KR20090030472A - The construction method of the paving layers having an elasticity - Google Patents

The construction method of the paving layers having an elasticity Download PDF

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KR20090030472A
KR20090030472A KR1020070095806A KR20070095806A KR20090030472A KR 20090030472 A KR20090030472 A KR 20090030472A KR 1020070095806 A KR1020070095806 A KR 1020070095806A KR 20070095806 A KR20070095806 A KR 20070095806A KR 20090030472 A KR20090030472 A KR 20090030472A
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chip
layer
chips
epdm
ocher
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KR1020070095806A
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KR100963298B1 (en
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박한수
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주식회사 그린켐
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    • EFIXED CONSTRUCTIONS
    • E01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01CCONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C7/00Coherent pavings made in situ
    • E01C7/08Coherent pavings made in situ made of road-metal and binders
    • E01C7/35Toppings or surface dressings; Methods of mixing, impregnating, or spreading them
    • E01C7/356Toppings or surface dressings; Methods of mixing, impregnating, or spreading them with exclusively synthetic resin as a binder; Aggregate, fillers or other additives for application on or in the surface of toppings having exclusively synthetic resin as binder
    • EFIXED CONSTRUCTIONS
    • E01CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01CCONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C7/00Coherent pavings made in situ
    • E01C7/08Coherent pavings made in situ made of road-metal and binders
    • E01C7/10Coherent pavings made in situ made of road-metal and binders of road-metal and cement or like binders
    • E01C7/14Concrete paving
    • E01C7/145Sliding coverings, underlayers or intermediate layers ; Isolating or separating intermediate layers; Transmission of shearing force in horizontal intermediate planes, e.g. by protrusions, by inlays

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Road Paving Structures (AREA)

Abstract

A functional elastic paving layer construction method is provided that the small quantity use of the coloring chip of which the price is expensive is possible. A functional elastic paving layer construction method comprises following steps: a step of forming an underlying layer(3) and installing the recycled rubber chip and waste tire chip with a superior elasticity and the tensile strength; a step of forming the polyurethanes solution of yellow soil paper chip or an overlying layer(4) it installs the second to EPDM (Ethylene Propylene Diene Monomer) yellow soil chip of high hardness with a superior adhesive force and tensile force; a step that makes the overlying layer with the thermostat roller and ossified.

Description

기능성 탄성 포장층 시공방법{The construction method of the paving layers having an elasticity}The construction method of the paving layers having an elasticity

본 발명은 탄성 포장층 시공방법에 관한 것으로, 좀더 구체적으로는 표면으로부터 일정 깊이로 흙을 파낸 다음, 다짐 공정을 행한 후에 콘크리트를 타설하여 양생시키고, 폴리우레탄수지, EPDM(Ethylene Propylene Diene Monomer)칩, 폐타이어칩이나 재생고무칩 등을 이용하여 포장하는 탄성 포장층 시공 방법에 있어서, 가격이 저렴하며 탄성과 인장강도가 우수한 폐타이어칩이나 재생고무칩으로 1차 포설하여 하지층을 형성한 다음, 접착력과 인장력이 우수한 고경도의 폴리우레탄황토수지칩 또는 EPDM(Ethylene Propylene Diene Monomer)황토칩으로 2차 포설하여 상지층을 형성하고 항온롤러로 다짐하여 경화시킴으로써 표면이 변색되는 문제점을 해결할 수 있고, 고가인 착색칩의 소량 사용이 가능하여 전체의 착색을 저렴한 비용으로 행할 수 있으며, 내구성이 우수하고 황토가 첨가되어 인체에 해가 되지 않으며 다량이 원적외선이 방출되는 환경친화적인 효과를 얻을 수 있도록 하는 기능성 탄성 포장층 시공방법에 관한 것이다.The present invention relates to a method for constructing an elastic pavement layer, more specifically, digging soil to a certain depth from the surface, and then curing by pouring concrete after the compaction process, polyurethane resin, EPDM (Ethylene Propylene Diene Monomer) chip In the method of constructing an elastic pavement layer for packaging using waste tire chips or recycled rubber chips, the foundation layer is first formed with waste tire chips or recycled rubber chips having low price and excellent elasticity and tensile strength. It is possible to solve the problem of discoloration by forming the upper layer by hard laying it with high hardness polyurethane ocher resin chip or EPDM (Ethylene Propylene Diene Monomer) ocher chip with excellent adhesion and tensile strength. It is possible to use a small amount of expensive colored chips, so that the whole coloring can be performed at low cost, and it has excellent durability. SAT is not harmful to the human body addition relates to a functional elastic pavement construction method to achieve the environment-friendly effect is much far-infrared emission.

일반적으로 도로포장은 도로면을 보호 강화하고 평탄성을 높여 사람의 통행과 차량의 주행을 편하게 하기 위하여 처리된 노면구조물로서, 여러 층으로 이루어진 층구조이며, 각 층은 각각의 역할을 분담하게 된다.In general, road pavement is a road structure that is processed to enhance the protection and flatness of the road surface and to facilitate the passage of people and the driving of the vehicle. The road pavement is a multi-layered layer structure, and each layer shares its role.

도로포장은 표층부의 재질에 따라 역청계(아스팔트) 포장, 콘크리트계 포장 및 블록 포장의 세 가지로 크게 분류되는 데, 역청계 포장은 표층부가 아스팔트 또는 타르에 의해 고결된 쇄석 등의 골재로 되어 있는 것으로, 아스팔트 포장, 타르 포장 등과 같이 부르고 있으며, 현재 세계 각국의 도로의 대부분을 차지하고 있고, 그 종류도 대단히 많다.The road pavement is classified into three types according to the material of the surface layer: bitumen (asphalt) pavement, concrete type pavement, and block pavement.The bituminous system pavement is composed of aggregates such as crushed stone which is solidified by asphalt or tar. It is called as asphalt pavement, tar pavement, etc., and currently occupies most of the roads around the world, and there are many kinds.

콘크리트계 포장은 표층부에 콘크리트를 포설한 것인 데, 콘크리트 뿐이거나 콘크리트에 철망을 삽입한 보통의 콘크리트 포장 외에, 철근 콘크리트 포장, 프리스트레스트 콘크리트 포장 등이 있으며, 블록포장은 돌, 벽돌, 시멘트, 나무, 아스팔트 등의 각종 블록을 표층부에 깔아서 된 것으로, 현재 차도에는 별로 쓰이지 않고, 보도나 광장 등에 쓰이고 있을 뿐이다.Concrete paving is concrete laid on the surface layer. In addition to concrete or ordinary concrete paving with wire mesh in concrete, reinforced concrete paving, prestressed concrete paving, etc., block paving includes stone, brick, cement, Various blocks such as wood and asphalt are laid on the surface layer, and they are not used for roadways but are used for sidewalks and plazas.

한편, 블록포장은 하지면을 다짐 시공한 후에 모래를 이용하여 보조기층을 형성하여 평탄성을 부여한 다음, 보도블록이나 고무블록 등을 설치하거나 포러스 콘크리트를 포설하는 방법이 사용되고 있다.On the other hand, block paving is used to form a base layer by using sand after compaction of the base surface to give flatness, and then install a sidewalk block, rubber block, or the like, or install porous concrete.

그러나, 상기의 방법은 강우시 모래층이 유실되거나 특정 부분으로 투과수의 과다한 유출로 인하여 불규칙한 침하가 발생하고, 이는 표층의 균열이나 손상 및 침하로 이어지는 문제점이 있을 뿐만 아니라 블록을 설치하는 데 많은 인력과 시간이 필요하며, 블록이 도로의 넓이와 정확하게 일치하지 않으므로 블록을 절단하여 마무리하여야 하는 등의 단점이 있었다.However, the above method causes irregular settlement due to the loss of sand layer during rainfall or excessive outflow of permeate to a certain part, which leads to cracking, damage and settlement of the surface layer as well as a lot of manpower to install the block. And time is required, and since the block does not exactly match the width of the road, the block has to be cut and finished.

또한, 어린이 놀이터는 가장 중요하게 고려되어야 할 부분이 안전이기 때문에 바닥면도 안전사고 예방을 위하여 충격흡수율이 좋아야 하고, 미끄럽지 않아야 하기 때문에 일정 두께 이상으로 모래를 포설하는 방법이 주로 사용되고 있지만, 최근 들어서는 어린이 놀이터가 각종 해충 또는 병원균의 온상이 되고 있어 놀이터에서 노는 것 자체를 꺼려 할 뿐만 아니라 신발이나 의류에 모래가 들어가 찰과상을 입거나 가정집을 포함한 주변 환경을 더럽히는 경우가 종종 발생하였다.In addition, since children's playground is the most important part to be considered, the floor surface should have good shock absorption to prevent safety accidents and should not be slippery. Playgrounds have become a breeding ground for various pests and pathogens, and not only are they reluctant to play on the playground, but sand often gets into the shoes or clothing, and the surrounding environment including homes is often polluted.

상기와 같은 문제점을 해결하기 위하여 최근에는 폴리우레탄수지, EPDM(Ethylene Propylene Diene Monomer)칩, 폐타이어칩이나 재생고무칩 등을 이용하여 표면을 전체적으로 포장하는 방법이 사용되고 있으며, 인도 및 광장 등의 경우에는 하지층으로 콘크리트를 타설하고 양생한 후에 칩을 이용하여 전체적으로 포장하여 탄성 포장층을 형성하는 방법이 사용된다.Recently, in order to solve the above problems, a method of packaging the entire surface using polyurethane resin, EPDM (Ethylene Propylene Diene Monomer) chip, waste tire chip or recycled rubber chip is used. In this case, after the concrete is poured into the base layer and cured, a method of forming an elastic pavement layer by packaging the whole using chips is used.

특히, 최근에는 탄성 포장층에 다양한 색상의 칩을 이용하므로서 특정 문양의 도안이나 형상을 형성시켜 미관을 좋게 하거나 각종 표지나 표식은 물론 도로 표지가 되도록 하는 방법이 사용되고 있다.In particular, in recent years, by using a chip of various colors in the elastic pavement layer, a method of forming a pattern or a shape of a specific pattern to improve aesthetics or various signs or signs, as well as road signs have been used.

그러나, 폐타이어칩이나 재생고무칩 또는 경화성우레탄칩을 이용하여 표면을 전체적으로 포장하는 방법으로 시공할 경우, 폐타이어칩, 재생고무칩 또는 경화성우레탄칩의 평균 경도가 65도 이하이므로 포장층이 탄성이 너무 높아 인체공학상 탄성 바닥재 재료로 불합리하고, 이를 해결하기 위하여 중탄 첨가량을 높여 경도가 높은 재료를 제조하여 사용하고 있으나 비중이 높고, 인장강도가 약하며, 변색이 잘 되고, 접착력이 현저히 저하되어 내구성이 저하되는 단점이 있었다.However, when the entire surface is packaged using waste tire chips, recycled rubber chips or curable urethane chips, the average hardness of the waste tire chips, recycled rubber chips or curable urethane chips is 65 degrees or less, so that the packaging layer is elastic. It is too high to be ergonomically elastic flooring material, and to solve this problem, it is used to manufacture materials with high hardness by increasing the amount of bicarbonate, but the specific gravity is high, the tensile strength is weak, the discoloration is good, and the adhesion is remarkably decreased. There was a disadvantage that the durability is lowered.

뿐만 아니라, 열가소성 폴리우레탄 칩 또는 EPDM칩의 평균 경도가 75도 이상이므로 열가소성 폴리우레탄 칩 또는 EPDM칩으로 시공한 포장층은 인장강도와 접착력이 우수하여 내구성은 있으나 어린이 놀이터 등과 같이 탄성을 요하는 탄성 바닥재로서는 부적합한 단점이 있었다.In addition, since the average hardness of the thermoplastic polyurethane chip or EPDM chip is more than 75 degrees, the pavement layer constructed of the thermoplastic polyurethane chip or the EPDM chip has excellent tensile strength and adhesive strength and is durable but needs elasticity such as a children's playground. As a flooring material, there were disadvantages.

따라서, 본 발명의 목적은 표면이 변색되는 문제점을 해결할 수 있고, 고가인 착색칩의 소량 사용이 가능하여 전체의 착색을 저렴한 비용으로 행할 수 있으며, 내구성이 우수하고 황토가 첨가되어 인체에 해가 되지 않으며 다량의 원적외선이 방출되는 환경친화적인 효과를 얻을 수 있는 기능성 탄성 포장층 시공 방법을 제공하는 데 있다.Therefore, the object of the present invention can solve the problem of discoloration of the surface, it is possible to use a small amount of expensive colored chips can be carried out the whole coloring at a low cost, excellent durability and harmful to the human body by the addition of ocher The present invention provides a method of constructing a functional elastic pavement layer, which can obtain an environment-friendly effect in which a large amount of far infrared rays are emitted.

상기 목적 뿐만 아니라 용이하게 달성할 수 있는 다른 목적들을 달성하기 위하여 본 발명에서는 표면으로부터 일정 깊이로 흙을 파낸 다음, 다짐 공정을 행한 후에 콘크리트를 타설하여 양생시키고, 폴리우레탄수지, EPDM(Ethylene Propylene Diene Monomer)칩, 폐타이어칩이나 재생고무칩 등을 이용하여 포장하는 탄성 포장 층 시공 방법에 있어서, 가격이 저렴하며 탄성과 인장강도가 우수한 폐타이어칩이나 재생고무칩으로 1차 포설하여 하지층을 형성한 다음, 접착력과 인장력이 우수한 고경도의 폴리우레탄황토수지칩 또는 EPDM(Ethylene Propylene Diene Monomer)황토칩으로 2차 포설하여 상지층을 형성하고 항온롤러로 다짐하여 경화시킴으로써 표면이 변색되는 문제점을 해결할 수 있고, 고가인 착색칩의 소량 사용이 가능하여 전체의 착색을 저렴한 비용으로 행할 수 있으며, 내구성이 우수하고 황토가 첨가되어 인체에 해가 되지 않으며 다량의 원적외선이 방출되는 환경친화적인 탄성 포장층 시공 방법을 발명하게 되었다.In order to achieve the above object as well as other objects that can be easily achieved in the present invention, by digging the soil to a certain depth from the surface, and after the compaction process to cast concrete to cure, polyurethane resin, EPDM (Ethylene Propylene Diene In the method of constructing an elastic pavement layer using mono chips, waste tire chips, or recycled rubber chips, the base layer is first laid with waste tire chips or recycled rubber chips which are inexpensive and have excellent elasticity and tensile strength. After forming, secondary laying with a high hardness polyurethane ocher resin chip or EPDM (Ethylene Propylene Diene Monomer) ocher chip having excellent adhesion and tensile strength to form an upper layer and hardening by compacting with a constant temperature roller. It is possible to solve the problem, and it is possible to use a small amount of expensive colored chips, so that the whole coloring can be performed at low cost. Was, the durability is excellent and the loess is added is not harmful to the human body was invented a large amount of far-infrared emission that is environmentally friendly in the elastic pavement construction method.

본 발명의 탄성 포장층 시공방법은 하지층에 가격이 저렴하며, 탄성이 우수한 폐타이어칩이나 재생고무칩으로 1차 포설하되 시공면의 좌,우 각각 10㎝ 정도 내측까지만 포설 시공하고, 접착력이 우수하고 인장강도가 높은 고경도의 폴리우레탄황토수지칩 또는 EPDM황토칩으로 하지층을 포함한 시공면 전체를 2차 포설하므로서 탄성이 있는 하지층이 형성되고 접착력과 인장력이 우수한 상지층을 형성하여 항온롤러로 다짐 고정 후 경화시키므로서 상,하지층이 일체화되고, 상지층에 다양한 색상으로 착색이 가능하며 접착력과 인장력이 좋고 황토를 첨가하여 탄성이 우수한 기능성탄성 포장층을 시공할 수 있었다.The method of constructing the elastic pavement layer of the present invention is inexpensive on the base layer, and is primarily laid with waste tire chips or recycled rubber chips with excellent elasticity, but only to the inside of the left and right sides of the construction surface is installed up to about 10 cm inside, and the adhesive strength is high. High-strength polyurethane ocher resin chip or EPDM ocher chip with high tensile strength, and the secondary laying of the entire construction surface including the base layer to form an elastic base layer and forming an upper layer with excellent adhesion and tensile strength. The upper and lower layers were integrated by hardening after compaction with a roller, and the upper and lower layers could be colored in various colors, and the adhesive elasticity and tensile strength were good.

본 발명에 따른 탄성 포장층 시공방법은 표면으로부터 일정 깊이로 흙을 파 낸 다음, 다짐 공정을 행한 후에 콘크리트를 타설하여 양생시키고, 폴리우레탄수지, EPDM칩, 폐타이어칩이나 재생고무칩 등을 이용하여 포장하는 탄성 포장층 시공 방법에 있어서, 가격이 저렴하며 탄성과 인장강도가 우수한 폐타이어칩이나 재생고무칩으로 1차 포설하여 하지층을 형성한 다음, 접착력과 인장력이 우수한 고경도의 폴리우레탄황토수지칩 또는 EPDM(Ethylene Propylene Diene Monomer)황토칩으로 2차 포설하여 상지층을 형성하고 항온롤러로 다짐하여 경화시키는 것으로 특징지워진다.In the method for constructing an elastic pavement layer according to the present invention, after digging soil to a certain depth from the surface, and after compacting process, the concrete is poured and cured, using polyurethane resin, EPDM chip, waste tire chip or recycled rubber chip. In the method of constructing an elastic pavement layer to be packaged, a low-cost, high-strength polyurethane having excellent adhesion and tensile strength is formed by first laying with waste tire chips or recycled rubber chips having excellent elasticity and tensile strength. It is characterized by secondary laying with ocher resin chip or EPDM (Ethylene Propylene Diene Monomer) ocher chip to form upper layer and hardening by compacting with constant temperature roller.

또한, 하지층 형성시 시공면의 좌,우 각각 10㎝ 정도 내측까지만 포설 시공하여 2차 상지층 포설시 하지층으로 형성되지 않은 좌,우 각각 10㎝ 정도가 상지층만으로 포설되어 하지층의 미약한 접착력으로 인한 손상을 미연에 방지하는 것을 특징으로 한다.In addition, when the base layer is formed, only 10 cm of each of the left and right sides of the construction surface is laid to the inner side. It is characterized in that to prevent damage due to the adhesive force in advance.

뿐만 아니라, 하지층은 65Hs 이하의 낮은 경도를 갖는 폐타이어칩이나 재생고무칩을 사용하고, 상지층은 75Hs 이상의 높은 경도와 15Mpa 이상의 인장 강도를 갖는 열가소성 폴리우레탄황토수지칩 또는 EPDM황토칩을 사용하는 것을 특징으로 한다.In addition, the base layer uses waste tire chips or recycled rubber chips having a low hardness of 65 Hs or less, and the upper layer uses thermoplastic polyurethane ocher resin chips or EPDM ocher chips having high hardness of 75 Hs or more and tensile strength of 15 Mpa or more. Characterized in that.

먼저, 표면으로부터 일정 깊이로 흙을 파낸 다음, 다짐 공정을 행한 후에 콘크리트를 타설하여 양생시킨다. 그러나, 이미 아스팔트, 시멘콘크리트, 보도블럭 등으로 포장된 경우에는 포장된 도로 표층의 굴곡진 면을 수평으로 교정한 후, 깨끗하게 청소하고 진공청소기로 틈새의 먼지를 빨아낸 다음, 롤러를 이용하여 우레탄 프라이머를 200 ∼ 400g/㎡의 양으로 정밀하게 도포하고 경화시킨다.First, the soil is dug to a certain depth from the surface, and after the compaction process, the concrete is poured and cured. However, if it is already paved with asphalt, cement concrete, sidewalk block, etc., the curved surface of the paved road surface is leveled horizontally, then cleaned and vacuumed through the gap with a vacuum cleaner. The primer is precisely applied and cured in an amount of 200 to 400 g / m 2.

우레탄프라이머가 도포, 경화된 표층에 2 ∼ 3㎜로 분쇄된 폐타이어칩이나 재생고무칩과 우레탄 바인더를 10 : 2.5(중량비)의 비율로 교반기에 투입하여 3 ∼ 4분간 혼합한 후, 1차로 하지층 포설을 한다. 이 때 시공면의 시공면의 좌,우 각각 10㎝ 정도 내측까지만 포설 시공하여 2차 상지층 포설시 하지층으로 형성되지 않은 좌,우 각각 10㎝ 정도가 상지층만으로 포설되어 하지층의 미약한 접착력으로 인한 손상을 미연에 방지하도록 한다.Waste tire chips, recycled rubber chips and urethane binders pulverized to 2-3 mm on the surface of the urethane primer applied and cured were put in a stirrer at a ratio of 10: 2.5 (weight ratio), mixed for 3 to 4 minutes, and then Lay the ground floor. At this time, install only up to 10cm of the left and right sides of the surface of the construction surface, and about 10cm of each of left and right, which is not formed as an underlying layer when laying the secondary upper layer, is laid only by the upper layer, so that the base layer is weak. Prevent adhesive damage.

하지층 포설이 끝난 즉시 표층에 접착력과 인장력이 우수한 고경도의 폴리우레탄황토수지칩 또는 EPDM황토칩과 우레탄 바인더를 10 : 2.5(중량비)의 비율로 교반기에 투입하여 3 ∼ 4분간 혼합한 후, 1차 포설한 하지층 위에 덮어씌워 시공면 전체를 2차 포설하므로서 저경도의 탄성이 있는 폐타이어칩이나 재생고무칩의 하지층이 형성되고, 접착력과 인장력이 우수한 고경도 폴리우레탄황토수지칩 또는 EPDM황토칩의 상지층이 형성되며, 항온롤러로 다짐하여 경화시키므로써 상,하지층이 일체화되고, 질기며 접착력이 좋은 탄성이 우수한 기능성 황토 탄성 포장층을 얻을 수 있었다.Immediately after laying the foundation layer, high hardness polyurethane ocher resin chips or EPDM ocher chips and urethane binders with excellent adhesion and tensile strength were added to the stirrer at a ratio of 10: 2.5 (weight ratio) and mixed for 3 to 4 minutes. By covering the entire installation surface by covering it on the first laid base layer, the underlayer of waste tire chip or regenerated rubber chip with low hardness is formed, and the high hardness polyurethane ocher resin chip with excellent adhesion and tensile force or The upper layer of the EPDM loess chip was formed, and by compacting with a constant temperature roller, the upper and lower layers were integrated, and the functional loess elastic pavement layer having excellent elasticity was obtained.

이 때 하지층은 65Hs 이하의 낮은 경도를 갖는 폐타이어칩이나 재생고무칩을 사용하고, 상지층은 75Hs 이상의 높은 경도와 15Mpa 이상의 인장 강도를 갖는 열가소성 폴리우레탄황토수지칩 또는 EPDM황토칩을 사용하는 것이 효과적이며, 열가소성 폴리우레탄황토수지칩 또는 EPDM황토칩을 착색시켜 사용하면 다량의 원적외선이 방출되는 다양한 색상의 포장층이 형성된다.At this time, the base layer uses waste tire chips or regenerated rubber chips with low hardness of 65Hs or less, and the upper layer uses thermoplastic polyurethane ocher resin chips or EPDM ocher chips having high hardness of 75Hs or more and tensile strength of 15Mpa or more. It is effective, and coloring the thermoplastic polyurethane ocher resin chip or EPDM ocher chip forms a packaging layer of various colors that emit a large amount of far infrared rays.

도 1은 본 발명의 시공 방법에 따라 시공된 포장층의 단면도이다.1 is a cross-sectional view of a packaging layer constructed according to the construction method of the present invention.

* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1. 지반 2. 표층1. Soil 2. Surface layer

3. 하지층 4. 상지층3. Underlayer 4. Upper Layer

Claims (4)

표면으로부터 일정 깊이로 흙을 파낸 다음, 다짐 공정을 행한 후에 콘크리트를 타설하여 양생시키고, 폴리우레탄수지, EPDM칩, 폐타이어칩이나 재생고무칩 등을 이용하여 포장하는 탄성 포장층 시공 방법에 있어서, 가격이 저렴하며 탄성과 인장강도가 우수한 폐타이어칩이나 재생고무칩으로 1차 포설하여 하지층을 형성한 다음, 접착력과 인장력이 우수한 고경도의 폴리우레탄황토수지칩 또는 EPDM(Ethylene Propylene Diene Monomer)황토칩으로 2차 포설하여 상지층을 형성하고 항온롤러로 다짐하여 경화시키는 것을 특징으로 하는 탄성 포장층 시공방법.In the method of constructing an elastic pavement layer, the soil is excavated to a certain depth and then compacted, and then concrete is poured and cured, and packaged using polyurethane resin, EPDM chips, waste tire chips or recycled rubber chips. Low cost and primary laying of waste tire chip or regenerated rubber chip with excellent elasticity and tensile strength to form an underlayer, and then high hardness polyurethane ocher resin chip or EPDM (Ethylene Propylene Diene Monomer) with excellent adhesion and tensile strength The method of constructing an elastic pavement layer, characterized in that the secondary layer is laid with ocher chips to form an upper layer, and then hardened by compacting with a constant temperature roller. 청구항 1에 있어서, 하지층 형성시 시공면의 좌,우 각각 10㎝ 정도 내측까지만 포설 시공하여 2차 상지층 포설시 하지층으로 형성되지 않은 좌,우 각각 10㎝ 정도가 상지층만으로 포설되도록 하는 것을 특징으로 하는 탄성 포장층 시공방법.The method of claim 1, wherein when the base layer is formed, only 10 cm of the left and right sides of the construction surface are laid so that only 10 cm of each of the left and right sides, which are not formed as the base layer, is installed only in the upper layer when the secondary upper layer is laid. Elastic packaging layer construction method characterized in that. 청구항 1에 있어서, 하지층은 65Hs 이하의 낮은 경도를 갖는 폐타이어칩이나 재생고무칩을 사용하고, 상지층은 75Hs 이상의 높은 경도와 15Mpa 이상의 인장 강도를 갖는 열가소성 폴리우레탄황토수지칩 또는 EPDM황토칩을 사용하는 것을 특징으로 하는 탄성 포장층 시공방법.The method of claim 1, wherein the base layer is a waste tire chip or recycled rubber chip having a low hardness of less than 65Hs, the upper layer is a thermoplastic polyurethane ocher resin chip or EPDM ocher chip having a high hardness of 75Hs or more and a tensile strength of 15Mpa or more Elastic packaging layer construction method characterized in that using the. 청구항 3에 있어서, 열가소성 폴리우레탄황토수지칩 또는 EPDM황토칩은 착색된 것임을 특징으로 하는 탄성 포장층 시공방법.The method of claim 3, wherein the thermoplastic polyurethane loess resin chip or EPDM loess chip is colored.
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KR100953974B1 (en) * 2009-05-01 2010-04-21 최정헌 Structure of bicycle road and constructing method thereof
KR101869049B1 (en) * 2017-03-20 2018-06-21 주식회사 폴리원 Cork Chip Elastic Packaging Material

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KR100614439B1 (en) * 2006-02-17 2006-08-25 주식회사 대한체육산업 Three-layered elastic paving material

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100953974B1 (en) * 2009-05-01 2010-04-21 최정헌 Structure of bicycle road and constructing method thereof
KR101869049B1 (en) * 2017-03-20 2018-06-21 주식회사 폴리원 Cork Chip Elastic Packaging Material

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