metal or nonmetallic substrates without the need for external plating currents. The electroless plating process involves the continuous growth of a nickel coating on a substrate by immersing the material in a suitable nickel plating bath under appropriate electroless plating conditions. In general, the plating bath contains an electroless nickel salt and a reducing agent. Some electroless plating baths use hypophosphite ions as reducing agents, and during the process, the hypophosphite ions are oxidized to orthophosphate ions and the nickel cations in the plating bath are reduced to form nickel-phosphorus alloys. It is formed by depositing on a desired material surface.
한편, 도 1을 참조하면, 종래의 무전해 도금방법은 니켈 - 크롬 도금과 같이 니켈을 도금한 후, 내식성 및 내마모성 등의 향상을 위하여 크롬을 도금하는 방법을 사용하고 있다. 예를 들어, 특허문헌 1에서는 철계 쾌삭강(Steel Used Machinery)의 무전해 니켈도금 방법을 개시하고 있고, 특허문헌 2에서는 수도미터기의 무전해 니켈 도금방법을 개시한다. 그러나, 내식성 및 내마모성 등의 향상을 위하여 요구되는 크롬은 환경에 미치는 악영향 때문에 규제 대상이 되어 점진적으로 사용을 금지하고 있는 물질이다.Meanwhile, referring to FIG. 1, the conventional electroless plating method uses a method of plating chromium in order to improve corrosion resistance and abrasion resistance after plating nickel, such as nickel-chromium plating. For example, Patent Document 1 discloses an electroless nickel plating method of iron-based free cutting steel, and Patent Document 2 discloses an electroless nickel plating method of a water meter. However, chromium, which is required for improving corrosion resistance and abrasion resistance, is a substance that is regulated due to adverse effects on the environment and is gradually prohibited from use.
특허문헌 1: 한국 공개특허 제1994-0009362호Patent Document 1: Korean Unexamined Patent Publication No. 194-0009362
특허문헌 2: 한국 등록특허 제0837607호Patent Document 2: Korean Patent No. 0837607
이에 본 발명에서는 니켈 도금한 다음, 크롬산층을 형성하는 대신 PTFE(polytetraflouroethylene)을 주성분으로 하는 도금액으로 처리하면 상술한 문제점을 해결할 수 있음을 발견하였고, 본 발명은 이에 기초하여 완성되었다.Therefore, in the present invention, it was found that the above problems can be solved by nickel plating and then treating with a plating liquid containing PTFE (polytetraflouroethylene) as a main component instead of forming a chromic acid layer, and the present invention was completed based on this.
따라서, 본 발명의 목적은 소재 표면에 크롬층이 없는 니켈 도금만으로도 소재의 강도를 향상시키고 부식을 방지할 수 있는 내식성이 우수한 무전해 니켈 도금액을 이용한 무전해 도금방법을 제공하는 데 있다.Accordingly, it is an object of the present invention to provide an electroless plating method using an electroless nickel plating solution which is excellent in corrosion resistance capable of improving the strength of the material and preventing corrosion even by nickel plating without a chromium layer on the surface of the material.
상기 목적을 달성하기 위한 본 발명의 내식성이 우수한 무전해 니켈 도금액을 이용한 무전해 도금방법은: Electroless plating method using an electroless nickel plating solution excellent in corrosion resistance of the present invention for achieving the above object:
무전해 니켈 도금방법에 있어서, 도금할 몸체를 초음파세척, 탈지, 및 산 처리하는 단계; 황산 니켈 6∼10중량%, 차아린산 나트륨(Sodium Hypophosphite) 10∼15중량%, PTFE(polytetraflouroethylene) 0.05∼0.5중량% 및 잔량은 순수를 포함하고, pH가 일정 범위로 유지되는 니켈 도금액에서 상기 산 처리된 몸체를 무전해 니켈 도금하는 단계; 상기 무전해 니켈 도금된 몸체를 PTFE 0.05∼0.5중량%, 유산(lactic acid) 10∼15중량%, 수산화 암모늄(ammonium hydroxide) 6∼10중량% 및 잔량은 순수를 포함하는 도금액에 침지시켜 내식성을 강화시키는 단계; 및 상기 몸체를 인산염으로 처리하는 단계;를 포함하는 것을 특징으로 한다.An electroless nickel plating method comprising the steps of: ultrasonic cleaning, degreasing, and acid treating a body to be plated; 6 to 10% by weight of nickel sulfate, 10 to 15% by weight of sodium hypophosphite, 0.05 to 0.5% by weight of PTFE (polytetraflouroethylene), and the balance include pure water, the pH of which is maintained in a nickel plating solution Electroless nickel plating the acid treated body; 0.05 to 0.5% by weight of PTFE, 10 to 15% by weight of lactic acid, 6 to 10% by weight of ammonium hydroxide, and the remaining amount of the electroless nickel plated body were immersed in a plating solution containing pure water to prevent corrosion. Strengthening; And treating the body with phosphate.
본 발명에 있어서, 상기 무전해 니켈 도금하는 단계에서, 상기 니켈 도금층의 두께는 3∼3.5㎛인 것을 특징으로 한다.In the present invention, in the step of electroless nickel plating, the thickness of the nickel plating layer is characterized in that 3 to 3.5㎛.
본 발명에 있어서, 상기 도금액의 도금온도가 70∼85℃인 것을 특징으로 한다.In the present invention, the plating temperature of the plating liquid is 70 to 85 ° C.
이와 같이, 본 발명은 소재 표면에 크롬층이 없는 무전해 니켈 도금만으로도 소재의 강도를 향상시키고 부식을 방지할 수 있는 효과가 있다.As described above, the present invention has an effect of improving the strength of the material and preventing corrosion even by electroless nickel plating without a chromium layer on the material surface.
이하 본 발명을 좀 더 구체적으로 살펴보면 다음과 같다.Looking at the present invention in more detail as follows.
도 1은 종래의 발명에 따른 무전해 니켈 도금 방법을 설명하기 위한 공정도로서, 도금할 몸체를 초음파 탈지, 산 처리, 무전해 니켈 도금(1차 또는 2차), 중크롬산 처리 및 인산염 처리 등의 공정을 거쳐 도금을 수행한다. 여기서, 초음파 처리에 의한 탈지 및 산 처리 등은 도금할 몸체를 깨끗하게 세척하여 도금 효율을 높이기 위한 공정으로, 일종의 전처리 단계로써 일반적인 공정이다. 그 다음, 주공정인 무전해 니켈 도금 공정에서 소정의 두께로 도금층을 형성하여 내마모성 등과 같은 기계적 및 전기적 특성을 향상시켜 몸체(금속)를 보호한 다음, 내식성 등의 향상을 위해 크롬산으로 처리한다. 최종적으로, 변색을 방지하기 위해 인산염으로 처리하여 무전해 니켈 도금을 완성한다.1 is a process chart for explaining the electroless nickel plating method according to the conventional invention, the process of ultrasonic degreasing, acid treatment, electroless nickel plating (primary or secondary), dichromic acid treatment and phosphate treatment, etc. Plating is carried out via. Here, degreasing and acid treatment by ultrasonic treatment is a process for increasing the plating efficiency by cleanly washing the body to be plated, which is a general process as a kind of pretreatment step. Next, in the electroless nickel plating process, which is the main process, the plating layer is formed to a predetermined thickness to improve mechanical and electrical properties such as wear resistance, to protect the body (metal), and then treated with chromic acid to improve corrosion resistance. Finally, it is treated with phosphate to prevent discoloration to complete the electroless nickel plating.
그러나, 본 발명은 도금할 몸체를 초음파 탈지, 산 처리, 무전해 니켈 도금한 다음, 종래의 중크롬산 처리 대신에 PTFE(polytetraflouroethylene)을 주성분으로 하는 도금액으로 처리하고, 인산염으로 처리한다.However, in the present invention, the body to be plated is subjected to ultrasonic degreasing, acid treatment, electroless nickel plating, and then treated with a plating solution containing PTFE (polytetraflouroethylene) as a main component instead of conventional dichromic acid treatment and treated with phosphate.
일반적으로, 무전해 도금의 니켈 이온의 소스는 니켈 클로라이드(nickel chloride), 황산 니켈(nickel sulfate), 니켈 브롬화물(nickel bromide), 니켈 플루오르화붕산염(nickel fluoroborate), 니켈 술포네이트(nickel sulfonate), 니켈 술포메이트(nickel sulfamate) 및 니켈 알킬 술포네이트(nickel alkyl sulfonate)를 포함한다. 본 발명에서는 황산 니켈을 사용하고, 도금 효율 측면에서 일반적인 사용량은 6∼10중량%이다.In general, the source of nickel ions in electroless plating is nickel chloride, nickel sulfate, nickel bromide, nickel fluoroborate, nickel sulfonate Nickel sulfamate and nickel alkyl sulfonate. In the present invention, nickel sulfate is used, and the general amount of use is 6 to 10% by weight in terms of plating efficiency.
본 발명에 있어서, 상기 무전해 니켈 도금 공정은 황산 니켈 6∼10중량%, 차아린산 나트륨(Sodium Hypophosphite) 10∼15중량%, PTFE 0.05∼0.5중량% 및 잔량은 순수를 포함하는 도금액에서 수행된다. 이때, pH 조절제, 예를 들어, 탄산칼륨 등을 이용하여 니켈 도금액의 pH를 일정 범위로 유지시킨다. 또한, 상기 차아린산 나트륨의 사용량이 10중량% 미만이면 도금두께가 얇거나 도금속도가 느린 문제가 생기며, 15중량%를 초과하면 반대로 도금두께가 두껍거나 속도가 빠른 문제가 있다. 또한, PTFE의 사용량이 0.05중량% 미만이면 내식성 및 내마모성 등이 떨어지고, 0.5중량%를 초과하면 도금 효율이 떨어질 수 있다.In the present invention, the electroless nickel plating process is carried out in a plating solution containing 6 to 10% by weight of nickel sulfate, 10 to 15% by weight of sodium hypophosphite, 0.05 to 0.5% by weight of PTFE, and the balance is pure water. do. At this time, the pH of the nickel plating solution is maintained in a predetermined range using a pH adjuster, for example, potassium carbonate. In addition, when the amount of the sodium hypophosphate used is less than 10% by weight, there is a problem in that the plating thickness is thin or the plating speed is low, and when the amount of sodium hypophosphate is more than 15% by weight, the plating thickness is thick or the speed is fast. In addition, when the amount of PTFE is less than 0.05% by weight, corrosion resistance and abrasion resistance may be lowered, and when the amount of PTFE is more than 0.5% by weight, the plating efficiency may be reduced.
이렇게 무전해 니켈 도금된 몸체는 내식성 및 내마모성 등을 강하시키기 위해 PTFE(polytetraflouroethylene)를 주성분으로 하는 도금액에 침지시킨다. 상기 도금액은 PTFE(polytetraflouroethylene) 0.05∼0.5중량%, 유산(lactic acid) 10∼ 15중량%, 수산화 암모늄(ammonium hydroxide) 6∼10중량% 및 잔량은 순수를 포함한다.The electroless nickel plated body is immersed in a plating solution containing PTFE (polytetraflouroethylene) as a main component to lower corrosion resistance and abrasion resistance. The plating solution contains 0.05 to 0.5% by weight of PTFE (polytetraflouroethylene), 10 to 15% by weight of lactic acid, 6 to 10% by weight of ammonium hydroxide, and the balance includes pure water.
상기 PTFE(polytetraflouroethylene)의 사용량이 0.05중량% 미만이면 내식성 및 내마모성 등이 떨어지고, 0.5중량%를 초과하면 도금 효율이 떨어질 수 있다. 상기 유산(lactic acid) 및 수산화 암모늄(ammonium hydroxide)은 상기 PTFE와 잘 혼합되어 상기 PTFE의 도금 효율을 향상시키기 위해 첨가되며, 상기 첨가량 범위를 벗어나면 상기 PTFE의 도금 효율이 현저히 떨어진다.When the amount of PTFE (polytetraflouroethylene) is less than 0.05% by weight, corrosion resistance and abrasion resistance may drop, and when it exceeds 0.5% by weight, plating efficiency may be reduced. The lactic acid and ammonium hydroxide are mixed with the PTFE and added to improve the plating efficiency of the PTFE. When the lactic acid and ammonium hydroxide are added, the plating efficiency of the PTFE is significantly lowered.
본 발명에 있어서, 마지막 공정으로 도금된 부위의 변색을 방지하기 위하여 상기 몸체를 인산염으로 처리하는데 이 과정은 종래의 공정과 동일하다.In the present invention, the body is treated with phosphate to prevent discoloration of the plated portion as a final process, which is the same as the conventional process.
이와 같이, 종래의 크롬산 처리는 염수 테스트를 통과하기 위한 방법으로 이 공정없이는 염수를 통과할 수 없었다. 그러나, 본 발명에서는 크롬산층을 형성하는 대신 PTFE(polytetraflouroethylene)를 주성분으로 하는 도금액으로 처리하여 인체에 유해한 크롬을 사용하지 않을 수 있었다.As such, the conventional chromic acid treatment was a method for passing the brine test and could not pass brine without this process. However, in the present invention, instead of forming the chromic acid layer, chromium harmful to the human body could not be used by treating with a plating solution containing PTFE (polytetraflouroethylene) as a main component.
아울러, 종래의 1차 무전해 도금 후 제품의 중요 부분을 폴리싱한 다음, 2차 무전해 도금, 크롬산 처리, 및 인산염 처리하여 무전해 도금이 2회된 몸체는 6∼7㎛으로 하고, 제품의 중요 부분은 3∼3.5㎛으로 완료하였으나, 본 발명에서는 도금할 몸체를 PTFE를 주성분으로 하는 도금액으로 처리함으로써, 상기 니켈 도금 횟수를 1회로 하여 그 도금층의 두께를 제품 전체에 3∼3.5㎛의 범위로 하여도 내식성 및 내마모성 등의 기계적 특성을 유지할 수 있다. 또한, 도금액의 성분에 PTFE를 사용함으로써 전반적인 도금 온도를 약 70∼85℃의 범위(종래에는 약 90℃ 이상)로 낮출 수 있는 부수적인 효과도 있다.In addition, after the first primary electroless plating, the important part of the product is polished, and then the second electroless plating, the chromic acid treatment, and the phosphate treatment are carried out twice, and the body having twice the electroless plating is 6-7 μm. In the present invention, the portion to be plated is treated with a plating solution containing PTFE as a main component, and the number of nickel plating is performed once, so that the thickness of the plated layer is in the range of 3 to 3.5 μm over the whole product. Even if the mechanical properties such as corrosion resistance and wear resistance can be maintained. In addition, the use of PTFE in the component of the plating liquid also has the side effect of lowering the overall plating temperature in the range of about 70 to 85 ° C (formerly about 90 ° C or more).
이하 실시 예를 통하여 본 발명을 좀 더 구체적으로 살펴보지만, 하기 예에 본 발명의 범주가 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to the following examples, but the scope of the present invention is not limited to the following examples.
실시 예 1Example 1
컴퓨터의 CD 드라이버를 인출하기 위한 솔레노이드의 요크 칩(yoke chip)을 초음파로 세척하여 탈지하고, 산으로 처리하여 세척하였다. 상기 솔레노이드의 요크 칩을 황산 니켈 8중량%, 차아린산 나트륨 12중량%, PTFE(polytetraflouroethylene) 0.1중량%, pH 조절제(탄산 칼륨) 0.3중량% 및 순수 79.6중량%로 구성된 니켈 도금액에 약 0.5시간 동안 침지시켜 도금하였다. 이때 도금액의 온도는 약 85℃로 유지하였고, 도금층의 두께는 약 3㎛이었다.The yoke chip of the solenoid for drawing out the CD driver of the computer was degreased by ultrasonic washing, and treated with acid. The yoke chip of the solenoid was about 0.5 hours in a nickel plating solution consisting of 8% by weight of nickel sulfate, 12% by weight of sodium hypochlorite, 0.1% by weight of PTFE (polytetraflouroethylene), 0.3% by weight of pH adjuster (potassium carbonate), and 79.6% by weight of pure water. Plating by dipping. At this time, the temperature of the plating liquid was maintained at about 85 ℃, the thickness of the plating layer was about 3㎛.
그 다음, 상기 무전해 니켈 도금된 솔레노이드의 요크 칩을 PTFE 0.1중량%, 유산(lactic acid) 12중량%, 수산화 암모늄(ammonium hydroxide) 8중량% 및 순수 79.9중량%로 구성된 도금액에 약 0.2시간 동안 침지시켰고, 이때 도금액의 온도 또한 약 85℃로 유지하였다. 이렇게 PTFE로 처리된 솔레노이드의 요크 칩을 통상의 방법으로 인산염 처리하였다.The yoke chip of the electroless nickel plated solenoid was then placed in a plating solution consisting of 0.1 wt% PTFE, 12 wt% lactic acid, 8 wt% ammonium hydroxide and 79.9 wt% pure water for about 0.2 hours. The temperature of the plating liquid was also maintained at about 85 ° C. The yoke chip of the solenoid treated with PTFE was phosphated by a conventional method.
상기와 같이 도금된 솔레노이드의 요크 칩을 5%의 염화나트륨에서 48시간 동안 방치 실험하였고, 전혀 손상이 없음을 확인하였다.The yoke chip of the solenoid plated as described above was left for 48 hours in 5% sodium chloride, and it was confirmed that there was no damage at all.
도 1은 종래의 발명에 따른 니켈도금 방법을 설명하기 위한 공정도이다.1 is a process chart for explaining a nickel plating method according to the conventional invention.
도 2는 본 발명에 따른 니켈도금 방법을 설명하기 위한 공정도이다.2 is a process chart for explaining a nickel plating method according to the present invention.
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