KR20090080392A - Plating method for using decal comania inmold and intenna for mobile communication terminal unit using the same - Google Patents

Abstract

A plating method using an imprint in mold and an antenna for a mobile communication terminal using the same are provided to increase the productivity by minimizing a manufacturing process. A plating method using an imprint in mold is as follows. A release film having the predetermined thickness is manufactured(S110). A conductive pattern is printed on a one side of the release film where an UV coating processing does not be performed(S120). The release film is inserted into the mold to perform the injection-mold so that the release film in which the conductive pattern is printed adheres closely to the exterior of the formed resin(S130). The plated conductive pattern on the exterior of the formed resin is plated in order to form electrical pattern on the conductive pattern(S140).

Description

Plating method using transfer in mold and intenna for mobile communication terminal using same {Plating method for using decal comania inmold and intenna for mobile communication terminal unit using the same}

The present invention relates to a plating method using a transfer in-mold and an intenna for a mobile communication terminal using the same. More specifically, a conductive pattern can be realized on a three-dimensional curved surface, and the manufacturing process can be simplified to significantly increase productivity. The present invention relates to a plating method using a transfer in-mold and an antenna for a mobile communication terminal using the same.

In general, a plating method for implementing a conductive pattern on an injection molded product is formed by double injection molding a material having different characteristics for plating, such as polycarbonate (PC) and ABS resin.

Here, the injection molded article is applied to a case and a panel of an electrical and electronic product, for example, is applied to a resin molded article for manufacturing an antenna of a mobile communication terminal.

On the other hand, the conventional plating method for implementing a conductive pattern in the injection molded article used a method of forming a conductive ink by pad printing on the surface of the injection molded article and then plated, further bending or deformation of a separate metal object (bending) Processed and fixed to the surface of the injection molded article was used.

However, the plating methods for implementing the conductive pattern in the injection molded article according to the prior art as described above had the following problems.

First, in the case of a double injection plating method in which double injection is performed using a material having different plating properties, that is, polycarbonate and ABS resin, the modification of the conductive pattern is not easy because the mold itself must be changed in order to modify the conductive pattern. there was.

In addition, the pad printing plating method for plating the conductive ink on the surface of the injection molded product after the pad printing is not only possible to realize the conductive pattern on the curved surface. In addition, the side printing requires pad printing by rotating the product separately. There was a problem that occurred.

On the other hand, the plating method for fixing the injection molded product by bending or deforming a separate metal material is also difficult to change the conductive pattern because the processing of the metal must be changed in order to change the conductive pattern, and the manufacturing process is also complicated. There was a problem.

As described above, the plating methods for implementing the conductive pattern in the injection molded article according to the prior art are impossible to implement the conductive pattern on the curved product, it was not easy to change the conductive pattern.

Therefore, since the manufacturing process is complicated, it is easy to change the conductive pattern, there is a need for a plating method for implementing the conductive pattern in the injection-molded article that can reduce the manufacturing cost by simplifying the manufacturing process.

In order to solve the above problems, an object of the present invention is to provide a plating method using a transfer in-mold capable of realizing a conductive pattern on a three-dimensional curved surface, significantly increasing the productivity by simplifying the manufacturing process do.

In addition, another object of the present invention is to increase the volume of the intenna by applying the conductive pattern to the intena resin molded article consisting of a curved three-dimensional shape having a curved surface, to maximize the performance of the intenna, and to change the conductive pattern by simplifying the manufacturing process An antenna for a mobile communication terminal is provided.

In order to achieve the above object, a plating method using a transfer in-mold according to a preferred embodiment of the present invention comprises the steps of preparing a release film having a predetermined thickness; Printing a conductive pattern on one surface of the release film not subjected to the ultraviolet (UV) coating; And inserting the release film into a mold so that the release film on which the conductive pattern is printed is in close contact with the outer surface of the resin molding.

Here, after the in-mold injection molding step, the release film separation step of separating the release film printed in-mold conductive pattern is removed from the resin molding.

In addition, after the release film separation step, a step of plating the surface of the conductive pattern may be performed so that an electrical pattern may be formed on the conductive pattern transferred to the outer surface of the resin molding by in-mold injection.

At this time, the plating step may include the steps of washing and etching the conductive pattern and the resin molding transferred to the resin molding by in-mold injection, and copper plating and washing the surface of the washed and etched conductive pattern; And a second plating process and a washing step for forming a second plating layer to protect the copper plated plating layer after the copper plating and washing step.

On the other hand, the intenna for the mobile communication terminal by the plating bang using the transfer in-mold as described above, the resin molding is coupled to the main body of the mobile communication terminal; A conductive pattern transferred to the outer surface of the resin molding through in-mold injection; An adhesive layer for bringing the conductive pattern into close contact with an outer surface of the resin molding; And a plating layer formed on a surface of the conductive pattern so that an electrical pattern can be formed on the conductive pattern.

In this case, the conductive pattern is printed on the release film not coated with ultraviolet (UV), it is preferable that the transfer to the front and side portions of the resin molding through the in-mold injection process.

In addition, the resin molding may be provided with a curved front surface portion, and the side portion may be roundly connected with the front surface portion.

Referring to the plating method using a transfer in-mold according to the present invention described above and the effect of the antenna for mobile communication terminals using the same as follows.

First, by applying the plating method using the transfer in-mold can be formed into a three-dimensional curved shape of the resin molding, thereby increasing the volume of the intenna resin molding when applied to the intenna can increase the efficiency of the intenna.

Second, in contrast to forming the conductive pattern through separate processes on the front and side surfaces of the resin molding in the conventional intenna, the conductive pattern may be realized by only a single in-mold injection process on the front and side surfaces of the resin molding. .

Third, since the conductive pattern can be implemented by a single in-mold injection process on the front and side surfaces of the intena resin molding, it is possible to easily implement the change of the conductive pattern without being limited to the change of the conductive pattern.

Fourth, when the plating method using the transfer in-mold is applied to the intenna, it is easy to implement a shape having a curved shape with respect to the resin molding of the intenna, and the manufacturing process can be simplified to reduce the manufacturing cost.

Fifth, the manufacturing process can be simplified by excluding the process of UV coating the surface of the release film on which the conductive pattern is printed, thereby reducing the manufacturing cost and significantly increasing the productivity.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the plating method using a transfer in-mold according to the present invention.

1 is a flowchart showing the overall process of the plating method using a transfer in mold according to the present invention, Figure 2 is a flow chart showing a plating process of a plating method using a transfer in mold according to the present invention.

3 is an exploded perspective view showing the structure of an intenna for a mobile communication terminal by a plating method using a transfer in-mold according to the present invention, and FIG. 4 is an intenna for a mobile communication terminal by a plating method using a transfer in-mold. Perspective view.

As shown in Figure 1 to 4, the plating method using a transfer in-mold according to a preferred embodiment of the present invention is a release film manufacturing step (S110), conductive pattern printing step (S120), in-mold injection molding step (S130), And it comprises a plating treatment step (S140).

Here, the release film manufacturing step (S110) is formed of a release film 70 having a predetermined thickness, the material of the release film 70 is preferably provided with a polyester (PET) material.

At this time, the surface of the release film 70 provided with the polyester material excludes ultraviolet (UV) coating treatment.

In addition, the conductive pattern printing step (S120) is preferably made of a step of printing the conductive pattern 50 required by the conductive ink on one surface of the release film 70 is not the ultraviolet (UV) coating treatment.

At this time, the printing method for printing the conductive ink pattern of the conductive pattern printing step (S120) may alternatively be applied to gravure printing or silk screen printing.

On the other hand, after the conductive pattern printing step (S120) further an adhesive layer printing step (not shown) in which the adhesive layer 30 is printed on the outer surface of the ink layer of the conductive pattern 50 printed on one surface of the release film 70. It is preferable to include.

As described above, the conductive film on one surface of the release film 70 through the release film 70 manufacturing step (S110), the conductive pattern 50 printing step (S120) and the adhesive layer 30 printing step (not shown). The pattern 50 and the adhesive layer 30 are printed in order.

Then, the in-mold injection molding step (S130) is made, the in-mold injection molding step (S130) is, as described above, the release film 70, the conductive pattern 50 and the adhesive layer 30 is printed It is preferably made of a step of in-mold injection molding by inserting into the mold to be in close contact with the outer surface of the resin molding (10).

Through the above steps, the conductive pattern 50 printed on the surface of the release film 70 is transferred to the outer surface of the resin molding 10, and the conductive pattern 50 is formed by the adhesive layer 30. ) Is smoothly transferred to the outer surface of the resin molding 10 and firmly attached and fixed.

Here, the in-mold injection in the in-mold injection molding step (S130) refers to an injection molding method in which a gravure printed film is inserted between molds to transfer the ink layer to the injection molding at the same time.

Meanwhile, after the in-mold injection molding step (S130), the release film 70 attached to one side of the conductive pattern 50 transferred in-mold to the outer surface of the resin molded product 10 may be formed on the resin molded product 10. It is preferable that the separation step (not shown) of the release film 70 to be separated from).

As described above, the release film 70 manufacturing step (S110), conductive pattern 50 printing step (S120), adhesive layer 30 printing step (not shown), in-mold injection molding step (S130) and the release film The conductive pattern 50 is transferred to the resin molding 10 through a separation step (not shown).

Thereafter, a plating process step (S140) is performed, and the plating process step (S140) is in-mold injected through the in-mold injection molding step (S130) and the conductive pattern 50 transferred to the outer surface of the resin molding 10. It is preferable that the step of plating the surface of the conductive pattern 50 so that an electrical pattern can be formed.

At this time, the plating step (S140) is a washing and etching step (S210) for washing and etching the surface of the conductive pattern 50, and the surface of the conductive pattern 50 subjected to the washing and etching copper plating and washing It comprises a step (S220).

Here, the washing and etching step (S210) is a step for converting the surface of the conductive pattern 50 to a state that can be plated, and after the copper plating and washing step (S220) after converting to a plating possible state Through the conductive pattern 50 may have an electrical pattern.

On the other hand, after the copper plating and washing step (S220) may further comprise a second plating treatment and washing step (S230) for forming a second plating layer to protect the copper-plated plating layer.

As described above, after the in-mold injection molding step (S130) and the release film 70 separation step (not shown), the washing and etching step (S210), copper plating and washing step (S220) and the second plating An electrical pattern may be smoothly formed on the conductive pattern 50 transferred to the resin molding 10 through the plating treatment step S140 including the treatment and washing step S230.

Plating method using the transfer in-mold as described above, when applied to the intenna, it is easy to implement a shape having a curved shape with respect to the resin molding 10 of the intenna, and the manufacturing process can be simplified to significantly reduce the manufacturing cost .

In addition, in the conventional plating method, the conductive pattern 50 is formed only by a single in-mold injection process on the front and side portions of the resin molding 10, unlike the conductive pattern is formed through a separate process. ) Can be implemented.

Furthermore, since the conductive pattern 50 can be implemented only by a single in-mold injection process, the change of the conductive pattern 50 can be easily implemented.

In addition, by excluding the process of UV (UV) coating the surface of the release film 70, the conductive pattern 50 is printed can simplify the manufacturing process to significantly increase productivity.

Meanwhile, the plating method using the transfer in-mold according to the present invention as described above may be applied to the intenna for the mobile communication terminal, and the intenna for the mobile communication terminal by the plating method using the transfer in-mold with reference to FIGS. 3 and 4. This will be described below.

3 is an exploded perspective view showing the structure of an intenna for a mobile communication terminal by a plating method using a transfer in-mold according to the present invention, and FIG. 4 is a perspective view showing an intenna for a mobile communication terminal by a plating method using a transfer in-mold. .

3 and 4, the intenna for the mobile communication terminal by the plating method using the transfer in-mold according to the present invention, the resin molding 10, the conductive pattern 50, the adhesive layer 30, and the plating layer 60 It is made, including.

Here, the resin molded product 10 is coupled to the main body of the mobile communication terminal, and preferably has a predetermined volume and is formed in a curved shape.

In detail, the resin molding 10 has the front portion 11 protruding to form a curved shape to the outside, the side portion 13 is connected to the edge of the front portion 11, the front portion 11 and the side portion It is preferable that the connection parts to which the 13 parts are connected are connected roundly.

Of course, the resin molding 10 has a front portion 11 is provided in a planar shape, the side portions 13 may also be connected in a plane shape so that the side portions 13 are angled at the edge of the front portion 11. It may be connected roundly.

In addition, the conductive pattern 50 is transferred to the outer surface of the resin molding 10 through in-mold injection, and the adhesive layer 30 is interposed between the conductive pattern 50 and the outer surface of the resin molding 10. do.

Here, the adhesive layer 30 is interposed between the conductive pattern 50 and the outer surface of the resin molding 10 so that the conductive pattern 50 is transferred to the outer surface of the resin molding 10 by the adhesive layer 30. It can be firmly attached and fixed.

On the other hand, the plating layer 60 is formed by plating on the surface of the conductive pattern 50 so that an electrical pattern can be formed on the conductive pattern 50.

At this time, the plating layer 60 is preferably formed through the washing and etching step (S210), and the copper plating and washing step (S220), the copper-plated plating layer 60 after the copper plating and washing step (S220) It may be formed by further comprising a second plating process and washing step (S230) to form a second plating layer (not shown) to protect the ().

In detail, by the step of washing and etching the surface of the conductive pattern 50 (S210) is converted to a state in which plating can be deposited on the surface of the conductive pattern 50, and then copper plating and washing step (S230) The conductive pattern 50 is plated so as to have an electrical pattern therethrough.

Intena by the plating method using the transfer in-mold according to the present invention as described above can be implemented by the plating method using the transfer in-mold can be realized in the shape of the resin molding 10 in a three-dimensional curved shape, moreover applied to the intenna Since the volume of the intena resin molded article 10 can be increased, the efficiency of the intenna can be increased.

In addition, in the conventional intenna, in contrast to forming a conductive pattern through separate processes on the front and side portions of the resin molding, a single in-mold on the front portion 11 and the side portions 13 of the resin molding 10 is formed. The conductive pattern 50 may be realized only by the injection process.

As described above, since the conductive pattern 50 may be realized only by a single in-mold injection process, the conductive pattern 50 implemented in the intena resin molding 10 as a new conductive pattern researched and developed for improving the performance of the intena. When a change of is required, the change of the conductive pattern 50 can be easily implemented.

In addition, since the conductive pattern 50 can be implemented using only a single in-mold injection process, the manufacturing process of the intenna can be simplified, and thus manufacturing cost can be reduced.

Although specific embodiments of the present invention have been described in detail above, the present invention is not limited thereto, and those skilled in the art may make various changes and modifications based on the technical idea of the present invention.

1 is a flow chart showing the overall process of the plating method using a transfer in-mold according to the present invention.

2 is a flow chart showing a plating process of the plating method using a transfer in-mold according to the present invention.

Figure 3 is an exploded perspective view showing the structure of the antenna for a mobile communication terminal by a plating method using a transfer in-mold according to the present invention.

Figure 4 is a perspective view showing an antenna for a mobile communication terminal by a plating method using a transfer in-mold.

<Description of Symbols for Main Parts of Drawing>

10: resin molding 30: adhesive layer

50: conductive pattern 60: plating layer

70: release film

Claims (7)

Preparing a release film having a predetermined thickness; Printing a conductive pattern on one surface of the release film not subjected to the ultraviolet (UV) coating; And And inserting the mold release film into a mold so as to be in close contact with the outer surface of the resin molding. The method of claim 1, After the in-mold injection molding step, a release film separation step of separating the release film printed with the in-mold conductive pattern printed from the resin molding is characterized in that the transfer in-mold plating method. The method of claim 2, After the release film separation step, the in-mold transfer inmold is characterized in that the step of plating the surface of the conductive pattern is formed so that the electrical pattern is formed on the conductive pattern transferred to the outer surface of the resin molding Plating method using. The method of claim 3, wherein The plating process may include washing and etching the conductive pattern and the resin molding which are in-mold injected and transferred to the resin molding; Copper plating and washing the surface of the washed and etched conductive pattern; And And a second plating treatment and a washing step to form a second plating layer to protect the copper plated plating layer after the copper plating and washing steps. Resin molding is coupled to the body of the mobile communication terminal; A conductive pattern transferred to the outer surface of the resin molding through in-mold injection; An adhesive layer for bringing the conductive pattern into close contact with an outer surface of the resin molding; And An antenna for a mobile communication terminal comprising a plating layer formed on a surface of the conductive pattern so that an electrical pattern can be formed on the conductive pattern. The method of claim 5, wherein The conductive pattern is printed on a release film not coated with ultraviolet (UV), the intenna for a mobile communication terminal, characterized in that transferred to the front portion and the side portion of the resin molding through an in-mold injection process. The method of claim 5, wherein The resin molded article is provided with a curved front surface, and the side portion is connected to the front portion rounded, the antenna for a mobile communication terminal, characterized in that the overall curved shape.

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