KR20100012991A - Apparatus and method for detecting a position - Google Patents

Apparatus and method for detecting a position Download PDF

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Publication number
KR20100012991A
KR20100012991A KR1020080074456A KR20080074456A KR20100012991A KR 20100012991 A KR20100012991 A KR 20100012991A KR 1020080074456 A KR1020080074456 A KR 1020080074456A KR 20080074456 A KR20080074456 A KR 20080074456A KR 20100012991 A KR20100012991 A KR 20100012991A
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KR
South Korea
Prior art keywords
reference block
optical sensor
detecting
edge
sides
Prior art date
Application number
KR1020080074456A
Other languages
Korean (ko)
Inventor
김재수
정연혁
Original Assignee
세크론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Priority to KR1020080074456A priority Critical patent/KR20100012991A/en
Publication of KR20100012991A publication Critical patent/KR20100012991A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A position detection method is disclosed. A position of a corner having a predetermined distance from the test socket is detected among the upper surfaces of the reference block integrally assembled with the test socket for inspecting the at least one semiconductor module. Next, the position of the test socket is detected based on the position of the detected upper surface edge. Therefore, the position of the test socket for the semiconductor module to test can be detected at once through the reference block.

Description

Position detection method and apparatus {APPARATUS AND METHOD FOR DETECTING A POSITION}

The present invention relates to a position detection method and apparatus, and more particularly, to a method and apparatus for detecting the position of the test socket for inspecting the semiconductor module.

In general, a semiconductor module includes an adhesion process of bonding a wafer on which semiconductor chips are formed to an adhesive sheet, a sawing process of cutting the wafer bonded to the adhesive sheet to individualize each of the chips, and separating the individualized chip from the adhesive sheet. A chip separation step of attaching the chip separated from the adhesive sheet to a substrate, a wire bonding step of electrically connecting the chip with a connection pad of the substrate, and molding the chip with an epoxy resin. And a molding step, a terminal forming step of forming a connection terminal electrically extending from the substrate to the outside, and the like.

The semiconductor module manufactured as described above is further inserted into the inspection socket of the motherboard in a separate inspection facility to further inspect the electrical characteristics of the semiconductor module.

Accordingly, the position of the test socket into which the semiconductor module is inserted is first detected by the vision apparatus by using a vision device to detect the position of the test socket by the reference block in the motherboard outside of the test equipment. After detecting the position where the motherboard is mounted through the reference block therein, the position of the test socket is finally determined by analyzing the data detected by the first detection and the second detection.

As described above, since the position detection of the test socket is performed twice like the first detection and the second detection, the detection operation is complicated and cumbersome.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a position detection method capable of detecting the position of an inspection socket at a time.

Another object of the present invention is to provide a position detection device to which the position detection method described above is applied.

In order to achieve the above object of the present invention, a position detection method according to one aspect is disclosed. A position of an edge having a predetermined distance from the inspection socket is detected among the upper surfaces of the reference block integrally assembled with the inspection socket for inspecting the at least one semiconductor module. Next, the position of the test socket is detected based on the position of the detected upper surface edge.

Here, the edge of the detected upper surface is a position where the first and second sides meet at right angles to each other, and thus, to detect the position of the upper surface edge of the reference block, the surface is reflected to face the upper surface of the reference block. Disposing a light sensor; moving the light sensor in directions parallel to each of the first and second sides of the upper surface; and analyzing a signal received as the light sensor moves to analyze the received signal. Measuring first and second distances between an initial position and the first and second sides, and calculating position coordinates of the upper surface edge through the measured first and second distances.

In order to achieve the above object of the present invention, a position detecting apparatus according to one aspect includes a reference block, a first detecting unit and a second detecting unit. The reference block is integrally assembled with an inspection socket for inspecting at least one semiconductor module. The first detector is disposed to face an upper surface of the reference block, and detects a position of a corner having a predetermined distance from the test socket of the upper surface. The second detector is connected to the first detector, and detects the position of the test socket based on the position of the edge of the upper surface detected by the first detector.

Here, the detected edge of the upper surface is a position where the first and second sides meet at right angles to each other, and thus the first detector includes an optical sensor, a transfer unit, and a calculation unit.

The optical sensor faces a top surface of the reference block and has a reflective feature. The transfer unit moves the optical sensor in directions parallel to each of the first and second sides of the upper surface. The calculating unit analyzes a signal received as the optical sensor moves to measure first and second distances between the initial position of the optical sensor and the first and second sides, and the measured first and second measurements. The position coordinates of the upper surface edge are calculated through the distances.

Meanwhile, the test socket and the reference block may be fixed to a surface opposite to other electronic components of the circuit board.

According to such a position detecting method and apparatus, the inspection socket and the reference block are integrally assembled to detect the position of the upper edge of the edge while maintaining the distance between the inspection socket and the upper edge of the reference block. By detecting the position of the inspection socket, the operation for inspecting the position of the inspection socket can be performed at once in the inspection facility.

Therefore, by shortening the time required to detect the position of the inspection socket to improve work efficiency therefor, it is possible to improve the productivity of the semiconductor module in which the inspection is performed in the inspection socket.

Hereinafter, with reference to the accompanying drawings will be described in detail a position detection method and apparatus according to an embodiment of the present invention. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a configuration diagram schematically showing a position detection device according to an embodiment of the present invention, Figure 2 is a perspective view showing in detail the position of the reference block of the position detection device shown in FIG.

1 and 2, the position detecting apparatus 1000 according to an exemplary embodiment of the present invention includes a reference block 100, a first detecting unit 200, and a second detecting unit 300.

The reference block 100 is integrally assembled with an inspection socket 40 for inspecting an operating state of at least one semiconductor module 10. Specifically, the semiconductor module 10 is an electronic device that requires a plurality of other electronic components 30 to inspect its operating state, so that the inspection socket 40 has a mother mounted with the electronic components 30. Since it is assembled to the board 20, the reference block 100 is also integrally assembled with the inspection socket 40 on the motherboard 20.

That is, the reference block 100 always maintains a constant distance from the test socket 40 on the motherboard 20. For example, the reference block 100 may be assembled while surrounding the inspection socket 40.

In this case, in order to test the operating state of the semiconductor module 10 at a high temperature state, the heating plates 50 to be installed on both sides of the test socket 40 are also wrapped by the reference block 100 to test the test socket. It can be assembled integrally as shown in (40).

In addition, the heat generating plates 50 typically need both portions of both sides of the reference block 100 parallel to the heat generating plate 50 as heat dissipation space is required. Therefore, fixing bars 110 fixing the positions of the heating plates 50 may be additionally assembled at both open sides.

Alternatively, the reference block 100 may have two divided structures to contact each of both sides of the heating plate 50 installed on both sides of the test socket 40.

The reference block 100 has a rectangular planar structure as a whole when viewed from above with the inspection socket 40 and the heating plate 50 wrapped. That is, all edges of the upper surface 120 of the reference block 100 are formed to be orthogonal.

The test block for inspecting the semiconductor module 10 includes the reference block 100, the test socket 40, the heating plate 50, and the motherboard 20 on which the electronic components 30 are mounted. A plurality of batches are stored in a separate storage box outside the (not shown) and then individually transferred to the inside of the inspection facility (not shown) when the semiconductor module 10 needs to be inspected. At this time, the inspection facility (not shown), typically, may be configured to operate about 70 of the motherboard 20.

The first detector 200 is installed above the reference block 100 of the motherboard 20 transferred to the inspection facility (not shown). The first detector 200 detects a position of one edge of the upper surface 120 of the reference block 100.

The first detector 200 includes an optical sensor 210, a transfer unit 220, and a calculator 230. The optical sensor 210 irradiates the laser light L to the upper surface 120 of the reference block 100, and then detects the laser light L reflected from the upper surface 120. In this case, the upper surface 120 of the reference block 100 may include a metal material such as aluminum to facilitate the reflection of the laser light L.

The transfer unit 220 is connected to the optical sensor 210. The transfer unit 220 moves the optical sensor 210 in a direction parallel to the upper surface 120 of the reference block 100. The optical sensor 210 detects a position where the optical sensor 210 moves by the transfer unit 220 and then leaves the upper surface 120 of the reference block 100.

That is, the optical sensor 210 detects this by rapidly changing the displacement reflected by the laser light L at the time of leaving the upper surface 120 of the reference block 100.

In this case, the inspection socket 40 and the heating plate 50, which are integrally assembled with the reference block 100, may be connected to other electronic components 30 in which the detection of the optical sensor 210 is mounted in the mother mode. In order to prevent the interference of the electronic board 30 of the motherboard 20 is assembled on the opposite side.

Therefore, since it is difficult to change the position of the optical sensor 210 and the transfer unit 220, the reference block 100, the inspection socket 40 and the heating plate 50 is the mother board 20 After assembling the back, it is preferable to mount the motherboard 20 inside the inspection equipment.

Hereinafter, a method of detecting the position of the corner of the upper surface 120 of the reference block 100 by moving the optical sensor 210 will be further described with reference to FIGS. 3 and 4.

FIG. 3 is a view of the position of the reference block shown in FIG. 2 from above, and FIG. 4 is an enlarged view of portion A of FIG. 3.

3 and 4, the transfer part 220 may include first and second sides 122 where the position of the first optical sensor 210 meets at an edge of the upper surface 120 of the reference block 100. The optical sensor 210 is moved in a direction parallel to each of 124.

In this case, the optical sensor 210 detects a time point at which the displacement at which the laser light L is reflected is sharply changed at each of the first and second sides 122 and 124.

The operation unit 230 is connected to the transfer unit 220 and the optical sensor 210. The calculation unit 230 analyzes a signal received as the optical sensor 210 moves to determine first and second positions between the initial position of the optical sensor 210 and the first and second sides 122 and 124. The second distances d1 and d2 are measured.

Accordingly, the calculator 230 recognizes the first and second distances d1 and d2 as normal coordinates, and calculates position coordinates of an edge of the upper surface 120 of the reference block 100 as its origin.

In this case, when the first and second distances d1 and d2 are less than about 3 mm, the control of the transfer unit 220 for moving the optical sensor 210 may be difficult. When exceeding, it is not preferable because the distance for moving the optical sensor 210 is too long, and the time for detecting the corner position of the upper surface 120 is unnecessarily increased. Therefore, the optical sensor 210 is preferably initially positioned such that the first and second distances d1 and d2 have a range of about 3 to 10 mm. In addition, the optical sensor 210 is more preferably positioned so that the first and second distances d1 and d2 are about 5 mm.

As described above, the first detection unit 200 may simply detect the position of the edge of the upper surface 120 of the reference block 100 through the operation unit 230 calculated through the movement of the optical sensor 210. Can be.

The second detector 300 is connected to the first detector 200. Specifically, the second detection unit 300 is connected to the operation unit 230 of the first detection unit 200, the exact position of the corner of the upper surface 120 of the reference block 100 from the operation unit 230 Get passed. Accordingly, the second detector 300 detects the position of the test socket 40 based on the position of the corner of the upper surface 120 of the reference block 100 detected by the first detector 200.

To this end, the distance between the test socket 40 and the reference block 100 defined as an integrated structure is input to the second detection unit 300 in advance. That is, when only the correct position of the corner of the upper surface 120 of the reference block 100 is input to the second detector 300, the position of the test socket 40 is automatically calculated.

The detected position of the test socket 40 is transmitted to the loading unit 60 so that the loading unit 60 accurately inserts the semiconductor module 10 into the test socket 40.

Therefore, the reference is made in a state in which the test socket 40 and the reference block 100 are integrally assembled so that the distance between the test socket 40 and the edge of the upper surface 120 of the reference block 100 is constant. By detecting the position of the corner of the upper surface 120 of the block 100 and thereby detecting the position of the inspection socket 40, the operation for inspecting the position of the inspection socket 40 can be performed at a time in the inspection facility. Can be.

That is, by shortening the time required to detect the position of the test socket 40 to improve work efficiency therefor, it is possible to improve the productivity of the semiconductor module 10 in which the test is performed in the test socket 40.

FIG. 5 is a flowchart schematically illustrating a method of detecting a position of an inspection socket using the position detection apparatus shown in FIG. 1.

1 to 5, in order to detect the position of the inspection socket 40 inserted to inspect the semiconductor modules 10, the motherboard 20 is first externally mounted to the inspection facility (not shown). Transfer to the inside of (S10).

Subsequently, the position of the corner of the upper surface 120 of the reference block 100 integrally assembled with the test socket 40 is detected through the first detector 200 (S20). In detail, an edge of the upper surface 120 of the reference block 100 is a position where the first and second sides 122 and 124 meet at right angles.

Accordingly, the optical sensor 210 of the first detection unit 200 is transferred along the first and second sides 122 and 124 through the transfer unit 220 in parallel to the initial position of the optical sensor 210. And first and second distances d1 and d2 between the first and second sides 122 and 124 are measured by the calculator 230, and then the first and second distances d1 and d2. By calculating the exact position of the corner of the upper surface 120 of the reference block 100 through the detection.

Subsequently, an accurate position of the test socket 40 integrated with the reference block 100 is detected based on the position of the corner of the upper surface 120 of the reference block 100 detected by the first detection unit 200. (S30).

Subsequently, the exact position of the test socket 40 is transmitted to the loading unit 60 so that the loading unit 60 accurately inserts the semiconductor module 10 into the test socket 40 (S40).

As a result, the inspection process for the semiconductor module 10 can be performed more efficiently by performing one detection process inside the inspection facility (not shown).

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

The present invention described above can be used in an apparatus capable of detecting the position of the test socket at one time by using a reference block integrally assembled with the test socket in the test facility.

1 is a configuration diagram schematically showing a position detection device according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating the position of a reference block in the position detecting apparatus shown in FIG. 1 in detail.

3 is a view as viewed from above the position of the reference block shown in FIG.

4 is an enlarged view of a portion A of FIG. 3.

FIG. 5 is a flowchart schematically illustrating a method of detecting a position of an inspection socket using the position detection apparatus shown in FIG. 1.

<Explanation of symbols for the main parts of the drawings>

10: semiconductor module 20: motherboard

30: electronic component 40: inspection socket

100: reference block 200: first detection unit

210: light sensor 220: transfer unit

230: calculator 300: second detector

1000: position detection device

Claims (5)

Detecting a corner position having a predetermined distance from the inspection socket of an upper surface of the reference block integrally assembled with the inspection socket for inspecting at least one semiconductor module; And And detecting the position of the test socket based on the detected edge position of the upper surface. The method of claim 1, wherein the edge of the detected upper surface is a position where the first and second sides meet at right angles to each other, Detecting the position of the upper surface edge of the reference block, Disposing a reflective optical sensor facing an upper surface of the reference block; Moving the photosensor in directions parallel to each of the first and second sides of the upper surface; Analyzing the received signal as the optical sensor moves and measuring first and second distances between the initial position of the optical sensor and the first and second sides; And Calculating edge coordinates of the upper surface through the measured first and second distances. A reference block integrally assembled with an inspection socket for inspecting at least one semiconductor module; A first detector installed opposite to an upper surface of the reference block and detecting a position of an edge having a predetermined distance from the inspection socket of the upper surface; And And a second detection unit connected to the first detection unit and detecting a position of the test socket based on a corner position of the upper surface detected by the first detection unit. The method of claim 3, wherein the detected edge of the upper surface is a position where the first and second sides meet at right angles to each other, The first detection unit, A reflective optical sensor facing an upper surface of the reference block; A transfer unit for moving the optical sensor in directions parallel to each of the first and second sides of the upper surface; And Analyzing a signal received as the optical sensor moves to measure first and second distances between the initial position of the optical sensor and the first and second sides, and through the measured first and second distances. And a calculator configured to calculate corner coordinates of the upper surface. 4. The position detection apparatus of claim 3, wherein the test socket and the reference block are fixed to a surface opposite to other electronic components of a circuit board.
KR1020080074456A 2008-07-30 2008-07-30 Apparatus and method for detecting a position KR20100012991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080074456A KR20100012991A (en) 2008-07-30 2008-07-30 Apparatus and method for detecting a position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080074456A KR20100012991A (en) 2008-07-30 2008-07-30 Apparatus and method for detecting a position

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KR20100012991A true KR20100012991A (en) 2010-02-09

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