KR20080106410A - Arc evaporation source and vacuum evaporation system - Google Patents

Abstract

An arc evaporation source and a vacuum evaporation system in which evaporation substances emitted from the cathode of vacuum arc discharge can be collected appropriately. The arc evaporation source (100) comprises first and second electrodes (14A, 14B) opposing each other through a gap (G), wherein at least any one of the first and second electrodes (14A, 14B) serves as a cathode and the other electrode of the first and second electrodes (14A, 14B) can collect evaporation substances emitted from the cathode based on vacuum arc discharge generated between the cathode and the anode. ® KIPO & WIPO 2009

Description

Arc evaporation source and vacuum evaporation system {ARC EVAPORATION SOURCE AND VACUUM EVAPORATION SYSTEM}

The present invention relates to an arc evaporation source and a vacuum evaporation apparatus, and more particularly, to an arc evaporation source and a vacuum evaporation apparatus with improved recovery performance of evaporation material in the vacuum arc deposition method.

In vacuum arc discharge, a high temperature and low activity cathode point is usually formed on a cathode (cathode; target), and a high energy electrode material (for example, a cathode material ion) is formed from the cathode point. )) Is released into the vacuum. The method of forming a film on the surface of a work using such an electrode material is called the vacuum arc vapor deposition method. This vacuum arc evaporation method eliminates the container containing electrode materials, such as crucibles and boats, by having a high energy electrode material directly obtained from a solid metal, thereby providing excellent adhesion to the work. Various advantages, such as the point which can be provided, are provided.

However, the biggest disadvantage of the vacuum arc deposition method is that the particles (droplets: 20 µm to 100 µm) called droplets are generated from the cathode cathode point of the vacuum arc discharge, and the droplets adhere to the workpiece surface. The film uniformity deterioration of the surface is concerned.

For this reason, conventionally, a method of suppressing the generation of droplets itself (for example, pulse discharge method) and a method of using a vacuum space in which the droplets are removed (for example, a shield method) and droplets inherently Various droplet coping techniques have been proposed, such as a method using a small vacuum space.

As an example of the droplet coping technique, there is a method of applying discharge power between a first electrode and a second electrode which are opposed to each other in a vacuum atmosphere. As a result, the surfaces of the first and second electrodes are mutually heated, and at the same time hot electron emission from the first and second electrodes is activated to further heat the surfaces of these electrodes. In this way, the cathode point of the 1st or 2nd electrode as a cathode becomes large, and the effect which reduces generation | occurrence | production of the droplet in a 1st or 2nd electrode is exhibited (refer patent document 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-69664

[Problem to Solve Invention]

In the above-described situation, the inventors of the present invention, such as the cathode material (cathode ion coating material) which can be used for deposition of droplets generated at the cathode of the vacuum arc discharge or the workpiece surface away from the edge of the existing droplet coping technique (hereinafter, Collectively, these are called "evaporation materials."

On the other hand, in the plasma processing technique described in Patent Document 1, which has the first and second electrodes facing each other, at first glance, the droplet emitted from the first and second electrodes moves the gap between the two electrodes. It can be attached to each other as if the droplet can be recovered.

However, the plasma processing technique described in Patent Document 1 focuses only on suppressing the generation of droplets themselves, and as a result, dismisses the recognition of the problem of recovery and reuse of the evaporation material, and releases the evaporation material as much as possible. It is completely contrary to the problem of the present invention to adjust to easy conditions and to recover and reuse them.

In the plasma processing technique described in Patent Document 1, when one electrode of the first and second electrodes becomes a cathode, the other electrode becomes an anode (anode). If so, it is difficult to recover the cathode ions (plus ions) released from the cathode even if the anode could recover the droplets. For this reason, it can be said that the technique described in patent document 1 is incomplete from the subject of this invention of recovery and reuse of an evaporation substance.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an arc evaporation source and a vacuum evaporation apparatus capable of properly recovering a vapor deposition material released from a cathode of a vacuum arc discharge.

[Means for solving the problem]

In order to solve the said subject, the arc evaporation source which concerns on this invention is provided with the 1st and 2nd electrode which mutually opposes each other with the clearance gap, and makes the electrode of at least one side of the said 1st and 2nd electrode as a cathode, Based on the vacuum arc discharge generated between the cathode and the anode, the electrode on the other side of the first and second electrodes is configured to recover the evaporated substance emitted from the cathode.

Here, the vacuum deposition apparatus according to the present invention is a vacuum chamber in which the arc evaporation source is disposed inside a pressure-reduced interior, and an electric power for supplying electric power for generating a vacuum arc discharge between the cathode and the anode to the cathode and the anode. It is a device provided with a supply means.

According to the configuration of the arc evaporation source and the vacuum deposition apparatus, the evaporation material released from the cathode during the vacuum arc discharge adheres to the other electrode and is recovered.

In addition, if the anode is the vacuum chamber, the circuit configuration of vacuum arc discharge can be simplified.

In addition, the evaporation materials are droplets and ions made of the cathode material.

And a work disposed inside the vacuum chamber, wherein the first and second electrodes are rods, and the first and second electrodes are arranged such that the gap is placed between their end faces. The second electrode may be arranged side by side in the longitudinal direction, and the workpiece may be disposed at a position facing the gap.

In addition, the vacuum chamber may be disposed inside the vacuum chamber and provided with a recovery member for recovering the evaporated material, and the surface of the recovery member may be curved to surround the gap except for a region between the workpiece and the gap.

According to the arrangement of the recovery member, the electrode material discharged from the first and second electrodes almost adheres to the inner surface of the recovery member in each direction facing the gap except the region where the workpiece is disposed.

Here, the vacuum deposition apparatus may have a first use state in which the first electrode is the cathode, and a second use state in which the second electrode is the cathode. And a switching means for switching between the first use state and the second use state.

In this way, if the first use state and the second use state in the vacuum deposition apparatus are switched and repeated at regular intervals through the switching means, then the deposition material recovered at the second electrode during the first use state is changed to the next second. During the use state, it is reused as part of the second electrode which functions as a cathode, and the evaporated material recovered at the first electrode during the second use state is reused as part of the first electrode which functions as the cathode during the next use state. fit.

Here, the power supply means may be a DC power source, and the switching means may be a switch for switching the connection between the negative electrode terminal of the DC power source between the first electrode and the second electrode.

The power supply means is an AC power source, and the switching means is supplied from the AC power source between one terminal of the AC power source and the first electrode and between the other terminal and the second electrode of the AC power source. It may have a rectifying element for rectifying the power to be generated.

According to the vacuum deposition apparatus using such an AC power source, by appropriately adjusting the AC cycle of the AC power source, the film thickness distribution distribution of the coating material on the work in the first use state and the work in the second use state are adjusted. It is expected that the deposition film thickness distribution unevenness of the coating material of the film cancels each other, and thus the deposition film thickness distribution unevenness of the coating material to the work can be prevented.

The power supply means is connected to a first direct current power source having a negative electrode terminal connected to the first electrode and a positive electrode terminal connected to the anode, a negative electrode terminal connected to the second electrode and the anode. A second DC power source having an anode side terminal may be provided.

According to the vacuum deposition apparatus using the first and the second DC power source, the vacuum arc discharge power supply to the first electrode by the first DC power source and the vacuum to the second electrode by the second DC power source The power supply for arc discharge is performed at the same time, so that the deposition film thickness unevenness of the coating material to the work by the first use state and the deposition film thickness distribution unevenness of the coating material to the work by the second use state cancel each other. It is expected that the deposition film thickness distribution unevenness of the coating material to the work can be prevented.

The above objects, other objects, features and advantages of the present invention will become apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings.

[Effects of the Invention]

According to the present invention, it is possible to obtain an arc evaporation source and a vacuum evaporation apparatus capable of appropriately recovering the evaporated material emitted from the cathode of the vacuum arc discharge.

1 is a cross-sectional view showing the configuration of an arc evaporation source for a vacuum deposition apparatus according to an embodiment of the present invention.

2 is a cross-sectional view showing the configuration of an arc evaporation source for a vacuum deposition apparatus according to an embodiment of the present invention.

3 is a schematic view for explaining an example of the configuration of a vacuum deposition apparatus according to the present embodiment.

FIG. 4 is a view for explaining a film material scattering form to the work by the first use state and a film material scattering form to the work by the second use state.

5 is a schematic view for explaining a configuration example of a vacuum deposition apparatus according to Modification Example 1. FIG.

6 is a schematic view for explaining a configuration example of a vacuum deposition apparatus according to Modification Example 2. FIG.

7 is a schematic view for explaining a configuration example of a vacuum deposition apparatus according to a third modification.

**** Explanation of Codes ****

10A, 10B: Arc Evaporation Unit

11A, 11B: Cover member

12A, 12B: Bracket

13A, 13B: Electrode Support

14A: first electrode

14B: second electrode

15: flange

16A, 16B: Feed Rod Member

17A, 17B: insulation member

20: vacuum chamber

21: work

22: selector switch

23: DC power source

31A: first diode

31B: second diode

31C: third diode

31D: fourth diode

32: AC power source

41: first DC power source

42: second DC power source

51: recovery member

52: inner surface

100: arc evaporation source

110, 120, 130, 140: vacuum deposition apparatus

PA, PB: Center of Axis

G: gap

SA1, SA2, SB1, SB2: circular surface

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described, referring drawings.

1 and 2 are cross-sectional views showing the configuration of an arc evaporation source for a vacuum deposition apparatus according to an embodiment of the present invention. FIG. 1 is a cross-sectional view along a plane parallel to the flange 15 at the central portions of the first and second electrodes 14A, 14B of the arc evaporation units 10A, 10B. 1 is a cross-sectional view taken along the line AA of FIG. 1.

As shown in Figs. 1 and 2, the arc evaporation source 100 includes a pair of arc evaporation units 10A and 10B and an insulating member 17A of the arc evaporation units 10A and 10B. A disk-shaped metal flange 15 supporting the feed rod members 16A and 16B of the arc evaporation units 10A and 10B with 17B interposed therebetween.

As shown in FIG. 1, the arc evaporation unit 10A has a first electrode 14A having a cylindrical shape (rod) made of a noble metal, and an annular hole in the center thereof. A state where the plate-shaped metal electrode support 13A holding the electrode 14A to support the first electrode 14A and the circular surface SA1 of one end of the first electrode 14A are in contact with each other. Is provided with a substantially rectangular metal bracket 12A for fixing and supporting the electrode support 13A by an appropriate fixing means (screw or the like) (not shown).

In addition, as shown in FIG. 2, the arc evaporation unit 10A extends through the flange 15 through the through hole (not shown) of the flange 15 and extends beyond the flange 15 to form the side surface of the bracket 12A (first electrode ( A cylindrical shape configured to be fixed by a suitable fixing means (screw or the like) (not shown) on a surface orthogonal to the contact surface of 14A), and configured to supply predetermined power to the first electrode 14A through the bracket 12A. Is inserted between the metal feed rod member 16A and the feed rod member 16A and the circumferential surface of the through hole of the flange 15 to be electrically connected between the feed rod member 16A and the flange 15. The cylindrical insulating member 17A which makes it possible to hold insulation, and the through-hole which penetrates the 1st electrode 14A by the predetermined length from circular surface SA2 of the other end, and has a bracket 12A and an electrode finger Portion and flange 15 of the first electrode 14A side of the feed rod member 16A bordering the earth 13A, the first electrode 14A, and the flange 15 11A of metal (stainless steel) cover member which covers the part of the 1st electrode 14A side of the insulating member 17A used as the boundary, and was provided in the flange 15 by appropriate fixing means (screw etc.) (not shown). It is equipped with.

In addition, the structure of the arc evaporation unit 10B is the same as that of the arc evaporation unit 10A, and it is referred about about each component of the arc evaporation unit 10B corresponding to each component of the arc evaporation unit 10A. The end of code is changed from "A" to "B". Therefore, detailed description of each component of the arc evaporation unit 10B is abbreviate | omitted here.

The cylindrical first and second electrodes 14A, 14B extend in the axial direction to penetrate the through holes of the cover members 11A, 11B and close to each other, and as a result, the first and second electrodes 14A, 14B. It is arrange | positioned facing each other so that the predetermined | prescribed disk-shaped clearance gap G formed between circular surface SA2 and SB2 of the other end of the electrodes 14A and 14B may be maintained. And as will be described in detail later, the first and second electrodes 14A, 14B serve as cathodes (cathodes; targets) of vacuum arc discharge and recover evaporated material emitted from the cathode of vacuum arc discharge. It has a role as a member.

1 and 2, the bracket 12A in the state of supporting the first electrode 14A through the electrode support 13A rotates the feed rod member 16A in the circumferential direction. It can rotate over the predetermined rotation range centering on the axis center PA of the feed rod member 16A. Similarly, the bracket 12B in the state which supported the 2nd electrode 14B through the electrode support 13B rotates the feed rod member 16B circumferentially, and centers the shaft of this feed rod member 16B. It can rotate over predetermined rotation range centering on PB. As the brackets 12A and 12B rotate, the gap G between the other end circular surface SA2 of the first electrode 14A and the other end circular surface SB2 of the second electrode 14B At the same time, the arc firing of the vacuum arc discharge (described later), in which both electrodes 14A and 14B are brought into contact with and separated from each other, is performed.

In detail, the electrode supports 13A and 13B have protrusions (not shown) protruding from the side surfaces of the electrode supports 13A and 13B, and the widthwise center portion of the protrusions is formed in a circular hole. It cuts out along the radial direction, and the slit hole which reaches this circular hole is formed. The first and second electrodes 14A and 14B are fixed to the electrode supports 13A and 13B by fastening means (screws, etc.) (not shown) for fastening the protrusions in the circumferential direction of the hole. It is. The electrode supports 13A and 13B are made of metal (for example, stainless steel) that can withstand heating by vacuum arc discharge through the first and second electrodes 14A and 14B. have.

The interior of the brackets 12A, 12B and the interior of the feed rod members 16A, 16B together have a hollow region (not shown), and water supplied from the coolant supply means (not shown) to the hollow region. The coolant, such as circulates. For this reason, the high temperature of the 1st and 2nd electrodes 14A and 14B accompanying vacuum arc discharge is moderately suppressed by the heat exchange with the coolant through the brackets 12A and 12B.

The cover members 11A and 11B are grounded through the flange 15 and the vacuum chamber 20 (to be described later), and thus the feed rod members 16A, 16B and the brackets 12A and 12B. ) And the discharge area when the vacuum arc discharge power is applied to the electrode supports 13A, 13B, and the first and second electrodes 14A, 14B. ) It is limited to the other end surface SA2, SB2 of 14B, and serves as a shield plate which can prevent abnormal discharge.

Next, the structural example of the vacuum evaporation apparatus which mounted the arc evaporation source 100 mentioned above in the inside of the vacuum chamber 20 is demonstrated.

3 is a schematic view for explaining an example of the configuration of a vacuum deposition apparatus according to the present embodiment.

In the meantime, in order to simplify the drawing, as the arc evaporation source 100, only the first and second electrodes 14A and 14B among the components are representatively shown, but in reality, the vacuum deposition apparatus 110 is shown. First and second arc evaporation units 10A and 10B in the arc evaporation source 100 shown in FIGS. 1 and 2 through openings (not shown) provided in the wall portion of the vacuum chamber 20 of After inserting the electrodes 14A and 14B into the vacuum chamber 20, the flange 15 of the arc evaporation source 100 is sealed (such as an O ring) (not shown). ), And is fixed to the wall of the vacuum chamber 20 by appropriate fixing means (screws, etc.) (not shown) (the same applies to FIGS. 5, 6, and 7 below).

According to FIG. 3, the vacuum deposition apparatus 110 includes a vacuum chamber 20 capable of depressurizing the inside, and first and second electrodes 14A and 14B disposed at appropriate points inside the vacuum chamber 20. An arc evaporation source 100 having a workpiece, a workpiece 21 disposed at an appropriate point inside the vacuum chamber 20, and an electrode and a vacuum chamber 20 on any one of the first and second electrodes 14A and 14B. Of the first and second electrodes 14A and 14B through the switching switch 22 while the anode side terminal is connected to the vacuum chamber 20 so as to generate a vacuum arc discharge between the anode and the anode. It comprises a DC power source (power supply means) 23 to which the negative electrode terminal is connected to either electrode. In addition, the vacuum chamber 20 is grounded, and therefore the positive terminal of the DC power source 23 is maintained at the ground potential.

Here, the structural member of the vacuum chamber 20 is made of a conductive material and is configured as part of a circuit (member) for performing vacuum arc discharge, while the first and second electrodes 14A, 14B are provided. Is configured to be insulated from the vacuum chamber 20, but, of course, an anode (metal plate or the like) (not shown) separate from the vacuum chamber 20 is disposed inside the vacuum chamber 20, and the DC power source 23 is disposed thereon. May be connected to the positive terminal.

In detail, the first and second electrodes 14A and 14B are formed so that the gap G is formed by their circular surfaces SA2 and SB2 (cross section). Are arranged side by side in the longitudinal direction of 14B, while the workpieces 21 are radially spaced apart laterally of the first and second electrodes 14A, 14B so as to face from the gap G. It is. When the workpiece 21 is disposed in such a direction with respect to the first and second electrodes 14A and 14B, the electrode and the vacuum chamber 20 on either side of the first and second electrodes 14A and 14B are disposed. The scattering amount in the direction of the workpiece 21 of the droplet which arises due to the vacuum arc discharge between) may be small. Of course, if attachment of the droplet to the workpiece 21 is confirmed, various droplet handling techniques may be introduced into the vacuum chamber 20 to prevent the droplet from adhering to the workpiece 21.

The DC power source 23 outputs a voltage of about 10 to 100 V (volts) and a current of about 10 to 500 A (amps) as DC power.

According to the configuration of the vacuum deposition apparatus 110 described above, the negative electrode terminal of the DC power source 23 is connected to the first electrode 14A of the noble metal (gold or silver, etc.) by switching of the switching switch 22. When the second electrode 14B is electrically floating while being connected at the same time, the operating state of the vacuum deposition apparatus 110 in which the first electrode 14A functions as a cathode (cathode; target) of vacuum arc discharge is used. (Hereinafter referred to as "first use state") is realized. Then, the precious metal which comprises this 1st electrode 14A from the other circular surface SA2 of the 1st electrode 14A based on the vacuum arc discharge which generate | occur | produces between the 1st electrode 14A and the vacuum chamber 20. FIG. Of electrode materials (noble metal plus ions, etc.) are equally emitted toward each direction facing the circular surface SA2, and as a result, a part of the electrode material reaches the surface of the workpiece 21 as a coating material, Deposited on the surface. At the same time, droplets of the precious metal constituting the first electrode 14A are discharged mainly from the other end circular surface SA2 of the first electrode 14A in the axial direction of the first electrode 14A. For this reason, the first electrode 14A is provided on the other end circular surface SB2 of the second electrode 14B facing the other end circular surface SA2 of the first electrode 14A with the gap G interposed therebetween. Part of the electrode material discharged and the droplet (evaporation material) are attached, so that the evaporation material can be efficiently recovered to the second electrode 14B.

On the other hand, the negative electrode terminal of the DC power source 23 is connected to the second electrode 14B of a noble metal (gold or silver, etc.) while the switching switch 22 is switched, and the first electrode 14A is electrically floating. In this case, the use state (hereinafter referred to as "second use state") of the vacuum deposition apparatus 110 in which the second electrode 14B functions as a cathode (cathode; target) of vacuum arc discharge is realized. Then, the precious metal which comprises this 2nd electrode 14B from the other end surface SB2 of the 2nd electrode 14B based on the vacuum arc power generation which generate | occur | produces between the 2nd electrode 14B and the vacuum chamber 20. FIG. Is discharged equally toward each direction facing this circular surface SB2, and as a result, a part of this electrode material reaches the surface of the workpiece 21 as a film material and is deposited on the surface. At the same time, droplets of the precious metal constituting the second electrode 14B are discharged mainly from the other end surface SB2 of the second electrode 14B in the axial direction of the second electrode 14B. For this reason, it discharge | releases from the 2nd electrode 14B to the other end circular surface SA2 of the 1st electrode 14A which opposes the other circular surface SB2 of the 2nd electrode 14B, and the clearance gap G between them. Once the evaporated material is attached, the evaporated material can be efficiently recovered to the first electrode 14A.

In this way, the first use state and the second use state in the vacuum deposition apparatus 110 are switched over and over again for a predetermined period (for example, every one batch period) through the switching switch 22, and the first use is repeated. The evaporated material recovered at the second electrode 14B during the state is reused as part of the second electrode 14B functioning as the cathode during the next second use state, and is applied to the first electrode 14A during the second use state. The recovered evaporated material is preferably reused as part of the first electrode 14A which functions as a cathode during the next first use state.

Moreover, the vacuum deposition apparatus 110 is equipped with the control apparatus (not shown) which controls the operation | movement, and this control apparatus controls the vacuum arc discharge in the vacuum deposition apparatus 110 suitably.

Next, operation | movement of the vacuum deposition apparatus 110 which concerns on this embodiment is demonstrated.

Since the power supply conditions for generating the vacuum arc discharge and the gas conditions inside the vacuum chamber 20 are all based on the known technology, their detailed description is omitted here.

After installing the workpiece 21 and the arc evaporation source 100 in the vacuum chamber 20 of the vacuum deposition apparatus 110, the vacuum gas 20 by introducing a discharge gas from the appropriate point of the wall of the vacuum chamber 20 The vacuum exhaust device is operated to maintain the at a predetermined vacuum degree (for example, 1 Pa).

In this state, the firing of the vacuum arc discharge is performed according to the contact firing method, for example. That is, the first and second electrodes 14A and 14B are rotated so as to be close to each other with respect to the axial center PA and PB, respectively (see FIG. 1), so that the first and second electrodes 14A and ( 14B) is brought into contact with each other. In this state, when a current flows between the two electrodes 14A and 14B, and then the two electrodes 14A and 14B are separated thereafter, a spark that occurs at the moment when the two electrodes 14A and 14B are removed. The vacuum arc discharge is induced by the discharge.

Subsequently, predetermined power is applied to the first electrode 14A and the vacuum chamber 20 to execute the first use state in the vacuum deposition apparatus 110. Then, the film | membrane material of the noble metal which comprises the 1st electrode 14A is deposited on the workpiece | work 21 based on the vacuum arc discharge between the 1st electrode 14A and the vacuum tank 20, and the 2nd electrode 14B ), The evaporated material discharged from the first electrode 14A is recovered, and the recovered evaporated material is reused in the next use state.

After the one batch period is finished, the vacuum of the vacuum deposition apparatus 110 is opened to the air to replace the work 21 inside the vacuum chamber 20, and the same vacuum arc discharge organic operation is performed again. Thereafter, predetermined power is applied to the second electrode 14B and the vacuum chamber 20 so as to execute the second use state in the vacuum deposition apparatus 110. Then, the film | membrane material of the noble metal which comprises the 2nd electrode 14B is deposited on the workpiece | work 21 by the vacuum arc discharge between the 2nd electrode 14B and the vacuum chamber 20, and the 1st electrode 14A is carried out. The evaporated material discharged from the second electrode 14B is recovered, and the recovered evaporated material is reused in the next first use state.

[Modification 1]

In the above embodiment, an example in which switching between the first use state and the second use state in the vacuum deposition apparatus 110 is performed every batch is described. However, when such a batch unit is switched, as illustrated in FIG. 4, deposition of the coating material onto the work 21 in the first use state is performed based on the scattering form of the coating material in the A pattern shown by solid lines. The deposition of the coating material on the workpiece 21 in the second use state is performed based on the film material scattering pattern of the B pattern indicated by the dotted line. For this reason, the scattering distribution of a coating material may change every time (that is, every batch), and may cause the deposition film thickness distribution nonuniformity of the coating material to the workpiece | work 21 further.

Here, an example of a structure of the vacuum deposition apparatus which suitably prevents the induction | occurrence | production of the film thickness distribution of the coating material to the said workpiece | work 21 is demonstrated.

5 is a schematic view for explaining a configuration example of a vacuum deposition apparatus according to the present modification.

As shown in FIG. 5, the vacuum deposition apparatus 120 according to the present modification is replaced with the DC power source 23 and the switching switch 22 in the vacuum deposition apparatus 110 (FIG. 3) of the embodiment. And an AC power source 32 (power supply means) and four first to fourth diodes (rectifier elements) 31A, 31B, 31C, and 31D.

Since the structure of the vacuum deposition apparatus 120 of that excepting the above is the same as that of the vacuum deposition apparatus 110 (FIG. 3), description of the structure common to both is abbreviate | omitted.

The AC power source 32 outputs a voltage of about 10 to 100 V (volts) and a current of about 10 to 500 A (amps) as AC power such as a square wave.

The first diode 31A is inserted between the one terminal of the AC power source 32 and the wiring between the vacuum chamber 20 such that the first diode 31A is in a direction (forward direction) to conduct toward the vacuum chamber 20 from this one terminal. . The second diode 31B has a direction (reverse direction) in which the second diode 31B does not conduct toward the second electrode 14B from the one terminal between the wiring between one terminal of the AC power source 32 and the second electrode 14B. It is inserted as possible.

The third diode 31C is inserted between the other terminal of the AC power source 32 and the wiring between the vacuum chamber 20 so that the third diode 31C becomes a direction (forward direction) to conduct toward the vacuum chamber 20 from the other terminal. . The fourth diode 31D has a direction (reverse direction) in which the fourth diode 31D does not conduct from the other terminal toward the first electrode 14A between the wiring between the other terminal of the AC power source 32 and the first electrode 14A. It is inserted as possible.

According to the configuration of the vacuum deposition apparatus 120 as described above, the first electrode 14A and the second electrode in accordance with the AC cycle of the AC power source 32 on the basis of the potential (actually the ground potential) of the vacuum chamber 20. An alternating negative potential is applied to the electrode 14B.

Then, during the one batch period of the vacuum deposition apparatus 120, the first use state (the film material scattering form of the A pattern of FIG. 4) and the second use state (the B pattern of FIG. 4) in the vacuum deposition apparatus 120 The coating material scattering form) is automatically switched over a plurality of times at a short interval in one batch period corresponding to an alternating frequency of the alternating current power source 32. Therefore, by appropriately adjusting the AC frequency of the AC power source 32, uneven coating material deposition film thickness distribution to the work 21 in the first use state and coating material deposition film to the work 21 in the second use state. It is anticipated that thickness distribution nonuniformity cancels each other and the vapor deposition film thickness distribution nonuniformity of the coating material to the workpiece | work 21 can be prevented.

[Modification 2]

Here, another example of the configuration of the vacuum deposition apparatus that appropriately prevents the deposition film thickness distribution unevenness of the coating material to the workpiece 21 described with reference to FIG. 4 will be described.

FIG. 6: is a schematic diagram explaining one structural example of the vacuum deposition apparatus equipped with the arc evaporation source which concerns on this modification.

As shown in FIG. 6, the vacuum deposition apparatus 130 according to the present modification is replaced with the DC power source 23 and the switching switch 22 in the vacuum deposition apparatus 110 (FIG. 3) of the embodiment. A first DC power source 41 (power supply means) capable of supplying power to the first electrode 14A, and a second DC power source 42 (power supply capable of supplying power to the second electrode 14B). Means) is configured.

Since the structure of the vacuum deposition apparatus 120 of that excepting the above is the same as that of the vacuum deposition apparatus 110 (FIG. 3), description of the structure common to both is abbreviate | omitted.

In the first DC power source 41, the vacuum chamber 20 is configured to generate a vacuum arc discharge between the first electrode 14A (cathode; target) and the vacuum chamber 20 (anode; anode). The positive terminal of the DC power source 41 is connected, and the negative terminal is connected to the first electrode 14A. In addition, the vacuum chamber 20 is grounded, and therefore, the positive electrode terminal of the first DC power source 41 is maintained at the ground potential.

Similarly, in the second DC power source 42, the vacuum chamber 20 is provided to generate a vacuum arc discharge between the second electrode 14B (cathode; target) and the vacuum chamber 20 (anode; anode). The anode side terminal of the second DC power source 42 is connected, and the cathode side terminal is connected to the second electrode 14B. In addition, the vacuum chamber 20 is grounded, and therefore, the positive electrode terminal of the second DC power source 42 is maintained at the ground potential.

According to the configuration of the vacuum deposition apparatus 130 as described above, the power supply for vacuum arc discharge to the first electrode 14A by the first DC power source 41 and the second by the second DC power source 42 The power supply for vacuum arc discharge to the electrode 14B is performed at the same time, whereby the film material deposition film thickness distribution unevenness to the work 21 in the first use state and the work 21 in the second use state. It is anticipated that the film material deposition film thickness distribution nonuniformity of a furnace may cancel each other and the film material deposition film thickness distribution nonuniformity to the workpiece 21 can be prevented.

However, as a disadvantage of the present modification, it can be assumed that the recovery of the cathode ions (plus ions) from the first and second electrodes 14A and 14B becomes difficult.

[Modification 3]

According to the first use state of the vacuum deposition apparatus 110, the other end circular surface SA2 of the first electrode 14A is based on the vacuum arc discharge generated between the first electrode 14A and the vacuum chamber 20. The electrode material of the noble metal which comprises this 1st electrode 14A is similarly discharge | released toward each direction facing this circular surface SA2. Similarly, according to the second use state of the vacuum deposition apparatus 120, based on the vacuum arc discharge generated between the second electrode 14B and the vacuum chamber 20, the other end circular surface of the second electrode 14B ( The electrode material of the noble metal which comprises this 2nd electrode 14B from SB2 is discharged | emitted similarly toward each direction facing this circular surface SB2. For this reason, it discharges from the 1st and 2nd electrode 14A, 14B in each direction which faces clearance gap G (circular surface SA2, SB2) except the area | region which arrange | positioned the workpiece 21. One electrode material is attached to the wall of the vacuum chamber 20 or the structure inside the vacuum chamber 20 without being recovered.

Here, an example of a structure of the vacuum deposition apparatus which collects such an electrode material is demonstrated.

FIG. 7: is a schematic diagram explaining one structural example of the vacuum deposition apparatus which concerns on this modification, Comprising: It is the figure seen from the axial direction of the 1st and 2nd electrode 14A, 14B.

As shown in FIG. 7, the vacuum deposition apparatus 140 is comprised in the vacuum chamber 20, and is comprised by the collection | recovery member 51 which roughly divided the cylindrical member.

That is, the recovery member 51 is disposed so that the longitudinal direction (direction perpendicular to the width direction) of the recovery member 51 is parallel with the axial directions of the first and second electrodes 14A and 14B. At the same time, the inner surface 52 of the recovery member 51 is curved to surround the gap G except for the region between the workpiece 21 and the gap G.

According to such a collection member 51, the first and second electrodes 14A in each direction facing the gap G (circular surfaces SA2 and SB2) except for the region where the workpiece 21 is disposed. The electrode material discharged from and 14B almost adheres to the inner surface of the recovery member 51. Then, when the recovery member 51 with the electrode material adhered is pulled out from the vacuum chamber 20, the electrode material can be peeled from the recovery member 51 by an appropriate peeling method, so that the electrode material can be reliably recovered.

From the above description, many improvements and other embodiments of the present invention are apparent to those skilled in the art. The foregoing description, therefore, is to be construed as illustrative only and is provided for the purpose of teaching those skilled in the art the best mode of carrying out the invention. The details of the structure and / or function may be substantially changed without departing from the spirit of the present invention.

The arc evaporation source and vacuum deposition apparatus according to the present invention are useful as an apparatus for forming a film on a work by, for example, vacuum arc discharge.

Claims (11)

Having first and second electrodes facing each other with a gap therebetween; An electrode of at least one of the first and second electrodes is used as a cathode, and an electrode of the other of the first and second electrodes is discharged from the cathode based on a vacuum arc discharge generated between the cathode and the anode. Arc evaporation source, characterized in that configured to recover the evaporation material. And a power supply means for supplying power to the cathode and the anode to generate a vacuum arc discharge between the cathode and the anode. Vapor deposition apparatus. The method of claim 2, And said anode is said vacuum chamber. The method of claim 2, And the evaporation material is a droplet and an ion made of the material of the cathode. The method of claim 2, A work disposed inside the vacuum chamber, The first and second electrodes are rods, and the first and second electrodes are arranged side by side in the longitudinal direction of the first and second electrodes such that the gap is placed between their cross sections, and the workpiece is A vacuum deposition apparatus, wherein the vacuum deposition apparatus is disposed at a position facing the gap. The method of claim 5, A recovery member disposed inside the vacuum chamber and recovering the evaporated material; And the surface of the recovery member is curved to surround the gap except for a region between the workpiece and the gap. The method of claim 2, And a first use state in which the first electrode is the cathode, and a second use state in which the second electrode is the cathode. The method of claim 7, wherein And a switching means for switching between the first use state and the second use state. The method of claim 8, The power supply means is a direct current power source, And said switching means is a switch for switching a connection between the negative electrode terminal of said DC power source between said first electrode and said second electrode. The method of claim 8, The power supply means is an AC power source, The switching means has a rectifying element for rectifying the electric power supplied from the AC power source between one terminal of the AC power source and the first electrode, and between the other terminal and the second electrode of the AC power source. Vacuum deposition apparatus. The method of claim 2, The power supply means includes a first DC power source having a negative electrode terminal connected to the first electrode and a positive electrode terminal connected to the anode, a negative electrode terminal connected to the second electrode and a positive electrode connected to the anode And a second DC power source having a side terminal.

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