KR20090090571A - Probe card for testing semiconductor devices - Google Patents

Probe card for testing semiconductor devices Download PDF

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Publication number
KR20090090571A
KR20090090571A KR1020080015861A KR20080015861A KR20090090571A KR 20090090571 A KR20090090571 A KR 20090090571A KR 1020080015861 A KR1020080015861 A KR 1020080015861A KR 20080015861 A KR20080015861 A KR 20080015861A KR 20090090571 A KR20090090571 A KR 20090090571A
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KR
South Korea
Prior art keywords
leveling
plate
level plate
probe card
flatness
Prior art date
Application number
KR1020080015861A
Other languages
Korean (ko)
Inventor
구현성
Original Assignee
구현성
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Publication date
Application filed by 구현성 filed Critical 구현성
Priority to KR1020080015861A priority Critical patent/KR20090090571A/en
Publication of KR20090090571A publication Critical patent/KR20090090571A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card for testing a semiconductor device, comprising: a frame on which a plurality of probes are installed; a printed circuit board positioned on the frame; and a printed circuit board connected to the probe; And a level plate fixed to the frame with a gap between them, a reinforcement plate positioned on the level plate, and a plurality of leveling means for coupling the level plate to the reinforcement plate and adjusting the flatness of the level plate from the reinforcement plate. Accordingly, the present invention allows the frame to be pushed and pulled with a uniform force over a large area by using a level plate even in the case of a probe card having a large area due to the large diameter of the semiconductor wafer, thereby precisely adjusting flatness through overall leveling. It is possible to adjust the flatness through the level plate, the flatness of the frame or the printed circuit board is kept constant, thereby reducing the number of leveling bolts used to adjust the flatness, and to facilitate the flatness adjustment. By forming the plate to be divided, it is possible to easily and quickly perform partial leveling, and has the effect of overcoming the difficulty of maintaining flatness due to loosening of the screw fastening portion despite repeated use.

Description

PROBE CARD FOR TESTING SEMICONDUCTOR DEVICES}

According to the present invention, even in the case of a probe card having a large area, the frame can be pushed and pulled with a uniform force over a large area to enable precise adjustment of the flatness through the overall leveling, and the flatness can be performed quickly and easily. It is related with the probe card for semiconductor element test which can be performed.

In general, a process of manufacturing a pure silicon wafer to manufacture a semiconductor device, a process of manufacturing a semiconductor device by forming a pattern on the silicon wafer, and electrical characteristics of the semiconductor device to determine whether the semiconductor device is good or bad A series of manufacturing processes are required, such as a test process, a process of packaging a semiconductor element, and a process of finally testing the packaged semiconductor element.

The process of testing the electrical characteristics of the semiconductor device, for example, an electric die sorting (EDS) process determines the defects by testing the electrical characteristics of the semiconductor device to feed back the problems early in the manufacturing process of the semiconductor device. Increase yield and reduce the cost of assembly and package test due to premature removal of defective semiconductor devices.

Such a device for inspecting a semiconductor device formed on a semiconductor wafer includes a tester and a probe system, and the probe system includes a probe card in mechanical contact with an electrode pad of the semiconductor device. Is installed.

A probe card provided in a probe system for inspecting electrical characteristics of a conventional semiconductor device will be described with reference to the accompanying drawings.

1 is an exploded perspective view illustrating a probe card for testing a semiconductor device according to the related art. As shown in the drawing, a conventional probe card for testing semiconductor devices 10 includes a plurality of probes 11 formed of a thin plate, and a plurality of slits 12a formed on both sides thereof so that the probes 11 are mounted, respectively. A rectangular frame 13 and a frame 13 in which a groove 13a is formed so that both ends of the bar 12 and the probe mounting bar 12 are fitted, and an opening 13b through which the probe 11 is exposed is formed. ) Is fixed to include a printed circuit board 14 to which the probe 11 is installed.

The probe 11 is formed on the rectangular body 11a and the upper end of the body 11a to be electrically connected to each other by contacting the connection pads 2 of the chip formed on the semiconductor wafer 1 for inspection. 11b and an elastic terminal portion 11c formed at the lower end of the body 11a and in contact with the pad of the circuit board 14.

The probe card 10 for testing a semiconductor device according to the related art is generated from a tester by being electrically connected to the connection pad 2 on the semiconductor wafer 1 by the elastic probe pin portion 11b of the probe 11. The signal transmitted to the probe system is transmitted to the connection pad 2 on the semiconductor wafer 1, and the flatness due to the deformation of the circuit board 14 and the frame 13 including the probe 11 may be caused by repeated use. Even though the adjustment is necessary, it does not have a structure to enable such a flatness control, so it has a problem of costly and time consuming to maintain flatness.

For this reason, as shown in Figure 2, a probe card having a flatness adjusting means has been developed, the conventional probe card having a flatness adjusting means of the Utility Model Registration Application No. 20-2004-0006652 filed in the Republic of Korea Patent Office The "probe card for testing a circuit board" and, as shown, a printed circuit board 20 having a through hole 21 formed in the center thereof, and a printed circuit board 20 coupled to the center of an upper surface of the printed circuit board 20. Reinforcement plate 30 to prevent deformation of the fixed board (not shown) directly coupled to the bottom surface of the reinforcement plate 30 through the through-hole 21 of the printed circuit board 20, the printed circuit board 20 The top and the pattern formed on the bottom of the combination is combined with the bottom of the fixed plate (not shown) while supporting the needle 70 and the needle 70 is bent vertically after the end is bent downward at a predetermined angle and the bottom 70 Inserted between the fixture 80 and the reinforcement plate 30 and the fixture 80 Including a control spring 90 for adjusting the height of the needle 70, a plurality of coupling holes 31 are formed in the center of the reinforcing plate 30, the coupling bolt 53 is inserted and the coupling holes 31 A coupling nut insertion groove 31a into which the coupling nut 33 is inserted is formed at an upper portion thereof, and an adjustment spring insertion groove 31b having a size that allows the adjustment spring 90 to be interposed at the lower portion thereof is formed.

Probe card having a conventional flatness adjusting means having such a configuration is to adjust the flatness by the tightening and loosening of the coupling bolt 53 and the elastic force of the adjustment spring (90).

As described above, the probe card having the flatness adjusting means according to the prior art adjusts the flatness by the elastic force of the adjustment spring, but by repeated use, the elastic force of the adjustment spring is weakened to properly perform the flatness adjustment. As the area of the printed circuit board increases due to the large diameter of the semiconductor wafer, it is inevitable to use a large number of coupling bolts and coupling nuts and adjustment springs, and due to the large difference in elastic force between the operation of the coupling bolts and the adjustment springs. It is more difficult to precisely adjust the flatness, and it is not easy to secure a space for mounting a plurality of adjustment springs, and the size is unnecessarily large even if it is secured. Has a problem that it is difficult to maintain the flatness properly The.

According to the present invention, even if the probe card having a large area due to the large diameter of the semiconductor wafer, it is possible to push and pull the frame with a uniform force over a large area, thereby precisely adjusting the flatness through the overall leveling. It is possible to adjust the flatness by reducing the number of bolts used to adjust the flatness, and to immediately compensate the leveling deviation caused by the tilt or the deviation between the equipments in the test work space, and even for repeated use. Nevertheless, the difficulty of maintaining the flatness due to loosening of the screw fastening portion.

A probe card for testing a semiconductor device according to the present invention is a probe card for inspecting a semiconductor device, comprising: a frame having a plurality of probes installed at a lower portion thereof, a printed circuit board positioned on the frame, and having a probe connected thereto; It is located on the circuit board, the level plate is fixed to the frame with the printed circuit board in between, the reinforcement plate located on the level plate, and the level plate to the reinforcement plate, and the flatness of the level plate from the reinforcement plate It comprises a plurality of leveling means for adjusting.

The level plate of the probe card for testing a semiconductor device according to the present invention is characterized in that it consists of a plurality of partition plates by being divided into regions including one or more leveling means of the plurality of leveling means.

The leveling means of the probe card for testing a semiconductor device according to the present invention is characterized in that the first leveling bolt is screwed to the level plate through the reinforcing plate.

Leveling means of the probe card for semiconductor device test according to the present invention, the second leveling bolt screwed to the reinforcement plate, penetrates through the level plate, the support jaw is formed to support the upper end of the level plate, and the level plate Another stopper is characterized in that it comprises a stop member fixed to the end of the second leveling bolt protruding from and supporting the level plate in close contact with the reinforcement plate by the rotation of the second leveling bolt.

According to the present invention, even in the case of a probe card having a large area due to the large diameter of the semiconductor wafer, the level plate can be used to push and pull the frame with a uniform force over a large area, thereby precisely adjusting the flatness through overall leveling. In addition, by adjusting the flatness through a level plate in which the flatness of the frame or the printed circuit board is kept constant, the flatness can be easily adjusted by reducing the number of leveling bolts used to adjust the flatness. It is formed to be divided so that flatness can be performed by using a large area as a small level point and partial leveling can be performed easily and quickly, and the flatness can be easily and quickly adjusted. The leveling deviation that occurred immediately on site Can be corrected, and despite the repeated use has the effect of overcoming the difficulty of maintaining flatness due to loosening of the screw fastening portion.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

FIG. 3 is an exploded perspective view showing a semiconductor device test probe card according to a first embodiment of the present invention, and FIG. 4 is a cross-sectional view showing main parts of a semiconductor device test probe card according to a first embodiment of the present invention. to be. As illustrated, the probe card 100 for testing a semiconductor device according to the first embodiment of the present invention is for inspecting a semiconductor device and includes a frame 110 in which a plurality of probes (not shown) are installed. And a printed circuit board 120 positioned on the frame 110, a level plate 130 positioned on the printed circuit board 120, a reinforcement plate 140 positioned on the level plate 130, and A plurality of leveling means 150 couples the level plate 130 to the reinforcing plate 140.

Frame 110 is provided with a plurality of probes, in this embodiment is mounted so that a plurality of probes are arranged in the mounting bar 111 in the longitudinal direction, the mounting bar 111 is coupled to the lower surface by the coupling bolt 112. The plurality of connection holes 113 are installed to provide a passage for the probe (not shown) to be electrically connected to the printed circuit board 120 positioned on the upper surface by installing the plurality of side-by-side probe tips. The upper portion of the probe fixed to the mounting bar 111 is electrically connected to the circuit pattern patterned on the printed circuit board 120.

On the other hand, the probe (not shown) is made of a material having excellent conductivity so that both ends are electrically connected to the connection pads 2 (shown in FIG. 1) and the circuit patterns of the printed circuit board 120, which are objects to be inspected. In addition, it is made of a thin plate to have a fine structure, the mounting bar 111 forms a slit into which the probe is fitted to directly fix the probe, or the number of probes corresponding to 1 DUT (Device Under Test) is fixed As the separate mounting member is fixed, a plurality of probes may be fixed to be arranged along the longitudinal direction through the mounting member, and the probe may be fixed using an epoxy resin.

The printed circuit board 120 is positioned on the frame 110 and supported by the frame 110 to be electrically connected to a probe fixed to the mounting bar 111.

The level plate 130 is positioned on the printed circuit board 120 and fixed to the frame 110 with the printed circuit board 120 interposed therebetween, and the frame 110 and the printed circuit board 120 maintain flatness. It has a material and a structure having sufficient strength as follows.

Various fixing means, such as bolts and screws, may be used to fix the level plate 130 and the frame 110. In the present embodiment, the flatness between the level plate 130 and the frame 110 may be kept constant. Supporting means (161) and the coupling means 160 consisting of a fixing bolt 162 is used.

The support 161 penetrates through each of the through holes 121 formed to be evenly distributed over the entire area of the printed circuit board 120, and the lower end of the support 161 is screwed into each of the fastening holes 114 of the frame 110, and the top of the support 161 is printed. It protrudes from the circuit board 120 to support the lower surface of the level plate 130. Therefore, the support 161 is fixed to the frame 110 and then polished the upper end to adjust the flatness to uniformly maintain the flatness between the level plate 130 and the frame 110 supported on the upper end of the support 161. This prevents deformation of the frame 110 when adjusting the flatness, and in particular, when the frame 110 is soft or thin, the frame 110 is fixed to a part that is widely distributed or needs to be leveled. By supporting the level plate 130 serves to minimize the deformation of the frame 110.

The fixing bolt 162 fixes the level plate 130 on the support 161 by screwing the support bolt 161 through the through hole 131 formed in the level plate 130 supported on the top of the support 161. Let's do it.

The reinforcing plate 140 is coupled to the lower surface of the level plate 130 by a plurality of leveling means 150 provided to be distributed over the entire area, the frame 110, the printed circuit board 120 and the like to maintain the flatness It is formed of a material and a structure having sufficient strength to be supported in a state.

The leveling means 150 is composed of a plurality, the level plate 130 is coupled to the reinforcing plate 140, and adjusts the flatness of the level plate 130 from the reinforcing plate 140.

The leveling means 150 is a first leveling bolt 151 that is screwed into the fastening hole 132 of the level plate 130 through the through hole 141 is formed to be evenly distributed over the front of the reinforcing plate 140 When the head 151a of the leveling bolt 151 is caught by the reinforcing plate 140, the separation is suppressed downward, and a wrench groove 151b for inserting the hexagon wrench is formed at the upper end, and the wrench groove 151b. In place of the slotted slot or cross groove for the insertion of the driver can be formed.

The leveling means 150 is screwed into a screw hole 142 formed to correspond to the through hole 141 at a position corresponding to the first leveling bolt 151 in the reinforcing plate 140, and thus, the first leveling bolt 151. It may further include a leveling fixing bolt 152 for fixing the first leveling bolt 151 by supporting the upper end, a wrench hole 152a for insertion of the hexagon wrench is formed in the center of the leveling fixing bolt 152 do.

5 is a perspective view illustrating a level plate of a probe card for testing a semiconductor device according to a second exemplary embodiment of the present invention. As shown, the semiconductor device test probe card 200 according to the second embodiment of the present invention has the same configuration as the first embodiment, but the level plate 230 is any one of a plurality of leveling means 150 Alternatively, there is a difference in that the divided plate 231 is divided into a region including two or more leveling means 150. Accordingly, the dividing plate 231 is coupled to the frame 110 with the printed circuit board 120 (shown in FIGS. 3 and 4) interposed therebetween, and includes the reinforcing plate 140 by one or more leveling means 150; 3 and 4), thereby enabling flatness by using a large area as a small level point and enabling partial leveling so that flatness control can be easily and quickly performed.

On the other hand, the dividing plate 231 has a circular arc shape in the present embodiment so that the level plate 230 has a circular shape, as in the probe card 300 for semiconductor device test according to the third embodiment shown in FIG. The plate 331 is made of a square, and the level plate 330 may be made of a rectangle as a whole according to the arrangement of the split plate 331, without being limited thereto, the divided plate may be polygonal, circular, oval, straight and curved. Level plates may also have various shapes by being arranged in various shapes such as shapes.

FIG. 7 is a cross-sectional view illustrating main parts of a probe card for testing a semiconductor device according to a fourth exemplary embodiment of the present invention. FIG. As shown, the probe card 400 for testing a semiconductor device according to the fourth embodiment of the present invention includes a frame 110 on which a plurality of probes (not shown) are installed, and on the frame 110. A level on the printed circuit board 120, the level plate 430 located on the printed circuit board 120, the reinforcement plate 440 located on the level plate 430, and the reinforcement plate 440. A plurality of leveling means 450 for coupling the plate 430, the configuration of the frame 110, printed circuit board 120, etc. in the semiconductor device test probe card 100 according to the first embodiment Since it has been described in detail, only the parts having a difference will be described.

The leveling means 450 is provided in plurality so as to be evenly distributed over the front surface of the reinforcing plate 440, each of which is screwed through the reinforcing plate 440 and through the level plate 430, but also through the level plate 430 The second leveling bolt 451 is formed to support the upper end of the support jaw 451d and the second leveling bolt 451 which is fixed to the end of the second leveling bolt 451 protruding downward from the level plate 430. The stop member 452 supports the level plate 430 to be in close contact with the reinforcing plate 440 by the rotation of the 451.

The second leveling bolt 451 is formed with a male screw portion 451a on an upper circumferential surface of the second leveling bolt 451 so as to be screwed into each of the fastening holes 441 evenly distributed over the front of the reinforcing plate 440, and the lower portion penetrates the level plate 430. Is penetrated so as to slide up and down in the hole 431, the groove or cross groove is formed on the top to be rotated by the driver, or the wrench groove (451b) to be rotated using a hexagon wrench as in this embodiment Is formed.

When the second leveling bolt 451 moves upward from the reinforcing plate 440 by rotation, the level plate 430 is pulled upward by the stop member 452, which will be described later. Otherwise, the reinforcing plate 440 is rotated. When moving downward from the support jaw 451d is caught by the upper end of the level plate 430 pushes the level plate 430 downward.

The second leveling bolt 451 may be installed at various parts of the required position in the reinforcement plate 440 to adjust the flatness to any position of the level plate 430 to increase the accuracy of the test, depending on the size of the pitch The precision of flatness can be improved.

The stop member 452 has a number corresponding to that of the second leveling bolt 451, and is fixed to the outer circumferential surface of the end of the second leveling bolt 451 protruding downward from the level plate 430. By loosening the bolt 451, the level plate 430 maintaining the flatness between the printed circuit board 120 and the frame 110 is supported to be in close contact with the reinforcing plate 440.

The stop member 452 has a second leveling such that the level plate 430 having the upper end supported by the support jaw 451d of the second leveling bolt 451 does not have a clearance for moving up and down in the second leveling bolt 451. In the bolt 451, the level plate 430 is preferably fixed at a position to be in close contact with the support jaw 451d.

On the other hand, the level plate 430 has a plurality of insertion grooves 432 for inserting the stop member 452 into the lower surface, respectively, so that the printed circuit board 120 positioned on the lower surface is not interfered by the stop member 452. Is formed.

As shown in FIG. 8, the stop member 452 has a first mounting groove 451c formed along an outer circumferential surface at an end of the second leveling bolt 451 through a cutout 452a formed at one side thereof. It is a stop ring 452b fitted to it.

The stop ring 452b is formed of a material having a restoring force by bending, is opened through the cutout 452a to be mounted in the first mounting groove 451c, and is supported by the insertion groove 432 side of the level plate 430. The support part 452c is formed integrally so that the support part 452c is not undesirably rotated by the support part 452c in a state of being fixed to the end of the second leveling bolt 451. As a result, the level plate 430 is stably supported.

As another embodiment, as shown in FIG. 9, the stop member 452 includes an opening ring 452d and a second leveling bolt 451 formed at one side thereof so as to be located at an outer circumferential surface of the end of the second leveling bolt 451. It includes a plurality of fastening projections (452e) to be inserted into the second mounting groove (451e) formed along the outer circumferential surface at the end to secure the open ring (452d) to the end of the second leveling bolt (451). Accordingly, the fastening protrusion 452e is inserted into the second mounting groove 451e by the restoring force while the opening ring 452d is opened through the opening and inserted into the second leveling bolt 451. 451) is fixed to the end.

As shown in FIG. 10, the stop member 452 is a stop pin 452f inserted into a mounting hole 451f formed at the end of the second leveling bolt 451.

The stop pin 452f is bent so as to face each other so that the engaging portion 452g is formed in the folded portion, and is inserted into the mounting hole 451f so as to protrude from the mounting hole 451f while the locking portion 452g is caught. Both ends are bent and fixed to the mounting hole 451f.

Meanwhile, as shown in FIG. 11, the stop pin 452f forms a bent portion 452h so that any one of both ends thereof is spaced apart from the other one, and a side portion connected to the bent portion 452h is spaced apart from the opposite side. By forming the bent portion 452i so as to be convex, the bent portion 452h is bent in the direction in which the bent portion 452h is spaced by the pressing of the bent portion 452i, and it is not necessary to bend both ends for fixing.

Meanwhile, similar to the first embodiment, the leveling fixing bolt may be provided to limit the rotation of the second leveling bolt 451, and the level plate 430 may also be formed of a plurality of split plates to easily adjust the partial flatness. have.

Referring to the operation of the semiconductor device test probe card according to the present invention having such a configuration as follows.

3 and 4, according to the first embodiment of the present invention, the leveling for the corresponding portion of the level plate 130 in accordance with the rotation direction of the first leveling bolt 151 in the position where the leveling is required And by adjusting the amount of leveling by the amount of rotation of the first leveling bolt 151 to adjust the flatness of the frame 110 and the printed circuit board 120 fixed to the level plate 130.

Since the frame 110 is not required to adjust the spacing with the level plate 130 and is fixed only while the flatness of the level plate 130 is kept constant, deformation of the flatness is prevented and flatness is maintained. As a result, the flatness can be quickly and easily adjusted only by the leveling of the level plate 130, and even in the case of a probe card having a large area due to the large diameter of the semiconductor wafer, By allowing the level plate 130 to push and pull the frame 110, it is possible to precisely adjust the flatness through the overall leveling.

In addition, the first leveling bolt 151 used to adjust the flatness to the area by adjusting the flatness through the level plate 130 in which the flatness with the frame 110 or the printed circuit board 120 is kept constant. By reducing the number of to facilitate the adjustment of the flatness.

As shown in FIG. 5 and FIG. 6, the level plates 230 and 330 are formed of a plurality of split plates 231 and 331, thereby performing flatness using a large area as a small level point and corresponding to an area requiring flatness control. The leveling is performed only on the split plates 231 and 331 to reduce the time and effort required to adjust the flatness.

According to the fourth embodiment of the present invention illustrated in FIG. 7, when a specific portion of the level plate 430 sags downward than a desired position, the second leveling bolt 451 positioned at the sagging portion of the level plate 430 may be removed. By moving upward by rotating, the stop member 452 pulls the level plate 430 upward so that the printed circuit board 120 and the frame 110 are brought into close contact with the reinforcing plate 440 to perform leveling.

On the contrary, when a specific portion of the level plate 430 is positioned above the desired position, the second leveling bolt 451 rotates downward by rotating the second leveling bolt 451 located at the specific portion to support the second leveling bolt 451. The jaw 451d pushes the upper end of the level plate 430 downward so that the frame 110 together with the printed circuit board 120 moves away from the reinforcement plate 440 to perform leveling.

On the other hand, the probe card for testing a semiconductor device according to the present invention, when the leveling is finished, the first and second leveling bolts (151,451) is fixed by tightening the leveling fixing bolts 152 so as not to cause any further rotation, the leveling is required again In this case, the leveling fixing bolt 152 may be loosened to adjust the flatness in the same manner as described above.

In addition, the probe card for testing a semiconductor device according to the present invention can immediately correct the leveling deviation caused by the inclination or the deviation between the equipment in the test work space in addition to the above-described action in the field, and screwing in spite of repeated use To overcome the difficulty of maintaining flatness due to loosening of the site.

As described above, specific embodiments have been described in the detailed description of the present invention, but it is obvious that the technology of the present invention can be easily modified by those skilled in the art, and such modified embodiments are defined in the claims of the present invention. It will be included in the technical spirit described.

1 is a cross-sectional view showing a probe card for testing a semiconductor device according to the prior art,

Figure 2 is an exploded perspective view showing a probe card having a flatness adjusting means according to the prior art,

3 is an exploded perspective view showing a probe card for testing a semiconductor device according to a first embodiment of the present invention;

4 is a cross-sectional view showing the main parts of a probe card for testing a semiconductor device according to a first embodiment of the present invention;

5 is a perspective view illustrating a level plate of a probe card for testing a semiconductor device according to a second exemplary embodiment of the present invention;

6 is a perspective view illustrating a level plate of a probe card for testing a semiconductor device according to a third exemplary embodiment of the present invention;

FIG. 7 is a cross-sectional view illustrating main parts of a probe card for testing a semiconductor device according to a fourth exemplary embodiment of the present invention.

8 is a perspective view illustrating a stop member of a probe card for testing a semiconductor device according to a fourth embodiment of the present invention;

9 is a perspective view illustrating another embodiment of a stop member of a probe card for testing a semiconductor device according to a fourth embodiment of the present invention;

10 is a perspective view illustrating still another embodiment of a stop member of a probe card for testing a semiconductor device according to a fourth embodiment of the present invention;

11 is a perspective view illustrating still another embodiment of a stop member of a probe card for testing a semiconductor device according to a fourth embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: frame 111: mounting bar

112: coupling bolt 113: connection hole

114: fastening hole 120: printed circuit board

121: through hole 130,230,330,430: level plate

131: through hole 132: fastening hole

231,331: Split plate 140,440: Reinforcement plate

141: through hole 142: screw hole

150,450 leveling means 151 first leveling bolt

151a: Head 151b: Wrench Groove

152: leveling fixing bolt 152a: wrench hole

160: coupling means 161: support

162: fixing bolt 431: through hole

432: insertion groove 441: fastening hole

450: leveling means 451: second leveling bolt

451a: male thread 451b: wrench groove

451c: First mounting groove 451d: Supporting jaw

451e: 2nd mounting groove 451f: mounting hole

452: stopping member 452a: incision

452b: detent ring 452c: support

452d: Opening ring 452e: Fastening protrusion

452f: stop pin 452g: hook

452h: bend portion 452i: bend portion

Claims (9)

A probe card for inspecting a semiconductor device, A frame on which a plurality of probes are installed, A printed circuit board positioned on the frame and to which the probe is connected; A level plate positioned on the printed circuit board and fixed to the frame with the printed circuit board interposed therebetween; A reinforcing plate positioned on the level plate, A plurality of leveling means for coupling the level plate to the reinforcement plate and adjusting the flatness of the level plate from the reinforcement plate Probe card for semiconductor device testing comprising a. The method of claim 1, The level plate, Consisting of a plurality of dividing plates by dividing into one or more of the plurality of leveling means or an area including two or more leveling means Probe card for semiconductor device testing, characterized in that. The method of claim 1, It further comprises a plurality of coupling means for coupling the frame and the level plate, The coupling means, A support for screwing the frame through the printed circuit board and having an upper end projecting from the printed circuit board to support a lower surface of the level plate; Fixing bolts screwed to the support through the level plate Probe card for testing semiconductor devices, including The method of claim 1, The leveling means, A first leveling bolt that is threaded to the level plate through the reinforcing plate Probe card for semiconductor device testing, characterized in that. The method of claim 4, wherein The leveling means, A leveling fixing bolt screwed to a position corresponding to the first leveling bolt in the reinforcing plate to fix the first leveling bolt; Probe card for semiconductor device testing further comprising. The method of claim 1, The leveling means, A second leveling bolt screwed to the reinforcing plate, penetrating through the level plate, and having a supporting jaw formed to support an upper end of the level plate; A stop member fixed to an end of the second leveling bolt protruding from the level plate and supporting the level plate to be in close contact with the reinforcing plate by rotation of the second leveling bolt; Probe card for semiconductor device testing comprising a. The method of claim 6, The level plate, Forming a plurality of insertion grooves for inserting the stop member respectively on the bottom surface Probe card for semiconductor device testing, characterized in that. The method according to claim 6 or 7, The stop member, Fixed to a position in which the level plate is in close contact with the support jaw in the second leveling bolt Probe card for semiconductor device testing, characterized in that. The method of claim 6, The leveling means, A leveling fixing bolt screwed into a position corresponding to the second leveling bolt in the reinforcing plate to fix the second leveling bolt; Probe card for semiconductor device testing further comprising.
KR1020080015861A 2008-02-21 2008-02-21 Probe card for testing semiconductor devices KR20090090571A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220034529A (en) * 2020-09-11 2022-03-18 스테코 주식회사 Probe card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220034529A (en) * 2020-09-11 2022-03-18 스테코 주식회사 Probe card

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