KR20100022613A - Tape carrier package for plasma display panel and plasma display apparatus using the same - Google Patents

Abstract

PURPOSE: A tape carrier package for a plasma display panel and a plasma display apparatus using the same are provided to emit heat through a penetration hole by applying a heat sink with an adhered part and an penetration hole. CONSTITUTION: A driver chip(210) runs a plasma display panel. A flexible substrate(200) exposes electrode pads to one end and the other end. The flexible substrate has conductive lines connected to the electrode pads. A driver chip is connected to the conductive lines. A first heat sink(300) is adhered to the lower part of the flexible substrate with a first heat tape(310). A second heat sink(100) is comprised of an adhesive unit, a frame unit, and a plurality of connection units.

Description

Tape carrier package for plasma display panel and plasma display device using the same {Tape carrier package for plasma display panel and plasma display apparatus using the same}

The present invention relates to a tape carrier package for a plasma display panel capable of increasing heat dissipation efficiency and a plasma display apparatus using the same.

As is generally known, a plasma display panel (PDP) discharges a gas injected in a discharge cell isolated by a barrier rib, and the ultraviolet rays generated therein excite phosphors of R, G, and B. By emitting light.

Such a simple structure has attracted attention as a large display device due to its ease of fabrication, high brightness and high luminous efficiency, memory function, high nonlinearity, and wide viewing angle of 160 ° or more.

FIG. 1 is a conceptual diagram illustrating a schematic structure of a general plasma display apparatus, including a plasma display panel 10 having exposed electrodes, a driving substrate 30 for providing a driving voltage to the plasma display panel 10, and And a tape carrier package (TCP) 20 formed on a flexible substrate connecting the electrodes to the cells of the plasma display panel 10 and the driving substrate 30.

An electrical and physical connection between the plasma display panel 10 and the TCP 20 and an electrical and physical connection between the TCP 20 and the driving substrate 30 use an anisotropic conductive film (ACF).

In the TCP 20, the wirings are densely arranged on the flexible substrate, and are connected to the wirings to receive power from the driving substrate 30 to provide the electrodes to the electrodes of the plasma display panel 10. This is implemented.

In general, the driving driver chip has a structure in which a small number of voltages and driving control signals are applied to alternately output a plurality of signals having high power, and thus the number of wirings connected to the driving substrate 30 is small, and the plasma The number of wirings connected to the display panel 10 side is large.

2 is a schematic cross-sectional view for explaining a tape carrier package for a plasma display panel according to the prior art, comprising: a drive driver chip 22 for driving a plasma display panel; A flexible substrate (21) having electrode pads exposed at one end and the other end and having conductive lines connected to the electrode pads, and having the drive driver chip (22) connected to the conductive lines and mounted; A first heat sink 52 bonded to a lower portion of the flexible substrate 21 by a first heat tape 51; It consists of a second heat sink 62 bonded by a second thermal tape 61 on the drive driver chip 22.

Here, as shown in FIGS. 4A and 4E, the first and second heat sinks 52 and 62 are heat dissipation structures of a tape carrier package made of a hard metal material.

In addition, one surface of the first and second row tapes 51 and 61 is bonded to the first and second heat sinks 52 and 62 in a shape similar to those of FIGS. 4B and 4D, and the driving driver chip 22 and the flexible substrate ( The other surface is glued and packaged.

Therefore, the cross-sectional view of FIG. 2 is packaged in the same shape as the top view of FIG.

The tape carrier package for the conventional plasma display panel has poor adhesion to the driving driver chip and the flexible substrate when the flatness of the heat sink is poor, so that the heat generated from the driving driver chip is not smoothly discharged, thereby causing a defect in the driving driver chip. do.

In addition, since the heat sinks block the driving driver chip and the flexible substrate, air is not circulated between the first and second heat sinks, thereby degrading heat dissipation efficiency.

The present invention is to solve the problem that the heat radiation efficiency is lowered.

According to a first preferred embodiment of the present invention,

A driver driver chip for driving the plasma display panel;

A flexible substrate exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having the driving driver chip connected to the conductive lines;

A first heat sink adhered to the lower portion of the flexible substrate by a first heat tape;

A plasma display including an adhesive portion adhered to the driving driver chip by a second thermal tape, a frame portion outside the adhesive portion, and a second heat sink including a plurality of connection portions connected to the adhesive portion and the frame portion. A tape carrier package for a panel is provided.

According to a second preferred embodiment of the present invention,

A plasma display panel having exposed electrodes;

A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate;

The tape carrier package,

A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines;

A first heat sink adhered to the lower side of the flexible substrates by a first heat tape;

A plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates, a frame part on the outside spaced apart from the plurality of adhesive parts, and the plurality of adhesive parts and the frame part Provided is a plasma display device comprising a second heat sink including a plurality of connection parts connected to the second heat sink.

According to a third preferred embodiment of the present invention,

A plasma display panel having exposed electrodes;

A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate;

The tape carrier package,

A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines;

A first heat sink adhered to the lower side of the flexible substrates by a first heat tape;

A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates,

The second heat sink is,

A first frame part in which a plurality of first through holes are formed;

An adhesive part inserted into the plurality of first through holes, which may be bent, and adhered to the upper part of the driving driver chip by a second row tape, a guide part which is spaced apart from the adhesive part, and the adhesive part And second frame parts including a plurality of connection parts connected to the guide part.

According to a fourth preferred embodiment of the present invention,

A plasma display panel having exposed electrodes;

A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate;

The tape carrier package,

A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines;

A first heat sink adhered to the lower side of the flexible substrates by a first heat tape;

A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates,

The second heat sink is,

A first frame portion having a first through hole formed therein;

A plurality of adhesive parts inserted into the first through hole and bent, and bonded to an upper portion of the driving driver chip, a guide part on the outside spaced apart from the plurality of adhesive parts, the plurality of adhesive parts, and Provided is a plasma display device comprising a second frame part including a plurality of connection parts connected to a guide part.

According to a fifth preferred embodiment of the present invention,

A plasma display panel having exposed electrodes;

A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate;

The tape carrier package,

A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines;

A first heat sink adhered to the lower side of the flexible substrates by a first heat tape;

A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates,

The second heat sink is,

A plurality of adhesive parts that can be bent, bonded to the top of the driver driver chip, a frame portion on the outside spaced apart from the plurality of adhesive portions, and the plurality of adhesive portions and a plurality of connecting portions connected to the frame portion There is provided a plasma display apparatus.

According to the present invention, by applying a heat sink having an adhesive portion and a through hole, the driver driver chip is adhered to the adhesive portion, thereby dissipating heat to the adhesive portion and dissipating heat through the through hole, thereby increasing heat dissipation efficiency. It can be effective.

And, by applying the flexible heat sink structure, even if the flatness of the heat sink is somewhat poor, the contact between the heat sink and the driving driver chip can be maintained at all times, thereby increasing heat dissipation efficiency.

In addition, the present invention has the effect that even if there is a tolerance of the thickness of the heat tape and the assembling nut is maintained in close contact with the drive driver chip and the heat sink, it is possible to prevent a failure due to heat generation of the drive driver chip.

In addition, the present invention has the effect of preventing the crack of the drive driver chip due to abnormal bonding strength between the heat sink and the drive driver chip.

In addition, the present invention can further heat-attach the heat sink to the driver driver chip and the flexible substrate by bonding the first heat sink to which the driver driver chip is bonded and the second heat sink to which the flexible substrate is bonded, thereby increasing heat dissipation efficiency. It can be effective.

In addition, the present invention has the effect of improving the heat generation level of the components for operating the driving driver chip and the plasma display panel by circulating air through the through-hole formed in the heat sink.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 5 is a schematic perspective view illustrating a heat sink of a tape carrier package for a plasma display panel according to the present invention, wherein the heat sink 100 includes an adhesive part 110 adhered to a driving driver chip; A frame part 120 spaced apart from the adhesive part 110; It is composed of a plurality of connecting parts 130 connected to the adhesive portion and the frame portion.

In addition, the heat sink 100 has a through hole 140 formed of the adhesive part 110, the frame part 120, and the plurality of connection parts 130.

Therefore, the driving driver chip adhered to the adhesive part 110 may release heat to the adhesive part 110 and at the same time release heat through the through hole 140, thereby increasing heat dissipation efficiency.

6 is a schematic cross-sectional view illustrating a tape carrier package for a plasma display panel according to the present invention, wherein the tape carrier package for a plasma display panel includes a drive driver chip 210 for driving the plasma display panel; A flexible substrate 200 having electrode pads exposed at one end and the other end, conductive lines connected to the electrode pads embedded therein, and the driving driver chip 210 connected to the conductive lines and mounted; A first heat sink 300 adhered to the lower portion of the flexible substrate 200 by a first heat tape 310; An adhesive part bonded to the upper part of the driving driver chip 210 by a second thermal tape 180, a frame part outside the adhesive part, and a plurality of connection parts connected to the adhesive part and the frame part. It consists of two heat sinks 100.

Here, it is preferable that the frame portion of the second heat sink 100 is adhered to the first thermal tape 310.

That is, the frame portion of the second heat sink 100 and the first heat sink 300 are bonded to each other by the first heat tape 310, so that the adhesive portion of the second heat sink 100 is bonded to each other. It may be in close contact with the drive driver chip 210, and the first heat sink 300 may be in close contact with the flexible substrate 200, and thus heat generated by the drive driver chip 210 may be reduced. It can be released efficiently.

In addition, as shown in FIG. 7A, the second heat sink 100 of the present invention is a heat sink including an adhesive part 110, a frame part 120, and connecting parts 130.

In addition, an area of the second heat tape 180 bonding the adhesive part of the second heat sink 100 to the driving driver chip 210 is larger than that of the upper surface of the driving driver chip 210, It is preferred to be smaller or equal than area.

In addition, the first heat sink 300 is a bulk heat sink without the adhesive part 110, the frame part 120, and the connection parts 130, and the first heat tape 300 is a flexible substrate. It is desirable to have an area to which the 200 and the frame portion of the first heat sink can be bonded.

As described above, the tape carrier package for the plasma display panel according to the present invention may further adhere the heat sink to the driving driver chip and the flexible substrate by adhering the first heat sink to the second heat sink, thereby increasing heat dissipation efficiency. There is an advantage.

FIG. 8 is a schematic top view of a tape carrier package for a plasma display panel according to the present invention, in which the first and second heat sinks are packaged in close contact with a driving driver chip and a flexible substrate. ), Since the through hole 140 is formed between the frame part 120 and the plurality of connection parts 130, heat generated from the driving driver chip is transferred through the adhesive part 110 and the through hole 140. Can be released, it is possible to increase the heat radiation efficiency.

9A and 9B are a perspective view and a cross-sectional view for explaining a preferred shape of the heat sink applied to the present invention. As described above, the heat sink of the present invention includes an adhesive part 110, a frame part 120, and connecting parts 130. It is provided.

Here, it is preferable that the adhesive part 110 and the connection parts 130 of the second heat sink 100 are formed of a material having a flexible flexibility.

In this case, more preferably, as shown in FIG. 9B, the connecting portions 130 are bent regions 131 connected to the frame portion 120 and bent regions 132 connected to the adhesive portion 110. .

That is, the frame part 120 and the adhesive part 110 are positioned on different horizontal planes by the bent regions of the connection parts 130, and on the horizontal plane of the frame part 120 and the horizontal plane of the adhesive part 110. The driving driver chip 210 and the flexible substrate 200 are accommodated and positioned therebetween.

In addition, the adhesive portion 110 and the connecting portion 130 is preferably formed of a flexible material that can be bent.

Thus, by applying the flexible heat sink structure, the present invention can maintain the contact between the heat sink and the driving driver chip at all times even if the flatness of the heat sink is somewhat poor, thereby increasing heat dissipation efficiency.

In addition, the present invention maintains close contact between the driving driver chip and the heat sink even if the thickness of the heat tape or the tolerance of the assembling nut is maintained, thereby preventing a defect due to heat generation of the driving driver chip.

In addition, the present invention can prevent the crack of the driving driver chip due to abnormal bonding strength between the heat sink and the driving driver chip.

In addition, the present invention has the advantage that the heat is circulated through the through hole formed in the heat sink, thereby improving the heat generation level of the components for operating the drive driver chip and the plasma display panel.

10A and 10B are cross-sectional views illustrating various shapes of a heat sink applied to the present invention, and a plurality of connection parts connecting the adhesive part 110 and the frame part 120 of the heat sink may be formed. It is preferable to form symmetrically with respect to.

FIG. 10A illustrates a heat sink in which two connection parts 130a and 130b are formed, and two through holes 141a and 141b are formed in the heat sink by the two connection parts 130a and 130b. have.

10B, four connection parts 130a, 130b, 130c and 130d and four through holes 141a, 141b, 141c and 141d are formed in the heat sink.

FIG. 11 is a plan view showing a schematic coupling state of a plasma display device having a tape carrier package for a plasma display panel according to the present invention, the plasma display device comprising: a plasma display panel 500 having electrodes exposed thereto; A driving substrate 600 for providing a driving voltage to the plasma display panel 500; A tape carrier package connects the electrodes of the plasma display panel 500 and the driving substrate 600.

Here, the tape carrier package includes a plurality of flexible substrates having electrode pads exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and a driving driver chip connected to the conductive lines. 200); A first heat sink attached to a lower portion of the flexible substrates by a first thermal tape; A plurality of adhesive parts adhered to the driving driver chip of each of the plurality of flexible substrates 200 by a second row tape, a frame part on the outside spaced apart from the plurality of adhesive parts, and the plurality of adhesive parts And a second heat sink 100 having a plurality of connection parts connected to the frame part.

FIG. 12 is a schematic plan view illustrating another example of the heat sink applied to FIG. 11. The heat sink 700 may include a first frame part 720 having a plurality of first through holes 710 formed therein; An adhesive part 730 inserted into the plurality of first through holes 720 and may be bent, and bonded to an upper portion of a driving driver chip, and a guide part 740 spaced apart from the adhesive part 730. ) And second frame parts 760 including a plurality of connection parts 750 connected to the adhesive part 730 and the guide part 740.

FIG. 13 illustrates another example of the heat sink, in which the heat sink 800 includes: a first frame part 820 having a first through hole 810 formed therein; A plurality of adhesive parts 830 inserted into the first through hole 810, bent, and adhered to an upper portion of the driving driver chip, and a guide part which is spaced apart from the plurality of adhesive parts 830. 840, and a second frame portion 860 including a plurality of bonding portions 830 and a plurality of connecting portions 850 connected to the guide portion 840.

In addition, FIG. 14 is a heat sink made of a flexible material, which may be bent, and includes a plurality of adhesive parts 910 adhered to an upper portion of a driving driver chip, and a frame part that is spaced apart from the plurality of adhesive parts 910. 920 and a plurality of connection parts 930 connected to the plurality of adhesive parts 910 and the frame part 920.

Being flexible means that it is made of a flexible material.

15A and 15B are schematic cross-sectional views illustrating a state in which the second frame part of FIGS. 12 and 13 is inserted into the first frame part. Referring to FIG. 12, as shown in FIG. 15A, each of the plurality of first through holes 710 formed in the first frame part 720 may be seated to seat the second frame part 760. It is preferable that the part 711 is formed.

The second frame portion 760 is seated and inserted into the seating portion 711 as shown in FIG. 15B.

FIG. 16 is a schematic cross-sectional view illustrating another example of a tape carrier package for a plasma display panel according to the present invention. In the aforementioned tape carrier package of the plasma display panel of FIG. 6, the first heat sink 300 and the second heat sink are shown in FIG. 6. Similar to the heat sink 100, the heat sink 100 may be formed of an adhesive part, a frame part, and a plurality of connection parts.

In this case, the flexible substrate 200 may be bonded to the adhesive portion of the first heat sink 300, and the thermal tape may be limited to a size such that the flexible substrate 200 is adhered only to the adhesive portion of the first heat sink 300. .

In addition, since the structure of FIG. 16 is implementable by the above description, further description is omitted.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1 is a conceptual diagram illustrating a schematic structure of a general plasma display device

2 is a schematic cross-sectional view illustrating a tape carrier package for a plasma display panel according to the related art.

3 is a schematic cross-sectional view illustrating a tape carrier package for a plasma display panel according to the prior art.

4A to 4E are exploded plan views illustrating a structure of a flexible substrate for a plasma display panel according to the related art.

5 is a schematic perspective view illustrating a heat sink of a tape carrier package for a plasma display panel according to the present invention.

6 is a schematic cross-sectional view illustrating a tape carrier package for a plasma display panel according to the present invention.

7A to 7E are exploded plan views illustrating a structure of a flexible substrate for a plasma display panel according to the related art.

8 is a schematic top view of a tape carrier package for a plasma display panel according to the present invention.

9A and 9B are a perspective view and a cross-sectional view for explaining a preferred shape of the heat sink applied to the present invention.

10A and 10B are cross-sectional views illustrating various shapes of a heat sink applied to the present invention.

11 is a plan view showing a schematic coupling state of a plasma display device having a tape carrier package for a plasma display panel according to the present invention.

12 is a schematic plan view for explaining another example of the heat sink applied to FIG. 11.

FIG. 13 is a schematic plan view illustrating another example of a heat sink applied to FIG. 11.

14 is a schematic plan view for explaining an example in which the heat sink applied to FIG. 11 is made of a flexible material;

15A and 15B are schematic cross-sectional views illustrating a state in which the second frame part of FIGS. 12 and 13 is inserted into the first frame part.

16 is a schematic cross-sectional view illustrating another example of a tape carrier package for a plasma display panel according to the present invention.

Claims (14)

A driver driver chip for driving the plasma display panel; A flexible substrate exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having the driving driver chip connected to the conductive lines; A first heat sink adhered to the lower portion of the flexible substrate by a first heat tape; A plasma display including an adhesive portion adhered to the driving driver chip by a second thermal tape, a frame portion outside the adhesive portion, and a second heat sink including a plurality of connection portions connected to the adhesive portion and the frame portion. Tape carrier package for panels. The method according to claim 1, The frame portion of the second heat sink, A tape carrier package for a plasma display panel, wherein the tape carrier is bonded to the first thermal tape. The method according to claim 1, And a through hole is formed between the adhesive part, the frame part and the plurality of connection parts of the second heat sink. The method according to claim 1, The adhesive carrier and the connection parts of the second heat sink are formed of a flexible material that can be bent. The method according to claim 1, The connection portion, And a region connected to the frame portion and a region connected to the adhesive portion are bent. The method according to claim 1, The connection portion, Tape carrier package for a plasma display panel, characterized in that formed symmetrically based on the adhesive portion. The method according to claim 1, The first heat sink, An adhesive part, a frame part on the outside spaced apart from the adhesive part, and a plurality of connection parts connected to the adhesive part and the frame part, And the adhesive portion of the first heat sink is adhered to the first thermal tape. A plasma display panel having exposed electrodes; A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate; The tape carrier package, A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines; A first heat sink adhered to the lower side of the flexible substrates by a first heat tape; A plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates, a frame part on the outside spaced apart from the plurality of adhesive parts, and the plurality of adhesive parts and the frame part And a second heat sink having a plurality of connection parts connected to the plasma display device. A plasma display panel having exposed electrodes; A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate; The tape carrier package, A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines; A first heat sink adhered to the lower side of the flexible substrates by a first heat tape; A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates, The second heat sink is, A first frame part in which a plurality of first through holes are formed; An adhesive part inserted into the plurality of first through holes, which may be bent, and adhered to the upper part of the driving driver chip by a second row tape, a guide part which is spaced apart from the adhesive part, and the adhesive part And second frame parts including a plurality of connection parts connected to the guide part. A plasma display panel having exposed electrodes; A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate; The tape carrier package, A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines; A first heat sink adhered to the lower side of the flexible substrates by a first heat tape; A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates, The second heat sink is, A first frame portion having a first through hole formed therein; A plurality of adhesive parts inserted into the first through hole and bent, and bonded to an upper portion of the driving driver chip, a guide part on the outside spaced apart from the plurality of adhesive parts, the plurality of adhesive parts, and And a second frame part including a plurality of connection parts connected to the guide part. A plasma display panel having exposed electrodes; A driving substrate for providing a driving voltage to the plasma display panel; A tape carrier package connecting the electrodes of the plasma display panel to the driving substrate; The tape carrier package, A plurality of flexible substrates exposed at one end and the other end thereof, having conductive lines connected to the electrode pads, and having a driver driver chip connected to the conductive lines; A first heat sink adhered to the lower side of the flexible substrates by a first heat tape; A second heat sink including a plurality of adhesive parts bonded to each other by a second thermal tape on a driving driver chip of each of the plurality of flexible substrates, The second heat sink is, A plurality of adhesive parts that can be bent, bonded to the top of the driver driver chip, a frame portion on the outside spaced apart from the plurality of adhesive portions, and the plurality of adhesive portions and a plurality of connecting portions connected to the frame portion Plasma display device, characterized in that. The method according to claim 8, The connection portion, And a region connected to the frame portion and a region connected to the adhesive portion are bent. The method of claim 8, wherein The first heat sink, An adhesive part, a frame part on the outside spaced apart from the adhesive part, and a plurality of connection parts connected to the adhesive part and the frame part, And the adhesive portion of the first heat sink is adhered to the first thermal tape. The method according to claim 9 or 10, The first through hole formed in the first frame portion is provided with a mounting portion for mounting the second frame portion, And the second frame portion is seated and inserted into a seating portion of the first through hole.

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