KR20080102745A - Semiconductor device tester and method for transferring tested semiconductor device thereby - Google Patents

Abstract

A testing apparatus of semiconductor device and the tested semiconductor device transfer method using the same are provided to deliver the semiconductor device which is test completed from the test tray to the customer tray. A testing apparatus of semiconductor device includes the tester testing the settled semiconductor device in the test tray; the unload area(200) in which the tested semiconductor device is loads according to the test result class; the unload buffer(800a,800b) arranged between the fixed location and the unload area of the test tray ejected from the tester; the first unload picker which loads the rest semiconductor devices in the remaining area of the unload buffer(600a); the second unload picker for delivering the first class semiconductor device to the unload area(600b).

Description

Semiconductor device test device and method for transferring tested semiconductor device using same {Semiconductor device tester and method for transferring tested semiconductor device ever}

1 is a conceptual diagram schematically showing a configuration of a conventional semiconductor device test apparatus.

2 is a conceptual diagram schematically illustrating a configuration of a semiconductor device test apparatus according to an embodiment of the present invention.

3 is a perspective view of an example of an unload buffer used in the semiconductor device test apparatus of FIG. 2.

4 illustrates test results on a test tray of semiconductor devices tested in the semiconductor device test apparatus of FIG. 2.

FIG. 5 illustrates a result of loading semiconductor devices from the test tray of FIG. 4 into the unload buffer by the first unload picker in the semiconductor device test apparatus of FIG. 2.

FIG. 6 illustrates a result of loading semiconductor devices into a customer tray from an unload buffer of FIG. 5 by a second unload picker in the semiconductor device test apparatus of FIG. 2.

The present invention is a semiconductor device test apparatus, specifically, a semiconductor device test apparatus capable of quickly classifying semiconductor devices tested by two or more unload pickers according to semiconductor device test results, and classifying and transporting the tested semiconductor devices using the same. It is about a method.

It is necessary to test each of the semiconductor devices manufactured in the semiconductor device manufacturing process and screen out the good and bad semiconductor devices. The device used here is called a semiconductor device test device.

The semiconductor device test apparatus is largely comprised of a tester for testing the quality of a semiconductor device and a handler for supplying the semiconductor device to the tester, and classifying the semiconductor device according to a test result of the tester.

In this case, as shown in FIG. 1, the handler picks up the semiconductor device from the customer tray of the load unit 10 on which the semiconductor device to be tested is loaded through the load picker 40a and transfers the semiconductor device to the test tray 30a. The test tray 30a in which the semiconductor device is loaded is transferred to a tester (not shown).

When the semiconductor device is tested in the tester, the handler picks up the semiconductor device from the test tray 30b in which the tested semiconductor device is loaded through the unload picker 40b, classifies the semiconductor device according to the test result, and then unloads the part 20. In the customer tray. The customer trays classified and loaded according to the test results are discharged to the outside from the semiconductor device test apparatus.

Each of the semiconductor devices delivered into the tester is tested in contact with the test equipment while being loaded in the test trays 30a and 30b. The semiconductor devices are arranged to be spaced apart from each other by a predetermined distance for smooth contact between the test equipment and the semiconductor devices. Preferably, for this purpose, the interval between the stacking grooves in which the semiconductor elements formed in the test trays 30a and 30b in which the semiconductor element to be tested is loaded is loaded, and the semiconductor elements formed in the customer tray are stacked. It is different from the spacing of the loading grooves.

Therefore, it is necessary for the load picker 40a or the unload picker 40b to adjust the spacing of the semiconductor elements picked up to match the spacing of the loading grooves of the test trays 30a and 30b or the spacing of the customer trays. To this end, a load buffer 50b and an unload buffer 50b are provided between the test trays 30a and 30b and the customer trays on the load unit 10 and the unload unit 20.

However, when classifying and transferring the semiconductor device tested in the handler of the semiconductor device test apparatus to the customer tray of the unloading unit 20 according to the test result in the test tray, the unload picker 40b of the conventional semiconductor device test apparatus is First, the semiconductor devices are completely classified according to the test result class of the semiconductor device and loaded into the unload buffer 50b. Then, the semiconductor devices fully classified and loaded according to the test result class are unloaded from the unload buffer 50b according to the test result class. It transfers to the customer tray of the part 20.

That is, in the conventional semiconductor device test apparatus, the unload picker 40b needed to completely classify the semiconductor devices loaded on the test tray according to the test result grade and load them in the unload buffer 50b. However, when the test result of the semiconductor device is varied to three or more, such as first grade, second grade, and third grade, when the unload picker 40b picks up the semiconductor element, the picked-up semiconductor element is a first-class semiconductor element The semiconductor device is moved to and loaded into the first class region in the unload buffer 50b, and when the picked-up semiconductor device is a second-class semiconductor device, the semiconductor device is moved to and loaded into the second class region in the unload buffer 50b, and the picked-up semiconductor device is a third-class semiconductor device In this case, each region of the unload buffer 50b has to be moved several times as many as the number of grades as a result of the test of the picked-up semiconductor device. there was. In addition, such a semiconductor device classification transfer time has a problem of increasing rapidly as the test result grades are diversified. As a result, a problem arises in that the work efficiency (UPH) of the classification transfer step of the tested semiconductor device is lowered.

In order to solve the above problems of the prior art, the present invention provides a semiconductor device test apparatus that can quickly classify the tested semiconductor device from the test tray according to the test result grade and transfer it to the customer tray, and transfer of the tested semiconductor device using the same. To provide a method.

An apparatus for testing a semiconductor device according to an aspect of the present invention is a device for testing a quantity / unit of a semiconductor device, the apparatus comprising: a tester for testing the semiconductor device mounted on a plurality of test trays; An unloading unit in which the tested semiconductor devices are classified and stacked according to test result grades; An unload buffer disposed between the fixed position of the test tray and the unload unit discharged from the tester; Picking up a plurality of semiconductor devices from the test tray, sorting and arranging only the semiconductor devices having the test result grade 1 in a portion of the unload buffer, and then loading the remaining semiconductor elements in the remaining region of the unload buffer as it is. A first unload picker; And first-class semiconductor devices of the partial region are picked up and transferred to the unload unit as they are from the unload buffer, and the semiconductor devices of the remaining grades of the remaining region are picked up and selectively classified according to the test result grade. And a second unload picker for transferring to the unload unit.

The second unload picker delivers the picked up semiconductor device to different customer trays according to the test result grade.

The unload buffer is provided to move between the fixed position of the test tray and the unload unit.

Two or more unload buffers may be provided.

While the first unload picker loads the semiconductor element from the test tray into the two or more unload buffers, the second unload picker moves the semiconductor to the customer tray of the unload part from the other one of the two or more unload buffers. The device can be loaded.

According to another aspect of the present invention, a method of transferring a semiconductor device is a method of classifying and transferring semiconductor devices loaded and tested in a test tray according to a test result grade, wherein a plurality of semiconductor devices in which a first unload picker is picked up from the test tray Arranging only the semiconductor devices having the first grade as the test result in a portion of the unload buffer; The first unload picker aligning the remaining test result class semiconductor devices among the plurality of picked up semiconductor devices in the remaining area of the unload buffer without distinction; A second unload picker picking up the semiconductor device of the first grade arranged in a partial region of the unload buffer as it is and loading it into a customer tray corresponding to the first grade of the unloading portion; And sorting, by the second unload picker, the semiconductor devices of the remaining test result grades picked up from the remaining area of the unload buffer according to the test result grades and loading them in corresponding customer trays of the unload unit, respectively. do.

The semiconductor device transfer method may further include moving the unload buffer from one side of the test tray to one side of the unload unit when the transfer of the semiconductor element to the unload buffer by the first unload picker is completed. .

When there are two or more unload buffers, while the first unload picker aligns the semiconductor element from the test tray to one of the two or more unload buffers, the second unload picker is the remainder of the two or more unload buffers. The semiconductor device may be loaded into a customer tray of the unloading unit from one of them.

In order to achieve the above technical problem, the present invention tests a semiconductor device loaded in an unload buffer, in addition to a first unload picker for first classifying a semiconductor device tested from a test tray according to a test result grade and transferring the same to a unload buffer. The classification time of the tested semiconductor device can be significantly shortened by using the second unload picker which secondary sorts according to the result grade and transfers it to the customer tray.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

First, a semiconductor device test apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to FIG. 2.

As shown in FIG. 2, the semiconductor device test apparatus according to an exemplary embodiment of the present inventive concept may include a load unit 100, an unload unit 200, test tray position regions 300a and 300b, and a load picker 400a and 400b. , Load buffers 500a, 500b and 600, first unload picker 600a, second unload picker 600b, unload buffers 800a and 800b, and testers (not shown).

First, the load unit 100 loads a customer tray in which a plurality of semiconductor devices to be tested are seated, and provides the customer trays to the load pickers 400a and 400b.

The unload unit 200 provides an empty customer tray to the second unload picker 600b to receive and load the tested semiconductor devices classified according to the test grade result from the second unload picker 600b. To this end, the unloading unit 200 is configured to provide more than one customer tray corresponding to the test result grade. Specifically, when the test result grades are three grades of 1, 2, and 3, the unloading unit 200 is configured to provide three or more customer trays that may respectively correspond to the test result grades.

The test tray location areas 300a and 300b indicate areas in which the test trays can be located, and the test tray location areas 300a are areas in which empty test trays are located for loading the semiconductor device under test, and test tray location areas 300b is an area where the test tray is located to discharge the tested semiconductor device to the unload buffers 800a and 800b.

The load pickers 400a and 400b pick up the semiconductor elements seated on the customer trays of the rod part 100, adjust the intervals of the picked-up semiconductor elements to intervals between the loading grooves of the test tray, and then test the trays. To pass. In this case, the load buffers 500a, 500b, and 600 may be used to assist in adjusting the gap of the semiconductor device.

The first unload picker 600a simultaneously picks up a plurality of semiconductor devices as many as the number of pickups from a test tray loaded with the tested semiconductor devices in a tester, and ranks 1 according to a test result grade among the plurality of semiconductor devices picked up. Select only the semiconductor devices judged as "good grade" and arrange them in some regions of the unload buffers 800a and 800b, and apply the semiconductor devices of other grades such as grade 2 (normal grade) and grade 3 (bad grade). No further screening is performed, and the rest is placed in the remaining regions of the unload buffers 800a and 800b.

In the exemplary embodiment of the present invention, a test result grade is classified into three grades of 1 grade (good grade), 2 grade (normal grade), and 3 grade (bad grade), but is not limited thereto. Test result grades may be appropriately classified according to the purpose of the invention.

The second unload picker 600b picks up the semiconductor devices of the first grade disposed in the partial region from the unload buffers 800a and 800b, as they are, and corresponds to the first class of the empty customer trays of the unloading unit 200. Load it in the tray.

In addition, the second unload picker 600b picks up the semiconductor devices of the other grades disposed in the remaining areas from the unload buffers 800a and 800b, and then determines the second grade (normal grade) according to the test result grade. Selected semiconductor elements are selectively loaded into the customer trays corresponding to the second grade of the empty customer trays of the unloading unit 200, and the semiconductor elements determined as the third grade (bad grade) are placed in the empty customer trays of the unloading unit 200. It is loaded in the customer tray corresponding to grade 3. Here, some regions and the remaining regions of the unload buffers 800a and 800b are not determined on the unload buffers 800a and 800b, and may be appropriately set according to the ratio of semiconductor devices of each grade according to the purpose of the present invention. have.

For example, if a test result grade in a tester is displayed for semiconductor devices loaded in a test tray, it may appear as shown in FIG. 4.

The test result grade of each of the semiconductor devices is transferred to a controller (not shown), and the controller controls the first unload picker 600a to select the semiconductor device from among the plurality of semiconductor devices picked up by the first unload picker 600a. As a result of the test, semiconductor devices having a grade 1 are aligned in some regions of the unload buffers 800a and 800b as shown in FIG. 5.

In addition, the control unit arranges the semiconductor devices of other grades having a test result grade other than 1 grade without being sorted as described above, and is arranged in the remaining regions of the unload buffers 800a and 800b as shown in FIG. 5.

As such, when the transfer of the semiconductor devices from the test trays to the unload buffers 800a and 800b is completed, the controller controls the second unload picker 600b to arrange the first class semiconductor devices arranged in a portion of the unload buffers 800a and 800b. 6 to be picked up and loaded into the customer tray corresponding to the first grade among the empty customer trays of the unloading unit 200.

On the other hand, the control unit controls the second unload picker (600b), the test result grade of the plurality of semiconductor devices picked up in the remaining area of the unload buffer (800a, 800b) by the second unload picker 600b As shown in FIG. 6, the phosphor semiconductor devices are loaded in the customer trays corresponding to the second grade among the empty customer trays of the unloading unit 200. The control unit loads the semiconductor devices having the test result grade 3 into the customer trays corresponding to the 3 grades among the empty customer trays of the unloading unit 200 as shown in FIG. 6.

As described above, in the semiconductor device test apparatus of the present invention, two or more unload pickers, such as the first unload picker 600a and the second unload picker 600b, are used to classify and transfer semiconductor devices according to test result grades. It can be separated above.

Therefore, even when the test result grade in the semiconductor device test apparatus is three or more, such as grade 1, grade 2, and grade 3, the first unload picker 600a classifies the semiconductor elements into grade 1 and the remaining grades. Only the primary classification is performed, and the second unload picker 600b further performs another classification (secondary classification) of the remaining classes of semiconductor devices into second and third grades. As described above, the classification performed in each unload picker is limited in turn, so that the classification of semiconductor devices can be performed more quickly.

The unload buffers 800a and 800b are shown in FIG. 3, and are located on one side of the region 300b in which the test tray where the test is completed is located, and the semiconductor devices loaded in the test tray are unloaded according to the test result. A place that is classified by the picker 600a and the second unload picker 600b and temporarily stored when delivered to the unloading unit 200.

Specifically, the unload buffers 800a and 800b may be configured to classify semiconductor devices having a first grade of test result selected by the first unload picker 600a from the test tray into the unload unit 200. Some areas are temporarily stored before the transfer, and the remaining areas are temporarily stored before being transferred to the unload unit 200 by the second unload picker 600b.

In addition, the unload buffers 800a and 800b may assist the operation of adjusting the pitch between the semiconductor devices on the test tray to the pitch between the semiconductor devices on the customer tray.

Although the unload buffers 800a and 800b in the present invention are not particularly limited, the unload buffers 800a and 800b in the embodiment of the present invention may be provided to be movable as shown in FIG. 2.

Specifically, the unload buffers 800a and 800b are positioned at one side of the region 300b in which the test trays are located, and the semiconductor devices classified first by the first unload picker 600a according to the test result grade are provided in the test trays. When the data is transferred from the unload buffers 800a and 800b to the unload buffers 800a and 800b, the unload buffers 800a and 800b are moved from the region 300b in which the test tray is located to one side of the unload unit 200. When the unload buffers 800a and 800b are moved to one side of the unload unit 200, the semiconductor devices sorted by the second unload picker 600b are transferred to the customer tray of the unload unit 200 as they are. The semiconductor devices are secondarily classified and transferred to the customer tray of the unloading unit 200.

However, as shown in FIG. 2, the unload buffers 800a and 800b may include two or more, that is, the first unload buffer 800a and the second unload buffer 800b.

In this case, while the first unload picker 600a first classifies the semiconductor devices from the test tray according to the test result grade, the first unload picker 600a transfers the semiconductor devices to the first unload buffer 800a located at one side of the test tray location area 300b. The second unload picker 600b classifies the semiconductor elements and transfers the semiconductor elements to the customer tray of the unload unit 200 from the second unload buffer 800b located at one side of the unload unit 200. That is, the first unloaded picker 600a and the second unloaded picker 600b can operate at the same time, so that sorting and transfer of semiconductor elements can be more quickly achieved.

In the exemplary embodiment of the present invention, only two unload pickers are used. However, three or more unload pickers may be configured according to the number of test result grades of the semiconductor device.

The semiconductor element transfer method of the present invention using the semiconductor element transfer device as described above may be configured as follows.

First, the first unload picker 600a is controlled according to the test result grade received from the tester, so that only the semiconductor device of the first grade (good grade) among the plurality of semiconductor devices picked up from the test tray is included in the unload buffers 800a and 800b. Arrange and arrange in some areas. Then, the first unload picker 600a is controlled to arrange the remaining semiconductor devices in the remaining regions of the unload buffers 800a and 800b without distinguishing them.

If the unload buffers 800a and 800b are movable in this embodiment, the unload buffers 800a and 800b may be moved from one side of the test tray position area 300b to one side of the unload unit 200. have.

Next, the second unload picker is controlled to pick up the semiconductor device of the first grade aligned in some regions of the unload buffers 800a and 800b as it is, and load the semiconductor device corresponding to the first grade of the unloading unit 200. For semiconductor devices disposed in the remaining regions of the unload buffers 800a and 800b by controlling the second unload picker, semiconductor devices having a second grade (normal grade) among the plurality of semiconductor elements picked up according to the test result grade Is loaded into the customer trays corresponding to the second grade of the unloading portion 200, and semiconductor devices of the third grade (normal grade) are loaded into the customer trays corresponding to the third grade of the unloading portion 200 according to the test result grade.

On the other hand, in the present embodiment, if the unload buffer is composed of two, such as the first unload buffer 800a and the second unload buffer 800b, the semiconductor devices are first sorted by the first unload picker 600a and the first unload buffer 800a is separated from the test tray. During the transfer to the first unload buffer 800a, the semiconductor devices may be secondarily sorted by the second unload picker 600b and transferred from the second unload buffer 800b to the customer tray of the unload unit 200. .

As described above, when the semiconductor device test apparatus of the present invention is used, when classifying and transferring semiconductor devices according to test result grades, only primary classification is performed, such as only classifying only semiconductor devices corresponding to the grades determined as the highest frequency. In addition to the unload picker, by providing a separate unload picker for performing secondary classification on the remaining class of semiconductor devices, it is possible to greatly reduce the classification and transfer time for each test class of the semiconductor devices.

In addition, in the semiconductor device test apparatus of the present invention, the unload buffer is set to two or more, such as the first unload buffer and the second unload buffer, so that the primary classification and the secondary classification are simultaneously performed in the first unload buffer and the second unload buffer, respectively. As a result, the classification and transfer time for each test grade of the semiconductor device may be further shortened.

Using the semiconductor device test apparatus of the present invention, even if the test grade system is changed as necessary, it can be easily applied to the changed test grade through two or more unload pickers.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications can be made within the scope of the technical idea of the present invention, and it is obvious that the present invention belongs to the appended claims. Do.

Claims (8)

In the semiconductor device test apparatus for testing the quantity / part of the semiconductor device, A tester for testing the semiconductor device mounted on a plurality of test trays; An unloading unit in which the tested semiconductor devices are classified and stacked according to test result grades; An unload buffer disposed between the fixed position of the test tray and the unload unit discharged from the tester;  Picking up a plurality of semiconductor devices from the test tray, sorting and arranging only the semiconductor devices having the test result grade 1 in a portion of the unload buffer, and then loading the remaining semiconductor elements in the remaining region of the unload buffer as it is. A first unload picker; And The first class semiconductor devices of the partial region are picked up as they are and transferred to the unloading unit from the unload buffer, and the semiconductor devices of the remaining grades of the remaining region are picked up and selectively classified according to the test result grade. A second unload picker for transferring to the unload unit; Semiconductor device test apparatus comprising a The method of claim 1, The second unload picker And transferring the picked-up semiconductor device to a different customer tray according to the test result grade. The method of claim 1, The unload buffer The semiconductor device test apparatus, characterized in that it is provided to move between the fixed position of the test tray and the unloading portion. The method of claim 1, And at least two unload buffers. The method of claim 4, wherein While the first unload picker loads the semiconductor device from the test tray into the two or more unload buffers, And the second unload picker loads the semiconductor device into a customer tray of the unload part from the other one of the two or more unload buffers. In the semiconductor device transfer method for classifying and transporting the semiconductor device loaded on the test tray and tested according to the test result grade, Arranging, by the first unload picker, only the semiconductor devices having the test result grade 1 among the plurality of semiconductor devices picked up from the test tray in a partial region of the unload buffer; Arranging, by the first unload picker, semiconductor devices of the remaining test result grade among the plurality of semiconductor devices picked up in the remaining area of the unload buffer without distinction; A second unload picker picking up the semiconductor device of the first grade arranged in a partial region of the unload buffer as it is and loading it into a customer tray corresponding to the first grade of the unloading portion; And The second unload picker sorting and classifying the remaining test result class semiconductor devices picked up from the remaining area of the unload buffer according to the test result class and loading the respective unloaded pickers into corresponding customer trays of the unload unit; Semiconductor device transfer method comprising a. The method of claim 6, And moving the unload buffer from one side of the test tray to one side of the unload unit when the transfer of the semiconductor element to the unload buffer by the first unload picker is completed. Song method. The method of claim 6, When there are two or more unload buffers, While the first unload picker aligns the semiconductor device in the two or more unload buffers from the test tray, And the second unload picker loads the semiconductor device into a customer tray of the unload part from the other one of the two or more unload buffers.

Images