KR20100080079A - Back light unit and liquid crystal display having thereof - Google Patents

Back light unit and liquid crystal display having thereof Download PDF

Info

Publication number
KR20100080079A
KR20100080079A KR1020080138700A KR20080138700A KR20100080079A KR 20100080079 A KR20100080079 A KR 20100080079A KR 1020080138700 A KR1020080138700 A KR 1020080138700A KR 20080138700 A KR20080138700 A KR 20080138700A KR 20100080079 A KR20100080079 A KR 20100080079A
Authority
KR
South Korea
Prior art keywords
led
connector
liquid crystal
led assembly
assembly substrate
Prior art date
Application number
KR1020080138700A
Other languages
Korean (ko)
Inventor
양준혁
김기성
Original Assignee
엘지디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020080138700A priority Critical patent/KR20100080079A/en
Publication of KR20100080079A publication Critical patent/KR20100080079A/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)

Abstract

PURPOSE: A backlight device and a liquid crystal display element equipping the same for reducing a manufacturing time are provided to simply combine an LED assembly substrate and an LED driver. CONSTITUTION: A plurality of LEDs(112) is mounted on at least one LED assembly substrate. A first connector(117) is formed in the LED assembly substrate. A pin(117a) or an insertion groove is formed. A second connector(132) or an insertion hole is installed in an LED driver. The LED assembly substrate and LED driver are electrically connected.

Description

백라이트장치 및 이를 구비한 액정표시소자{BACK LIGHT UNIT AND LIQUID CRYSTAL DISPLAY HAVING THEREOF}BACK LIGHT UNIT AND LIQUID CRYSTAL DISPLAY HAVING THEREOF}

본 발명은 백라이트장치에 관한 것으로, LED기판과 LED드라이버의 결합구조가 단순화된 백라이트장치 및 이를 구비한 액정표시소자에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight device, and to a backlight device and a liquid crystal display device having the same in which the coupling structure of the LED substrate and the LED driver is simplified.

근래, 휴대폰(Mobile Phone), PDA, 노트북컴퓨터와 같은 각종 휴대용 전자기기가 발전함에 따라 이에 적용할 수 있는 경박단소용의 평판표시장치(Flat Panel Display Device)에 대한 요구가 점차 증대되고 있다. 이러한 평판표시장치로는 LCD(Liquid Crystal Display), PDP(Plasma Display Panel), FED(Field Emission Display), VFD(Vacuum Fluorescent Display) 등이 활발히 연구되고 있지만, 양산화 기술, 구동수단의 용이성, 고화질의 구현이라는 이유로 인해 현재에는 액정표시소자(LCD)가 각광을 받고 있다.Recently, with the development of various portable electronic devices such as mobile phones, PDAs, and notebook computers, there is an increasing demand for flat panel display devices for light and thin applications. Such flat panel displays are being actively researched, such as LCD (Liquid Crystal Display), PDP (Plasma Display Panel), FED (Field Emission Display), VFD (Vacuum Fluorescent Display), but mass production technology, ease of driving means, Liquid crystal display devices (LCDs) are in the spotlight for reasons of implementation.

상기 액정표시소자는 투과형 표시소자로서, 액정분자의 굴절율 이방성에 의해 액정층을 투과하는 광의 양을 조절함으로써 원하는 화상을 화면상에 표시한다. 따라서, 액정표시소자에서는 화상의 표시를 위해 액정층을 투과하는 광원인 백라이트(back light)가 설치된다. 일반적으로 백라이트는 크게 2종류로 구분될 수 있다.The liquid crystal display is a transmissive display and displays a desired image on the screen by adjusting the amount of light passing through the liquid crystal layer by the refractive index anisotropy of the liquid crystal molecules. Accordingly, in the liquid crystal display device, a back light, which is a light source passing through the liquid crystal layer, is provided for displaying an image. In general, the backlight can be classified into two types.

첫째는 램프가 액정패널의 측면에 설치되어 액정층에 광을 제공하는 측면형 백라이트이고 둘째는 램프가 액정패널의 하부에서 직접 광을 제공하는 직하형 백라이트이다.The first is a side type backlight that is provided on the side of the liquid crystal panel to provide light to the liquid crystal layer, and the second is a direct type backlight that provides light directly under the liquid crystal panel.

측면형 백라이트는 액정패널의 측면에 설치되어 반사판과 도광판을 통해 액정층을 광을 공급할 수 있다. 따라서, 두께를 얇게 할 수 있게 되므로, 얇은 두께의 표시장치가 요구되는 노트북 등에 주로 사용된다. 그러나, 측면형 백라이트는 광을 발광하는 램프가 액정패널의 측면에 위치하므로 대면적의 액정패널에 적용하기 어려울 뿐만 아니라 도광판을 통해 광이 공급되므로 고휘도를 얻기 어렵게 된다. 따라서, 근래 각광받고 있는 대면적의 LCD TV용 액정패널에는 적합하지 않다는 문제가 있었다.The side backlight may be installed on the side of the liquid crystal panel to supply light to the liquid crystal layer through the reflection plate and the light guide plate. Therefore, since the thickness can be made thin, it is mainly used in notebooks and the like which require a thin display device. However, the side backlight is difficult to apply to a large area liquid crystal panel because the lamp for emitting light is located on the side of the liquid crystal panel, it is difficult to obtain high brightness because light is supplied through the light guide plate. Therefore, there has been a problem that it is not suitable for the large-area liquid crystal panel for LCD TVs, which is in the spotlight recently.

직하형 백라이트는 램프로부터 발광된 광이 직접 액정층에 공급되므로 대면적의 액정패널에 적용될 수 있을 뿐만 아니라 고휘도가 가능하기 때문에, LCD TV용 액정패널을 제작하는데 주로 사용되고 있다.The direct type backlight is mainly used to manufacture a liquid crystal panel for an LCD TV because the light emitted from the lamp is directly supplied to the liquid crystal layer, and can be applied to a large area liquid crystal panel as well as high brightness.

한편, 근래 백라이트의 램프로서 형광램프 대신 발광소자(Light Emitting Device)와 같이 자체적으로 광을 발광하는 광원을 사용하고 있다. 이 발광소자는 R, G, B 단색광을 방출하기 때문에, 백라이트에 적용했을 때 색재현율이 좋고 구동전력을 절감할 수 있다는 장점이 있다.On the other hand, in recent years, as a lamp of the backlight, instead of a fluorescent lamp, a light source that emits light itself, such as a light emitting device (Light Emitting Device). Since the light emitting device emits R, G, and B monochromatic light, it has the advantage of good color reproduction and reduction of driving power when applied to the backlight.

도 1은 발광소자(Light Emitting Device)로 이루어진 백라이트를 구비한 종래 액정표시소자를 나타내는 도면이다. 도 1에 도시된 바와 같이, 액정표시소자(1)는 액정패널(3)과 상기 액정패널(3)에 광을 공급하는 복수의 LED(12)로 이루어진 백라이트(10)로 구성된다.1 is a view showing a conventional liquid crystal display device having a backlight composed of a light emitting device. As shown in FIG. 1, the liquid crystal display device 1 includes a liquid crystal panel 3 and a backlight 10 including a plurality of LEDs 12 that supply light to the liquid crystal panel 3.

액정패널(3)은 유리와 같은 투명한 제1기판(3a) 및 제2기판(3b)과 그 사이의 형성된 액정층(도면표시하지 않음)으로 이루어지는데, 제1기판(3a)은 박막트랜지스터 및 화소전극이 형성되는 TFT기판이고 제2기판(3b)은 컬러필터층이 형성되는 컬러필터기판이다. 또한, 상기 제1기판(3a)의 측면에는 구동회로부(5)가 구비되어 하부기판(3a)에 형성된 박막트랜지스터와 화소전극에 각각 신호를 인가한다.The liquid crystal panel 3 comprises a transparent first substrate 3a and a second substrate 3b, such as glass, and a liquid crystal layer (not shown) formed therebetween. The first substrate 3a includes a thin film transistor and The TFT substrate on which the pixel electrode is formed and the second substrate 3b are the color filter substrate on which the color filter layer is formed. In addition, the driving circuit unit 5 is provided on the side of the first substrate 3a to apply signals to the thin film transistor and the pixel electrode formed on the lower substrate 3a, respectively.

도면에는 도시하지 않았지만, 제1기판(3a)에는 복수의 화소를 정의하는 복수의 게이트라인 및 데이터라인이 형성되고, 각각의 화소에는 박막트랜지스터가 구비되어 게이트라인을 따라 외부로부터 주사신호가 인가됨에 따라 구동된다. 또한, 상기 화소에는 각각 화소전극이 형성되어 박막트랜지스터가 구동됨에 따라 상기 데이터라인을 따라 외부로부터 화상신호가 입력된다.Although not shown in the drawing, a plurality of gate lines and data lines defining a plurality of pixels are formed on the first substrate 3a, and each pixel is provided with a thin film transistor to scan signals from the outside along the gate lines. Driven accordingly. In addition, as pixel electrodes are formed in the pixels to drive thin film transistors, image signals are input from the outside along the data lines.

도면에는 도시하지 않았지만, 제2기판에는 화상비표시영역으로 광이 투과하는 것을 차단하는 블랙매트릭스와 실제 컬러를 구현하는 컬러필터층이 형성되며, 제1판 및 제2기판 사이에 액정층이 형성된다.Although not shown in the drawing, a black matrix that blocks light from passing through the non-display area and a color filter layer for real color are formed on the second substrate, and a liquid crystal layer is formed between the first and second substrates. .

상기 백라이트(10)는 차례로 배치되는 복수의 적색(R), 녹색(G), 청색(B)의 LED(12)으로 이루어져 액정패널(3)에 광을 공급한다. 이때, 상기 LED(12)는 LED어셈블리기판(15)에 실장되어 외부로부터 상기 LED(12)로 신호가 입력된다.The backlight 10 includes a plurality of red (R), green (G), and blue (B) LEDs 12 arranged in sequence to supply light to the liquid crystal panel 3. At this time, the LED 12 is mounted on the LED assembly substrate 15 and a signal is input to the LED 12 from the outside.

도 2는 LED(12)가 LED어셈블리기판(15)에 실장된 것을 나타내는 도면이다. 도 2에 도시된 바와 같이, LED어셈블리기판(15)은 하부커버(20)에 복수개가 구비되며, 각각의 LED어셈블리기판(15)에 LED(12)가 실장된다. 도면에는 도시하지 않았지 만 상기 LED어셈블리기판(15)에는 배선이 형성되어 상기 LED(12)로 신호가 인가되며, LED어셈블리기판(15)의 양측면에는 커넥터(17)가 형성되어 상기 커넥터(17)를 통해 외부의 신호가 LED어셈블리기판(15)으로 입력된 후, 배선을 통해 LED(12)로 인가된다.2 is a diagram showing that the LED 12 is mounted on the LED assembly substrate 15. As shown in FIG. 2, a plurality of LED assembly substrates 15 are provided on the lower cover 20, and the LEDs 12 are mounted on the respective LED assembly substrates 15. Although not shown in the drawing, a wiring is formed on the LED assembly board 15 so that a signal is applied to the LED 12, and connectors 17 are formed on both sides of the LED assembly board 15 to form the connector 17. After the external signal is input to the LED assembly substrate 15, it is applied to the LED 12 through the wiring.

LED(12)로의 신호는 외부에 설치된 LED드라이버로부터 공급된다. 즉, 도 3에 도시된 바와 같이, LED드라이버(30)는 하부커버(20)의 배면, 즉 액정표시소자의 외부에 설치되어, LED어셈블리기판(15)의 커넥터(19)와 LED드라이버(30)의 커넥터(32)를 케이블(19)이나 와이어를 통해 연결한다. 이때, 하부커버(20)에는 복수의 홀(22)이 형성되어 상기 케이블(19)이 홀(22)을 통해 LED어셈블리기판(15)과 LED드라이버(30)를 연결한다.The signal to the LED 12 is supplied from an externally installed LED driver. That is, as shown in Figure 3, the LED driver 30 is installed on the back of the lower cover 20, that is, the outside of the liquid crystal display device, the connector 19 and the LED driver 30 of the LED assembly substrate 15 Connector 32 is connected via a cable 19 or a wire. In this case, a plurality of holes 22 are formed in the lower cover 20 so that the cable 19 connects the LED assembly board 15 and the LED driver 30 through the holes 22.

그러나, 상기와 같은 구조의 백라이트장치는 다음과 같은 문제가 있다.However, the backlight device having the above structure has the following problems.

LED(12)는 LED어셈블리기판(15)에 그룹별로 실장되며, LED(12)에 인가되는 신호도 그룹별로 인가된다. 다시 말해서, 동일한 LED어셈블리기판(15)에 실장된 LED(12)도 그룹에 따라 다른 신호가 인가되는 것이다. 따라서, LED드라이버(30)로부터 각각의 그룹에 다른 신호를 인가하기 위해서는 많은 수의 케이블(19)이 필요하게 되므로, 비용이 증가하게 될 뿐만 아니라 많은 수의 케이블(19)을 체결하기가 용이하지 않았다. 더욱이, 상기 케이블(19)의 연결은 작업자가 수작업으로 직접 해야만 하므로, 체결비용이 증가하고 체결시간도 지연되는 문제가 있었다.The LEDs 12 are mounted on the LED assembly substrate 15 in groups, and the signals applied to the LEDs 12 are also applied in groups. In other words, different signals are applied to the LEDs 12 mounted on the same LED assembly substrate 15 depending on the group. Therefore, in order to apply a different signal to each group from the LED driver 30, a large number of cables 19 are required, which not only increases the cost but also makes it easy to fasten a large number of cables 19. Did. In addition, since the connection of the cable 19 must be done manually by a worker, there is a problem that the fastening cost is increased and the fastening time is also delayed.

본 발명은 상기한 문제를 해결하기 위한 것으로, LED어셈블리기판과 LED드라이버에 커넥터를 형성한 후, 핀과 삽입홈을 형성하고 상기 핀을 삽입홈에 삽입함으로써 LED어셈블리기판과 LED드라이버를 간단하게 결합할 수 있는 백라이트장치를 제공하는 것을 목적으로 한다.The present invention is to solve the above problems, after forming a connector on the LED assembly board and the LED driver, forming a pin and the insertion groove and inserting the pin into the insertion groove to simply combine the LED assembly substrate and the LED driver. An object of the present invention is to provide a backlight device.

본 발명의 다른 목적은 상기와 같은 백라이트장치를 구비한 액정표시소자를 제공하는 것이다.Another object of the present invention is to provide a liquid crystal display device having the backlight device as described above.

상기한 목적을 달성하기 위해, 본 발명에 따른 백라이트장치는 복수의 LED가 실장되어 액정패널에 광을 공급하는 적어도 하나의 LED어셈블리기판; LED어셈블리기판에 형성되고 핀 또는 삽입홈이 형성된 제1커넥터; 및 삽입홈 또는 핀이 형성된 제2커넥터가 설치된 LED드라이버로 구성되며, 제1커넥터에 형성된 핀 또는 삽입홈과 제2커넥터에 형성된 삽입홈 및 핀을 결합 상기 LED어셈블리기판 및 LED드라이버을 전기적인 연결하는 것을 특징으로 한다.In order to achieve the above object, the backlight device according to the present invention comprises a plurality of LED mounted at least one LED assembly substrate for supplying light to the liquid crystal panel; A first connector formed on the LED assembly substrate and having pins or insertion grooves formed therein; And an LED driver in which an insertion groove or a pin-shaped second connector is installed, and the pin or insertion groove formed in the first connector and the insertion groove and pins formed in the second connector are electrically connected to the LED assembly substrate and the LED driver. It is characterized by.

또한, 본 발명에 따른 액정표시소자는 액정패널; 복수의 LED(Light Emitting Device)가 실장되어 액정패널에 광을 공급하는 적어도 하나의 LED어셈블리기판과, LED어셈블리기판에 형성되고 핀 또는 삽입홈이 형성된 제1커넥터와, 삽입홈 또는 핀이 형성된 제2커넥터가 설치된 LED드라이버를 포함하는 백라이트장치로 구성되며, 제1커넥터에 형성된 핀 또는 삽입홈과 제2커넥터에 형성된 삽입홈 및 핀을 결 합 상기 LED어셈블리기판 및 LED드라이버을 전기적인 연결하는 것을 특징으로 한다.In addition, the liquid crystal display device according to the present invention is a liquid crystal panel; At least one LED assembly substrate mounted with a plurality of light emitting devices (LEDs) to supply light to the liquid crystal panel, a first connector formed on the LED assembly substrate and having pins or insertion grooves formed therein, and insertion grooves or pins formed first Consists of a backlight device including an LED driver having two connectors, the pin or the insertion groove formed in the first connector and the insertion groove and the pin formed in the second connector to connect the LED assembly substrate and the LED driver electrically. It is done.

본 발명에서는 LED어셈블리기판과 LED드라이버에 커넥터를 형성한 후, 핀과 삽입홈을 형성하고 상기 핀을 삽입홈에 삽입함으로써 LED어셈블리기판과 LED드라이버를 간단하게 결합할 수 있게 된다. 따라서, 제조비용을 절감하고 제조시간을 대폭 단축할 수 있게 된다.In the present invention, after the connector is formed on the LED assembly board and the LED driver, a pin and an insertion groove are formed, and the pin is inserted into the insertion groove, so that the LED assembly board and the LED driver can be easily combined. Therefore, it is possible to reduce the manufacturing cost and significantly shorten the manufacturing time.

이하, 첨부한 도면을 참조하여 본 발명에 대해 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

본 발명의 백라이트장치는 LED어셈블리기판과 LED드라이버의 결합구조를 제외한 다른 구조는 종래의 백라이트장치의 구조와 동일하다. 따라서, 이하의 설명에서는 종래 백라이트장치와 동일한 구조에 대해서는 간략하게 설명하고 LED어셈블리기판과 LED드라이버의 결합구조만을 상세히 설명한다.The backlight device of the present invention has the same structure as that of the conventional backlight device except for the coupling structure of the LED assembly substrate and the LED driver. Therefore, in the following description, the same structure as the conventional backlight device will be briefly described, and only the coupling structure of the LED assembly substrate and the LED driver will be described in detail.

도 4는 본 발명에 따른 백라이트장치의 LED어셈블리기판과 LED드라이버의 결합구조를 나타내는 도면이다.4 is a view showing a coupling structure of the LED assembly substrate and the LED driver of the backlight device according to the present invention.

도 4에 도시된 바와 같이, LED어셈블리기판(115)의 제1면에는 복수의 LED(112)가 배열되어 있다. As shown in FIG. 4, a plurality of LEDs 112 are arranged on the first surface of the LED assembly substrate 115.

LED(112)로는 단색광 LED와 백색광 LED를 사용할 수 있다. 단색광 LED를 사용하는 경우, R, G, B의 단색광을 발광하는 LED를 교대로 배열하여 각각의 발광소자에서 발광하는 단색광을 자연적으로 혼합하여 액정패널로 공급한다.As the LED 112, a monochromatic LED and a white LED may be used. In the case of using a monochromatic LED, LEDs emitting monochromatic light of R, G, and B are alternately arranged, and the monochromatic light emitted from each light emitting device is naturally mixed and supplied to the liquid crystal panel.

백색광 LED를 사용하는 경우, 단색광 LED와 형광체를 사용하거나 적외선 파장대의 LED와 형광체를 사용한다. 즉, 단색광 LED와 형광체를 사용하는 경우 청색 LED에 노란색 형광체를 도포하여 청색 LED에서 발광하는 청색의 단색광의 일부가 상기 노란색 형광체에 흡수됨에 따라 상기 형광체로부터 노란색광이 발광되므로 상기 청색광과 노란색광이 혼합되어 백색광이 출력되는 것이다.If white light LEDs are used, use monochromatic LEDs and phosphors, or LEDs and phosphors in the infrared wavelength band. That is, when a monochromatic LED and a phosphor are used, yellow light is emitted from the phosphor as a part of the blue monochromatic light emitted from the blue LED by applying a yellow phosphor to the blue LED is absorbed by the yellow phosphor. White light is output by mixing.

또한, 적외선파장대의 LED를 사용하는 경우 형광체에서 적외선을 흡수한 후 광을 발광하므로써 백색광을 액정패널에 공급하는 것이다.In addition, in the case of using an infrared wavelength LED, the white light is supplied to the liquid crystal panel by absorbing infrared rays from the phosphor and emitting light.

도면에는 도시하지 않았지만, 상기 LED어셈블리기판(115)에는 금속배선이 형성되어 상기 LED(112)로 신호를 전송한다.Although not shown in the figure, a metal wire is formed on the LED assembly substrate 115 to transmit a signal to the LED 112.

LED어셈블리기판(115)의 제2면의 일측에는 커넥터(117)가 형성되어 있다. 상기 커넥터(117)는 금속배선을 통해 LED(112)로 연결되어 외부로부터 신호가 입력되면, 입력된 신호를 금속배선을 통해 LED(112)로 인가한다.The connector 117 is formed on one side of the second surface of the LED assembly substrate 115. When the connector 117 is connected to the LED 112 through a metal wire and a signal is input from the outside, the connector 117 applies the input signal to the LED 112 through the metal wire.

상기 LED어셈블리기판(115)은 LED드라이버(130)에 연결되어 LED드라이버(130)로부터 LED(112)로 입력되는 신호에 따라 상기 LED(112)가 작동하게 된다. 이때, 상기 LED어셈블리기판(115)와 LED드라이버(130)의 연결은 LED어셈블리기판(115) 및 LED드라이버(130)에 각각 형성된 커넥터(117,132)에 의해 이루어진다. 즉, 도면에 도시된 바와 같이, LED어셈블리기판(115)의 커넥터(117)에는 복수의 핀(117a)이 형성되고 LED드라이버(130)의 커넥터(132)에는 복수의 삽입홈(132a)이 형성되어 상기 LED어셈블리기판(115)의 커넥터(117)의 핀(117a)이 LED드라이버(130)의 커넥터(132)의 삽입홈(132a)에 삽입된다.The LED assembly substrate 115 is connected to the LED driver 130 so that the LED 112 operates according to a signal input from the LED driver 130 to the LED 112. At this time, the connection between the LED assembly substrate 115 and the LED driver 130 is made by the connectors 117 and 132 formed on the LED assembly substrate 115 and the LED driver 130, respectively. That is, as shown in the figure, a plurality of pins 117a are formed in the connector 117 of the LED assembly substrate 115 and a plurality of insertion grooves 132a are formed in the connector 132 of the LED driver 130. The pin 117a of the connector 117 of the LED assembly board 115 is inserted into the insertion groove 132a of the connector 132 of the LED driver 130.

이때, 상기 LED어셈블리기판(115)의 커넥터(117)에는 복수의 삽입홈이 형성되고 LED드라이버(130)의 커넥터(132)에는 복수의 핀이 형성되어 LED드라이버(130)의 커넥터(132)의 핀이 상기 LED어셈블리기판(115)의 커넥터(117)의 삽임홈에 삽입될 수 있을 것이다.In this case, a plurality of insertion grooves are formed in the connector 117 of the LED assembly substrate 115, and a plurality of pins are formed in the connector 132 of the LED driver 130, so that the connector 132 of the LED driver 130 is formed. The pin may be inserted into the insertion groove of the connector 117 of the LED assembly substrate 115.

상기 핀(117a)과 삽입홈(132a)의 결합에 의해 LED드라이버(130)의 제어신호가 LED어셈블리기판(115)에 실장된 LED(112)에 인가된다. 즉, 신호가 커넥터(117,132)의 핀(117a) 및 삽입홈(132a)을 통해 LED어셈블리기판(115)으로 전달되는 것이다.The control signal of the LED driver 130 is applied to the LED 112 mounted on the LED assembly substrate 115 by the combination of the pin 117a and the insertion groove 132a. That is, the signal is transmitted to the LED assembly substrate 115 through the pins 117a and the insertion grooves 132a of the connectors 117 and 132.

한편, 상기 LED어셈블리기판(115)과 LED드라이버(130)는 실제 하부커버(120)를 사이에 두고 배치된다. 따라서, 상기 LED어셈블리기판(115)과 LED드라이버(130)를 커넥터(117,132)의 핀(117a)과 삽임홈(132a)을 통해 서로 연결하려면, 도 5에 도시된 바와 같이 상기 하부커버(120)에 홀을 형성하여 상기 홀을 통해 핀(117a)과 삽임홈(132a)을 결합한다.Meanwhile, the LED assembly substrate 115 and the LED driver 130 are actually disposed with the lower cover 120 interposed therebetween. Therefore, to connect the LED assembly board 115 and the LED driver 130 to each other through the pins 117a and the insertion grooves 132a of the connectors 117 and 132, the lower cover 120 as shown in FIG. A hole is formed in the pin 117a and the insertion groove 132a through the hole.

상기와 같이, 본 발명에서는 LED어셈블리기판(115)과 LED드라이버(130)에 각각 커넥터(117,132)를 형성하고 각각의 커넥터에 핀 또는 삽입홈을 형성하여 핀을 삽입홈에 삽입함으로써 LED어셈블리기판(115)과 LED드라이버(130)를 전기적으로 연결시킨다.As described above, in the present invention, the LED assembly substrate 115 and the LED driver 130 are formed with the connectors 117 and 132, respectively, and pins or insertion grooves are formed in the respective connectors to insert the pins into the insertion grooves. 115) and the LED driver 130 is electrically connected.

종래 케이블을 이용한 LED어셈블리기판(115)과 LED드라이버(130)의 결합구조에서 작업자가 일일이 케이블을 수작업에 의해 연결하는데 반해, 본 발명에서는 핀을 삽입홈에 삽입함으로써 결함하므로 백라이트장치의 형성시간을 단축시킬 수 있 게 된다. 또한, LED어셈블리기판(115)과 LED드라이버(130)를 연결하는 케이블을 수납하는 공간이 필요없게 되므로, 슬림한 백라이트장치의 구성이 가능하게 된다.In the coupling structure of the LED assembly substrate 115 and the LED driver 130 using a conventional cable, the operator manually connects the cable by hand, whereas in the present invention, the pin is inserted into the insertion groove so that the formation time of the backlight device is reduced. It can be shortened. In addition, since the space for accommodating the cable connecting the LED assembly substrate 115 and the LED driver 130 is not required, a slim backlight device can be configured.

한편, 본 발명에서는 하나의 LED드라이버(130)를 복수의 LED어셈블리기판(115)과 연결할 수도 있다.Meanwhile, in the present invention, one LED driver 130 may be connected to the plurality of LED assembly substrates 115.

즉, 도 6에 도시된 바와 같이, 제1면에 복수의 LED(112)가 실장된 복수의 LED어셈블리기판(115)이 구비된 경우, 각각의 LED어셈블리기판(115)에 핀(117a) 또는 삽입홈이 형성된 커넥터(117)를 설치하고, 이 커넥트(117)를 하나의 LED드라이버(130)에 복수개 형성된 커넥터(132)의 삽입홈(132a) 또는 핀과 결합시킴으로써 하나의 LED드라이버(130)에서 커넥터(117,132)의 핀과 홈을 통해 복수의 LED어셈블리기판(115)에 실장된 LED(112)에 신호를 인가할 수 있게 된다.That is, as shown in FIG. 6, when the plurality of LED assembly substrates 115 on which the plurality of LEDs 112 are mounted are provided on the first surface, the pins 117a or the respective LED assembly substrates 115 are provided. Install a connector 117 having an insertion groove, and combine the connector 117 with the insertion groove 132a or pin of the connector 132 formed in a plurality of LED driver 130, one LED driver 130 A signal may be applied to the LEDs 112 mounted on the plurality of LED assembly substrates 115 through pins and grooves of the connectors 117 and 132.

또한, 도 7에 도시된 바와 같이, 복수의 LED(112)가 실장된 LED어셈블리기판(115)이 2열로 배열된 경우 LED어셈블리기판(115)에 형성된 커넥터(117)을 일정 영역에 모이도록 배치하고 일정 영역에 배치된 커넥터(117)의 핀 또는 삽입홈을 하나의 LED드라이버(130)에 형성된 복수의 커넥터(132)의 삽입홈 또는 핀과 결합시킴으로써 하나의 LED드라이버(130)를 복수의 LED어셈블리기판(115)과 연결할 수 있게 되는 것이다.In addition, as shown in FIG. 7, when the LED assembly boards 115 on which the plurality of LEDs 112 are mounted are arranged in two rows, the connectors 117 formed on the LED assembly boards 115 are arranged to gather in a predetermined region. And a single LED driver 130 by combining the pins or insertion grooves of the connector 117 disposed in a predetermined area with the insertion grooves or pins of the plurality of connectors 132 formed in one LED driver 130. Will be able to connect with the assembly substrate (115).

상기와 같은 결합구조를 갖는 LED어셈블리기판(115)과 LED드라이버(130)를 구비한 백라이트장치가 설치된 액정표시소자가 도 8에 도시되어 있다.8 illustrates a liquid crystal display device in which a backlight device including the LED assembly substrate 115 and the LED driver 130 having the above-described coupling structure is installed.

도 8에 도시된 바와 같이, 액정표시소자(101)는 실제 화상을 구현하는 액정패널(103)과 상기 액정패널(103)에 광을 공급하는 복수의 LED(112)로 이루어진 백 라이트장치(110)로 구성된다.As shown in FIG. 8, the liquid crystal display device 101 includes a liquid crystal panel 103 for realizing an image and a backlight device 110 including a plurality of LEDs 112 for supplying light to the liquid crystal panel 103. It consists of

액정패널(103)은 제1기판(103a) 및 제2기판(103b)과 그 사이의 형성된 액정층(도면표시하지 않음)으로 이루어진다. 상기 제1기판(103a)은 TFT기판으로서, 게이트라인 및 데이터라인에 의해 복수의 화소가 형성되고, 각각의 화소에는 박막트랜지스터와 화소전극이 형성된다. 또한, 제2기판(103b)은 컬러필터기판으로서 실제 컬러를 구현하는 컬러필터층과 화상비표시영역으로 광이 투과되는 것을 차단하는 블랙매트릭스로 이루어지다. 상기 제1기판(103a)과 제2기판(103b) 사이에는 액정층이 형성되며, 상기 제1기판(103a)의 측면에는 구동회로부(105)가 구비되어 하부기판(103a)에 형성된 박막트랜지스터와 화소전극에 각각 신호를 인가한다.The liquid crystal panel 103 is composed of a first substrate 103a and a second substrate 103b and a liquid crystal layer (not shown) formed therebetween. The first substrate 103a is a TFT substrate, and a plurality of pixels are formed by a gate line and a data line, and a thin film transistor and a pixel electrode are formed in each pixel. In addition, the second substrate 103b is a color filter substrate, and includes a color filter layer that realizes actual color and a black matrix that blocks light from being transmitted to the image non-display area. A liquid crystal layer is formed between the first substrate 103a and the second substrate 103b, and the thin film transistor formed on the lower substrate 103a is provided with a driving circuit portion 105 on the side of the first substrate 103a. A signal is applied to each pixel electrode.

상기 백라이트장치(110)는 LED어셈블리기판(115)과, 상기 LED어셈블리기판(115)에 실장된 복수의 LED(112)으로 이루어진다. 도면에는 도시하지 않았지만, 상기 LED(115)의 상부에는 LED(115)로부터 발광된 광을 액정패널(103)로 인도하는 도광판이나 확산판을 배치될 수 있고, 상기 도광판 상부에 광을 확산시키고 집광시키는 광학시트가 형성될 수도 있다.The backlight device 110 includes an LED assembly substrate 115 and a plurality of LEDs 112 mounted on the LED assembly substrate 115. Although not shown in the drawing, a light guide plate or a diffusion plate for guiding light emitted from the LED 115 to the liquid crystal panel 103 may be disposed above the LED 115, and the light may be diffused and collected on the light guide plate. An optical sheet may be formed.

상기와 같은 백라이트장치(110) 및 액정패널(103)은 하부커버(120)에 의해 조립된다.The backlight device 110 and the liquid crystal panel 103 as described above are assembled by the lower cover 120.

상기 LED어셈블리기판(115)은 하부커버(120)에 형성된 홀을 통해 LED드라이버(130)와 연결된다. 이때, 상기 LED어셈블리기판(115)과 LED드라이버(130)에는 핀 또는 삽입홈이 형성된 커넥터가 설치되어 상기 홀을 통해 상기 LED어셈블리기판(115)과 LED드라이버(130)에는 핀 또는 삽입홈이 서로 결합하여 LED어셈블리기 판(115)과 LED드라이버(130)를 전기적으로 연결시키는 것이다.The LED assembly substrate 115 is connected to the LED driver 130 through a hole formed in the lower cover 120. At this time, the LED assembly board 115 and the LED driver 130 are provided with a connector formed with a pin or an insertion groove, and the LED assembly board 115 and the LED driver 130 have pins or insertion grooves through the holes. By coupling to the LED assembly plate 115 and the LED driver 130 to electrically connect.

상기와 같은 구성의 액정표시소자에서는 액정패널(103)의 제1기판(103a)에 형성된 게이트라인을 따라 주사신호가 입력되면 박막트랜지스터가 활성화되고, 동시에 데이터라인을 따라 외부로부터 화상신호가 입력되면 화소전극에 전압이 인가되어 액정층에 전계가 형성된다.In the liquid crystal display device having the above-described configuration, when the scan signal is input along the gate line formed on the first substrate 103a of the liquid crystal panel 103, the thin film transistor is activated, and simultaneously the image signal is input from the outside along the data line. Voltage is applied to the pixel electrode to form an electric field in the liquid crystal layer.

이때, 상기 LED드라이버(130)에서는 커넥터의 핀과 삽입홈을 통해 신호를 LED어셈블리기판(115)로 공급하며, 이 신호가 LED어셈블리기판(115)에 형성된 금속배선을 따라 LED(112)에 인가됨으로써 LED(112)에서 발광된 광이 액정패널(103)로 공급된다.At this time, the LED driver 130 supplies a signal to the LED assembly substrate 115 through the pin and the insertion groove of the connector, the signal is applied to the LED 112 along the metal wiring formed on the LED assembly substrate 115. As a result, the light emitted from the LED 112 is supplied to the liquid crystal panel 103.

액정패널(103)의 액정층은 전계에 의해 투과도가 조절되므로, 이 투과도의 조절에 따라 액정층을 투과하는 광량이 제어되어 화상을 구현하게 된다. Since the transmittance of the liquid crystal layer of the liquid crystal panel 103 is controlled by an electric field, the amount of light passing through the liquid crystal layer is controlled according to the control of the transmittance to implement an image.

상술한 바와 같이, 본 발명에서는 LED어셈블리기판(115)과 LED드라이버(130)에 커넥터를 설치하고 각각 서로 결합하는 핀 및 삽입홈을 형성함으로써 LED어셈블리기판(115)과 LED드라이버(130)를 간단하게 연결할 수 있게 된다.As described above, in the present invention, the LED assembly substrate 115 and the LED driver 130 are simplified by installing a connector on the LED assembly substrate 115 and the LED driver 130 and forming pins and insertion grooves that are coupled to each other. Can be connected.

한편, 상술한 상세한 설명에서는 본 발명을 특정한 구조로 한정하여 설명하고 있지만, 이것은 설명의 편의를 위한 것이지 본 발명의 권리를 한정하기 위한 것은 아니다. 본 발명의 다양한 변형례나 본 발명을 기초로 용이하게 창안할 수 있는 구조 등은 본 발명의 범위에 포함되어야만 할 것이다. 따라서, 본 발명의 권리범위는 상술한 상세한 설명에 의해 결정되는 것이 아니라 첨부한 특허청구범위에 의해 결정되어야만 할 것이다.On the other hand, in the above detailed description has been described the present invention limited to a specific structure, but this is for convenience of description and not to limit the rights of the present invention. Various modifications of the present invention or structures that can be easily devised based on the present invention should be included in the scope of the present invention. Therefore, the scope of the present invention should be determined not by the above detailed description but by the appended claims.

도 1은 종래 액정표시소자의 구조를 나타내는 도면.1 is a view showing the structure of a conventional liquid crystal display device.

도 2는 하부커버에 배치된 복수의 LED어셈블리기판을 나타내는 도면.2 is a view showing a plurality of LED assembly substrates disposed on the lower cover.

도 3은 LED어셈블리기판과 LED드라이버의 종래 결합구조를 나타내는 도면.3 is a view showing a conventional coupling structure of the LED assembly substrate and the LED driver.

도 4는 본 발명에 따른 LED어셈블리기판과 LED드라이버의 결합구조를 나타내는 도면.Figure 4 is a view showing a coupling structure of the LED assembly substrate and the LED driver according to the present invention.

도 5는 하부커버를 사이에 두고 LED어셈블리기판과 LED드라이버가 결합된 것을 나타내는 도면.5 is a view showing that the LED assembly substrate and the LED driver are coupled with the lower cover in between.

도 6은 복수의 LED어셈블리기판과 LED드라이버의 결합구조를 나타내는 도면.6 is a view illustrating a coupling structure of a plurality of LED assembly substrates and an LED driver.

도 7은 복수의 LED어셈블리기판과 LED드라이버의 다른 결합구조를 나타내는 도면.7 is a view showing another coupling structure of a plurality of LED assembly substrate and the LED driver.

도 8은 본 발명에 따른 액정표시소자의 구조를 나타내는 도면.8 is a view showing the structure of a liquid crystal display device according to the present invention.

Claims (6)

복수의 LED가 실장되어 액정패널에 광을 공급하는 적어도 하나의 LED어셈블리기판;At least one LED assembly substrate mounted with a plurality of LEDs to supply light to the liquid crystal panel; LED어셈블리기판에 형성되고 핀 또는 삽입홈이 형성된 제1커넥터; 및A first connector formed on the LED assembly substrate and having pins or insertion grooves formed therein; And 삽입홈 또는 핀이 형성된 제2커넥터가 설치된 LED드라이버로 구성되며,Consists of an LED driver with a second connector formed with an insertion groove or pin, 제1커넥터에 형성된 핀 또는 삽입홈과 제2커넥터에 형성된 삽입홈 또는 핀을 결합하여 상기 LED어셈블리기판 및 LED드라이버을 전기적인 연결하는 것을 특징으로 하는 백라이트장치.And a pin or an insertion groove formed in the first connector and an insertion groove or a pin formed in the second connector to electrically connect the LED assembly substrate and the LED driver. 제1항에 있어서, 상기 LED드라이버의 제2커넥터에 형성된 삽입홈 또는 핀은 복수의 LED어셈블리기판 각각에 형성된 제1커넥터의 핀 또는 삽입홈과 결합되는 것을 특징으로 하는 백라이트장치. The backlight device of claim 1, wherein an insertion groove or a pin formed in the second connector of the LED driver is coupled to a pin or insertion groove of the first connector formed in each of the plurality of LED assembly substrates. 제1항에 있어서,The method of claim 1, 상기 LED 상부에 배치되어 광을 액정패널로 인도하는 도광판;A light guide plate disposed on the LED to guide light to the liquid crystal panel; 상기 도광판 위에 배치되어 광을 확산시키고 집광시키는 광학시트; 및An optical sheet disposed on the light guide plate to diffuse and collect light; And 상기 LED어셈블리기판, 도광판 및 광학시트를 조립하는 하부커버를 추가로 포함하는 것을 특징으로 하는 백라이트장치.And a lower cover for assembling the LED assembly substrate, the light guide plate, and the optical sheet. 제3항에 있어서, LED어셈블리기판은 하부커버 내측에 형성되고 LED드라이버는 하버커버 외측에 배치되는 것을 특징으로 하는 백라이트장치.The backlight device of claim 3, wherein the LED assembly substrate is formed inside the lower cover and the LED driver is disposed outside the harbor cover. 제4항에 있어서, 상기 LED어셈블리기판의 제1커넥터와 LED드라이버의 제2커넥터는 하부커버에 형성된 홀을 통해 연결되는 것을 특징으로 하는 백라이트장치.The backlight device of claim 4, wherein the first connector of the LED assembly substrate and the second connector of the LED driver are connected through a hole formed in a lower cover. 액정패널;A liquid crystal panel; 복수의 LED(Light Emitting Device)가 실장되어 액정패널에 광을 공급하는 적어도 하나의 LED어셈블리기판과, LED어셈블리기판에 형성되고 핀 또는 삽입홈이 형성된 제1커넥터와, 삽입홈 또는 핀이 형성된 제2커넥터가 설치된 LED드라이버를 포함하는 백라이트장치로 구성되며,At least one LED assembly substrate mounted with a plurality of light emitting devices (LEDs) to supply light to the liquid crystal panel, a first connector formed on the LED assembly substrate and having pins or insertion grooves formed therein, and insertion grooves or pins formed first It consists of a backlight device that includes an LED driver with two connectors, 제1커넥터에 형성된 핀 또는 삽입홈과 제2커넥터에 형성된 삽입홈 또는 핀을 결합하여 상기 LED어셈블리기판 및 LED드라이버을 전기적인 연결하는 것을 특징으로 하는 액정표시소자.And a pin or an insertion groove formed in the first connector and an insertion groove or a pin formed in the second connector to electrically connect the LED assembly substrate and the LED driver.
KR1020080138700A 2008-12-31 2008-12-31 Back light unit and liquid crystal display having thereof KR20100080079A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080138700A KR20100080079A (en) 2008-12-31 2008-12-31 Back light unit and liquid crystal display having thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080138700A KR20100080079A (en) 2008-12-31 2008-12-31 Back light unit and liquid crystal display having thereof

Publications (1)

Publication Number Publication Date
KR20100080079A true KR20100080079A (en) 2010-07-08

Family

ID=42641081

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080138700A KR20100080079A (en) 2008-12-31 2008-12-31 Back light unit and liquid crystal display having thereof

Country Status (1)

Country Link
KR (1) KR20100080079A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8292447B2 (en) 2010-08-17 2012-10-23 Lg Innotek Co., Ltd. Backlight unit and display apparatus having the same
TWI462398B (en) * 2010-07-06 2014-11-21 J S T Mfg Co Ltd Installation structure for connector
CN110750012A (en) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 Backlight assembly
KR102318912B1 (en) * 2021-02-09 2021-10-28 주식회사 레다즈 Backlight unit and method for manufacturing printed circuit board thereof
CN115586671A (en) * 2022-09-28 2023-01-10 苏州华星光电技术有限公司 Backlight module and display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI462398B (en) * 2010-07-06 2014-11-21 J S T Mfg Co Ltd Installation structure for connector
US8292447B2 (en) 2010-08-17 2012-10-23 Lg Innotek Co., Ltd. Backlight unit and display apparatus having the same
CN110750012A (en) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 Backlight assembly
CN110750012B (en) * 2019-10-30 2022-11-18 京东方科技集团股份有限公司 Backlight assembly
KR102318912B1 (en) * 2021-02-09 2021-10-28 주식회사 레다즈 Backlight unit and method for manufacturing printed circuit board thereof
CN115586671A (en) * 2022-09-28 2023-01-10 苏州华星光电技术有限公司 Backlight module and display device

Similar Documents

Publication Publication Date Title
CN101770103B (en) Liquid crystal display device having good heat radiating function
US20120169967A1 (en) Two-Way Liquid Crystal Display Device
EP1930958A2 (en) Light emitting diode package, and light source unit and backlight unit including the same
US20060193132A1 (en) Backlight assembly and liquid crystal display device using the same
US8441597B2 (en) Liquid crystal display device for preventing light leakage
KR20120068499A (en) Backlight unit and liquid crystal display device and method having the same
KR20080051256A (en) Light source unit, light emission device and display device provided with the same
WO2012128064A1 (en) Illumination device, display device, and television reception device
KR20100080079A (en) Back light unit and liquid crystal display having thereof
US20140009695A1 (en) Illumination device, display device, and television reception device
US9482916B2 (en) Liquid crystal display
WO2012128077A1 (en) Illumination device, display device, and television reception device
KR20110067881A (en) Liquid crystal display device
KR20130024163A (en) Liquid crystal display device including substrate having emitting device attached thereon
US9476577B2 (en) Lighting device, display device, and television reception device
KR20140006252A (en) Lcd module associated with panel using air zero gap bonding
WO2013024715A1 (en) Illumination device, display device, television receiving device
WO2012128076A1 (en) Illumination device, display device, and television reception device
KR101513157B1 (en) Back light and liquid crystal display device having thereof
KR101634632B1 (en) Connecting structure of light emitting device substrate and flexible pinited circuit board, and liquid crystal display device having thereof
KR20130071925A (en) Liquid crystal display module inculding backlight unit
KR102057889B1 (en) Liquid crystal display device having light emitting device back light unit
KR20110070528A (en) Liquid crystal display device
KR20060078870A (en) A flat display device for shielding emi
KR20110070531A (en) Coupling structure of cover shield and liquid crystal display device having thereof

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination