KR20100050698A - An artificial marble chip with high transparency and high specific gravity and a method of the same - Google Patents

Abstract

PURPOSE: An artificial marble chip and a manufacturing method thereof are provided to improve the dimensional stability by reducing the shrinkage rate, and to successively manufacture the chip with a uniform pattern. CONSTITUTION: A manufacturing method of an artificial marble chip comprises the following steps: pre-heating a hardener in a thermostat; inserting the pre-heated hardener into a reaction bath; adding a diluent; and forming a resin syrup by adding 100 parts of brominated epoxy resin by weight into the reaction bath and heating the mixture at 80~90 deg C. The specific gravity of the brominated epoxy resin is 1.7~2. The diluent is a monomer selected from the group consisting of alkyl glycidyl ether, p-tert-butyl phenyl, phenyl glycidyl ether and others.

Description

High transparency and high specific gravity transparent chip for artificial marble and manufacturing method thereof {AN ARTIFICIAL MARBLE CHIP WITH HIGH TRANSPARENCY AND HIGH SPECIFIC GRAVITY AND A METHOD OF THE SAME}

The present invention relates to a high transparency and a high specific gravity transparent chip for artificial marble and a method of manufacturing the same. More specifically, the present invention relates to a transparent chip for high transparency and high specific gravity manufactured by using a brominated epoxy resin and a method of manufacturing the same.

Artificial marble is a synthetic synthetic material that combines natural marble chips or minerals with acrylic or unsaturated polyester resins and the like, and adds various additives or pigments thereto to realize the texture of natural marble. In general, artificial marble is largely divided into acrylic artificial marble and unsaturated polyester artificial marble according to the type of resin.

Since the appearance of artificial marble has a significant impact on the value of the product with various colors and patterns, the manufacture of marble chips that can give a more beautiful and natural marble feel may not be a very important technical task in the art. none. In particular, in recent years, in addition to the pattern implemented on the surface of artificial marble, the decorative effect of realizing even the pattern formed inside the artificial marble by transmitting light to the back of the artificial marble has been spotlighted. In this case, in order for the pattern formed by the marble chip inside the artificial marble to be projected by light, a high transparency of the marble chip itself is required. However, when the acrylic particles are used as the transparent marble chip, haze of the acrylic marble chip is increased in the process of mixing and curing with the acrylic resin syrup, thereby decreasing transparency. On the other hand, artificial marble matrix (matrix) using acrylic resin, but unsaturated ester as a marble chip was proposed a method, but the inorganic filler added to control the strength of the marble chip is not improved to a satisfactory level of transparency. There was a problem. In this regard, Korean Patent Publication No. 0841396 et al. Attempted to improve the transparency by reducing the content of the inorganic filler, but in this case, durability was lowered to obtain a high specific gravity transparent chip.

In addition, when curing by adding a curing agent to the unsaturated polyester resin, a problem that the final product after the curing process turns yellow. This is caused by reacting in a state where the curing agent is not dispersed properly, which is a serious defect as an artificial marble in which appearance is important. On the other hand, when the unsaturated polyester resin is used as a marble chip for transparency, the problem of bonding with the acrylic resin used as the matrix resin also remains an unsolved problem.

In short, according to the method used in the prior art, the commercially available and mixing characteristics of the curing agent used in the curing step during the manufacture of the transparent chip for artificial marble is not good, the physical properties of the manufactured transparent chip is lowered, and the adhesion to the matrix There is a significant problem of not being sufficient, which remains a problem that has not been solved before the filing date of the present invention.

As mentioned above, according to the method used in the prior art, the commercially available and mixed properties of the curing agent used in the curing step during the manufacture of the transparent chip for artificial marble is not good, the physical properties of the prepared transparent chip is reduced, and There is a significant problem that the adhesion is insufficient. Accordingly, the inventors of the present invention have completed the present invention as a result of repeated studies to produce transparent chips for artificial marble exhibiting high specific gravity and high transparency without deteriorating the physical properties of the prepared transparent chips.

Accordingly, an object of the present invention is to provide a transparent chip for artificial marble with high transparency and high specific gravity and a method of manufacturing the same. More specifically, the present invention relates to a highly transparent and high specific gravity transparent chip for the production of a brominated epoxy resin and a method for manufacturing the same, using a specific curing aid and curing agent for curing the brominated epoxy resin It features. That is, the work must be performed while heating the temperature for melting by the use of a solid brominated epoxy resin, which causes various problems in the process of mixing with a curing agent at a high temperature. For example, the curing conditions between the lot (Lot) may be different, there may be a difference in mechanical properties and yellowing phenomenon after curing, hard working in the mixing process due to the short working time. The present inventors have solved the above problems by appropriate mixing of the curing aid and the curing agent and mixing of the diluent.

Therefore, the present invention aims to solve the problem of deterioration of physical properties that may occur during curing by using a specific curing aid and curing agent as described above. In addition, another object of the present invention is to manufacture a transparent chip exhibiting good adhesion properties with the matrix during curing.

The object of the present invention as described above is achieved by the configuration of the present invention described below.

Referring to the method of manufacturing a transparent chip for artificial marble according to the present invention in detail.

First, a curing agent preheated to 80 to 90 ° C. is added to the reactor, and a diluent is added while stirring. A resin syrup is prepared while quantitatively supplying and melting 100 parts by weight of the brominated epoxy resin while heating the reactor to a temperature of 80 to 90 ° C. On the other hand, with respect to 100 parts by weight of the syrup prepared in the above process, the antistatic agent, the ultraviolet inhibitor, the coupling agent, the colorant, pearl and fumed silica, etc. in accordance with the properties required specifically melt and disperse and add a curing accelerator , Defoaming while mixing for 10 minutes, injected into the mold to pass through the first and second curing process, and then cooled and crushed to prepare a transparent marble for artificial marble.

The brominated epoxy resin (Tetrabromo bisphenol A epoxy resin) or its modified brominated epoxy resin (Modified tetrabromo bisphenol A epoxy resin) is usually solid at room temperature (25 ° C) and has a melting point of 65 to 95 ° C and a weight average molecular weight of 400 to 95 ° C. 2000 and specific gravity are 1.7-2.0.

Diluents used in the present invention are reactive diluents or non-reactive diluents. Examples of reactive diluents include alkylglycidyl ether, p-tert- butylphenylglycidyl ether, panylglycidyl ether, o- cresylglycidyl ether, 2-ethylhexyl glycidyl ether, trimethylolpropane triglycol Cyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and the like. On the other hand, examples of the non-reactive diluent include diallyl terephthalate, diallyl phthalate, tetraethylene glycol, polybutylene glycol, ethylene glycol, diethylene glycol, triethylene glycol, diallyl carbonate, halogenated styrene, vinyl toluene, di Vinylbenzene, alphamethylstyrene, and the like. The diluent is preferably alkylglycidyl ether, more preferably butylglycidyl ether. In addition, the diluents of the present invention may be used by mixing and modifying one or more selected from the group consisting of the examples mentioned above.

As a curing aid in the above production method, methyltetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methyl himic anhydride, and nadic methyl anhydride (NADIC Methyl Anhydride) and dodecenyl anhydrous baksan are used by mixing and modifying at least one selected from the group consisting of: More preferred curing aid is 4-methylhexahydrophthalic anhydride.

On the other hand, the curing agent in the production method is tetramethylammonium chloride, triethylamine, triethylbenzylammonium chloride, triphenylphosphine, benzyldimethylamine, ethyltritriphenyl phosphonium bromide, ethyltriphenylphosphonium iodide, 2-ethyl-4-methyl is used by mixing and modifying at least one selected from the group consisting of midazole, 2-methylimidazole, 2,4,6-tris (diamino-methyl) phenol. More preferred curing agent is benzyldimethylamine.

For a more specific example of the preparation method can refer to the bar described in the following specific description.

On the other hand, the transparent chip for artificial marble prepared by the manufacturing method is prepared by melting and mixing the brominated epoxy resin or modified brominated epoxy resin 64 to 84% by weight, curing agent 14 to 27% by weight, diluent 2 to 9% by weight 2 to 8 parts by weight of a curing agent and 0.01 to 1.0 parts by weight of a curing accelerator (liquid TTP) are added to 100 parts by weight of the resin syrup, followed by curing.

In addition, the transparent chip for artificial marble according to the present invention is 0.1 to 5 parts by weight of antistatic agent, 0.1 to 5 parts by weight of UV stabilizer, 0.1 to 3 parts by weight of coupling agent, 0.000001 to 1.0 weight of colorant based on 100 parts by weight of resin syrup And at least one selected from the group consisting of 0.01 to 5 parts by weight of pearl and 0.1 to 10 parts by weight of fumed silica may be added.

The transparent marble for artificial marble according to the present invention has a high specific gravity (1.50 to 1.90), excellent strength, small shrinkage ratio, excellent dimensional stability, and excellent mechanical properties and electrical insulation. On the other hand, it exhibits excellent adhesion with the matrix during curing, and can be continuously produced in a uniform pattern without regard to curing time or molding time, and has excellent transparency and refractive index. In addition, the sanding and morse hardness are the same as the matrix, and the coloring is free, so that it is easy to show three-dimensional texture, chemical resistance (solvent resistance, acid resistance, alkali resistance and water resistance), excellent heat resistance and smoothness, and artificial marble It shows the advantage that the surface chip distribution is good at the time of manufacture.

Hereinafter, the present invention will be described in detail by the following examples. However, the following examples are only intended to describe the present invention in more detail, and the protection scope of the present invention is not limited only to the examples described in the following examples. In addition, not only the following examples but also matters that can be easily inferred by those skilled in the art are obviously included in the protection scope of the present invention.

Manufacturing Method A

A-1. Preparation of Resin Syrup

15 to 27 wt% of the curing aid preheated to a temperature of 80 to 90 ° C. in a constant temperature bath (100TK) is placed in a reaction tank (200RT) heated to 80 to 90 ° C. and alkyl glycidyl ether 2 to 6 While adding the weight% and stirring, 67 to 83 weight% of the brominated epoxy resin in the solid state of the storage tank 523TK was quantitatively supplied to prepare a resin syrup. At this time, 67-83 weight% of the brominated epoxy resin melt | dissolved at 90-100 degreeC can also be quantitatively added.

A-2. Hardening

Based on 100 parts by weight of the syrup prepared by A-1, 2 to 8 parts by weight of the curing agent and 0.01 to 1.0 part by weight of the liquid TPP, which is a curing accelerator, were added thereto, and the thickness thereof was 18 mm in the mold 300 of a constant size. Put it in the following amount and harden | cure. When the thickness is 18 mm or more, yellowing may occur during curing of the resin syrup due to overheating exothermic reaction.

On the other hand, the curing process is divided into a first curing (400CRI) by heating to 70 to 90 ℃ and a second curing (400CRII) by heating to 110 to 160 ℃, through this process the transparency and physical properties of the desired quality You can get it.

After the above steps, cooling and crushing to produce an average particle diameter of 0.1 to 20 mm to separate and use in various chip sizes can contribute to the quality of manufacture and appearance of marble.

A-3. Input of additives (according to the quality required by the consumer)

With respect to 100 parts by weight of the resin syrup prepared in A-1, 0.1 to 5 parts by weight of antistatic agent, 0.1 to 5 parts by weight of UV stabilizer, 0.1 to 3 parts by weight of coupling agent, 0.000001 to 1.0 part by weight of colorant, and 0.01 to 5 pearl Part by weight, 0.1 to 10 parts by weight of fumed silica and the like may be prepared by additionally adding one or more according to the required physical properties of the consumer.

Preparation Method B

B-1. Preparation of Resin Syrup

14 to 23% by weight of the curing aid preheated to a temperature of 80 to 90 ° C in a constant temperature bath (100TK) was placed in a reaction tank (200RT) heated to 80 to 90 ° C, and 3 to 8% by weight of a curing agent, alkyl glycidyl ether 2 While adding to 5% by weight, while stirring, 64 to 81% by weight of the brominated epoxy resin in the solid state of the storage tank 523TK is supplied by quantitative supply to prepare a resin syrup. At this time, 64 to 81% by weight of the brominated epoxy resin melted at 90 to 100 ° C may be added in a fixed amount.

B-2. Hardening

To 100 parts by weight of the syrup prepared by B-1, 0.01 to 1.0 parts by weight of liquid TPP, which is a curing accelerator, was added, and a predetermined amount thereof was adjusted to a thickness of 18 mm or less in a mold 300 of a predetermined size, and cured. Let's do it. When the thickness is 18 mm or more, yellowing may occur during curing of the resin syrup due to overheating exothermic reaction.

On the other hand, the curing process is divided into a first curing (400CRI) by heating to 70 to 90 ℃ and a second curing (400CRII) by heating to 110 to 160 ℃, through this process the transparency and physical properties of the desired quality You can get it.

After the above steps, cooling and crushing to produce an average particle diameter of 0.1 to 20 mm to separate and use in various chip sizes can contribute to the quality of manufacture and appearance of marble.

B-3. Input of additives (according to the quality required by the consumer)

100 parts by weight of the resin syrup prepared in B-1, 0.1 to 5 parts by weight of antistatic agent, 0.1 to 5 parts by weight of UV stabilizer, 0.1 to 3 parts by weight of coupling agent, 0.000001 to 1.0 part by weight of colorant, and 0.01 to 5 of pearl Part by weight, 0.1 to 10 parts by weight of fumed silica and the like may be prepared by additionally adding one or more according to the required physical properties of the consumer.

Manufacturing Method C

C-1. Preparation of Resin Syrup

15 to 24% by weight of the curing aid preheated to a temperature of 80 to 90 ℃ in a constant temperature bath (100TK) into a reaction tank (200RT) heated to 80 to 90 ℃, added 3 to 8% by weight of the curing agent and stirred, A resin syrup was prepared while supplying 68-82% by weight of (523TK) of a brominated epoxy resin in a solid state in a fixed quantity. At this time, 68-82 weight% of the brominated epoxy resin melt | dissolved at 90-100 degreeC can also be quantitatively added.

C-2. Hardening

100 parts by weight of the syrup prepared by C-1, 2 to 7 parts by weight of alkylglycidyl ether, 0.01 to 1.0 part by weight of liquid TPP, which is a curing accelerator, were mixed, and then a mold of a constant size (300TR ) And set it to 18 mm or less in thickness to cure. When the thickness is 18 mm or more, yellowing may occur during curing of the resin syrup due to overheating exothermic reaction.

On the other hand, the curing process is divided into a first curing (400CRI) by heating to 70 to 90 ℃ and a second curing (400CRII) by heating to 110 to 160 ℃, through this process the transparency and physical properties of the desired quality You can get it.

After the above steps, cooling and crushing to produce an average particle diameter of 0.1 to 20 mm to separate and use in various chip sizes can contribute to the quality of manufacture and appearance of marble.

C-3. Input of additives (according to the quality required by the consumer)

Based on 100 parts by weight of the resin syrup prepared in C-1, 0.1 to 5 parts by weight of antistatic agent, 0.1 to 5 parts by weight of UV stabilizer, 0.1 to 3 parts by weight of coupling agent, 0.000001 to 1.0 part by weight of colorant, and 0.01 to 5 pearl Part by weight, 0.1 to 10 parts by weight of fumed silica and the like may be prepared by additionally adding one or more according to the required physical properties of the consumer.

On the other hand, the following experiments were carried out to evaluate the physical properties of the transparent chip for artificial marble according to the present invention. In addition, the results were compared with the physical property data of the transparent chip according to the prior art.

Example 1

21.5% by weight of a curing aid (EPIKURE CURING AGENT 101 manufactured by Hexion) preheated to 80 ° C to 90 ° C in a constant temperature bath (100TK) was placed in a reactor (200RT) heated to 80 ° C to 90 ° C, and alkylglycidyl ether 3.0. 75.5% by weight of the brominated epoxy resin (EPIKOTE RESIN 523 solid phase, 25 ° C, room temperature) manufactured by Hexion Co., Ltd. was supplied to the reaction tank (200RT) with a fixed-quantity feeder while melting, while stirring by weight. Resin syrup was prepared.

5.2 parts by weight of a curing agent (EPIKURE CURING AGENT 102 manufactured by Hexion) and 0.1 part by weight of liquid TPP (triphenyl posphite / triphenyl posphate manufactured by Songwon Industrial Co., Ltd.) as a curing accelerator based on 100 parts by weight of the resin syrup prepared as described above (200RT) It was added to the mixture and stirred sufficiently to disperse. In addition, in order to vacuum and defoaming the resin syrup prepared by the above procedure, a vacuum was applied to the reactor 200RT and mixed for 10 minutes to degas.

Thereafter, the resin syrup was poured into a molding mold 300TR having a predetermined size and cured. In the curing process, a first curing step (400CRI) by heating to 70 to 90 ℃ and a second curing (400CRII) by heating to 110 to 160 ℃ was carried out. On the other hand, the thickness of the molded plate was 18 mm or less to contribute to the color and quality stability of the transparent product.

After that, the mixture was cooled and crushed to produce an average particle diameter of 0.1 to 20 mm, and used separately in various chip sizes according to the requirements of the consumer.

Example 2

1.65 parts by weight of an antistatic agent (TOWREX ASV300 manufactured by Dongbo Chemical), 0.41 part by weight of a sunscreen agent (Tinuvin328, manufactured by CIBA), and a diluted dye (curing aid 50 g + Blue) according to the required physical properties of the composition prepared in Example 1 Dye: Macrolex Blue RR / Bayer AG Manufactured: Dispersed 0.002 g) 1.32 parts by weight was added, and 5.5 parts by weight of a curing agent (EPIKURE CURING AGENT 102, manufactured by Hexion), liquid TPP (triphenyl manufactured by Songwon Industries) 0.15 parts by weight of posphite / triphenyl posphate) was placed in a reactor (200 RT), followed by sufficient stirring to disperse. In addition, all the processes other than the above were made the same as Example 1.

Example 3

22 wt% of a curing aid (EPIKURE CURING AGENT 101 manufactured by Hexion) preheated to 80 to 90 ° C. in a constant temperature bath (100TK) was placed in a reactor (200 RT) heated to 80 to 90 ° C., butyl glycidyl ether ( Butyl Glycidyl Ether) 75.5% by weight of the brominated epoxy resin (EPIKOTE RESIN 523 solid phase / 25 ° C room temperature manufactured by Hexion) of the storage tank (523TK) was added to the reactor (200RT) with stirring. A resin syrup was prepared while feeding and melting.

5.3 parts by weight of a curing agent (EPIKURE CURING AGENT 102 manufactured by Hexion Corporation) and 0.11 part by weight of liquid TPP (triphenyl posphite / triphenyl posphate manufactured by Songwon Industrial Co., Ltd.) as a curing accelerator based on 100 parts by weight of the resin syrup prepared as described above (200RT) It was added to the mixture and stirred sufficiently to disperse. In addition, all the processes other than the above were made the same as Example 1.

Comparative Example 1

27 wt% of the curing agent (EPIKURE CURING AGENT AH-200 manufactured by Hexion) preheated to 80 ° C to 90 ° C in a constant temperature bath (100TK) was placed in a reaction tank (200RT) heated to 80 ° C to 90 ° C and stirred while storing the tank (523TK). The resin syrup was prepared by supplying 73 wt% of a brominated epoxy resin (YDB-400 manufactured by Kukdo Chemical Co., Ltd., at a solid / 25 ° C room temperature) to a reaction tank (200RT) with a fixed feed rate.

With respect to 100 parts by weight of the resin syrup prepared as described above, 2.3 parts by weight of alkylglycidyl ether and 0.22 parts by weight of liquid accelerator TPP (triphenyl posphite / triphenyl posphate manufactured by Songwon Industrial Co., Ltd.) were placed in a reaction tank (200 RT) and sufficiently stirred and dispersed. I was. In addition, all the processes other than the above were made the same as Example 1.

Comparative Example 2

77% by weight of bisphenol A epoxy (EPIKOTE RESIN 828; Unmodified, liquid standard epoxy resin based on Bisphenol-A) liquid at room temperature (25 ° C) and curing agent D-230 (JEFFAMINE D-230 from HUNTSMAN, ie Polyetheramine 23 wt% of the components) were uniformly mixed in a reaction tank (200RT), and 0.5 parts by weight of a curing accelerator A-399 (manufactured by HUNTSMAN) was added to 100 parts by weight of the prepared resin syrup, followed by sufficient mixing. In order to vacuum and defoaming the resin syrup prepared by the above method, a vacuum is applied to the reaction tank (200RT), mixed for 10 minutes, and degassed. Then, the resin syrup is fixed in a molding mold (300TR) of a constant size and cured. I was. In the curing process, a first curing step (400CRI) by heating to 70 to 80 ℃ and a second curing step (400CRII) by heating to 110 to 130 ℃ was carried out. In addition, all the processes other than the above were made the same as Example 1.

The physical properties of the resin compositions prepared in Examples 1-3 and Comparative Examples 1-2 were compared, and the results are shown in the following [Table 1].

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Specific gravity (25 levels) 1.601 1.582 1.603 1.594 1.086 Average transmittance (visible light) 83 79 85 67 88 Heat resistance (HDT) (℃) 109 108 110 109 73 Flexural Strength (kg / cm ³ ) 1183 1147 1214 1165 865 compare Yellowing phenomenon Low weight

On the other hand, the evaluation method of the physical properties in the above was performed by the following method.

1. Specific gravity was measured by specific gravity bottle at 25 ℃.

2. The average transmittance was measured with a spectrophotometer (HunterLab UltraScan PRO).

3. Heat resistance (HDT) was measured by ASTM D-648 method.

4. Flexural strength was measured by ASTM D-790 method.

Through the results of Table 1, it was confirmed that the transparent chip composition for artificial marble according to the present invention not only exhibits high specific gravity and high transparency, but also has excellent heat resistance and bending strength.

1 is a photograph of artificial marble surface using a transparent chip produced by the present invention.

2 is a transparent chip photograph taken by classifying by type, size by crushing the transparent plate produced by the present invention.

3 and 4 are schematic views of the manufacturing process of the transparent chip for artificial marble of the present invention.

Claims (20)

2 to 8 parts by weight of a curing agent based on 100 parts by weight of a resin syrup prepared by melt-mixing a brominated epoxy resin or a modified brominated epoxy resin by 64 to 84% by weight, a curing aid of 14 to 27% by weight, and a diluent 2 to 9% by weight. A transparent chip for artificial marble, which is prepared by hardening by adding 0.01 to 1.0 parts by weight of an accelerator (liquid TTP). According to claim 1, 0.1 to 5 parts by weight of the antistatic agent, 0.1 to 5 parts by weight of the UV stabilizer, 0.1 to 3 parts by weight of the coupling agent, 0.000001 to 1.0 parts by weight of the colorant, 0.01 to 5 of pearl per 100 parts by weight of the resin syrup Part by weight, 0.1 to 10 parts by weight of fumed silica further comprises at least one selected from the group consisting of transparent chips for artificial marble. The transparent chip for artificial marble according to claim 1 or 2, wherein the specific gravity of the brominated epoxy resin is 1.7 to 2.0. The diluent according to claim 1 or 2, wherein the diluent is alkylglycidyl ether, p-tert- butylphenylglycidyl ether, panylglycidyl ether, o- cresylglycidyl ether, 2-ethylhexyl glycy. One selected from the group consisting of cydyl ether, trimethylolpropane triglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether A transparent chip for artificial marble, characterized in that the above monomer. The transparent chip for artificial marble according to claim 4, wherein the diluent is alkylglycidyl ether. 6. The transparent chip for artificial marble according to claim 5, wherein the alkyl glycidyl ether is butyl glycidyl ether. The method according to claim 1 or 2, wherein the curing aid is methyltetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methyl Himic Anhydride, Nadic methyl anhydride (NADIC Methyl Anhydride), a transparent chip for artificial marble, characterized in that at least one hardening aid selected from the group consisting of dodecenyl anhydrides. 8. The transparent chip for artificial marble according to claim 7, wherein the curing aid is 4-methylhexahydrophthalic anhydride. The method of claim 1, wherein the curing agent is tetramethylammonium chloride, triethylamine, triethylbenzylammonium chloride, triphenylphosphine, benzyldimethylamine, ethyltritriphenyl phosphonium bromide, ethyltriphenyl At least one curing agent selected from the group consisting of phosphonium iodide, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2,4,6-tris (diamino-methyl) phenol Transparent chip for artificial marble. The transparent chip for artificial marble according to claim 9, wherein the curing agent is benzyldimethylamine. Method for manufacturing a transparent chip for artificial marble comprising the following steps: Preheating the curing agent in a thermostat bath; Introducing a preheated curing agent into the reactor; Adding a diluent; And 100 parts by weight of a brominated epoxy resin is quantitatively supplied to a reactor to prepare a resin syrup while heating to a temperature of 80 to 90 ° C. 12. The method of claim 11, wherein the method further comprises the following steps: Additionally adding at least one additive selected from the group consisting of an antistatic agent, a sunscreen agent, a coupling agent, a colorant, a pearl and a fumed silica with respect to 100 parts by weight of the resin syrup to melt disperse; Adding a curing accelerator; Mixing and defoaming; Injecting into a molding bath to undergo first and second curing processes; And Cooling and crushing. The method for manufacturing a transparent chip for artificial marble according to claim 11 or 12, wherein the specific gravity of the brominated epoxy resin is 1.7 to 2.0. The diluent of claim 11 or 12, wherein the diluent is alkylglycidyl ether, p-tert- butylphenylglycidyl ether, panylglycidyl ether, o- cresylglycidyl ether, 2-ethylhexyl glycy. One selected from the group consisting of cydyl ether, trimethylolpropane triglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and 1,6-hexanediol diglycidyl ether A method for producing a transparent chip for artificial marble, characterized in that the above monomer. 15. The method of claim 14, wherein the diluent is alkyl glycidyl ether. 16. The method of claim 15, wherein the alkyl glycidyl ether is butyl glycidyl ether. 13. The curing agent according to claim 11 or 12, wherein the curing aid is methyltetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methyl hydric anhydride, nadic methyl anhydride, dode A method for producing a transparent chip for artificial marble, characterized in that at least one curing aid selected from the group consisting of senyl anhydrous baksan. 18. The method of claim 17, wherein the curing aid is 4-methylhexahydrophthalic anhydride. 13. The method of claim 11 or 12, wherein the curing agent is tetramethylammonium chloride, triethylamine, triethylbenzylammonium chloride, triphenylphosphine, benzyldimethylamine, ethyltritriphenyl phosphonium bromide, ethyltriphenylphosphonium At least one curing agent selected from the group consisting of iodide, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2,4,6-tris (diamino-methyl) phenol Method for manufacturing a transparent chip for artificial marble. 20. The method of claim 19, wherein the curing agent is benzyldimethylamine.

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