KR20100072985A - Semiconductor chip with security function and method of processing thereof - Google Patents

Abstract

PURPOSE: A semiconductor chip having security function and an operation method thereof are provided to determine forgery of the semiconductor chip by measured surrounding environment information value with a sensor which is sensitive to the outside surrounding environment. CONSTITUTION: A sensor unit(112) measures around environment information according to physical change of a semiconductor chip(100). A storage unit(111) stores initial surrounding environment information which the sensor unit measured. A control unit(113) compares the measured current surrounding environment information and the stored initial surrounding environment information. If the measured current surrounding environment information and the stored initial surrounding environment information do not match, the control unit performs preset operation informing abnormality of the semiconductor chip or stops operation of the semiconductor chip.

Description

Semiconductor chip with security function and method of processing

The present invention relates to a semiconductor chip with a security function and a method of operating the same. More specifically, the present invention relates to a semiconductor chip equipped with a hacking prevention function and an authentication function and a method of operating the same.

The present invention is derived from a study conducted as part of the IT growth engine technology development project of the Ministry of Knowledge Economy and the Ministry of Information and Telecommunications Research and Development. Develop common security core modules for services.

Semiconductor chips are essential technology for the IT industry. Various technologies have been developed to protect and defend critical and critical technologies for semiconductor chips.

Conventionally, examples of applying a technology for protecting and defending a semiconductor chip in the semiconductor chip itself have been introduced. Devices using this technology implement various semiconductor layouts to prevent the semiconductor chip from being physically penetrated. In other words, a fuse device, a sensor responding to a specific environment, and the like are implemented in a semiconductor chip to prevent physical penetration.

However, illegal users attempt to hack into the semiconductor chips in which such devices are implemented. Primarily, cloning attempts are made on critical, expensive semiconductor chips.

Therefore, there is a great need for an authentication and copy protection device for illegal use of such semiconductor chips and prevention of tampering with semiconductor chip information.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a semiconductor chip having a security function for preventing illegal use and preventing forgery and a method of operating the same.

According to one embodiment of the invention, a semiconductor chip is provided. A semiconductor chip having a security function may include environmental information according to physical changes of the semiconductor chip, wherein the environmental information may include at least one of temperature, pressure, humidity, sound, light, and physical contact with the semiconductor chip. Sensor unit for measuring the information including; A storage unit which stores initial environment information measured by the sensor unit; And compares the current surrounding environment information measured by the sensor unit with the initial surrounding environment information stored in the storage unit to determine whether to match, and if not, executes a preset operation of notifying the abnormality of the semiconductor chip or And a control unit for stopping the operation of the semiconductor chip.

According to another embodiment of the present invention, a method of operating a semiconductor chip is provided. According to a method of operating a semiconductor chip having a security function, (a) when manufacturing the semiconductor chip, the environment information according to the physical change of the semiconductor chip measured with respect to the semiconductor chip, where the environment information is temperature, Storing an initial value of information including one or more of pressure, humidity, sound, light, and a change in physical contact with the semiconductor chip; (b) comparing the surrounding environment information currently measured with respect to the semiconductor chip with the initial surrounding environment information stored in the step (a) to determine whether there is a match; And (c) executing a preset operation for notifying the abnormality of the semiconductor chip or stopping the operation of the semiconductor chip when it does not match as a result of the determination in step (b).

According to an embodiment of the present invention, whether the semiconductor chip is stable to the surrounding environment or forgery can be determined from the sensor value output corresponding to the built-in or external sensor composed of elements sensitive to the external surrounding environment.

In addition, it is possible to strengthen the security of the semiconductor chip by authenticating the semiconductor chip using a value embedded in or external to the semiconductor chip and used for identification of the semiconductor chip. In addition, the authenticity or destruction of the product attached to the semiconductor chip can be known.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification and claims, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise. In addition, the terms “… unit”, “… unit”, “module”, “block”, etc. described in the specification mean a unit that processes at least one function or operation, which is hardware or software or a combination of hardware and software. It can be implemented as.

Now, a semiconductor chip with a security function and an operation method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

According to an embodiment of the present invention, a semiconductor chip having a security function includes an authentication function for preventing illegal use and forgery of semiconductor chip information. In addition, the present invention includes a semiconductor chip copy (or hacking) prevention function for preventing a risk caused by the use of a defective semiconductor chip due to ultra-precision semiconductor copying used in space, aviation, and the like.

A configuration for implementing a security function of the semiconductor chip (hereinafter, referred to as a "security device") may be implemented in four embodiments. According to various characteristics of the semiconductor chip, the configuration of the security device may be described in various forms, and some components may be removed due to the importance of the semiconductor chip.

≪ Example 1 >

1 is a block diagram showing a configuration of a security device of a semiconductor chip according to a first embodiment of the present invention.

As shown in FIG. 1, the security device 110 of the semiconductor chip 100 according to the first embodiment includes a storage 111, a sensor 112, and a controller 113.

The storage 111 may be implemented in the form of a memory such as a read only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a random access memory (RAM), and a one-time programmable EPROM (OTP) memory. The storage 111 stores initial peripheral environment information about the semiconductor chip 100 measured before the semiconductor chip 100 is manufactured and supplied to the user. Here, the initial environment information is an initial value of the environment information of the semiconductor chip 100, and the environment information refers to information according to physical changes of the semiconductor chip. This is information that includes one or more of changes in temperature, pressure, humidity, sound, light, and physical contact with the semiconductor chip. Temperature, pressure, humidity, sound and light are measured by their respective sensors. For example, when using a resistance temperature sensor, the resistance (impedance) value changes as the temperature changes. In addition, the change due to physical contact with the semiconductor chip refers to a change in physical value, that is, resistance value, of the semiconductor chip when a hacker contacts the semiconductor chip and damages the semiconductor chip to illegally use the semiconductor chip.

The sensor unit 112 measures environmental information about the semiconductor chip 100. The sensor unit 112 measures initial surrounding environment information or current surrounding environment information and outputs it to the controller 113.

The controller 113 is connected to the storage 111 and the sensor 112 to control various signal processing for the security function of the semiconductor chip 100. The control unit 113 stores the initial surrounding environment information output from the sensor unit 112 in the storage unit 111. In addition, the current surrounding environment information output from the sensor unit 112 and the initial surrounding environment information read out from the storage unit 111 are compared to determine whether there is a match. In this case, if it is determined that the case does not match, the predetermined operation for notifying the abnormality of the semiconductor chip 100 is executed or the operation of the semiconductor chip 100 is stopped.

The controller 113 may indicate whether the semiconductor chip 100 is abnormal through various physical measures. Physical measures include inducing a change in impedance (resistance, pattern, inductance) value on any predefined pin of semiconductor chip 100. Here, the change in impedance means that the control signal of the controller is changed to "0" or "1" to change the value of the resistor, the capacitor, and the inductance. In this case, since the physically changed value is measured by using the measuring device directly on the semiconductor chip 100, it is possible to recognize the abnormality of the semiconductor chip 100.

In addition, the physical measures include generating a specific signal predefined in the input and output of the semiconductor chip 100. For example, it generates a reset signal or generates a signal of "1" or "0" defined at the input / output terminal, thereby indicating that there is a problem in the semiconductor chip 100. In addition, physical measures include disabling the semiconductor chip 100.

<Example 2>

2 is a block diagram showing the configuration of a security device for a semiconductor chip according to a second embodiment of the present invention.

As shown in FIG. 2, the security device 110 of the semiconductor chip 100 according to the second embodiment includes the display unit 114 in addition to the configuration of FIG. 1. Since the same structure as FIG. 1 was demonstrated above, the description is abbreviate | omitted.

When an abnormality of the semiconductor chip 100 is found as a result of the determination of the controller 113, the display unit 114 performs a display operation of notifying the outside of the semiconductor chip 100 so that a person can visually determine whether the semiconductor chip 100 is abnormal.

The display unit 114 may be embodied in a form small in the semiconductor chip 100. In this case, the light emitting diode may be implemented as a material whose color is changed by a predetermined voltage or current. This may be made by mounting the semiconductor chip 100 when the semiconductor chip 100 is manufactured. Embedded semiconductor chip 100 refers to the semiconductor chip 100 itself.

In addition, the display unit 114 may be implemented in a form largely external to the semiconductor chip 100. As such, the external display 114 may be colored by a light-emitting diode (LED), a liquid crystal display (LCD), a 7-segment, an arbitrary voltage or current at a terminal (or a pin terminal) of the semiconductor chip 100. By connecting a change material and the like can indicate whether the chip is abnormal.

<Example 3>

3 is a block diagram showing the configuration of a security device for a semiconductor chip according to a third embodiment of the present invention.

As shown in FIG. 3, the security device 110 of the semiconductor chip 100 according to the third embodiment includes a security unit 115 in addition to the configuration of FIGS. 1 and 2. 1 and 2 have been described above, the description thereof will be omitted.

The security unit 115 encrypts or decrypts the surrounding environment information output from the sensor unit 112 and input through the control unit 113 and the initial surrounding environment information output from the storage unit 111 and input through the control unit 113. Perform the function. At this time, the security unit 115 encrypts the initial environment information to be stored in the storage unit 111 and stores it in the storage unit 111, and decrypts the initial environment information from the storage unit 111 when reading out the control unit 113 Will output The configuration of the security unit 115 may be used when the semiconductor chip 100 is an expensive or very important chip.

<Example 4>

4 is a block diagram showing the configuration of a security device for a semiconductor chip according to a fourth embodiment of the present invention.

As shown in FIG. 4, the security device 110 of the semiconductor chip 100 according to the fourth embodiment includes an input / output interface unit 116 in addition to the configuration of FIGS. 1, 2, and 3. 1, 2, and 3 have been described above, the description thereof will be omitted.

The input / output interface unit 116 is a communication module that processes reliable information of the semiconductor chip 100 through the input / output interface terminal of the security device 110 of the semiconductor chip 100. The input / output interface unit 116 is connected to the control unit 113 to communicate with an external device 200 of the semiconductor chip 100 to verify the reliability of the semiconductor chip 100. That is, information for authenticating whether the semiconductor chip 100 is a legitimate chip, not a duplicated chip, is transmitted and received with the external device 200. Through the input / output interface 116, the security device 110 of the semiconductor chip 100 may be used in various ways, such as cell phone replication, battery replication, and core chip replication.

In addition, the input / output interface unit 116 may include a serial communication module, that is, a universal asynchronous receiver / transmitter (UART), I2C, general purpose input / output (GPIO), universal serial bus (USB), and the like.

5 is a block diagram illustrating a detailed configuration of the sensor unit 112 described with reference to FIGS. 1 to 4.

As shown in FIG. 5, the sensor unit 112 includes a sensor 112a and a sensor signal processing module 112b.

The sensor 112a generates an analog signal of ambient environment information or initial ambient environment information measured by being embedded or external to the semiconductor chip.

The sensor signal processing module 112b is connected to the sensor 112a, converts an analog signal output from the sensor 112a into a digital signal, and outputs the digital signal to the controller 113. The sensor signal processing module 112b converts the digital value of a predetermined specific bit (or N bit).

6 and 7 illustrate an embodiment of the input / output interface unit 116 described with reference to FIG. 4. At this time, the identification information of the semiconductor chip 100 for verifying the reliability of the semiconductor chip 100 is implemented in the form of a radio frequency identification (hereinafter referred to as "RFID") tag form.

6 shows an input / output interface unit 116 according to the first embodiment of the present invention.

As shown in FIG. 6A, the input / output interface unit 116 according to the first embodiment represents an RFID tag embedded in a package of the semiconductor chip 100. In this case, the RFID tag considers the package state, and in particular, inserts an RFID tag operating in a high frequency (HF), ultrahigh frequency (UHF), and VUHF band into the package to prevent duplication of a semiconductor chip. RFID tags can be made passive and semi-active. The RFID tag is mounted on a portion allowed by space in the package. In other words, it can be said to be a packageless contactless RFID tag. Since the semiconductor chip 100 is embedded in the package, the authenticity of the semiconductor chip can be easily determined by recognizing the RFID tag ID of the semiconductor chip 100 using an RFID reader.

However, in order to hack the semiconductor chip 100 instead of the replication of the semiconductor chip 100 itself, only the package may be removed and duplicated. In this case, RFID tags embedded in the package alone cannot protect against semiconductor duplication. Therefore, the sensor can be inserted and processed to prevent the enhanced semiconductor copying as illustrated in FIGS. 6B and 6C. In this case, the sensor may be located at the exterior of the semiconductor chip package as shown in FIG. 6B or may be located at the inside of the semiconductor chip package as shown in FIG. 6C to have any random value predefined. In this case, the sensor unit 112 and the RFID tag chip of the semiconductor chip is composed of one semiconductor chip 100, but the sensor is separately configured as shown in FIGS. 6B and 6C. That is, the sensor is located at a portion of the semiconductor chip package in the semiconductor chip 100. The sensor and the RFID tag are connected through a pad.

In this case, the sensor may store the N bit (N natural number) data in the storage 111 of the semiconductor chip 100 or in an RFID reader which is an external device. At this time, the stored value is an initial value. The semiconductor chip 100 is sold in the state where the initial value is stored and used in the market.

7 shows an input / output interface unit 116 according to a second embodiment of the present invention.

As shown in FIG. 7, the input / output interface unit 116 according to the second embodiment is equipped with an RFID antenna in an external package of the semiconductor chip 100. The RFID tag chip is connected to the RFID antenna and stored inside the semiconductor chip to store identification information for authenticating the semiconductor chip. The RFID chip and the sensor unit are embedded in the semiconductor chip, and the semiconductor chip 100 and the RFID antenna are connected in the pad.

7A illustrates a form in which an RFID antenna is mounted inside a package of a semiconductor chip, and FIG. 7B illustrates a form in which an RFID antenna is mounted outside a package of a semiconductor chip or on a semiconductor chip mounting board.

Next, a method of operating a semiconductor chip according to each of the first and third embodiments will be described.

8 is a flowchart illustrating a method of operating a semiconductor chip according to a first embodiment of the present invention.

As shown in FIG. 8, according to the method of operating a semiconductor chip according to the first exemplary embodiment of the present invention, it is largely divided into an initial stage and a use stage.

In the initial stage, the control unit 113 of FIG. 1 requests the sensor unit 112 of FIG. 1 to measure initial ambient environment information (S101) and receives an initial sensor value (which means the same as the initial ambient environment information) ( S103).

The controller 113 transmits the initial sensor value received in step S103 to the storage unit 111 of FIG. 1 (S105). The storage unit 111 stores the initial sensor value received in step S105 (S107).

Subsequently, when the controller 113 recognizes the occurrence of the authentication situation, that is, whether the semiconductor chip (100 in FIG. 1) needs to be copied (S109), the control unit 112 requests the sensor unit 112 to measure the surrounding environment information (S111). In response to the authentication sensor value (meaning the same meaning as the surrounding environment information) is received (S113).

The control unit 113 requests the storage unit 111 to store the initial sensor value stored in step S107 (S115). The storage unit 111 reads out the stored initial sensor value (S117) and transmits the stored initial sensor value to the control unit 113 (S119).

The controller 113 compares the authentication sensor value received in step S113 with the initial sensor value received in step S119 (S121) and determines whether there is a match (S123).

If it is determined in step S123 that the controller 113 matches, the controller 113 permits authentication of the semiconductor chip 100. That is, the semiconductor chip 100 determines not to be a duplicated chip but a chip having a right to use.

On the other hand, if it is determined that the case does not match in step S123, the control unit 113 executes a predetermined physical action on the semiconductor chip 100.

9 is a flowchart illustrating a method of operating a semiconductor chip according to a second embodiment of the present invention.

As shown in FIG. 9, according to the method of operating a semiconductor chip according to the second exemplary embodiment of the present invention, the method is divided into an initial stage and a use stage, as in FIG. 8.

At the manufacturing time before the semiconductor chip 100 is provided to the user, the controller (113 of FIG. 3) requests the sensor unit 112 (S201) and receives a response (S203). ) Is transmitted to the security unit (115 of FIG. 3) (S205). The security unit 115 encrypts the received initial sensor value (S207) and transfers the stored sensor (111 in FIG. 3) (S209). The storage 111 stores the received encrypted initial sensor value (S211).

Subsequently, when the occurrence of the authentication situation for the semiconductor chip 100 is recognized (S213), the controller 113 requests a sensor sensor 112 (which has the same meaning as the surrounding environment information) and receives a response (S215) ( S217).

The control unit 113 requests the encrypted initial sensor value stored in S209 from the storage 111 (S219). The storage unit 111 reads out the stored initial sensor value (S221) and transmits it to the security unit 115 (S223).

The security unit 115 decrypts the received encrypted initial sensor value (S225) and transmits the encrypted initial sensor value to the control unit 113 (S227).

The control unit 113 compares the decoded initial sensor value received in step S227 with the authentication sensor value received in step S217 (S229), and determines whether there is a match (S231).

As a result of the determination in step S231, if there is a match, the controller 113 allows authentication of the semiconductor chip 100, and if it does not match, the controller 113 executes a predetermined physical action on the semiconductor chip 100.

The embodiment of the present invention is not implemented only through the above-described apparatus and / or method, but may be implemented through a program or a recording medium on which the program is recorded, which realizes a function corresponding to the configuration of the embodiment of the present invention. Such an implementation can be easily implemented by those skilled in the art from the description of the above-described embodiments.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

1 is a block diagram showing the configuration of a security device for a semiconductor chip according to a first embodiment of the present invention.

2 is a block diagram showing the configuration of a security device for a semiconductor chip according to a second embodiment of the present invention.

3 is a block diagram showing the configuration of a security device for a semiconductor chip according to a third embodiment of the present invention.

4 is a block diagram showing the configuration of a security device for a semiconductor chip according to a fourth embodiment of the present invention.

5 is a block diagram illustrating a detailed configuration of the sensor unit described with reference to FIGS. 1 to 4.

6 shows an input / output interface unit according to a first embodiment of the present invention.

7 illustrates an input / output interface unit according to a second embodiment of the present invention.

8 is a flowchart illustrating a method of operating a semiconductor chip according to a first embodiment of the present invention.

9 is a flowchart illustrating a method of operating a semiconductor chip according to a second embodiment of the present invention.

Claims (12)

In a semiconductor chip with a security function, A sensor unit measuring ambient environment information according to physical changes of the semiconductor chip; A storage unit which stores initial environment information measured by the sensor unit; And Compares the current surrounding environment information measured by the sensor unit with the initial surrounding environment information stored in the storage unit to determine whether to match, and if it does not match, executes a predetermined operation for notifying the abnormality of the semiconductor chip or the semiconductor Control unit to stop the operation of the chip Semiconductor chip comprising a. The method of claim 1, The sensor unit includes: A sensor for measuring environmental information of the semiconductor chip and generating an analog signal of the measured environmental information; And A sensor signal processing module connected to the sensor and converting the analog signal output from the sensor into a digital signal having a predetermined specific bit value and outputting the digital signal to the controller A semiconductor chip comprising a. The method of claim 1, And the surrounding environment information is information including one or more of temperature, pressure, humidity, sound, light, and changes due to physical contact with the semiconductor chip. The method according to any one of claims 1 to 3, A display unit for performing a display operation of informing the outside of the abnormality of the semiconductor chip when the abnormality of the semiconductor chip is found as a result of the determination of the controller; A security unit which encrypts the initial surrounding environment information and stores it in the storage unit, decrypts the initial surrounding environment information from the storage unit, and outputs the initial surrounding environment information to the controller; And Input / output interface unit for transmitting and receiving information for authentication of the semiconductor chip in cooperation with an external device under the control of the controller The semiconductor chip further comprises one or more of. The method of claim 4, wherein The input and output interface unit, And a radio frequency identification tag chip mounted on the package of the semiconductor chip. The method of claim 4, wherein The input and output interface unit, A radio frequency identification tag antenna mounted on the package of the semiconductor chip or mounted outside the package of the semiconductor chip; And A radio frequency identification tag chip connected to the radio frequency identification tag antenna and stored in the semiconductor chip to store identification information for authenticating the semiconductor chip. A semiconductor chip comprising a. In the method of operating a semiconductor chip with a security function, Storing an initial value of surrounding environment information according to a physical change of the semiconductor chip measured for the semiconductor chip when the semiconductor chip is manufactured; Comparing the surrounding environment information currently measured with respect to the semiconductor chip with the initial surrounding environment information stored in the storing step, and determining whether or not there is a match; And As a result of the determination, in the case of mismatching, executing a predetermined operation for notifying the abnormality of the semiconductor chip or stopping the operation of the semiconductor chip Method of operating a semiconductor chip comprising a. The method of claim 7, wherein The stopping step is, A method of operating a semiconductor chip, the method comprising inducing a change in an impedance value to a predetermined specific pin for notifying an abnormality of the semiconductor chip or generating a specific signal predefined at an input / output of the semiconductor chip. 9. The method according to claim 7 or 8, The stopping step is, And performing a predefined display operation of informing the outside of the abnormality of the semiconductor chip. 10. The method of claim 9, The determining step, And reading out and decrypting the initial ambient environment information which is encrypted and stored in the storing step, and comparing the decrypted initial environment information with the surrounding environment information. The method of claim 10, At the request of an external device, providing the external device with radio frequency identification tag information necessary to perform an authentication procedure of the semiconductor chip; Method of operating a semiconductor chip further comprising. The method of claim 11, And the surrounding environment information is information including one or more of temperature, pressure, humidity, sound, light, and a change in physical contact with the semiconductor chip.

Images