KR20100075244A - Method for manufacturing dissimilar conductor sleeve - Google Patents

Abstract

PURPOSE: A heterogeneous conductor sleeve manufacturing method is provided to bond the heterogeneous conductors completely by organically combining a process of spray coating the metallic powder and a process of rolling friction welding the heterogeneous metals. CONSTITUTION: The metal powder is heated to a predetermined temperature prior to a high speed injection process of the metal powder(S100). The metal powder of copper or copper alloy is sprayed at high speed to the bonding surface of a second round rod(S110). The coating layer of the metal powder is formed on the second round rod through the high speed injection process of the metal powder(S120).

Description

Manufacturing method of different conductor sleeves {METHOD FOR MANUFACTURING DISSIMILAR CONDUCTOR SLEEVE}

The present invention relates to a method of joining different conductors. More particularly, the present invention relates to a method of manufacturing a high voltage hetero conductor connecting sleeve.

For example, a conductor connecting sleeve is used to connect high voltage cables to each other. In this case, when the conductors to be connected are made of the same material, it may be connected by a conventional welding method such as metal inert gas (MIG) welding.

However, when the conductors to be connected are different, the hetero conductors are connected by using a sleeve for connecting the hetero conductors.

The main material used for high voltage conductors is made of copper or aluminum. Accordingly, in the section where the copper wire and the aluminum wire should be connected, the copper wire and the aluminum wire are connected through the sleeve for connecting the hetero conductors.

Here, in order to manufacture the sleeve for connecting the hetero conductors, it is necessary to join the round bar of the same material and the round bar of aluminum.

In general, heterojunction of aluminum and copper is known to be very difficult. There are two main reasons for this. The first is that the difference between the melting point and specific gravity of aluminum and copper is large, resulting in a large amount of pores and cracks. Second, a large amount of intermetallic compound (IMC), AlCu, Al ₂ Cu, etc., generated by the reaction of the two materials is generated, resulting in a very brittle state of the joint, which significantly reduces the strength of the joint.

Therefore, the development of a bonding method for increasing the strength of the joint in the bonding between different conductors is urgently needed.

This provides a method for producing a different conductor sleeve that can increase the strength of the joint.

To this end, the present production method is a method for manufacturing a different conductor sleeve, the step of high-speed spraying the metal-based powder on the joint surface of one conductor, coating the metal-based powder on the joint surface of one conductor through the high-speed injection of the metal-based powder, metal-based It may comprise the step of bonding the powder-coated one side of the conductor and the other conductor by rotational friction.

Here, the method may further include preheating the metal-based powder before the high-speed injection of the metal-based powder.

Here, the metal-based powder may have a particle size of 1 to 50 μm.

In addition, the coating thickness of the metal-based powder may be 0.1 ~ 5mm.

As described above, according to the present exemplary embodiment, the organically bonding process of spray coating the metal-based powder and the process of rotating friction welding the dissimilar metal can be more completely bonded between the different conductors.

In addition, the bonding strength of the bonding surface can be further improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

The drawings are schematic and illustrate that they are not drawn to scale. The relative dimensions and ratios of the parts in the figures have been exaggerated or reduced in size for clarity and convenience in the figures and any dimensions are merely exemplary and not limiting. And the same structure, element or part that appears in more than one figure the same reference numerals are used in different embodiments to indicate corresponding or similar features.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the term "comprising" embodies a particular characteristic, region, integer, step, operation, element, and / or component, and other specific characteristics, region, integer, step, operation, element, component, and / or group. It does not exclude the presence or addition of.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly defined terms used are additionally interpreted to have a meaning consistent with the related technical literature and the presently disclosed contents, and are not interpreted in an ideal or very formal sense unless defined.

Embodiments of the invention described with reference to a perspective view specifically illustrate an ideal embodiment of the invention. As a result, various variations of the illustration, for example variations in the manufacturing method and / or specification, are expected. Thus, the embodiment is not limited to any particular form of the depicted area, but includes modifications of the form, for example, by manufacture. For example, the regions shown or described as being flat may have characteristics that are generally coarse / rough and nonlinear. Also, the portion shown as having a sharp angle may be rounded. Thus, the regions shown in the figures are merely approximate, and their shapes are not intended to depict the exact shape of the regions, nor are they intended to limit the scope of the present invention.

1 illustrates a process for manufacturing a hetero conductor sleeve according to the present embodiment.

In the following description, as a hetero conductor sleeve, a round bar made of pure copper or copper alloy (hereinafter referred to as a first round bar 10 for convenience of description) and a round bar made of aluminum or aluminum alloy (hereinafter referred to as a second round bar (for convenience of description) A method of manufacturing a sleeve bonded to 20) is described as an example. Of course, the manufacturing method is not limited to this, it will be applicable to the production of hetero conductor bonding sleeves of various materials.

According to the above-described drawings, the manufacturing method of the present invention comprises the step of high-speed spraying the powder of copper or copper alloy (hereinafter referred to as metal powder) to the bonding surface of the second round bar 20 (S110), and through the high-speed spraying of the metal powder Forming the coating layer 30 of the metal powder on the joint surface of the second round bar 20 (S120), the rotational friction welding of the joint surface of the second round bar 20 and the joint surface of the first round bar 10 It includes the step (S130 ~ S140).

In this embodiment, the metal powder has a particle size of 1 ~ 50㎛. When the particle size of the metal powder is out of the range, it is difficult to accelerate or plastic deformation of the metal powder, so that coating may not be performed properly.

The metal powder is bonded to the bonding surface of the second round bar 20 by a high-speed spraying step and the coating layer forming step to form a coating layer 30.

Here, the high-speed injection of the metal powder is made through a compressed gas. As shown in FIG. 2, when the high pressure compressed gas is injected through the injection nozzle 100 together with the metal powder, the metal powder is coated on the joint surface of the second round bar 20. That is, the metal powder is accelerated by the supersonic jet together with the compressed gas injected through the injection nozzle 100 to be fired onto the joint surface of the target second round bar 20. The metal powder fired from the injection nozzle 100 impinges on the joint surface of the second round bar 20 at a speed (about 300 to 1300 m / sec) sufficient to be combined with plastic deformation of the material. As such, when the metal powder collides with the bonding surface of the second round bar 20 at high speed, the atomic powder is formed by the instantaneously high pressure and temperature while destroying the thin metal oxide film of the metal powder. The metal powder is to form a coating layer 30 while being bonded to the bonding surface of the second round bar (20).

Thus, by forming the coating layer 30 through the high-speed injection of the metal powder, it is possible to solve the disadvantages of the conventional spray coating to melt the powder at a high temperature.

The compressed gas may be selected from air or helium, nitrogen, or a mixture thereof.

According to the present embodiment, the metal powder is heated to a predetermined temperature before the high speed injection of the metal powder.

 The heating of the metal powder is achieved by directly heating the metal powder or by raising the temperature of the compressed gas injected with the metal powder. In this embodiment, the heating temperature of the compressed gas for heating the metal powder may be 600 ℃. As such, by increasing the temperature of the metal powder through heating of the compressed gas, the adhesion rate of the metal powder particles collided with the second round bar 20 may be increased.

In the present embodiment, the coating layer 30 formed on the second round bar 20 by the metal powder may have a thickness t of 0.1 to 5 mm. When the thickness t of the coating layer 30 is smaller than 0.1 mm, the bonding effect is lowered. When the thickness t of the coating layer 30 gradually increases, the tip area of the coating layer 30 gradually decreases. Therefore, when the thickness of the coating layer 30 is larger than 5mm, the tip area of the coating layer 30 is small so that even bonding is not achieved.

When the coating layer 30 is formed on the second round bar 20 according to the metal powder injection, the joint surface of the second round bar 20 and the joint surface of the first round bar 10 are frictionally rotated and welded to each other. )

3 illustrates a rotation friction welding process between the second round bar and the first round bar.

According to the drawings, the rotation friction welding is fixed to the second round bar 20 and the first round bar 10, respectively, the bonding surface and the first surface of the second round bar 20, the coating layer 30 is formed by a metal powder Abutting the joint surface of the round bar 10 with each other while applying a certain pressure to rotate the first round bar (10).

As the first round bar 10 rotates with respect to the second round bar 20 which is fixed, frictional heat is generated at the joint surface of both materials. Accordingly, the metal powder forming the coating layer 30 on the bonding surface of the second round bar 20 is bonded to each other by the first round bar 10 and the frictional heat, thereby forming a bonding between different conductors. (S130 to S140)

In this way, the manufacturing method is a high-speed injection of the metal powder is coated on the bonding surface of the second round bar 20 and bonded to the first round rod 10 and the rotational friction welding process to facilitate the bonding between different conductors more easily You can do it.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is a flowchart illustrating a process of manufacturing a hetero conductor sleeve according to a manufacturing method according to the present embodiment.

2 is a schematic view for explaining a step of coating a metal powder in the manufacturing method according to the present embodiment.

3 is a schematic view for explaining the step of bonding the different conductors in the manufacturing method according to the present embodiment.

Explanation of symbols on the main parts of the drawings

10: first round bar 20: second round bar

30: coating layer

Claims (5)

In the method of manufacturing a different conductor sleeve, Spraying the metal powder on the joint surface of one conductor at high speed; Forming a coating layer of the metal-based powder on the bonding surface of one conductor through the high-speed injection of the metal-based powder, Bonding by rotating friction between one conductor and the other conductor coated with a metal powder Heterogeneous conductor sleeve manufacturing method comprising a. The method of claim 1, The method of manufacturing a different conductor sleeve further comprising the step of preheating the metal-based powder before the high-speed injection of the metal-based powder. The method according to claim 1 or 2, The metal-based powder has a particle size of 1 ~ 50㎛ hetero conductor sleeve manufacturing method. The method of claim 3, wherein Coating thickness of the metal-based powder is 0.1 ~ 5mm hetero conductor sleeve manufacturing method. In the method of manufacturing a different conductor sleeve for joining the first round bar made of pure copper or copper alloy and the second round bar made of aluminum or aluminum alloy, Spraying a metal powder of copper or copper alloy on the second round bar joint surface at high speed; Forming a coating layer of the metal powder on the bonding surface of the second round bar through the high-speed spraying of the metal powder, Rotating friction welding the joining surface of the second round bar and the joining surface of the first round bar Heterogeneous conductor sleeve manufacturing method comprising a.

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