KR20090012395A - 박막증착장치 - Google Patents
박막증착장치 Download PDFInfo
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- KR20090012395A KR20090012395A KR1020070076163A KR20070076163A KR20090012395A KR 20090012395 A KR20090012395 A KR 20090012395A KR 1020070076163 A KR1020070076163 A KR 1020070076163A KR 20070076163 A KR20070076163 A KR 20070076163A KR 20090012395 A KR20090012395 A KR 20090012395A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (9)
- 반응기;상기 반응기 내부에 회전 가능하게 설치되며 상면에 기판을 안착시키는 복수의 기판 안착부를 구비하는 기판 지지부;상기 기판 지지부의 상부에 서로 다른 종류의 원료가스를 상기 기판 지지부 상으로 공급하는 복수의 원료가스 공급장치와 상기 복수의 원료가스 공급장치 사이에 배치되어 상기 원료가스를 퍼지하는 퍼지가스를 상기 기판 지지부 상으로 공급하는 복수의 퍼지가스 공급장치가 방사형으로 설치되는 가스 분사부; 및상기 복수의 원료가스를 상기 반응기 외부로 가이드하여 배기시키도록 복수의 배기구가 마련된 배기홈부와, 상기 배기홈부에 설치되어 상기 배기홈부를 상호 격리된 복수의 배기유로로 분할하는 복수의 격벽이 형성되어 있으며, 상기 기판 지지부 둘레를 감싸도록 고리형으로 배치되는 배기부;를 포함하는 것을 특징으로 하는 박막증착장치.
- 제1항에 있어서,상기 배기홈부는,상기 반응기의 외벽부와, 상기 반응기 외벽부로부터 상기 기판 지지부를 향해 연장형성되어 고리형으로 배치되는 바닥부와, 상기 바닥부로부터 상측으로 연장형성되며 상기 반응기 외벽부와 일정거리 이격되도록 상기 기판 지지부와 반응기 외벽부 사이에 고리형으로 배치되는 내벽부에 의하여 둘러싸여 형성되는 것을 특징으로 하는 박막증착장치.
- 제2항에 있어서,상기 격벽은 상기 외벽부와 내벽부 및 바닥부와 일체로 형성되는 것을 특징으로 하는 박막증착장치.
- 제1항 또는 제2항에 있어서,상기 배기부는,고리형의 판상으로 형성되어 상기 배기홈부의 개방된 상측을 덮도록 설치되며, 상기 복수의 원료가스가 상기 배기홈부로 유입될 수 있도록 상면과 하면 사이를 관통하는 복수의 유입공이 형성되어 있는 배플을 더 구비하는 것을 특징으로 하는 박막증착장치.
- 제4항에 있어서,상기 격벽은 상기 배플과 일체로 형성되는 것을 특징으로 하는 박막증착장치.
- 제1항 또는 제2항에 있어서,상기 가스 분사부는,상기 방사형으로 배치된 원료가스 공급장치들의 중앙부에 배치되어, 상기 복수의 원료가스들이 상기 기판 지지부의 상부에서 혼합되지 않도록 상기 원료가스들을 퍼지하기 위한 퍼지가스가 공급되는 중앙퍼지가스 공급장치를 더 구비하는 것을 특징으로 하는 박막증착장치.
- 제1항 또는 제2항에 있어서,상기 가스 분사부와 상기 기판 지지부의 각 중앙부 중 어느 하나에는 볼록하게 돌출부가 형성되며, 다른 하나에는 상기 돌출부를 수용하기 위하여 오목하게 삽입홈부가 형성되어 있는 것을 특징으로 하는 박막증착장치.
- 제1항 또는 제2항에 있어서,상기 각 배기유로로 유입된 가스를 상기 반응기 외부로 배출하기 위하여, 상기 각 배기유로와 연결되는 복수의 펌프를 더 구비하는 것을 특징으로 하는 박막증착장치.
- 반응기와,상기 반응기 내부에 회전 가능하게 설치되며 상면에 기판을 안착시키는 복수의 기판 안착부를 구비하는 기판 지지부와,상기 기판 지지부의 상부에 서로 다른 종류의 원료가스를 상기 기판 지지부 상으로 공급하는 복수의 원료가스 공급장치와 상기 복수의 원료가스 공급장치 사이 에 배치되어 상기 원료가스를 퍼지하는 퍼지가스를 상기 기판 지지부 상으로 공급하는 복수의 퍼지가스 공급장치가 방사형으로 설치되는 가스 분사부와,상기 복수의 원료가스를 상기 반응기 외부로 가이드하여 배기시키도록 복수의 배기구가 마련된 배기홈부와, 상기 배기홈부에 설치되어 상기 배기홈부를 상호 격리된 복수의 배기유로로 분할하는 복수의 격벽이 형성되어 있으며, 상기 기판 지지부 둘레를 감싸도록 고리형으로 배치되는 배기부를 구비하는 복수의 공정챔버; 및상기 공정챔버 내의 가스를 외부로 배기하기 위한 복수의 펌프;를 구비하며,상기 복수의 펌프 각각은 상기 각 공정챔버의 복수의 배기유로 중 동일한 가스를 배기하는 배기유로와 연결되어 있는 것을 특징으로 하는 박막증착장치.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070076163A KR100967882B1 (ko) | 2007-07-30 | 2007-07-30 | 박막증착장치 |
PCT/KR2008/004301 WO2009017322A1 (en) | 2007-07-30 | 2008-07-23 | Reactor for depositing thin film on wafer |
CN2008801001697A CN101755073B (zh) | 2007-07-30 | 2008-07-23 | 在晶圆上沉积薄膜的反应器 |
TW097128837A TWI496199B (zh) | 2007-07-30 | 2008-07-30 | 在晶圓上沈積薄膜的反應器 |
Applications Claiming Priority (1)
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KR1020070076163A KR100967882B1 (ko) | 2007-07-30 | 2007-07-30 | 박막증착장치 |
Related Child Applications (1)
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KR1020090060331A Division KR101334643B1 (ko) | 2009-07-02 | 2009-07-02 | 박막증착장치 |
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KR20090012395A true KR20090012395A (ko) | 2009-02-04 |
KR100967882B1 KR100967882B1 (ko) | 2010-07-05 |
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KR1020070076163A KR100967882B1 (ko) | 2007-07-30 | 2007-07-30 | 박막증착장치 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101045216B1 (ko) * | 2009-05-26 | 2011-06-30 | 주식회사 테스 | 기판처리장치 |
KR20160146248A (ko) * | 2015-06-12 | 2016-12-21 | 주식회사 테스 | 박막증착장치 |
KR20160148746A (ko) * | 2015-06-16 | 2016-12-27 | 한국기계연구원 | 화학적 기상 증착 공정의 오염물질 제거 장치 |
KR20200127132A (ko) * | 2018-10-05 | 2020-11-10 | (주)아이작리서치 | 파우더용 원자층 증착 장치 |
KR102597096B1 (ko) * | 2023-05-26 | 2023-11-01 | 주성엔지니어링(주) | 기판처리장치 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100497748B1 (ko) * | 2002-09-17 | 2005-06-29 | 주식회사 무한 | 반도체소자 제조용 원자층 증착 장치 및 원자층 증착 방법 |
KR100616486B1 (ko) * | 2004-02-09 | 2006-08-28 | 백용구 | 독립적으로 가스가 흐르는 독립분리셀을 이용한원자층박막 증착장치 및 증착방법 |
-
2007
- 2007-07-30 KR KR1020070076163A patent/KR100967882B1/ko active IP Right Grant
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101045216B1 (ko) * | 2009-05-26 | 2011-06-30 | 주식회사 테스 | 기판처리장치 |
KR20160146248A (ko) * | 2015-06-12 | 2016-12-21 | 주식회사 테스 | 박막증착장치 |
KR20160148746A (ko) * | 2015-06-16 | 2016-12-27 | 한국기계연구원 | 화학적 기상 증착 공정의 오염물질 제거 장치 |
KR20200127132A (ko) * | 2018-10-05 | 2020-11-10 | (주)아이작리서치 | 파우더용 원자층 증착 장치 |
KR102597096B1 (ko) * | 2023-05-26 | 2023-11-01 | 주성엔지니어링(주) | 기판처리장치 |
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