KR20080056888A - Photosensitive resin composition for color filter of low surface roughness and excellent sensitivity characteristics and color filter using thereof - Google Patents

Abstract

A photosensitive resin composition, and a color filter prepared by using the composition are provided to reduce surface roughness, to improve sensitivity and to enhance development, heat resistance, chemical resistance and electrical properties with a small amount of exposure. A photosensitive resin composition comprises 0.5-40 wt% of an alkali-soluble resin; 1-30 wt% of a photopolymerizable monomer; 0.1-20 wt% of a photopolymerization initiator; 5-55 wt% of a pigment; 0.01-10 wt% of an antioxidizing agent; 0.01-2 wt% of a fluorine-based or silicone-based leveling agent; and the balance of a solvent. Preferably the alkali-soluble resin comprises 0.5-20 wt% of an acrylic resin containing a carboxyl group and 0.01-20 wt% of an epoxy novolac acrylic carboxylate resin based on the total amount of the composition.

Description

PHOTOSENSITIVE RESIN COMPOSITION FOR COLOR FILTER OF LOW SURFACE ROUGHNESS AND EXCELLENT SENSITIVITY CHARACTERISTICS AND COLOR FILTER USING THEREOF}

The present invention relates to a photosensitive resin composition for color filters having a low surface roughness (roughness) and excellent sensitivity characteristics, and more particularly, has excellent developability, heat resistance, chemical resistance and electrical properties at low exposure doses, thickness uniformity, The present invention relates to a photosensitive resin composition for color filters, which has improved surface roughness and adhesion, which is advantageous for high contrast expression and defect improvement of alignment films during high-speed liquid crystal injection.

Color filters are used in liquid crystal displays, optical filters of cameras, and the like, and are manufactured by coating fine regions colored in three or more colors such as red, green, and blue on a solid state imaging device or a transparent substrate. Such colored thin films are usually formed by dyeing, printing, electrodeposition, pigment dispersion, or the like. Currently, this method is applied to manufacturing LCDs of mobile phones, notebook computers, monitors, TVs, and the like.

In the dyeing method, an image having a dyeing base material such as natural photosensitive resin such as gelatin, amine-modified polyvinyl alcohol, amine-modified acrylic resin, etc. is formed on a glass substrate in advance and then dyed with a dye such as a direct dye to form a colored thin film. However, in order to form a multi-colored thin film on the same substrate, it is necessary to perform flameproof processing every time the color is changed, so that the process is very complicated and the time is delayed. In addition, the clarity and dispersibility of the commonly used dyes and resins themselves are good, but there are disadvantages in that light resistance, moisture resistance and heat resistance, which are the most important characteristics, are poor. For example, although Korean Patent Publication No. 1991-4717 and Korean Patent Publication No. 1994-7778 use azo compounds and azide compounds as dyes, they have disadvantages of poor heat resistance and durability compared to pigments.

In the printing method, printing is performed using the ink which disperse | distributed the pigment to thermosetting or photocurable resin, and a colored thin film is formed by hardening with heat or light. According to this method, the material cost can be reduced compared to other methods, but it is difficult to form highly precise and detailed images, and the thin film layer formed is not uniform. Republic of Korea Patent Publication No. 1995-703746 and Republic of Korea Patent Publication No. 1996-11513 propose a method of manufacturing a color filter using an inkjet method, the color resist composition sprayed from the nozzle for the printing of a delicate and accurate pigment is dye type As a result, the durability and heat resistance are inferior to the dyeing method.

In contrast, Korean Patent Publication No. 1993-700858, Korean Patent Publication No. 1996-29904, and Korean Patent Publication No. 1996-29904 propose an electrodeposition method using an electroprecipitation method. It can be formed, and because it uses a pigment, it has excellent heat resistance and light resistance, but when the pixel size is precise and fine electrode pattern in the future, colored stains due to electrical resistance appear at both ends or the thickness of the colored film is thick, There is a problem that is difficult to apply to color filters that require a high degree of precision.

On the other hand, the pigment dispersion method repeats a series of processes of coating a photopolymerizable composition containing a colorant on a transparent substrate provided with a black matrix, exposing the pattern of the form to be formed, and then thermally curing the non-exposed areas with a solvent. It is a method by which a colored thin film is formed. The pigment dispersion method has the advantage of improving heat resistance and durability, which are the most important properties of the color filter, and maintaining the thickness of the film uniformly. For example, Japanese Patent Laid-Open Nos. 7-140654, 10-254133 and the like have proposed methods for producing color resists using pigment dispersion.

The colored photosensitive resin composition used for manufacturing the color filter by the pigment dispersion method generally consists of alkali-soluble resin, a photopolymerizable monomer, a photoinitiator, an epoxy resin, a solvent, other additives, etc.

The pigment dispersion method having the above characteristics is actively applied to manufacture LCDs of mobile phones, notebook computers, monitors, TVs, and the like. However, in recent years, in the resin composition for color filters using a pigment dispersion method having various advantages, not only excellent pattern characteristics but also improved performance are required. That is, in order to achieve the best image quality, there is a need for a color filter resin composition having characteristics of improving response speed and high contrast and having excellent pattern characteristics according to a shortening of an exposure process.

However, the conventional photosensitive resin composition has a problem in that when the liquid crystal passes at a high speed between the alignment layer and the ITO surface having poor surface roughness during vacuum filling at a high exposure dose, there is a problem of damaging the alignment layer to cause domain defects.

Therefore, it is inevitably required to develop a resin composition for color filters that is effective in improving defects of the alignment film by forming a pattern having a low surface roughness and a hard film with a small exposure amount.

The present invention is to overcome the problems of the prior art described above, one object of the present invention is excellent in developability, heat resistance, chemical resistance and electrical properties with a small exposure dose, and improved thickness uniformity, surface roughness and adhesion It is to provide a photosensitive resin composition for color filters that is advantageous for high contrast expression and defect improvement of an alignment layer during high-speed liquid crystal injection.

Another object of the present invention is to provide a color filter manufactured using the composition described above.

One aspect of the present invention for achieving the above object,

(a) 0.5-40 wt% of alkali-soluble resin;

(b) 1 to 30% by weight of the photopolymerizable monomer;

(c) 0.1 to 20 wt% of a photopolymerization initiator;

(d) 5-55 weight percent of pigment;

(e) 0.01 to 10% by weight antioxidant;

(f) 0.01 to 2% by weight of a fluorine or silicone leveling agent; And

(g) It relates to the photosensitive resin composition for color filters containing a residual amount of a solvent.

The composition according to another embodiment of the present invention may optionally further include additives such as dispersants, surfactants, stabilizers and the like.

Another aspect of the present invention for achieving the above object relates to a color filter manufactured using the composition described above.

Hereinafter, the present invention will be described in more detail.

(a) alkali-soluble resin

In the present invention, at least one carboxyl group-containing acrylic resin is used as the alkali-soluble resin, and if necessary, it is preferably used together with the epoxy novolac acrylic carboxylate resin to improve the chemical resistance and curing property of the pattern.

The carboxyl group-containing acrylic resin may be a copolymer of an ethylenically unsaturated monomer having one or more carboxyl groups and other ethylenically unsaturated monomers copolymerizable therewith. At this time, the weight ratio of the carboxyl group-containing ethylenically unsaturated monomer is preferably 5 to 50%, preferably 10 to 40% of the total copolymer.

The molecular weight (Mw) of the carboxyl group-containing acrylic resin is preferably in the range of 3,000 to 150,000, preferably in the range of 5,000 to 50,000, and its acid value is preferably in the range of 20 to 50 mg / KOH.

Although it does not specifically limit as said carboxyl group-containing ethylenically unsaturated monomer, For example, acrylic acid, methacrylic acid, maleic acid, itaconic acid, a fumaric acid, etc. are mentioned, The said carboxyl group-containing acrylic resin is a monomer of at least 1 type. Include.

The other ethylenically unsaturated monomer copolymerizable with the carboxyl group-containing ethylenically unsaturated monomer is not particularly limited either. For example, styrene, α-methyl styrene, vinyltoluene, vinyl benzyl methyl ether, methyl acrylate, methyl meta Acrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-hydroxy ethyl acrylate, 2-hydroxy ethyl methacrylate, 2-hydroxy butyl acrylate, 2-hydroxy Unsaturated carboxylic acid esters such as butyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, phenyl acrylate and phenyl methacrylate; Unsaturated carboxylic acid amino alkyl esters such as 2-amino ethyl acrylate, 2-amino ethyl methacrylate, 2-dimethyl amino ethyl acrylate and 2-dimethyl amino ethyl methacrylate; Carboxylic acid vinyl esters such as vinyl acetate and vinyl benzoate; Unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate; Vinyl cyanide compounds such as acrylonitrile and methacrylonitrile; Unsaturated amides such as acryl amide and methacryl amide. These unsaturated monomers can be used individually or in mixture of 2 or more, respectively.

Specific examples of the carboxyl group-containing acrylic resin composed of such monomers include methacrylic acid / benzyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene copolymer, methacrylic acid / benzyl methacrylate / 2-hydroxy ethyl methacrylate copolymer, methacrylic acid / benzyl methacrylate / styrene / 2-hydroxy ethyl methacrylate copolymer, and the like, but are not necessarily limited thereto.

Moreover, it is preferable that the said epoxy novolak acrylic carboxylate resin has a molecular weight (Mw) of 3,000-30,000, and an acid value is 60-70 mgKOH / g.

In the present invention, the content of the alkali-soluble resin is preferably 0.5 to 40% by weight of the total composition. If the content of the alkali-soluble resin is less than 0.5% by weight may cause a problem that does not develop in the alkaline developer, when the content of more than 40% by weight may cause a phenomenon that the surface roughness is increased due to the lack of crosslinkability.

In addition, when using the said carboxyl group-containing acrylic resin and epoxy novolak acrylic carboxylate resin together, 0.5-20 weight% of carboxyl group-containing acrylic resin and 0.01-20 weight% of epoxy novolak acrylic carboxylate resin in the whole composition. It is preferable to use the content of.

When the content of the epoxy novolac acrylic carboxylate resin is less than 0.01% by weight, the effect of improving the chemical resistance and curing characteristics of the pattern is insignificant, whereas when it exceeds 20% by weight, it may be difficult to form the pattern.

(b) Photopolymerization Monomer

The photopolymerizable monomer used in the composition of the present invention is a monomer generally used in the photosensitive resin composition for color filters, for example ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacryl Rate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentane Pentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene Glycol Dimethacrylate, Propylene Glycol Dimethacrylate, 1,4- Tan diol dimethacrylate, 1,6-hexanediol, but be selected from at least one member selected from methacrylates such as, but are not necessarily limited thereto.

The content of the photopolymerizable monomer is preferably 1 to 30% by weight based on the total resin composition. If the content is less than 1% by weight, it may be difficult to implement the pattern, such as insufficient curing after pattern formation, and the edges of the pattern may not be cleanly formed.If the content is more than 30% by weight, the viscosity of the resin composition may be excessively increased. In addition, there is a concern that the adhesion may not be developed in the alkaline developer due to problems.

(d) Photopolymerization Initiator

The photopolymerization initiator used in the composition of the present invention is a compound capable of initiating the polymerization of the photopolymerizable monomer by the wavelength of visible light, ultraviolet ray, far infrared ray, etc., and is a photopolymerization initiator generally used in the photosensitive resin composition. As said photoinitiator, a triazine type compound, an acetophenone type compound, a benzophenone type, a thioxanthone type compound, a benzoin type compound, an imidazole type compound, a carbazole type compound, a diketone type compound, a sulfonium borate type compound, for example , Diazo-based, biimidazole-based compounds and oxime-based compounds may be selected from one or more, but are not necessarily limited thereto.

It is preferable that content of the said photoinitiator is 0.1-20 weight% with respect to the whole resin composition. If the content is less than 0.1% by weight, due to low sensitivity, the photopolymerization does not occur sufficiently during exposure in the pattern forming process and is not good for the straightness of the pattern, whereas if it exceeds 20% by weight, the sensitivity is so high that the upper end of the pattern surface becomes convex. This may occur, or may cause problems in solubility and storage stability of the solvent, and may cause a problem that the unreacted initiator remaining after photopolymerization lowers the transmittance.

Specific examples of the triazine-based compound in the photopolymerization initiator include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (3 ' , 4'-dimethoxy styryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxy naphthyl) -4,6-bis (trichloromethyl) -s -Triazine, 2- (p-methoxy phenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tril) -4,6-bis (trichloromethyl) -s -Triazine, 2-piphenyl-4,6-bis (trichloro methyl) -s-triazine, bis (trichlorobetayl) -6-styryl-s-triazine, 2- (naphtho 1-yl ) -4,6-bis (trichloro methyl) -s-triazine, 2- (4-methoxy naphtho 1-yl) -4,6-bis (trichloro methyl) -s-triazine, 2- 4-trichloro methyl (piperonyl) -6-triazine, 2-4-trichloro methyl (4'-methoxy styryl) -6-triazine, etc. are mentioned.

In the case of the triazine-based initiator, since the reaction speed with respect to light has a high sensitivity, gas such as a halogen compound may be generated during exposure to contaminate a device such as a mask.

Specific examples of the acetophenone compound of the photopolymerization initiators include 2,2'-diethoxyacetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropionate Rio benzophenone, pt- butyl-trichloro Acetophenone, pt-butyldichloroacetophenone, benzophenone, 4-chloroacetophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzo Phenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethyl And amino-1- (4-morpholinophenyl) -butan-1-one.

Specific examples of the benzophenone compound in the photopolymerization initiator include benzophenone, benzoyl benzoic acid, benzoyl benzoic acid methyl, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis (dimethyl amino) benzo Phenone, 4, 4'-bis (diethyl amino) benzophenone, etc. are mentioned.

Specific examples of the thioxanthone compound in the photopolymerization initiator include thioxanthone, 2-chloro thioxanthone, 2-methyl thioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2, 4-diisopropyl thioxanthone, 2-chloro thioxanthone, etc. are mentioned.

Specific examples of the benzoin-based compound among the photopolymerization initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, and the like.

Specific examples of the imidazole compound in the photopolymerization initiator are 2,2-bis-2-chlorophenyl-4,5,4,5, -tetraphenyl-2-1, 2-biimidazole, 2,2-bis (2,4,6-tricyanophenyl) -4,4,5,5-tetraphenyl-1,2-biimidazole etc. are mentioned.

The photopolymerization initiator according to an embodiment of the present invention may be used in combination with a sensitizer, a curing accelerator (chain transfer agent), etc. as necessary.

Specific examples of the sensitizer include acetophenone of 4-diethyl network, 4-zimethylaminopuropiophenone, benzoate of ethyl-3-dimethyl network and benzo of 2-ethylhexyl-1,4-dimethyl network. Eight, etc., Specific examples of the curing accelerator, 2-mercapto benzo imidazole, 2-mercapto benzo thiazole, 2-mercapto benzo oxazole, 2,5-zimelcaputo-1,3 , 4- cheer diazo-ru, etc. are mentioned.

(d) pigments

Specific examples of the pigment used in the composition of the present invention include phthalocyanine pigments, azo pigments, anthraquinone pigments, indigo pigments, perylene pigments, perinone pigments, dioxazine pigments, quinacridone pigments, isoin Organic pigments, such as a drione pigment and a phthalone pigment, Inorganic pigments, such as carbon black, etc. are mentioned, Any one of these can be used individually, or can mix and use 2 or more types.

The content of the pigment is preferably 5 to 55% by weight based on the total resin composition. If the content is less than 5% by weight, the coloring effect is insignificant, while if the content exceeds 55% by weight there is a problem that the development performance is sharply lowered.

(e) antioxidants

Specific examples of the antioxidant used in the composition of the present invention include 2,2-thio bis (4-methyl-6-t-butyl phenol), 2,6-di-t-butyl phenol, pentaethrityl tetrakis (pentaethrityl tetrakis) [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] and tris- (2,4-di-t-butylphenyl) phosphite; However, it is not necessarily limited thereto.

In the present invention, it is preferable to use an antioxidant represented by the following formula (1).

 [Formula 1]

(m is an integer from 1 to 4, n is an integer from 1 to 20)

The content of the antioxidant is preferably 0.01 to 10% by weight based on the total resin composition, the molecular weight (Mw) is preferably 500 to 1,000. If the content is less than 0.01% by weight, due to the effect of high sensitivity, there is a problem that can cause a change in the exposure process, such as blocking the opening of the substrate by increasing the line width due to the rapid radical chain reaction in the pattern forming process. On the other hand, if the content exceeds 10% by weight, photopolymerization does not occur sufficiently during exposure, and may cause problems such as poor pattern straightness.

(f) fluorine or silicone Leveling agent

The leveling agent used in the composition of the present invention preferably uses a fluorine-based or silicone-based surfactant as an additive so that the pigment component is uniformly dispersed in the solvent and excellent in leveling property.

In particular, the fluorine-based surfactant is an additive suitable for the slit coating process because it not only improves the electrical properties, but also has excellent leveling properties and low bubble generation at a high speed during coating, so that film defects are small. In addition, it has excellent surface tension resistance and a good effect even in small amounts compared to silicone surfactants, and also has excellent reactivity with organic solvents.

Examples of the fluorine-based surfactants include polyether co-modified silicones, and specifically, 3M's FC-430, F-475 and the like can be used. These may be used alone, or may be used by mixing two or more kinds. In addition, examples of the silicone-based surfactants include dimethylpolysiloxane and polyoxyalkylene thymethylene polysiloxane in which polyether is modified.

It is preferable that the addition amount of the said fluorine-type or silicone type leveling agent is 0.01-2 weight% with respect to the whole resin composition.

(g) solvent

The solvent used in the composition of the present invention can be used without limitation to the general solvent used in the photosensitive resin composition, specific examples thereof, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, propylene glycol methyl ether, ethyl Lactate, polyethylene glycol, cyclohexanone, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, and the like. One type may be used alone or two or more types may be mixed and used.

The amount of the solvent may be used in the remaining amount except the amount of the above components in the total resin composition, it is preferably 20 to 70% by weight based on the total resin composition so that the resin liquid has a viscosity that can be applied to the substrate. . When the amount of the solvent used is too small, application of the resin composition itself is difficult, and in many cases, it is difficult to maintain flatness in a film having a thickness of 3 µm or more.

In addition, the present invention may further include an epoxy compound, if necessary, for preventing the tearing of the pattern and improving the chemical resistance.

Examples of the epoxy compounds include phenol novolac epoxy resins, tetramethyl bi-phenyl epoxy resins, bisphenol A epoxy resins, cycloaliphatic epoxy resins, ortho-cresol noblock resins, and the like. desirable.

In the present invention, the amount of the epoxy compound added is preferably 0.01 to 10% by weight of the total composition. If the amount is less than 0.01% by weight, the effect of the effect according to the addition is insignificant, if it exceeds 10% by weight there may be a problem in storage and process margins.

The resin composition according to an embodiment of the present invention may further add a silane coupling agent to promote adhesion to the organic substrate. Specific examples of the silane coupling agent include vinyl trimethoxy silane, vinyl tris (2-methoxy ethoxy silane), 3-glycidoxy propyl trimethoxy silane, 2- (3,4-epoxy cyclohexyl) Ethyl trimethoxy silane, 3-chloro propyl methyl dimethoxy silane, 3-chloro propyl trimethoxy silane, 3-methacryloxy propyl trimethoxy silane, 3-mercapto propyl trimethoxy silane and the like.

It is preferable that the addition amount of the said silane coupling agent is 0.01-2 weight% with respect to the whole resin composition. When the amount added is less than 0.01% by weight, there is a problem in that the adhesion to the required glass adhesion is inferior, and when the amount exceeds 2% by weight, there is a problem in that the storage stability and coating property of the composition are inferior.

Another aspect of the invention relates to a color filter made using the composition described above.

In order to manufacture the color filter according to an embodiment of the present invention, first, by using a method such as spin coating, roller coating, spray coating, screen coating, etc. on the glass substrate for the color filter the photosensitive resin composition according to the present invention For example, it apply | coats in thickness of 0.5-5 micrometers. Next, the apply | coated photosensitive coloring composition dries a solvent in 50-110 degreeC and the conditions of 1 to 10 minutes generally with a hot air oven or a hotplate. Active lines are irradiated to the said photosensitive resin layer using the pattern mask which has a predetermined pattern. As a light source used for irradiation, UV ray of 190-450 nm, Preferably 200-400 nm area | region is irradiated, for example, electron beam and X-ray irradiation are also suitable. In general, since ultraviolet rays passing through the photo mask are generally 300 nm or more light, light having wavelengths called i-ray (365 nm), h-ray (405 nm), and g-ray (436 nm) in the bright spectrum of ultra-high pressure mercury lamp is used for polymerization or crosslinking reaction. Used. Therefore, in the photosensitive coloring composition for color filters, the sensitivity with respect to the three bright spectrums is important. After the irradiation as described above, when the coating layer is treated with an alkaline developer, the unilluminated portion of the coating layer is dissolved and a pattern necessary for the color filter is formed. The substrate obtained as described above is subjected to postbaking for about 20 to 50 minutes at 160 to 300 ° C to obtain a pixel layer. By repeating this process in accordance with the required number of colors, a color filter having a desired pattern can be obtained.

Further, in the above process, crack resistance, solvent resistance, and the like can be further improved by heating the image pattern obtained by development again or curing by active ray irradiation or the like.

Hereinafter, the present invention will be further embodied by the following examples, but the following examples are for the purpose of explanation only, and are not intended to limit or limit the scope of the present invention.

Example  One

Using an antioxidant represented by the following formula (2), using the components of the composition shown in Table 1 to prepare a photosensitive resin composition as follows.

[Formula 2]

That is, after dissolving the photopolymerization initiator, the epoxy compound and the antioxidant in a solvent, the mixture was stirred at room temperature for 2 hours. Subsequently, the carboxyl group-containing acrylic resin, dipentaerythritol triacrylate monomer and epoxy novolac acrylic carboxylate resin were added and stirred at room temperature for 2 hours. After adding the pigment to it, it was stirred at room temperature for 1 hour. The leveling and coupling agents were then added and stirred at room temperature for 1 hour. The solution was filtered three times to remove impurities.

Example  2

A photosensitive resin composition was prepared in the same manner as in Example 1, except that 10 g of (A ′) CGI-124 alone was used as the photopolymerization initiator.

Example  3

A photosensitive resin composition was prepared in the same manner as in Example 1, except that 6 g of antioxidant and 2 g of (A ′) CGI-124 were used as the photopolymerization initiator.

Comparative Example 1

A photosensitive resin composition was prepared in the same manner as in Example 1, except that 33 g of a solvent was used without adding an antioxidant.

Comparative Example 2

A photosensitive resin composition was prepared in the same manner as in Example 1, except that 36 g of a solvent was used without adding an antioxidant and a fluorine-based leveling agent.

Pattern physical properties evaluation, electrical property evaluation, contrast evaluation and surface roughness evaluation of the photosensitive resin compositions prepared from Examples 1 to 3 and Comparative Examples 1 and 2 were performed as follows, and the results are shown in Tables 2 to 5 below. .

[Pattern Property Evaluation]

The resin composition was apply | coated in the thickness of 1-2 micrometers on the glass substrate of thickness 1mm degreasing-washed, and it dried on the hotplate at constant temperature (80 degreeC), and fixed time (150 second), and obtained the coating film. Subsequently, a photomask was placed on the coating film and exposed using a high pressure mercury lamp having a wavelength of 365 nm, followed by a development-wash-drying process for about 150 seconds at 30 ° C. and atmospheric pressure using a 1.33% KOH-based aqueous solution. . After the said process, the post-baking process was performed in constant temperature (235 degreeC) and fixed time (25 minutes) in a hot air circulation drying oven. Subsequently, after obtaining a pattern, it was observed in a contact pattern meter and an optical microscope to evaluate the pattern properties, and is shown in Table 2 below.

- Evaluation standard

(Circle): When the line width and straightness of a pattern are favorable within exposure amount 30-80mj / cm <2>.

(Triangle | delta): When the line width and straightness of a pattern are favorable within exposure amount 80-130mj / cm <2>.

X: Good line width and straightness of the pattern at an exposure dose of 130mj / cm 2 or more

[Electrical characteristic evaluation]

The resin composition was apply | coated to the thickness with respect to the target color value using the glass substrate used as the ITO pattern, and it dried on the hotplate, and obtained the coating film. Subsequently, a photomask for a voltage holding ratio (VHR) was placed on the coating film and exposed using a high-pressure mercury lamp having a wavelength of 365 nm, followed by development for about 150 seconds at 30 ° C. and atmospheric pressure using a 1.33% KOH-based aqueous solution. A washing-drying process was performed. After the above process, the post-baking process is performed at a constant temperature (235 ° C.) and a predetermined time (25 minutes) in a hot air circulation drying oven, and a bead for maintaining cell gaps of a predetermined size is placed in a sealant capable of adhering both substrates. Adhesion is performed. Subsequently, after inserting a high-speed liquid crystal, a wire was attached to the ITO pattern to prepare and evaluate a cell for measuring VHR, as shown in Table 3 below.

- Evaluation standard

○: Excellent electrical property-VHR 60 ~ 100%

△: Good electrical property-VHR 30 ~ 60%

×: Poor electrical property-VHR 0 ~ 30%

[ Contrast  evaluation]

The resin composition was coated on a glass substrate having a thickness of 1 mm degreased under coating conditions for a target color value, and dried on a hot plate at a constant temperature (80 ° C.) for a predetermined time (150 seconds) to obtain a coating film. Subsequently, using a high pressure mercury lamp having a wavelength of 365 nm on the coating film, the entire exposure was performed at a constant exposure amount (80mj / cm 2), followed by a post-baking process at a constant temperature (235 ° C.) and a fixed time (25 minutes) in a hot air circulation drying oven. Was performed. Subsequently, after obtaining a colored coating film, it evaluated by the contrast ratio measuring instrument, and the result is shown in following Table 4.

- Evaluation standard

○: Excellent contrast-1000 ~ 1200

△: Good contrast-800 to 1000

×: Contrast defect-800 or less

[Evaluation of surface roughness (roughness)]

The resin composition was apply | coated in the thickness of 1-2 micrometers on the glass substrate of thickness 1mm degreasing-washed, and it dried on the hotplate at constant temperature (80 degreeC), and fixed time (150 second), and obtained the coating film. Subsequently, a photomask was placed on the coating film and exposed using a high pressure mercury lamp having a wavelength of 365 nm, followed by a development-wash-drying process for about 150 seconds at 30 ° C. and atmospheric pressure using a 1.33% KOH-based aqueous solution. . After the above process, the drying process was performed in a hot air circulation oven at a constant temperature (235 ° C.) and for a predetermined time (25 minutes), and impurities remaining in the substrate were removed through a UV-ashing process in a learned pattern. Subsequently, the roughness of the pattern was evaluated by atomic force microscope (AFM, Atomic Force Microscope), and the results are shown in Table 5 below.

- Evaluation standard

○: Excellent surface roughness-2 ~ 6 nm

△ good surface roughness-6 to 10 nm

×: surface roughness defect-10 nm or more

As can be seen from Tables 2 to 5, Examples 1 to 3 of the photosensitive resin composition according to the present invention have excellent properties in surface roughness (roughness) by using an antioxidant as compared to Comparative Examples 1 to 2 In addition, it can be seen that the effect is excellent also in the uniformity and electrical properties of the pattern by using a fluorine-based surfactant.

Although the preferred embodiments have been described above, the present invention can be variously modified without departing from the scope of protection of the present invention, which should be construed as being included in the protection scope of the present invention. .

As described in detail above, the photosensitive resin composition for color filters of the present invention is excellent in developability, heat resistance, chemical resistance, and electrical properties with a small exposure amount, and improves thickness uniformity, surface roughness and adhesion, resulting in high contrast expression and high speed. It is possible to provide a color filter that is advantageous for improving defects of the alignment layer during the liquid crystal injection.

Claims (7)

(a) 0.5-40 wt% of alkali-soluble resin; (b) 1 to 30% by weight of the photopolymerizable monomer; (c) 0.1 to 20 wt% of a photopolymerization initiator; (d) 5-55 weight percent of pigment; (e) 0.01 to 10% by weight antioxidant; (f) 0.01 to 2% by weight of a fluorine or silicone leveling agent; And (g) Photosensitive resin composition for color filters containing a residual amount of solvent. According to claim 1, wherein the alkali-soluble resin is 0.5 to 20% by weight of the carboxyl group-containing acrylic resin and epoxy novolac acrylic carboxylate resin relative to the total composition 0.01-20 weight%, The photosensitive resin composition for color filters characterized by the above-mentioned. The method of claim 1, wherein the antioxidant is pentaethrithyl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] and tris- (2,4-di- At least one selected from the group consisting of a blend with t-butylphenyl) phosphite, the photosensitive resin composition for color filters. The photosensitive resin composition for color filters according to claim 1, wherein the antioxidant is represented by the following Chemical Formula 1. [Formula 1]

(m is an integer from 1 to 4, n is an integer from 1 to 20) The method of claim 1, wherein the resin composition comprises at least one epoxy compound selected from phenol novolac epoxy resin, tetra methyl bi-phenyl epoxy resin, bisphenol A epoxy resin, cycloaliphatic epoxy resin or ortho-cresol noblel resin. 0.01 to 10% by weight further comprising the photosensitive resin composition for color filters. The photosensitive resin composition for color filters according to claim 1, wherein the resin composition further comprises 0.01 to 2 parts by weight of a silane coupling agent based on the total resin composition. The color filter manufactured using the resin composition of any one of Claims 1-6.