KR20100052105A

KR20100052105A - Plasma display panel

Info

Publication number: KR20100052105A
Application number: KR1020080110986A
Authority: KR
Inventors: 정재상
Original assignee: 엘지전자 주식회사
Priority date: 2008-11-10
Filing date: 2008-11-10
Publication date: 2010-05-19

Abstract

PURPOSE: A plasma display panel and a manufacturing method thereof are provided to improve the reliability of a plasma display panel by reducing the misdischarge and the afterimage due to the impurity existing in a discharge cell. CONSTITUTION: A first substrate(61) comprises an address electrode(69), a first dielectric layer(63), and a partition wall(65). A second substrate(51) is combined with the first substrate while the partition wall is arranged between the second substrate and the first substrate. The second substrate comprises a sustain electrode pair(53), a second dielectric layer(55), and a protective film(57). A fluorescent material layer(67) is formed within the discharge cell between the partition wall and the partition wall. A gas barrier layer(70) is formed on at least one surface among the fluorescent layer surface and the partition surface. The gas barrier layer is formed to at least one among the silica gel, the bauxite, and the activated charcoal.

Description

Plasma display panel and manufacturing method thereof

The present invention relates to a plasma display panel, and more particularly, to a plasma display panel capable of removing impurities in a discharge cell and a method of manufacturing the same.

In general, a plasma display panel is a device for realizing a predetermined image by exciting a phosphor with ultraviolet rays generated by gas discharge. The plasma display panel may be classified into an AC type and an AC type.

The AC plasma display panel has a structure in which an electrode formed in a discharge space is not covered by a dielectric and is not exposed, and the DC plasma display panel has a structure in which an electrode formed in a discharge space is exposed.

Currently, an AC plasma display panel is generally widely used, and an AC plasma display panel is largely composed of a back substrate and a front substrate, and has a structure having discharge cells serving as discharge spaces therebetween.

In this case, an address electrode and a dielectric layer are formed on the rear substrate, a partition wall is formed on the dielectric layer to distinguish discharge cells, and a phosphor layer is formed in the discharge cell divided by the partition wall.

A sustain electrode pair consisting of a pair of transparent electrodes and a bus electrode is formed on the front substrate in a direction crossing the address electrode, and a dielectric layer and a protective film are formed on the front substrate including the sustain electrode pair.

The rear substrate and the front substrate thus constructed are joined by a sealing material, thereby completing the plasma display panel.

The plasma display panel has a high resolution and large screen configuration, and has been spotlighted as a next generation thin display device.

An object of the present invention is to provide a plasma display panel capable of removing impurities present in a discharge cell using a gas barrier layer made of a porous material, and a method of manufacturing the same.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above are clearly understood by those skilled in the art from the following descriptions. Could be.

According to the present invention, a plasma display panel includes a first substrate having an address electrode, a first dielectric layer, and a partition wall, and a second substrate having a sustain electrode pair, a second dielectric layer, and a passivation layer coupled to the first substrate with a partition wall therebetween. A phosphor layer formed in a discharge cell between the partition walls and the partition walls, and a gas barrier layer formed on at least one surface of the phosphor layer surface and the partition wall surface and formed of at least one of silica gel, bauxite, and activated carbon. Can be configured.

Here, the thickness of the gas barrier layer is 1 to 90um, the particle size of the gas barrier layer is 2-6um, the spacing between the particles may be 0.01-10um.

In addition, the gas barrier layer may be formed on a portion of the surface of the phosphor layer to expose a portion of the surface of the phosphor layer, or may be formed on a portion of the surface of the barrier rib so that a portion of the surface of the barrier layer is exposed.

In addition, the surface of the gas barrier layer may have an uneven shape.

Meanwhile, a method of manufacturing a plasma display panel according to the present invention includes a first substrate having an address electrode, a first dielectric layer, a partition wall, and discharge cells divided by the partition wall, a second electrode having a sustain electrode pair, a second dielectric layer, and a protective film. Preparing a substrate, forming a phosphor layer in a discharge cell, mixing a vehicle, powder made of at least one of silica gel, bauxite, and activated carbon to form a gas barrier paste, and forming a gas barrier paste on the surface of the phosphor layer. And applying to at least one of the surfaces of the barrier ribs, drying and firing the applied gas barrier paste to form a gas barrier layer, and bonding the first substrate and the second substrate to each other. .

Here, the gas barrier paste may include a powder having 0.1 to 10% by weight and a vehicle having a 90 to 99.9% by weight.

Other objects, features and advantages of the present invention will become apparent from the following detailed description of embodiments taken in conjunction with the accompanying drawings.

The plasma display panel and the manufacturing method according to the present invention has the following effects.

The present invention can remove impurities present in the discharge cell by forming a gas barrier layer made of a porous material on the partition wall and the phosphor layer.

Therefore, by reducing misdischarges and residual images due to impurities present in the discharge cells, the reliability of the plasma display panel can be improved and the overall quality can be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In general, a plasma display panel is discharged under the influence of an electric field like a fluorescent lamp.

The gas present in the plasma display panel is a mixed gas of He, Ne, and Xe having a pressure of several hundred torr, and the purity is very important.

In the case of fluorescent lamps, it is well known that the discharge voltage is increased by about 2 times with hydrogen gas within about 1%.

Impurities such as H20, H2, O2, CO, and CO2 may be present in the plasma display panel, and the impurities may adversely affect discharge characteristics such as discharge start voltage, driving voltage, and luminance.

In particular, in the case of H2O, the metal of the DC plasma display panel may be oxidized, and may be adsorbed onto the MgO thin film of the AC plasma display panel to reduce the efficiency of the panel and to cause an erroneous discharge.

Thus, a getter can be used to remove such impurities.

1 is a view showing the position of the getter formed in the plasma display panel, Figure 2 is a view showing the diffusion of impurities present in the discharge cell, as shown in Figure 1, the getter is around the discharge region of the plasma display panel It can be located in the to remove the impurities generated in the discharge region.

However, getters located around the discharge region may not be very effective at removing impurities.

The reason is that in the case of the AC plasma display panel, the conductance due to the partition wall is not good, and as shown in FIG. 2, when impurities caused by the discharge exist in the discharge cell space or diffuse into the adjacent discharge cells, they may cause erroneous discharge. This can adversely affect the efficient and stable discharge.

Therefore, in order to remove impurities in the plasma display panel, a new direction approach may be required.

3 is a view illustrating a plasma display panel according to the present invention. As shown in FIG. 3, the present invention provides a first substrate 61 having an address electrode 69, a first dielectric layer 63, and a partition wall 65. ) And a second substrate 51 having a sustain electrode pair 53, a second dielectric layer 55, and a protective film 57, wherein the second substrate 51 has a partition 65 therebetween. It is coupled with the first substrate 61.

In the discharge cell between the partition wall 65 and the partition wall 65, the phosphor layer 67 is formed, and the gas barrier layer 70 is formed on at least one of the surface of the phosphor layer 67 and the partition wall 65. Is formed.

Here, the gas barrier layer 70 is made of a porous material to remove impurities such as H20, H2, O2, CO, CO2, etc. present in the discharge cell.

In the present invention, at least one of silica gel, bauxite, and charcoal may be used.

The reason for using these materials is that there are pores of various sizes in the material, which can absorb impurities into the pores.

Here, the silica gel, bauxite, activated carbon may include micropores having a size of about 0.7-2.0 nm, mesopores having a size of about 2.0-50 nm, and macropores having a size of about 50 nm or more.

Among the materials used as the gas barrier layer 70 of the present invention, in particular, silica gel is made by artificially dehydrating silicic acid, so that impurities such as moisture may be absorbed well by the nature of returning to nature.

In addition, since the silica gel has a property of sucking water in chemical equilibrium with respect to the artificially dehydrated portion, it may serve as a hygroscopic material.

The silica gel is an amorphous xerogel in which silicic acid is intricately bonded in three dimensions. The component is SiO.nH 2 O, and the number of water molecules may vary depending on conditions.

In general, most of silicic acid present in nature is produced by silica gel, and synthetic silica gel may be prepared by gelling silica sol obtained by metathesis of water glass (sodium silicate) aqueous solution and sulfuric acid or hydrochloric acid.

Silica gel is usually colorless and granular, and has a specific gravity of about 2.2-2.3. It is resistant to acids but slowly soluble in dark base solutions.

In addition, the silica gel has a strong adsorption force on most substances such as water vapor and ammonia gas, and may also be used as a desiccant, dehydrating agent, chromatography adsorbent, catalyst, and lubricating body.

Subsequently, bauxite and activated carbon in addition to silica gel have similar characteristics to silica gel, and when applied to the gas barrier layer 70 of the present invention, it is very effective in removing impurities.

The gas barrier layer 70 of the present invention may be manufactured by mixing a powder of at least one of silica gel, bauxite, and activated carbon in a vehicle to produce a gas barrier paste, and then drying and baking the same.

Here, the composition ratio of the gas barrier paste may be composed of a powder having about 0.1-10% by weight and a vehicle having a weight ratio of about 90-99.9%.

The gas barrier paste is then subjected to a drying process for about 5 to 90 minutes in a temperature range of about 20 to 90 degrees, followed by a firing process for about 30 to 60 minutes in a temperature range of about 100 to 400 degrees, thereby forming a phosphor layer and a partition wall. The gas barrier layer 70 including powder particles such as silica gel, bauxite, activated carbon and the like remains on the surface.

The gas barrier layer 70 of the present invention may be formed of a single material of any one of silica gel, bauxite, and activated carbon, or may be mixed and used in some cases.

In addition, the thickness of the gas barrier layer 70 is preferably about 1-90um.

The reason for this is that when the thickness of the gas barrier layer 70 is about 1 μm or less, impurity removal performance may deteriorate and residual images and mis-discharge may occur. When the thickness of the gas barrier layer 70 is about 90 μm or more, the color of the phosphor Deterioration of the characteristics and instability of the discharge may be caused to lower the luminescence brightness.

In addition, the particle size of the gas barrier layer 70 may be about 2-6um, and the spacing between particles may be about 0.01-10um.

Here, the interval between the incident and the particles may vary depending on the content of the powder particles contained in the gas barrier paste.

That is, when the content of the powder particles contained in the gas barrier paste is small, the distance between the particles and the particles is far, and when the content of the powder particles contained in the gas barrier paste is large, the distance between the particles and the particles becomes closer.

Although not shown in FIG. 3, a buffer layer may be further formed between the phosphor layer 67 and the gas barrier layer 70 in the discharge cell of the plasma display panel.

Here, the buffer layer may be formed of a mixture of the material of the phosphor layer 67 and the material of the gas barrier layer 70.

In this case, the material ratio of the phosphor layer 67 and the material ratio of the gas barrier layer 70 are equal to each other, and the lower region of the buffer layer adjacent to the phosphor layer 67 is the material ratio of the phosphor layer 67. It is larger than the material ratio of the gas barrier layer 70, and the upper region of the buffer layer adjacent to the gas barrier layer 70 may form less material ratio of the phosphor layer 67 than the material ratio of the gas barrier layer 70. Can be.

As described above, the reason why the buffer layer is formed between the phosphor layer 67 and the gas barrier layer 70 is that the adhesion between the phosphor layer 67 and the gas barrier layer 70 can be improved, and the phosphor layer 67 is formed. This is because deterioration of color characteristics of the phosphor and instability of discharge due to the gas barrier layer 70 covering the top surface can be prevented.

In addition, the gas barrier layer 70 of the present invention may be further formed on the passivation layer 57 of the second substrate 51 facing the discharge cell.

When the gas barrier layer 70 is further formed on the passivation layer 57 in the discharge cell, the effect of removing impurities in the discharge cell may be better than that of the structure formed only on the phosphor layer 67 and the partition wall 65.

Experiment results on this will be described later.

4 and 5 illustrate another embodiment according to the present invention. As shown in FIG. 4, the gas barrier layer 70 may be formed only on a part of the entire surface of the phosphor layer 67 and the partition wall 65. Alternatively, as shown in FIG. 5, the surface of the gas barrier layer 70 may be formed in an uneven form.

The gas barrier layer 70 of FIG. 4 may be formed on a portion of the surface of the phosphor layer so that a portion of the surface of the phosphor layer 67 is exposed. It may be formed.

As shown in FIG. 4, the reason for forming the gas barrier layer 70 is not only to prevent degradation of color characteristics and instability of the discharge due to the gas barrier layer 70 covering the phosphor layer 67. This is because the surface area of the gas barrier layer 70 may be increased to be more effective for removing impurities.

In addition, the gas barrier layer 70 of FIG. 5 is manufactured in a concave-convex shape in order to further increase the surface area.

In order to maximize the surface area, the gas barrier layer 70 of FIG. 5 may have the same surface area of the convex region and the area of the concave region.

As shown in FIG. 5, the gas barrier layer 70 having a concave-convex surface has a large surface area and is very effective for removing impurities.

As described above, the manufacturing method of the plasma display panel according to the present invention is as follows.

First, as shown in FIG. 1, a sustain electrode pair 53 including a transparent electrode and a bus electrode is formed on the second substrate 51.

Here, the first substrate 51 is manufactured by milling and cleaning the glass or soda-lime glass for the display substrate.

The transparent electrode is formed of ITO, SnO 2, or the like by a photoetching method by sputtering, a lift-off method by CVD, or the like.

Subsequently, the bus electrode may use a material containing a general-purpose conductive metal and a noble metal.

The bus electrode material may be prepared by mixing a universal conductive metal and a noble metal to form a paste, and may form a core of the universal metal and a noble metal layer on the surface.

Then, the second dielectric layer 55 is formed on the sustain electrode pair 53.

Here, the second dielectric layer 55 is laminated by a material including low melting glass or the like by screen printing, coating or laminating a green sheet.

In addition, the bus electrode material and the second dielectric layer 55 may be fired. Each of the bus electrode material and the second dielectric layer 55 may be fired in a separate process, but may be fired in one process to simplify the process.

In this case, the firing temperature is preferably about 500 to 600 degrees. When the firing process of the bus electrode and the second dielectric layer 55 is performed together, the amount of bus electrode material that is oxidized can be reduced by blocking the dielectric between oxygen and the bus electrode. have.

Next, the passivation layer 57 is deposited on the second dielectric layer 55.

The protective film 57 may be made of magnesium oxide, and may include silicon as a dopant, and the protective film 57 may be formed by chemical vapor deposition (CVD), electron beam (E-beam), or ion plating (Ion-). It can be formed by plating), sol-gel method, sputtering method and the like.

In some cases, the gas barrier layer 70 may be further formed on the surface located in the discharge cell among the entire surfaces of the protective film 57.

The gas barrier layer 70 will be described later.

Next, an address electrode 69 is formed on the first substrate 61.

Here, the first substrate 61 may be formed of a display substrate glass or soda-lime glass by processing such as milling or cleaning, and the address electrode 69 may be formed of silver (Ag) or the like. It can be formed by a screen printing method, a photosensitive paste method or a photoetching method after sputtering.

In addition, the address electrode 69 can be formed using a general purpose conductive metal and a noble metal, and the specific process is the same as that of the bus electrode mentioned above.

The first dielectric layer 63 is formed on the address electrode 69.

Here, the dielectric layer 63 may be formed of a material including a low melting point glass and a filler such as TiO2 by screen printing or laminating green sheets, and the dielectric layer 63 may be used to increase the luminance of the plasma display panel. It is preferable to show white.

In order to simplify the process, the dielectric layer 63 and the address electrode 69 may be fired in one process.

Subsequently, a partition wall 65 for separating each discharge cell is formed.

First, a partition material is prepared, and a solvent, a dispersant, a parent glass, and a porous filler are mixed and milled.

Here, as the base glass, there are flexible base glass and lead-free base glass, and the lead base glass includes ZnO, PbO and B2O3, and the like, and the lead-free base glass includes ZnO, B2O3, BaO, SrO, CaO, and the like. As the filler, oxides such as SiO 2 and Al 2 O 3 are used.

Next, a partition material is applied over the first dielectric layer 63.

Here, the coating of the partition material may be performed by a spray coating method, a bar coating method, a screen printing method, a green sheet method, or the like, and is preferably made of green and laminated. Can be.

The partitioning material may be sanded, etched, or photosensitive.

In order to pattern the barrier material, first, a dry film resist (DFR) is formed on the barrier material at predetermined intervals.

Here, the DFR is preferably formed at the position where the partition wall is to be formed.

Subsequently, when the etchant is injected from the upper portion of the DFR, the partition material of the portion not provided with the DFR is gradually etched and patterned in the form of the partition wall 65.

Then, the DFR is removed, the etching liquid is removed through the washing process, and then the firing process is completed to complete the structure of the partition wall 65.

Here, the partition wall 65 may be formed of a striate type, a well type, a delta type, or the like.

Subsequently, the phosphor layer 67 is applied to the first dielectric layer 63 and the side walls of the partition wall 65 in the discharge cell.

In the phosphor layer 67, red, green, and blue phosphors are sequentially applied in accordance with each discharge cell, and are applied by screen printing or photosensitive paste.

For example, Y (V, P) O4: Eu, or (Y, Gd) BO3: Eu may be used as the red phosphor, and Zn2SiO4: Mn, (Zn, A) 2SiO4: Mn (A May be selected from the group consisting of alkali metals) and mixtures thereof.

Further, green phosphor, BaAl 12 O 19: Mn, (Ba, Sr, Mg) OaAl 2 O 3: Mn (an integer from a = 1 to 23), MgAlxOy: Mn (x = 1 to 10, y = 1 to 30), LaMgAlxOy: Tb, At least one phosphor selected from the group consisting of Mn (x = 1-14, y = 8-47), and ReBO3: Tb (Re is at least one rare earth element selected from Sc, Y, La, Ce, and Gd); It can also be mixed and used.

As the blue phosphor, BaMgAl 10 O 17: Eu, CaMgSi 2 O 6: Eu, CaWO 4: Pb, Y 2 SiO 5: Eu or a mixture thereof may be used.

Next, a gas barrier paste is formed on at least one of the surface of the phosphor layer 67 and the surface of the partition wall 65.

Here, the gas barrier paste may be prepared by mixing a powder of at least one of silica gel, bauxite, and activated carbon in a vehicle.

The powder used for the gas barrier paste is a porous material to remove impurities such as H20, H2, O2, CO, CO2, etc. present in the discharge cell, such as silica gel, bauxite, and charcoal. At least any one of) can be used.

The vehicle may be used alone, such as ethanol, or may be made by mixing an organic binder and a solvent.

Here, when the organic binder and the solvent are mixed, the organic binder having about 5 to 80% by weight and the solvent having about 20 to 95% by weight may be mixed.

The organic binder is an organic polymer, and may be a cellulose polymer, an acrylic polymer, a vinyl polymer, or the like, and the solvent may be an organic solvent such as benzene, alcohol, chloroform, ester, cyclohexanone, N, N-dimethylacetamide, acetonitrile, or the like. It may be a solvent, or may be a water-soluble solvent such as water, aqueous potassium sulfate solution, and magnesium sulfate aqueous solution, and may be used alone or in combination of two or more thereof.

As such, a gas barrier paste is prepared by mixing a powder made of at least one of silica gel, bauxite, and activated carbon with the prepared vehicle.

Here, the gas barrier paste consists of a powder having about 0.1-10% by weight and a vehicle having a ratio of about 90-99.9% by weight.

The fabricated gas barrier paste is applied on at least one of the surface of the phosphor layer 67 and the partition wall 65. The coating method is spray method, screen printing method, doctor blade method. (doctor blade method, dip method, reverse roll method, direct roll method, gravure method, extrusion method, brush method, etc. It can be carried out by selecting from, it is preferable to use a spray method.

Next, the gas barrier paste is subjected to a drying process for about 5 to 90 minutes at a temperature range of about 20 to 90 degrees, followed by a firing process for about 30 to 60 minutes at a temperature range of about 100 to 400 degrees.

If the firing temperature is too low or the firing time is too short, it is difficult to remove other materials from the gas barrier paste other than pure powder particles. If the firing temperature is too high or the firing time is long, deterioration of the gas barrier paste may occur. have.

As such, after the drying and firing process, the gas barrier layer 70 including powder particles such as silica gel, bauxite, activated carbon, and the like remains on the surface of the phosphor layer 67 and the partition wall 65.

As described above, the gas barrier layer 70 of the present invention may be formed of a single material of any one of silica gel, bauxite, and activated carbon, or may be mixed and used in some cases.

Then, the second substrate 51 is bonded and sealed to the first substrate 61 with the partition wall 65 therebetween, and after discharge of impurities therein, the discharge gas 160 is injected.

Here, the sealing process is performed by screen printing, dispensing, or the like.

Subsequently, when the sealing material is fired, in the firing process, the organic matter contained in the sealing material is removed, and the first substrate 61 and the second substrate 51 are bonded to each other.

In this firing process, the width of the sealing material may be wider and the height may be lowered.

In addition, the sealing material can also be formed and used for the upper board or lower board in the form of a sealing tape.

In addition, when the aging process is performed on the bonded first and second substrates 61 and 51, the characteristics of the protective film may be improved.

In addition, a front filter may be formed on the second substrate 51, and the front filter is provided with an electromagnetic shielding film for shielding electromagnetic radiation emitted from the panel to the outside.

The electromagnetic shielding film may be patterned in a specific form in order to shield electromagnetic waves while ensuring the visible light transmittance required by the display device.

In addition, a near infrared shielding film, a color correction film, an antireflection film, and the like may be formed on the front filter.

Thus, the preferable Example and comparative example of this invention produced are described.

The following examples are only examples of the present invention, and the present invention is not limited by the following examples.

First embodiment

A gas barrier paste containing silica gel powder having 0.5% by weight was applied on the phosphor layer and the partition wall, dried at 50 ° C for 30 minutes, and then fired at 300 ° C for 40 minutes to form a gas barrier layer.

Second embodiment

A gas barrier paste containing silica gel powder having 1.0% by weight was applied on the phosphor layer and the partition wall, dried at 50 ° C for 30 minutes, and then fired at 300 ° C for 40 minutes to form a gas barrier layer.

Third Embodiment

A gas barrier paste containing 0.5% by weight of silica gel powder was applied onto the phosphor layer and the partition wall, dried at 50 ° C. for 30 minutes, and then calcined at 300 ° C. for 40 minutes to form a first gas barrier layer.

Further, a gas barrier paste containing silica gel powder having 0.5% by weight was applied on the protective film of the upper plate, dried at 50 ° C. for 30 minutes, and then calcined at 300 ° C. for 40 minutes to form a second gas barrier layer.

Comparative example

No gas barrier layer was formed on the phosphor layer and the partition wall.

Table 1 below shows the afterimage characteristics of the first, second, and third examples and comparative examples according to the present invention.

TABLE 1

An afterimage Border Complementary image Comparative example 64.9 196.5 179.6 First embodiment 19.8 161.6 70.7 Second embodiment 15.3 148.9 75.5 Third Embodiment 6.1 97.7 49.7

Table 2 below shows the degree to which the afterimage characteristics of the first, second and third embodiments of the present invention are improved compared to the comparative example.

TABLE 2

An afterimage Border Complementary image
Absolute value Visibility First embodiment 60% less than 18% less than 20% less than 60% less than Second embodiment 75% less than 25% less than 23% less than 62% less than Third Embodiment 90% less than 50% less than 49% less than 70% less than

As shown in Table 2, the embodiments of the present invention can be seen that the afterimage property is significantly improved compared to the comparative example without the gas barrier layer.

That is, in the case of dark afterimage and complementary afterimage, the present invention has the effect of reducing to at least 60% or less, and the effect of reducing to at least 18% or less even in boundary afterimages.

6A to 6C are graphs showing the afterimage characteristics of the first, second, and third embodiments of the present invention and the comparative example, and FIG. 6A is a first, second, and third embodiment of the present invention (SG1, SG2). , SG3) and the dark afterimage of the comparative example (Ref), Figure 6b is a complementary afterimage of the first, second, third embodiment (SG1, SG2, SG3) and Comparative Example (Ref) of the present invention 6C is a graph comparing boundary residuals between the first, second, and third embodiments SG1, SG2, and SG3 of the present invention and Comparative Example Ref.

First, as shown in FIGS. 6A and 6B, the dark afterimage and the complementary afterimage are remarkably reduced in the residual luminance of the present invention compared to the comparative example, and also in the boundary afterimage, as shown in FIG. It can be seen that the residual luminance decreases.

As described above, the present invention forms a gas barrier layer made of a porous material on the barrier ribs and the phosphor layer to remove impurities present in the discharge cell, thereby preventing mis-discharge and residual image due to impurities present in the discharge cell. There is an effect that can be reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the embodiments, but should be defined by the claims.

1 is a view illustrating a position of a getter formed in a plasma display panel.

2 shows the diffusion of impurities present in a discharge cell;

3 illustrates a plasma display panel according to the present invention.

4 and 5 show another embodiment according to the present invention.

6A to 6C are graphs showing the afterimage characteristics of the first, second and third embodiments of the present invention and a comparative example

Claims

A first substrate having an address electrode, a first dielectric layer and a partition wall;

A second substrate having a sustain electrode pair, a second dielectric layer, and a protective film, the second substrate being coupled to the first substrate with the barrier ribs interposed therebetween,

A phosphor layer formed in the discharge cell between the barrier rib and the barrier rib; And

And a gas barrier layer formed on at least one of the phosphor layer surface and the partition wall surface, the gas barrier layer comprising at least one of silica gel, bauxite, and activated carbon.

The plasma display panel of claim 1, wherein the gas barrier layer has a thickness of 1-90 um.

The plasma display panel as claimed in claim 1, wherein the gas barrier layer has a particle size of 2-6 um, and an interval between the particles is 0.01-10 um.

The plasma display panel of claim 1, wherein the gas barrier layer is formed on a portion of the surface of the phosphor layer to expose a portion of the surface of the phosphor layer.

The plasma display panel of claim 1, wherein the gas barrier layer is formed on a portion of the barrier rib to expose a portion of the barrier rib.

The plasma display panel of claim 1, wherein a surface of the gas barrier layer has a concave-convex shape.

The plasma display panel of claim 1, wherein a buffer layer is formed between the phosphor layer and the gas barrier layer.

8. The plasma display panel of claim 7, wherein the buffer layer is a mixture of a material of the phosphor layer and a material of the gas barrier layer.

8. The method of claim 7, wherein the center region of the buffer layer has the same material ratio of the phosphor layer and the material ratio of the gas barrier layer, and the lower region of the buffer layer adjacent to the phosphor layer has a material ratio of the phosphor layer. The material ratio of the gas barrier layer is greater than that of the gas barrier layer, and the upper region of the buffer layer adjacent to the gas barrier layer has a material ratio of the phosphor layer less than that of the gas barrier layer.

The plasma display panel of claim 1, wherein the gas barrier layer is formed on a passivation layer of the second substrate facing the discharge cell.

Preparing a first substrate having an address electrode, a first dielectric layer, a partition, and a discharge cell divided by the partition, and a second substrate having a sustain electrode pair, a second dielectric layer, and a protective film;

Forming a phosphor layer in the discharge cell;

Mixing a vehicle with a powder made of at least one of silica gel, bauxite, and activated carbon to make a gas barrier paste;

Applying the gas barrier paste on at least one of the phosphor layer surface and the partition surface;

Drying and baking the applied gas barrier paste to form a gas barrier layer; And,

And attaching the first substrate and the second substrate to each other.

12. The method of claim 11, wherein the gas barrier paste comprises a powder having 0.1 to 10% by weight and a vehicle having a weight ratio of 90 to 99.9%.

12. The method of claim 11, wherein the drying process is performed for 5 to 90 minutes in a temperature range of 20 to 90 degrees.

The method of claim 11, wherein the firing process is performed for 30 to 60 minutes in a temperature range of 100 to 400 degrees.