KR20090070120A - Stacking type wafer lens and manufacturing method thereof and camera module having it - Google Patents

Abstract

A laminated-typed wafer lens, a manufacturing method thereof, and a camera module including the laminated-typed wafer lens are provided to decrease tolerance which is generated in spacer adhesion by forming an interval maintaining hole between the lenses. A plurality of the wafer lenses(WL1,WL2) comprise a lens formed on an upper part and a lower part of a lens substrate(S1,S2). A spacer(111,121) is formed on both sides of the surface which is formed to an opposite direction among the wafer lenses. An interval maintaining hole is positioned between the spacer and the wafer lens. The interval maintaining hole maintains intervals to prevent contact of the lenses facing each other.

Description

Stacking type wafer lens and manufacturing method, and camera module having a stacked wafer lens

The present invention relates to a laminated wafer lens and a method of manufacturing the same, and more particularly, to a laminated wafer lens for reducing tolerances generated when the spacer is bonded by further including a spacer for fixing and fixing each other between the laminated wafer lenses. It relates to a manufacturing method and a camera module provided with a stacked wafer lens.

In general, a replication process is a method of manufacturing a lens on a wafer basis, and in the case of using a wafer lens manufactured by such a replication method, a semiconductor process can be used to align the lens. In addition, the arrangement can be performed more easily than the conventional method, and the tolerance property can be improved, thereby reducing the volume of the lens.

The replication method is a method of manufacturing a wafer lens by forming a thin wafer layer using a transparent optical material such as polymer on a transparent lens substrate made of glass or the like.

Hereinafter, a camera module with a stacked wafer lens according to the related art will be described with reference to related drawings.

1 is a cross-sectional view of a camera module with a stacked wafer lens according to the prior art.

First, as shown in FIG. 1, a camera module including a stacked wafer lens according to the related art includes an image sensor module ISM for optical conversion, and a housing H1 coupled on the image sensor module ISM. ) And a plurality of wafer lenses WL1 and WL2 sequentially stacked in the housing H1.

Here, the image sensor module ISM is provided with an image sensor (not shown) for converting incident light incident from the outside into an electrical signal.

In addition, a lower portion of the housing H1 is coupled to an outer upper surface of the image sensor module ISM, and a plurality of first and second wafer lenses WL1 and WL2 are mounted therein.

In this case, the first and second wafer lenses WL1 and WL2 are sequentially stacked and mounted in the housing H1. In the first wafer lens WL1, first and second lenses L1 and L2 are formed on the upper and lower surfaces of the first lens substrate S1, respectively, and face the second wafer lens WL2. First spacers 10 are formed at both ends of the lower portion.

In addition, the second wafer lens WL2 has third and fourth lenses L3 and L4 formed on and under the first lens substrate S2, respectively, and the first wafer lens WL2. Second spacers 20 are formed at both side ends of the upper portion facing the upper surface.

In this case, the first and second spacers 10 and 20 face each other of the first and second wafer lenses WL1 and WL2 when the first and second wafer lenses WL1 and WL2 are stacked. The second and third lenses L2 and L3 are formed so as not to contact each other.

In addition, the first and second spacers 10 and 20 are adhesively fixed to the upper portion of the first and second spacer lenses WL1 and WL2 through an adhesive B or the like.

However, the camera module having the stacked wafer lens according to the related art having the above configuration has the following problems.

In the conventional camera module having a stacked wafer lens, a predetermined adhesive B is applied to the first and second spacers 10 and 20 formed at both sides to stack the first and second wafer lenses WL1 and WL2. After that, the pressure is fixed to each other.

In this case, when the adhesive B is uniformly applied and the pressure applied to the first and second wafer lenses WL1 and WL2 is uniformly applied, the first wafer lens WL1 and the second wafer lens WL2. Although the stacking height of can be maintained constant, there is a problem that the stacking height is different from each other when the adhesive (B) is not applied evenly and applied more to any one spacer.

In addition, when a difference occurs in the pressure applied to the first and second wafer lenses WL1 and WL2, and a larger pressure is applied to any one of the spacers, the height is lower than the height of the region where the pressure is relatively small. There was a problem that a tolerance occurs by being stacked.

Accordingly, the stacking heights of the first and second wafer lenses WL1 and WL2 are not constant, so that the focus of the lens needs to be readjusted. there was.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and further includes a spacer for fixing adhesiveness between the stacked wafer lenses to further reduce the tolerances generated when the spacers are bonded. It is an object of the present invention to provide a camera module equipped with a lens.

Laminated wafer lenses according to the present invention for achieving the above object, a plurality of wafer lenses formed with a lens on the upper and lower lens substrate; Spacers formed on both sides of surfaces of the plurality of wafer lenses facing each other; And a gap holder positioned between the spacer and the wafer lens to maintain the gap such that the lenses facing each other do not contact each other. There is an effect of reducing the occurrence of a tolerance.

At this time, the spacer is characterized in that formed in the concave or convex shape.

In addition, the height of the gap holder is characterized in that the height of the lens facing each other, the gap holder is characterized in that formed in the shape of any one selected from spherical, cylindrical columnar, hexahedral or hexagonal columnar.

In addition, a method of manufacturing a stacked wafer lens according to the present invention for achieving the above object comprises the steps of preparing a plurality of wafer lenses formed with a plurality of lenses on the upper and lower lens substrate and a spacer formed between the lens of any one surface; Positioning the prepared wafer lens so that spacers face each other; Positioning a plurality of gap holders on a wafer lens positioned below the prepared wafer lens; Applying an adhesive on the spacer and curing each wafer lens by bringing it into close contact; And cutting the combined plurality of wafer lenses around each lens to form a plurality of stacked wafer lenses. Accordingly, the present invention may further reduce the tolerance of the stacked wafer lens by further providing a gap holder between the plurality of wafer lenses.

In this case, the wafer lens is characterized in that formed by the replication process, the spacer is characterized in that formed in the concave or convex surface.

In addition, the height of the gap holder is characterized in that the height of the lens facing each other, the gap holder is characterized in that formed in the shape of any one selected from spherical, cylindrical columnar, hexahedral or hexagonal columnar.

In addition, the camera module with a stacked wafer according to the present invention for achieving the above object, Image sensor module for converting the incident light into an electrical signal; And a stacked wafer lens coupled to the image sensor module, provided with spacers and a gap holder on both sides of the wafer lens, and stacked with the plurality of wafer lenses.

In this case, the spacer is characterized in that formed in the concave or convex surface, the height of the gap holder is characterized in that the height of the lens facing each other, the gap holder is spherical, cylindrical columnar, hexahedral or hexagonal columnar Characterized in that formed in any one of the selected shape.

The stacked wafer lens and the method of manufacturing the same according to the present invention have an advantage of reducing the tolerance generated when the spacer is bonded by further comprising a gap holder in addition to the spacer for fixing and fixing each other between the stacked wafer lenses.

In addition, the stacked wafer lens and the manufacturing method according to the present invention can simplify the process because there is no need to additionally adjust the focus by the gap holder, and can improve the reliability as the tolerance is reduced to reduce the occurrence rate of defects. It has an effect.

In addition, the camera module equipped with a stacked wafer lens according to the present invention can eliminate the housing for fixing a plurality of wafer lenses by the interval holder, thereby reducing the material cost and miniaturizing as the volume can be reduced. There is an advantage to this.

The stacked wafer lens according to the present invention, a method of manufacturing the same, and a structure and effects of the camera module provided with the stacked lens will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown. .

Stacked  Wafer lens

Hereinafter, a multilayer wafer lens and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

2 to 5 are cross-sectional views for manufacturing a stacked wafer lens according to the present invention.

First, as shown in FIG. 5, the stacked wafer lens according to the present invention includes a first wafer lens WL1 having first and second lenses L1 and L2 formed on and under the first lens substrate S1. ), And the second and second wafer lenses WL2 and the first and second wafer lenses WL1 and WL2 having the third and fourth lenses L3 and L4 formed on and under the second lens substrate S2. It includes a spacing holder 140 formed therebetween.

Here, each of the first and second lenses L1 and L2 formed in the first wafer lens WL1 and the third and fourth lenses L3 and L4 formed in the second wafer lens WL2 are replicated. It is preferably formed through a replication process.

In addition, the first lens substrate S1 may be formed of glass of transparent material in order to allow incident light incident from the outside to pass therethrough.

First and second spacers 111 and 121 are formed at both ends of the first and second wafer lenses WL1 and WL2, and contact surfaces of the first and second spacers 111 and 121 are formed on the contact surfaces of the first and second wafer lenses WL1 and WL2. An adhesive 130 is applied to fix them to each other.

In this case, the first and second spacers 111 and 121 are formed in a concave or convex shape.

In particular, in the stacked wafer lens according to the present invention, a tolerance generated when the first and second wafer lenses WL1 and WL2 are adhesively fixed using only the first and second spacers 111 and 121 as in the related art. In order to prevent the gap holder 140 further has a predetermined height.

The gap holder 140 is provided to prevent a tolerance of a height generated when the first and second spacers 111 and 121 are bonded by the adhesive 130, and the first and second wafer lenses are provided. It is provided in the both sides of the surface which WL1 and WL2 face each other.

In this case, the gap holder 140 may have a height higher than that of the second and third lenses L2 and L3 formed on the surfaces of the first and second wafer lenses WL1 and WL2 facing each other. The reason is that when the second and third lenses L2 and L3 are formed lower than the heights of the second and third lenses L2 and L3, the second and third lenses L2 and L3 come into contact with each other. This is because the deformation of L3) may occur or breakage may occur.

In addition, the spacer 140 may be formed in any one shape selected from spherical, cylindrical columnar, hexahedral or hexagonal columnar.

A method of manufacturing a stacked wafer lens having such a configuration will be described in more detail with reference to FIGS. 2 to 5 as follows.

In the method of manufacturing a stacked wafer lens according to the present invention, as shown in FIG. 2, a first lens substrate S1 and a second lens substrate S2 are prepared.

Thereafter, a first lens L1 is formed on the prepared first lens substrate S1 and a second lens L2 is formed on the bottom of the prepared first lens substrate S1. In addition, a third lens L3 is formed on the second lens substrate S2, and a fourth lens L4 is formed on the bottom of the second lens substrate S2. The first to fourth lenses L1 to L4 may be formed by performing a replication process.

In this case, a first spacer 111 is formed below the first lens substrate S1, and a second spacer 121 is formed above the second lens substrate S2. The first and second spacers 111 and 121 are formed outside the regions where the first to fourth lenses L1 to L4 are formed on the first and second lens substrates S1 and S2, respectively.

In this case, the first and second spacers 111 and 121 may be formed in an iron surface shape having a thin edge and a convex surface.

In addition, the first and second spacers 111 and 121 may be formed in the shape of any one of a concave surface having a concave center or a convex surface having a thin edge and a convex center.

After preparing the first and second wafer lenses WL1 and WL2 having the first and second spacers 111 and 121 and the first to fourth lenses L1 to L4, the second wafer lens WL2 is prepared. Place multiple spacing holders 140 on the top.

In this case, the spacing holder 140 may be located between the second spacer 121 and the third lens L3. The reason is that since the incident light is incident on the third lens L3, the gap holder 140 is connected to the third lens L3 and the second spacer 121 so as not to prevent the incident light from penetrating. It is preferable to locate in between.

In addition, the height of the spacer 140 is preferably higher than the height of the second and third lenses (L2, L3). The reason for this is that when the height of the spacer 140 is lower than the height of the second and third lenses L2 and L3, the bonding of the first and second wafer lenses WL1 and WL2 is performed. Since the second and third lenses L2 and L3 come into contact with each other, the shape of the second and third lenses L2 and L3 may be changed or damaged. Therefore, the height of the gap holder 140 may be increased. Use a height higher than).

In addition, the spacer 140 may be formed of any one selected from spherical, cylindrical columnar, hexahedral or hexagonal columnar shape.

As such, after the spacer 140 is positioned on the second wafer lens WL2, the adhesive 130 is coated on the second spacer 121 as illustrated in FIG. 3.

Then, the first and second wafer lenses WL1 and WL2 are pressed by applying pressure to the first wafer lens WL1 in the direction of the second wafer lens WL2. When the pressure is maintained for a predetermined time, the adhesive 130 is hardened to fix the first and second wafer lenses WL1 and WL2 in close contact with each other.

In particular, in the method of manufacturing a stacked wafer lens according to the present invention, the height of the first and second wafer lenses WL1 and WL2 is kept constant by the gap holder 140, thereby providing the first and second wafers. When the lenses WL1 and WL2 are pressurized, pressure is not applied uniformly as in the prior art, thereby preventing the occurrence of height tolerances.

Accordingly, it is possible to shorten the manufacturing process of the laminated lens by not refocusing due to the occurrence of a tolerance, and there is an advantage of reducing the defective occurrence rate of the lens due to the tolerance.

In addition, as shown in FIG. 4 showing an exemplary embodiment of the spacer 140, the spacer 140 is not positioned at both sides of all the second spacers 121. And may be selectively positioned only where the heights of the second wafer lenses WL1 and WL2 can be kept constant.

As such, by placing the gap holder 140 only at a designated position, there is an advantage of saving material costs.

Then, as shown in FIG. 5, a dicing process is performed based on the first and second spacers 111 and 121 as shown in FIG. The wafer lens 200 may be formed.

Meanwhile, as shown in FIGS. 6 and 7 showing modifications of the first and second spacers 111 and 121 of the stacked wafer lens 200 according to the present invention, the first and second spacers 111 and 121. ), The area to be coated with the adhesive 130 may be formed to have a concave shape.

In addition, the spacer 160 may be formed on one stacked wafer lens to miniaturize the structure of the spacer 150 of FIG. 6 to achieve the shape of the spacer 150 before the dicing process.

Stacked  Camera Module with Wafer Lens

Hereinafter, a camera module with a stacked wafer lens according to the present invention will be described in detail with reference to FIG. 8. However, the description of the same parts as the above-described stacked wafer lens among the configuration of the camera module will be omitted, and only the configuration different from the camera module will be described in detail.

8 is a cross-sectional view showing a camera module provided with a stacked wafer according to the present invention.

First, as shown in Figure 8, the camera module with a stacked wafer according to the present invention, the image sensor module (ISM) equipped with an image sensor (not shown), and on the image sensor module (ISM) The first to third wafer lenses WL1, WL2, and WL3 are stacked to form a stacked wafer lens 200.

In this case, the stacked wafer lenses 200 may be formed by sequentially stacking the first to third wafer lenses WL1, WL2, and WL3, and the first to third wafer lenses WL1, WL2, and WL3 may be stacked on each other. The first and second spacers 111 and 121 and the spacer 140 are formed in the facing area.

In particular, the camera module according to the present invention comprises only the first and second spacers 111 and 121 as in the prior art, so as to form the stacked wafer lens 200, each of the first to third wafer lenses WL1 and WL2. The gap between the first to third wafer lenses WL1, WL2, and WL3 is maintained using only the gap holder 140 without positioning the WL3 in the housing.

Accordingly, the camera module according to the present invention can save the material cost by not needing a housing as in the prior art, and there is an advantage of simplifying the process.

In addition, the camera module according to the present invention has an effect that can be miniaturized by reducing the volume by not mounting the housing.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope of the technical spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is a cross-sectional view of a camera module with a stacked wafer lens according to the prior art.

2 to 5 are cross-sectional views of a process for manufacturing a stacked wafer lens according to the present invention.

6 and 7 are cross-sectional views of spacer variants of the stacked wafer lens according to the present invention;

8 is a cross-sectional view of a camera module provided with a stacked wafer according to the present invention.

<Description of Symbols for Major Parts of Drawings>

S1, S2: lens substrate 111, 121: spacer

130: adhesive 140: spacer

L1 ~ L4: Wafer Lens ISM: Image Sensor Module

Claims (13)

A plurality of wafer lenses having lenses formed on and under the lens substrate; Spacers formed on both sides of surfaces of the plurality of wafer lenses facing each other; And A gap holder positioned between the spacer and the wafer lens to maintain a gap such that lenses facing each other do not contact each other; Stacked wafer lens comprising a. The method of claim 1, The spacer is a stacked wafer lens, characterized in that formed in the concave or convex shape. The method of claim 1, And the height of the spacer is higher than the height of the lenses facing each other. The method of claim 1, The spacing holder is a stacked wafer lens, characterized in that formed in any one shape selected from spherical, cylindrical columnar, hexahedral or hexagonal. Preparing a plurality of wafer lenses in which a plurality of lenses are formed above and below the lens substrate and a spacer is formed between the lenses of any one surface; Positioning the prepared wafer lens so that spacers face each other; Positioning a plurality of gap holders on a wafer lens positioned below the prepared wafer lens; Applying an adhesive on the spacer and curing each wafer lens by bringing it into close contact; And Cutting the combined plurality of wafer lenses around each lens to form a plurality of stacked wafer lenses; Laminated wafer lens manufacturing method comprising a. The method of claim 5, The wafer lens is a laminated wafer lens manufacturing method, characterized in that formed by a replication process. The method of claim 5, The spacer is a laminated wafer lens manufacturing method, characterized in that formed in the concave or convex surface. The method of claim 5, The height of the spacer is a laminated wafer lens manufacturing method, characterized in that higher than the height of the lenses facing each other. The method of claim 8, The spacing holder is a stacked wafer lens manufacturing method, characterized in that formed in any one shape selected from spherical, cylindrical columnar, hexahedral or hexagonal. A camera module having an image sensor and a wafer lens manufactured by a replication process, the camera module comprising: An image sensor module for converting incident light into an electrical signal; And A stacked wafer lens coupled to the image sensor module and provided with spacers and a gap holder on both sides of the wafer lens, wherein the plurality of wafer lenses are stacked; Camera module equipped with a stacked wafer lens, characterized in that it comprises a. The method of claim 10, The spacer is a camera module equipped with a stacked wafer lens, characterized in that formed in the concave or convex surface. The method of claim 10, And a height of the gap holder is higher than a height of the lenses facing each other. The method of claim 12, The spacing holder is a camera module with a stacked wafer lens, characterized in that formed in any one shape selected from spherical, cylindrical columnar, hexahedral or hexagonal columnar.

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