KR20100082397A - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

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Publication number
KR20100082397A
KR20100082397A KR1020080137948A KR20080137948A KR20100082397A KR 20100082397 A KR20100082397 A KR 20100082397A KR 1020080137948 A KR1020080137948 A KR 1020080137948A KR 20080137948 A KR20080137948 A KR 20080137948A KR 20100082397 A KR20100082397 A KR 20100082397A
Authority
KR
South Korea
Prior art keywords
light emitting
lead frames
lead
housing
emitting diode
Prior art date
Application number
KR1020080137948A
Other languages
Korean (ko)
Inventor
박광일
서태원
이상철
황웅준
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080137948A priority Critical patent/KR20100082397A/en
Publication of KR20100082397A publication Critical patent/KR20100082397A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

PURPOSE: A light emitting diode package is provided to improve brightness by multi-directionally emitting light from light emitting diode chips using a housing with a plurality of openings. CONSTITUTION: Light emitting diode chips(500, 600, 700) are electrically connected with lead frames(200, 300, 400). The light emitting diode chips generate light. The lead frames are spaced apart from each other and includes first and second lead terminals which are electrically separated. A housing(800) covers and fixes the lead frames. A plurality of openings(810, 820, 830) which exposes parts of the lead frames is arranged in the housing. A power supplying unit applies driving power to the lead frames.

Description

Light Emitting Diode Package {LIGHT EMITTING DIODE PACKAGE}

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package with increased light emission luminance.

In general, a light emitting diode (LED) is a kind of semiconductor used to convert an electrical signal into light and output the light using characteristics of a compound semiconductor. The light emitting diode has many advantages such as high luminous efficiency, long life, low power consumption, and environmental friendliness, and thus, the technical field using the light emitting diode is increasing.

In general, a light emitting diode package is manufactured in a package structure in which a light emitting chip having a light emitting diode is mounted inside a housing, and generates light by receiving power from an external printed circuit board through a lead frame electrically connected to the light emitting chip.

Since such a light emitting diode package usually includes only one light emitting chip for generating light, there is a problem in that it does not generate high luminance light.

Accordingly, the present invention has been made in view of such a problem, and the present invention provides a light emitting diode package capable of increasing luminance.

A light emitting diode package according to an aspect of the present invention includes a plurality of lead frames, a plurality of light emitting chips, and a housing.

The light emitting chips are disposed on the lead frames, respectively, and are electrically connected to the lead frames and generate light. The housing has a plurality of openings surrounding and fixing the lead frames and exposing portions of the lead frames on which the light emitting chips are disposed.

The LED package may further include a power applying unit electrically connected to the lead frames to apply driving power to the lead frames.

The housing may be formed of a polyhedron having a plurality of surfaces, the power applying unit may be disposed on any one of the surfaces, and the openings may be formed on the remaining surfaces of the surfaces. At this time, the housing may be formed of a hexahedron.

In example embodiments, each of the lead frames may include first and second lead terminals spaced apart from each other, and the power supply unit may be electrically separated from each other, and the first and second lead terminals may be separated from each other. And first and second power supply terminals electrically connected to each other, wherein the first lead terminal and the first power supply terminal are integrally formed, and the second lead terminal and the second power supply terminal are integrally formed. It can be formed as.

In another embodiment, the power applying unit may include a plurality of individual applying units electrically connected to the lead frames, respectively.

Each of the lead frames includes first and second lead terminals spaced apart from each other and electrically separated from each other, and each of the individual application parts is electrically separated from each other, and the first and second ends of each of the lead frames are separated from each other. And first and second power supply terminals electrically connected to lead terminals, respectively, wherein the first and second lead terminals of the lead frames and the first and second power supply terminals of the individual application units are formed in the housing. It may be electrically connected by internal connection lines disposed therein.

According to such a light emitting diode package, by using a housing having a plurality of openings, the light generated by the plurality of light emitting chips is divergent in various directions, thereby increasing the light emitting area to increase luminance. In addition, the operation of the light emitting chips can be controlled by applying driving power to the plurality of light emitting chips individually.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a perspective view showing a light emitting diode package according to an embodiment of the present invention, Figure 2 is a perspective view showing the light emitting diode package of Figure 1 from another side.

1 and 2, a light emitting diode package 100 according to an embodiment of the present invention includes a plurality of lead frames 200, 300, and 400, a plurality of light emitting chips 500, 600, and 700, and a housing 800.

The light emitting chips 500, 600, and 700 are disposed on the lead frames 200, 300, and 400, respectively, and are electrically connected to the lead frames 200, 300, and 400 to generate light. The lead frames 200, 300, and 400 may be formed of a metal having excellent electrical conductivity.

In addition, the lead frames 200, 300, and 400 are formed so that respective portions on which the light emitting chips 500, 600, and 700 are disposed are connected to each other, or each portion in which the light emitting chips 500, 600, and 700 are disposed is formed to be connected to each other. Each of the lead frames 200, 300, and 400 may be connected through a typical wire (not shown).

The light emitting chips 500, 600, and 700 may be made of a semiconductor material such as, for example, gallium nitride, arsenic nitride, or phosphorus nitride. The light emitting chips 500, 600, and 700 may generate light in various wavelength bands according to their purpose. For example, the light emitting chips 500, 600, and 700 may generate light in a red, yellow, blue, or ultraviolet wavelength band.

The housing 800 has a plurality of openings 810, 820, and 830 that surround and fix the lead frames 200, 300, and 400, and expose portions of the lead frames 200, 300, and 400 on which the light emitting chips 500, 600, and 700 are disposed. The housing 800 may be formed by, for example, molding molding using a polyphthalamide (PPA) resin.

Conventionally, although openings are formed only on one surface of the housing, the luminance is reduced by localizing a light emitting region of light generated from the light emitting chip, but the openings 810, 820, and 830 are formed on various surfaces of the housing 800, thereby The luminance may be improved by increasing the light emitting area of the LED package 100.

The openings 810, 820, and 830 may have a truncated cone shape that increases in area from an inner side adjacent to the lead frames 200, 300, and 400 in an upward direction. Thus, the openings 810, 820, 830 may be inclined at a predetermined angle on the inner wall of the housing 800 to increase the direct angle of the light emitting chips 500, 600, 700.

In addition, the openings 810, 820, 830 may be formed to be spaced apart from the edge of the housing 800, respectively, so that the openings 810, 820, 830 may not be connected to each other.

In addition, the LED package 100 may further include a molding member (not shown) filled in the openings 810, 820, and 830 to cover the light emitting chips 500, 600, and 700, respectively. The molding member may be formed of a transparent material to transmit light generated by the light emitting chips 500, 600, and 700.

Although not shown, the LED package 100 is a material having a high thermal conductivity inside the housing 800 in order to reduce the amount of heat emission increased due to the increased light emitting chips (500, 600, 700) compared to the conventional LED package It may also comprise a heat sink (slug) or a heat sink (slug) formed.

The LED package 100 may further include a power applying unit 900 electrically connected to the lead frames 200, 300, and 400 to apply driving power to the lead frames 200, 300, and 400.

The power applying unit 900 is formed on a surface mounted on a printed circuit board (not shown) provided from the outside of the housing 800, the lead frame (receiving a driving power from the printed circuit board) and electrically connected thereto. The light emitting chips 500, 600, and 700 may operate by transmitting driving power to the 200, 300, and 400.

The housing 800 may be formed of a polyhedron having a plurality of surfaces, the power applying unit 900 may be disposed on any one of the surfaces, and the openings 810, 820, and 830 may be formed on the remaining surfaces of the surfaces. have. At this time, the housing 800 may be formed of a hexahedron.

When the housing 800 is formed of a hexahedron, the openings 810, 820, and 830 are all five surfaces of the second to sixth surfaces except for the first surface on which the power applying unit 900 is formed in the housing 800. Each of the second or sixth surfaces except for the first surface on which the power applying unit 900 is formed may be formed on the respective surfaces.

In addition, since the light emitting chips 500, 600, and 700 are disposed on the same surface as the openings 810, 820, and 830 in the housing 800, up to five light emitting chips 500, 600, and 700 may be disposed.

As such, by forming the openings 810, 820, and 830 on various surfaces of the housing 800, the luminance of the light emitting diode package 100 may be increased by increasing the emission area of the light emitting chips 500, 600, and 700.

Hereinafter, a relationship between the power applying unit 900 and the lead frames 200, 300, and 400 according to whether the light emitting operations of the light emitting chips 500, 600, and 700 are controlled will be described in detail.

3 is a plan view illustrating a surface on which a power applying unit is formed in a housing of a light emitting diode package according to an exemplary embodiment of the present invention. 3 has the same configuration as the light emitting diode package shown in FIG. 1, the same reference numerals are used for the same components, and detailed description thereof will be omitted.

Referring to FIG. 3, each of the lead frames according to the exemplary embodiment of the present invention includes first and second lead terminals (not shown) spaced apart from each other and electrically separated from each other, and the power applying unit 900 is different from each other. Spaced apart and electrically separated, and including first and second power supply terminals 902 and 904 electrically connected to the first and second lead terminals, respectively, the first lead terminal and the first power supply terminal 902. ) May be integrally formed, and the second lead terminal and the second power supply terminal 904 may be integrally formed.

Light emitting chips (not shown) may be mounted on the first lead terminal, respectively, and electrically connected to the second lead terminal through a plurality of conductive wires (not shown). Alternatively, the conductive wires may be electrically connected to the first and second lead terminals through separate conductive wires. The light emitting chips generate light in response to a driving power applied through the lead frames and the conductive wires.

The first and second power supply terminals 902 and 904 may be connected to the first and second power supply terminals 902 and 904 by driving power having different polarities from an externally provided printed circuit board (not shown). The light emitting chips are operated by transferring the first and second lead terminals.

As such, the first and second lead terminals and the first and second power supply terminals 902 and 904 may be integrally formed to control the light emission operation of the light emitting chips.

4 is a plan view illustrating a surface on which a power applying unit is formed in a housing of a light emitting diode package according to another exemplary embodiment of the present invention. 4 is substantially the same as that shown in FIG. 1 except for the LED package and the power applying unit shown in FIG. 1, the same reference numerals are used for the same components, and detailed descriptions thereof will be omitted. do.

Referring to FIG. 4, the power applying unit 900 according to another embodiment of the present invention may include a plurality of individual applying units 910, 920, and 930 electrically connected to lead frames (not shown), respectively.

Each of the lead frames includes first and second lead terminals (not shown) separated from each other and electrically separated from each other, and each of the individual applying units 910, 920, and 930 is separated from each other and electrically separated from each other. First and second power supply terminals 912, 914, 922, 924, 932 and 934 electrically connected to the first and second lead terminals of the first and second lead terminals, respectively, and the first and second lead terminals of the lead frames and the individual applying units 910, 920, and 930. The first and second power supply terminals 912, 914, 922, 924, 932 and 934 may be electrically connected to each other by internal connection lines (not shown) disposed in the housing 800.

The power applying unit 900 may be connected to the lead frames through the internal connection lines disposed in the housing 800 to transfer driving power applied from a printed circuit board (not shown) to the lead frames. Can be. In this case, since the inner connection lines may contact the other inner connection lines and the lead frames in the housing 800, the surface may be made of an insulating material. Alternatively, the power applying unit 900 may be electrically connected to the lead frames using an auxiliary substrate such as a ceramic substrate in the housing 800.

By separately connecting the first and second lead terminals to the individual applying units 910, 920, and 930, the light emitting operation of the light emitting chip mounted on the lead frame connected to the individual applying unit 910 and the individual applying unit ( A light emitting operation of the light emitting chip mounted on the lead frame connected to the 920 and a light emitting operation of the light emitting chip mounted on the lead frame connected to the individual applying unit 930 may be controlled.

Although not shown, when the housing is a hexahedron, up to five individual application parts may be formed, and the individual application parts may be connected to the first and second lead terminals, respectively, to emit light of the light emitting chips. Respectively, or a portion of the individual applying portions is connected to a portion of the first and second lead terminals, and another portion of the individual applying portions is connected to the other portions of the first and second lead terminals to emit light. It is also possible to control the light emitting operation of the chips by a certain portion.

As such, by connecting the lead frames and the individual applying units, the driving power is individually applied to the light emitting chips so that each of the light emitting chips that individually emit light in one LED package 100 is performed. Can be controlled.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, the above description and the drawings below should be construed as illustrating the present invention, not limiting the technical spirit of the present invention.

1 is a perspective view showing a light emitting diode package according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating another example of the light emitting diode package of FIG. 1.

3 is a plan view illustrating a surface on which a power applying unit is formed in a housing of a light emitting diode package according to another exemplary embodiment of the present invention.

4 is a plan view illustrating a surface on which a power applying unit is formed in a housing of a light emitting diode package according to another exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: light emitting diode package 200, 300, 400: lead frame

500,600,700: Light emitting chip 800: Housing

810, 820, 830, 840, 850: opening 900: power supply

Claims (7)

A plurality of lead frames; A plurality of light emitting chips disposed on the lead frames and electrically connected to the lead frames and generating light; And And a housing having a plurality of openings surrounding and fixing the lead frames and exposing a portion of the lead frames on which the light emitting chips are disposed. The method of claim 1, And a power applying unit electrically connected to the lead frames to apply driving power to the lead frames. The method of claim 2, wherein the housing is formed of a polyhedron having a plurality of faces, The power applying unit is disposed on any one of the surfaces, The openings are LED package, characterized in that formed in the remaining of the surfaces. The method of claim 3, The housing is a light emitting diode package, characterized in that formed by a hexahedron. The method of claim 2, wherein each of the lead frames includes first and second lead terminals spaced apart from each other and electrically separated from each other. The power applying unit is spaced apart from each other and electrically separated, and includes first and second power applying terminals electrically connected to the first and second lead terminals, respectively. And the first lead terminal and the first power applying terminal are integrally formed, and the second lead terminal and the second power applying terminal are integrally formed. The method of claim 2, wherein the power applying unit And a plurality of individual application parts electrically connected to the lead frames, respectively. The method of claim 6, wherein each of the lead frames includes first and second lead terminals spaced apart from each other and electrically separated from each other. Each of the individual applying units is separated from each other and electrically separated from each other, and includes first and second power supply terminals electrically connected to the first and second lead terminals of each of the lead frames, respectively. Wherein the first and second lead terminals of the lead frames and the first and second power supply terminals of the individual application parts are electrically connected by internal connection lines disposed in the housing. package.
KR1020080137948A 2008-12-31 2008-12-31 Light emitting diode package KR20100082397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080137948A KR20100082397A (en) 2008-12-31 2008-12-31 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080137948A KR20100082397A (en) 2008-12-31 2008-12-31 Light emitting diode package

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KR20100082397A true KR20100082397A (en) 2010-07-19

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