KR20080069806A - Inverter printed circuit board and backlight assembly including the same - Google Patents

Abstract

An inverter PCB(Printed Circuit Board) and a backlight assembly comprising the same are provided to reduce the noise generated from the inverter PCB by forming at least one soundproofing part in the inverter PCB. An inverter PCB(100) comprises a plurality of connection pads(117), a plurality of socket joint parts(113), at least one first soundproofing part(115), and at least one driving voltage generation unit(150). The first soundproofing part is disposed below the driving voltage generation unit. The first soundproofing part is formed from one side of a core connection part of the driving voltage generation unit to the other side of the core connection part of the driving voltage generation unit. The noise generated from the core connection of the driving voltage generation unit is discharged in a direction of a lower container through the first soundproofing part, thereby reducing the noise of the inverter PCB.

Description

Inverter printed circuit board and backlight assembly including the same}

1 is a partial perspective view of an inverter circuit board according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of a driving voltage generator among the components of the inverter circuit board of FIG. 1.

3 is a cross-sectional view of the inverter circuit board of FIG. 1 taken along lines III-III '.

4 is a partial perspective view of an inverter circuit board according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of the inverter circuit board of FIG. 4 taken along lines VV ′.

6 is a partial perspective view of an inverter circuit board according to a third embodiment of the present invention.

FIG. 7 is a cross-sectional view of the inverter circuit board of FIG. 6 taken along the line of FIG.

8 is an exploded perspective view of the backlight assembly according to an embodiment of the present invention.

9 is an enlarged view of a portion A of FIG. 8.

FIG. 10 is a bottom perspective view illustrating a coupling relationship between the lower housing, the lamp socket, and the inverter circuit board of FIG. 8.

FIG. 11 is a cross-sectional view taken along the line XI-XI ′ after FIG. 8 is assembled.

(Explanation of symbols for the main parts of the drawing)

100, 101, 102: inverter circuit board 110: insulating board

111: wiring pattern 113: socket coupling portion

115, 116: First sound insulation 159: Second sound insulation

117: connection pad 150: driving voltage generator

157: core connection 200: backlight assembly

215: lower storage container 216: shield case

217: third sound insulation

The present invention relates to an inverter circuit board and a backlight assembly including the same, and more particularly, to an inverter circuit board and a backlight assembly including the same that can reduce noise.

In recent years, liquid crystal displays have been in the spotlight as display means.

The liquid crystal display device may include a liquid crystal panel displaying an image and a backlight assembly supplying light to the liquid crystal panel. In addition, the backlight assembly may include a light source for generating and emitting light, for example, a light source such as a fluorescent lamp, and an inverter circuit board capable of driving the light.

In addition, the inverter circuit board may include a plurality of driving voltage generators that generate a driving voltage, for example, an AC voltage, to receive a predetermined voltage, for example, a DC voltage, from the outside to drive the light source. The generated driving voltage may be provided as a light source of a backlight assembly composed of a plurality of lamps, and may drive a lamp.

The driving voltage generator of the inverter circuit board may be, for example, a transformer. The transformer may be formed by winding a coil around at least two iron cores spaced at a predetermined distance, and may convert a DC voltage into an AC voltage as an electromagnetic induction phenomenon generated according to the number of windings of the coil.

On the other hand, in terms of reliability of the liquid crystal display device, the regulation and management by noise has emerged as an important topic. However, in the conventional liquid crystal display device, the quality of the liquid crystal display device is deteriorated by the noise generated from the inverter circuit board, that is, the noise generated from the transformer. Therefore, it is necessary to reduce the noise generated from the inverter circuit board.

It is an object of the present invention to provide an inverter circuit board capable of reducing the generated noise.

Another object of the present invention is to provide a backlight assembly including such an inverter circuit board.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above technical problem, an inverter circuit board according to an embodiment of the present invention includes an insulating substrate and at least one mounted on the insulating substrate, and receives a predetermined voltage from an external source to generate a lamp driving voltage. The generator may be formed in a predetermined region of the insulating substrate overlapping the driving voltage generator, and include at least one first sound insulation unit to reduce noise generated from the driving voltage generator.

The backlight assembly according to an embodiment of the present invention for achieving the above another technical problem includes the inverter circuit board.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partial perspective view of an inverter circuit board according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of a driving voltage generation unit among the components of the inverter circuit board of FIG. 1, and FIG. 3 is an inverter circuit of FIG. 1. It is sectional drawing which cut | disconnected the board | substrate with the line of III-III '.

First, referring to FIG. 1, the inverter circuit board 100 may include an insulating substrate 110 on which a plurality of connection pads 117, a plurality of socket coupling portions 113, and at least one first sound insulation unit 115 are formed. And at least one driving voltage generator 150 mounted on the insulating substrate 110.

1 and 3, a plurality of socket coupling parts 113 may be formed at one side of the insulating substrate 110 of the inverter circuit board 100. The socket coupling portion 113 may protrude to a predetermined length so as to be inserted into a lamp socket (not shown) to be described later. Here, the socket coupling part 113 may further include a socket connection pad 113a made of a conductive material to be electrically connected to the lamp socket.

A plurality of connection pads 117 on which the driving voltage generator 150 to be described later is mounted may be formed on an upper surface of the insulating substrate 110. In addition, the plurality of connection pads 117 may be electrically connected to the socket coupling part 113, that is, the socket connection pad 113a, through the wiring pattern 111. Accordingly, a predetermined signal generated from the driving voltage generator 150, for example, a lamp driving voltage, may be provided from the plurality of connection pads 117 to the socket connection pad 113a through the wiring pattern 111. The lamp driving voltage may be provided to a lamp socket electrically connected to the socket connecting portion 113a.

In addition, the plurality of connection pads 117 may include an input pad 117a and an output pad 117b. In other words, the plurality of connection pads 117 drive the lamps generated from the input pad 117a and the driving voltage generator 150 connected to the input wire 111a through which a predetermined signal, for example, a DC voltage, is transmitted from the outside. It may be configured as an output pad 117b connected to an output wire 111b that transmits a voltage to the outside, for example, the socket coupling unit 113. The plurality of connection pads 117 may be formed of a conductive material, for example, a conductive material such as copper (Cu).

The driving voltage generator 150, for example, a driving voltage generator 150 such as a transformer may be mounted on the plurality of connection pads 117. The driving voltage generator 150 receives a DC voltage from the outside and converts the DC voltage into an AC voltage, for example, a lamp driving voltage.

Hereinafter, the driving voltage generator 150 will be described in detail with reference to FIG. 2. For convenience of description, the driving voltage generator in this embodiment will be described using an example of a transformer.

Referring to FIG. 2, the driving voltage generator 150 may include a coil 152 through which a large current flows, a bobbin 151 and a bobbin 151 wound around the coil 152. It may be composed of a core 155 surrounding the outside.

The coil 152 guides the flow of current, and a plurality of coils are wound around the outer circumferential surface of the bobbin 151. The magnitude of the electromagnetic induction phenomenon may be determined according to the number of windings of the coil 152 wound on the bobbin 151.

The bobbin 151 has a bobbin opening 151a wound around the outer circumferential surface of the bobbin 151, and may include a plurality of connection leads 154 protruding from both sides of the bobbin 151. . Here, the plurality of connection leads 154 may be mounted on a plurality of connection pads formed on the insulating substrate described above.

The core 155 is disposed outside the bobbin 151 to guide the magnetic flux by the current flowing in the coil 152. The cores 155 may be arranged to face each other with the bobbin 151 interposed therebetween, for example, in a 'ㅌ' shape. In addition, a pair of cores 155 may be disposed on both sides of the bobbin 151, and the pair of cores 155 may be coupled at the outer circumferential surface of the bobbin 151 to form a core connection portion 157.

Meanwhile, as described above, the driving voltage generator 150 having the above structure may convert a direct current (DC) voltage mounted on an insulating substrate and provided from the outside into a high voltage alternating current (AC) voltage. In this case, noise may be generated from the driving voltage generator 150. Such noise may occur mainly at the core connector 157, that is, the core connector 157 to which the pair of cores 155 surrounding the outer circumferential surface of the bobbin 151 are connected. Accordingly, in order to reduce such noise, the inverter circuit board may include a soundproof unit, for example, a first soundproof unit to be described later.

In addition, in the present exemplary embodiment, the core 155 has a shape of 'ㅌ' as an example, but the present invention is not limited thereto, and the core 155 may have a 'C' shape.

Referring to FIGS. 1 and 3 again, at least one first sound insulation unit 115 is disposed below the driving voltage generator 150, that is, on the upper surface of the insulating substrate 110 overlapping the driving voltage generator 150. Can be formed.

The first sound insulation unit 115 may be formed on the upper surface of the insulating substrate 110 in a first width, that is, in a horizontal width direction of the driving voltage generator 150.

In detail, the first sound insulation 115 may be formed on the insulating substrate 110 adjacent to the core connector 157 of the driving voltage generator 150 described above. The first sound insulation unit 115 may have a slit structure formed to have a predetermined width, and may be in a first direction of the driving voltage generator 150, for example, in a width direction of the driving voltage generator 150. It may be extended.

In other words, the first sound insulation unit 115 may be formed in one direction from one side to the other side of the core connection unit 157 of the driving voltage generator 150 on the insulating substrate 110, and has a slit structure formed in a predetermined width. Can be. The first sound insulation unit 115 may discharge noise generated from the core connection unit 157 of the driving voltage generator 150 toward the lower storage container (not shown) to be described later through the first sound insulation unit 115. Make sure Thereby, the noise of the inverter circuit board 100 can be reduced.

In addition, although not illustrated, the member 118, which is not described, may be a display mark 118 indicating a mounting position of the driving voltage generator 150 on the insulating substrate 110.

Hereinafter, an inverter circuit board according to a second embodiment of the present invention will be described with reference to FIGS. 4 and 5. 4 is a partial perspective view of an inverter circuit board according to a second exemplary embodiment of the present invention, and FIG. 5 is a cross-sectional view of the inverter circuit board of FIG. 4 taken along lines VV ′. For convenience of description, members having the same functions as the members shown in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof will be omitted. Inverter circuit board of the present embodiment, as shown in Figure 4, has a basically the same structure except for the following. That is, as shown in FIG. 4, the first sound insulation unit 116 of the inverter circuit board 101 of the present embodiment may be formed in a hole shape.

4 and 5, as described above, the inverter circuit board 101 may include a plurality of connection pads 117, a plurality of socket coupling parts 113, and at least one material. 1 may include an insulating substrate 110 on which the sound insulation unit 116 is formed, and at least one driving voltage generator 150 mounted on the insulating substrate 110.

Here, the first sound insulation unit 116 is formed in a plurality of hole structures on the lower surface of the driving voltage generator 150, that is, the upper surface of the insulating substrate 110 overlapping the driving voltage generator 150. Can be.

In detail, the first soundproof part 116 has a hole structure in which the insulating substrate 110 is punched in a predetermined width, and the first soundproof part 116 is a core connection part 157 of the driving voltage generator 150. It may be formed to extend in the direction from one side to the other side of the core connection portion 157 on the insulating substrate 110 adjacent to the ().

Meanwhile, the noise generated from the inverter circuit board 101, that is, the noise generated from the core connection unit 157 of the driving voltage generator 150 is discharged toward the lower storage container through the first soundproof unit 116. As a result, noise of the inverter circuit board 101 may be reduced.

Hereinafter, an inverter circuit board according to a third embodiment of the present invention will be described with reference to FIGS. 6 and 7. 6 is a partial perspective view of an inverter circuit board according to a third exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view of the inverter circuit board of FIG. For convenience of description, members having the same functions as the members shown in FIGS. 1 to 5 are denoted by the same reference numerals, and thus description thereof is omitted. The inverter circuit board of this embodiment has a basically identical structure except for the following, as shown in FIG. That is, as shown in FIG. 6, the inverter circuit board 102 of the present exemplary embodiment includes a cap soundproof second soundproof part 159 coupled from the top to the bottom of the driving voltage generator 150. Can be configured.

Referring to FIGS. 6 and 7, the inverter circuit board 102 of the present exemplary embodiment may include an insulating substrate having a plurality of connection pads 117 and a plurality of socket coupling portions 113 as described above. 110 and at least one driving voltage generator 150 mounted on the insulating substrate 110.

Here, as shown in FIG. 2, the driving voltage generator 150 may include a bobbin 151 wound around a coil 152 and a pair of cores 155 formed to surround the outside. As shown in FIG. 6, the second sound insulation unit 159 may be further coupled to the upper portion of the driving voltage generator 150.

In detail, the driving voltage generator 150 may be accommodated inside the second sound insulation 159 having a cap structure. That is, the second sound insulation unit 159 includes a predetermined accommodation portion recessed according to the shape of the core 155 and the bobbin 151 of the driving voltage generation unit 150, and the second sound insulation portion having the accommodation portion ( The 159 is coupled from the top to the bottom of the driving voltage generator 150 to surround the core 155 and the bobbin 151. Accordingly, the core connection unit 157 described above, that is, the core connection unit 157 where the noise is generated, may be covered by the second sound insulation unit 159, thereby reducing the noise generated from the driving voltage generator 150. can do. In this case, the second sound insulation 159 may be formed of a predetermined insulating material, for example, a resin mold.

The inverter circuit board of the present invention has been described above with reference to a number of embodiments. In the above embodiments, an example in which the first and second sound insulation units are independently formed on the insulating substrate of the inverter circuit board has been described. However, the present invention is not limited thereto. Obviously, it may be formed on the insulating substrate at the same time.

Hereinafter, a backlight assembly according to an embodiment of the present invention will be described with reference to FIGS. 8 to 11. 8 is an exploded perspective view of a backlight assembly according to an embodiment of the present invention, FIG. 9 is an enlarged view of a portion A of FIG. 8, and FIG. 10 is a combination of the lower housing, lamp socket, and inverter circuit board of FIG. 8. It is a bottom perspective view which shows a relationship, and FIG. 11 is sectional drawing cut | disconnected by the line XI-XI 'after FIG. 8 was assembled. For convenience of description, the inverter circuit board of the present embodiment will be described by taking the inverter circuit board according to the first embodiment of the present invention described above with reference to FIGS. 1 to 3 as an example.

First, referring to FIG. 8, the backlight assembly 200 according to the present exemplary embodiment includes a lamp 213, a lamp socket 220, an optical plate 212, a reflective sheet 214, optical sheets 211, and a lower part. The storage container 215, the inverter circuit board 100, and the shield case 216 may be included.

The lamp 213 may generate light by a lamp driving voltage provided from the inverter circuit board 100. For example, the lamp 213 may emit light by using a lamp driving voltage provided from the inverter circuit board 100. For example, the lamp 213 may be a light emitting diode (LED), a cold cathode fluorescent lamp (CCFL), an external electrofluorescent lamp (EEFL), or the like. Can be used. The lamps 213 may be spaced apart at a uniform distance and connected in phase in parallel, and may be configured in a direct type. In this case, in order to emit light of uniform brightness from the lamp 213, the lamp 213 may be arranged in a horizontal direction with respect to the liquid crystal panel (not shown).

The lamp socket 220 may be inserted / fixed through the socket insertion hole 215a formed in the lower housing 215, and may be positioned to correspond to the end of the lamp 213 to support / fix the lamp 213. . 9 and 10, the lamp socket 220 may be coupled upward from the bottom of the lower container 215. Here, the lamp connection part 221 of the lamp socket 220 may be positioned inside the lower housing 215, and the power connection part 222 of the lamp socket 220 may be disposed outside the lower housing 215. Can be.

The lamp 213 may be inserted into the lamp connector 221 to be electrically connected to the lamp 213. 9, the lamp 213 may include a lamp tube 213a to which a predetermined fluorescent substance is coated, and lead wires 213b formed at both ends of the lamp tube 213a. Here, the lead wire 213b may provide a lamp driving voltage provided from the outside, that is, the inverter circuit board 100 to an electrode (not shown) formed inside the lamp tube 213a.

The inverter circuit board 100 may be inserted into and electrically connected to the power connection unit 222. 10, the power connection unit 222 may include a power connection terminal 223 into which the socket coupling unit 113 of the inverter circuit board 100 is inserted. In this case, the power connection terminal 223 may be an inverter. It may be electrically connected to the socket connection pad formed on the socket coupling portion 113 of the circuit board 100.

9 and 10, the lamp connector 221 and the power connector 222 of the lamp socket 220 may be electrically connected to each other. Accordingly, the lamp driving voltage generated from the inverter circuit board 100 may be transmitted to the lamp connector 221 through the power connector 222 of the lamp socket 220, and finally, a plurality of lamp driving voltages may be connected to the lamp connector 221. The lamp 213 can be driven. Meanwhile, the lamp socket 220 may further include a light blocking plate 224 disposed between the lamp connection part 221 and the power connection part 222 to prevent leakage and / or incoming light.

Referring back to FIG. 8, the optical plate 212 may be disposed above the lamp 213 and may serve to improve luminance uniformity of the light provided from the lamp 213.

The reflective sheet 214 may be disposed under the lamp 213, and may reflect light leaking to the bottom of the lamp 213 to the upper side. The reflective sheet 214 may be integrally formed on the bottom surface of the lower housing 215.

The optical sheets 211 may be disposed above the optical plate 212, and may diffuse / converge the light provided from the lamp 213 via the optical plate 212. Such optical sheets 211 may, for example, comprise a diffusion sheet and at least one prism sheet.

The lower container 215 has a rectangular shape, and sidewalls are formed along the edge of the upper surface such that the above-described components in the sidewall, for example, the lamp 213, the lamp socket 220, the optical plate 212, and the optical The sheets 211 and the reflective sheet 214 may be received and fixed. Here, the lower housing 215 may be modified in various shapes according to the method of accommodating the above components.

The inverter circuit board 100 may receive a predetermined voltage from the outside to generate a lamp driving voltage capable of driving the plurality of lamps 213, for example, a lamp driving voltage that is an AC voltage. 8 and 11, the inverter circuit board 100 may include an insulating substrate 110, a driving voltage generator 150, and a first sound insulation 115.

In addition, the inverter circuit board 100 may be disposed on the bottom surface of the lower housing 215, and may be configured in a socket coupling manner inserted into the power connection portion 222 of the lamp socket 220 described above.

The inverter circuit board 100 may be spaced apart from the lower receiving container 215 at predetermined intervals. In this case, a predetermined support part 215b for supporting the inverter circuit board 100 may be formed in the lower housing 215. That is, the inverter circuit board 100 may be inserted into the lamp socket 220 to be electrically connected to the plurality of lamps 213, and may be spaced apart by the support part 215b of the lower housing 215.

The shield case 216 covers and covers the inverter circuit board 100, and may be coupled / arranged to a bottom surface of the lower housing 215. The shield case 216 may serve to protect the inverter circuit board 100 from the outside.

8 and 11, the shield case 216 has a predetermined distance from the driving voltage generator 150 of the inverter circuit board 100 to cover and cover the inverter circuit board 100. Can be. The shield case 216 may be formed of a conductive metal material, for example, the same material as that of the lower housing 215.

In addition, a third sound insulation formed to a predetermined thickness between the shield case 216 and the inverter circuit board 100, that is, between the inner surface of the shield case 216 and the driving voltage generator 150 of the inverter circuit board 100. Unit 217 may be disposed. In other words, the third sound insulation unit 217 may be disposed between the upper surface of the driving voltage generator 150 of the inverter circuit board 100 and the inner surface of the shield case 216 and have a thickness of approximately 5 to 10 mm. Can be formed. Accordingly, the noise generated from the inverter circuit board 100 and / or the noise flowing from the outside may be reduced.

Meanwhile, the third sound insulation unit 217 may be formed of a material having excellent heat transfer, for example, a thermal pad. Therefore, heat generated from the inverter circuit board 100 may be discharged to the outside through the third sound insulation 217 and / or the shield case 216.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

As described above, according to the inverter circuit board and the backlight assembly including the same, the noise generated from the inverter circuit board may be reduced by forming at least one sound insulation unit on the inverter circuit board. Thereby, the quality of a liquid crystal display device can be improved.

Claims (10)

Insulating substrate; A driving voltage generator configured to be mounted on at least one of the insulating substrates and to receive a predetermined voltage from the outside to generate a lamp driving voltage; And And at least one first sound insulation unit formed in a predetermined region of the insulating substrate overlapping the driving voltage generator and reducing noise generated from the driving voltage generator. According to claim 1, The driving voltage generator, A bobbin having a plurality of connection leads mounted on the insulating substrate and formed by winding a plurality of coils; And A pair of cores facing each other outwardly / arranged to guide the magnetic flux to the outside of the bobbin; And the first sound insulation part is formed on the insulating substrate adjacent to the core connection part. The method of claim 2, The first sound insulation unit is an inverter circuit board having a slit structure having a predetermined width in a direction extending from one side to the other side of the core connection portion on the insulating substrate. The method of claim 2, The first sound insulation unit has a hole structure formed in a direction extending from one side to the other side of the core connection portion on the insulating substrate. According to claim 1, And a second sound insulation unit having a cap structure coupled from an upper portion of the driving voltage generator to surround the driving voltage generator. The method of claim 5, And said second soundproof portion is a resin mold having insulating properties. Multiple lamps; A lower accommodating container accommodating the plurality of lamps; An inverter circuit board coupled to or disposed on a rear surface of the lower housing container and providing a driving signal to the plurality of lamps, the inverter circuit board according to any one of claims 1 to 6; And And a shield case covering and protecting the inverter circuit board. The method of claim 7, wherein The shield case is disposed at a predetermined distance from the driving voltage generator mounted on the inverter circuit board, And a third soundproofing part formed to a predetermined thickness between the driving voltage generator and the shield case. The method of claim 8, The thickness of the third sound insulation is approximately 5 ~ 10mm backlight assembly. The method of claim 8, And the third sound insulation unit is a thermal pad.

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