KR20080042317A - Plating fixing solution - Google Patents

Plating fixing solution Download PDF

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KR20080042317A
KR20080042317A KR1020060110568A KR20060110568A KR20080042317A KR 20080042317 A KR20080042317 A KR 20080042317A KR 1020060110568 A KR1020060110568 A KR 1020060110568A KR 20060110568 A KR20060110568 A KR 20060110568A KR 20080042317 A KR20080042317 A KR 20080042317A
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plating
composition
fixing ink
metal
present
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KR1020060110568A
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Korean (ko)
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KR100830970B1 (en
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이복행
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주식회사 갤트로닉스 코리아
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)

Abstract

A fixing ink for plating is provided to facilitate plating performed between heterogeneous materials, for example metallic plating on a plastic substrate, thereby improving the productivity, workability and cost-efficiency. A fixing ink for plating is obtained by introducing 250 g of a first composition containing 65 wt% of an acryl styrene resin, 5 wt% of a curing agent, 5 wt% of styrene rubber and 25 wt% of butadiene rubber in portions into 1 liter of a second composition containing 40% of methyl ethyl ketone, 10% of butyl acetate, 10% of ethyl cellosolve and 40% of cellosolve acetate, followed by melting and agitating for 2-3 hours. A dye with a desired color is optionally added during the melting and agitating step.

Description

도금정착잉크{PLATING FIXING SOLUTION}PLATING FIXING SOLUTION

도 1은 본 발명인 도금정착잉크가 기판에 도포되는 것을 나타낸 개략도이다.1 is a schematic view showing that the plating fixing ink of the present invention is applied to a substrate.

도 2는 본 발명인 도금정착잉크가 도포된 기판에 금속 도금액이 도포되는 것을 나타낸 개략도이다.Figure 2 is a schematic diagram showing that the metal plating solution is applied to the substrate to which the plating fixing ink of the present invention is applied.

도 3은 본 발명인 도금정착잉크에 의해 금속 도금액이 도금된 기판을 나타낸 평면도이다.3 is a plan view showing a substrate on which a metal plating solution is plated by the plating fixing ink of the present invention.

〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>

10 : 도금정착잉크10: Plating Fixing Ink

20 : 기판20: substrate

30 : 금속 도금액30: metal plating solution

본 발명은 플라스틱과 금속재질의 서로 다른 이질(異質)의 재질을 도금할 때 원하는 부분에 도금이 가능하도록 한 도금정착잉크에 관한 것으로서, 더욱 상세하게는 플라스틱 기판의 일면에 금속도금을 하여 금속대체효과를 얻고자 할 경우, 도금정착액을 도포하여 플라스틱기판 전체에 금속도금이 이루어지지 않고 원하는 부 분에만 도금이 이루어지도록 함으로써 생산단가의 절감은 물론, 생산성향상과 함께 작업효율성이 향상되도록 한 도금정착잉크에 관한 것이다.The present invention relates to a plating fixing ink which enables plating on a desired portion when plating different materials of plastic and metal, and more particularly, metal replacement on one surface of a plastic substrate. In order to achieve the effect, plating plating solution is applied so that metal plating is not performed on the entire plastic substrate and plating is performed only on desired parts, thereby reducing production cost and improving productivity and improving work efficiency. Relates to ink.

일반적으로 도금은 크게 나누어 전기도금, 화학도금, 용융도금 등이 있으며, 이중 화학도금은 전기가 통하지 않는 제품을 화학도금액에 넣어 도금하는 것이며, 용융도금은 용융된 금속 중에 물체를 일정시간 침지(浸漬)한 뒤 끌어올려 부착된 용융금속을 물체 표면에서 응고시킴으로써 금속피막층을 얻는 방법이며, 철강의 방식용(防蝕用)으로 용융아연도금, 용융알루미늄도금, 용융주석도금, 용융납도금 등에 이용되고 있다.Generally, plating is divided into electroplating, chemical plating, and hot-dip galvanizing. Double chemical plating is to plating non-conductive products into chemical plating solution, and hot dip plating is to immerse objects in molten metal for a certain time ( 방법) A method of obtaining a metal coating layer by solidifying the molten metal attached to it after lifting it up from the surface of an object. have.

또한, 전기도금은 전해 용액 중에 물건을 음극으로서 통전하여 표면에 도금금속을 부착시키는 것으로, 장식 또는 방녹 기능 등 다양한 목적으로 행해지며, 비교적 염가일 뿐 아니라 적절한 금속피막을 부여할 수 있기 때문에, 자동차와 음향, 항공기, 통신기, 컴퓨터 부품, 장신구, 건축자재 등 많은 용도의 부품을 도금하고 있다.In addition, electroplating is for attaching a plated metal to the surface by energizing an object as a cathode in an electrolytic solution, and is performed for various purposes such as decoration or antirust function, and is relatively inexpensive and can provide an appropriate metal film. They also plate parts for many uses, including acoustics, aircraft, telecommunications, computer parts, jewelry, and building materials.

이러한 전기도금은 다종의 소량품까지 가공할 수 있으며, 다채로운 금속의 질감을 부여할 수 있고, 고가의 금속에 뛰어난 특성과 양호한 밀착성을 가진 피막을 얻을 수 있는 장점이 있다.This electroplating can be processed up to a small amount of a variety of products, it is possible to give the texture of a variety of metals, there is an advantage that can obtain a film having excellent properties and good adhesion to expensive metals.

이외에도, 프라즈마원리를 이용한 도금, 이온증착, 습식, 건식 등의 다양한 방식으로 도금이 행해지고 있다.In addition, plating is performed by various methods, such as plating using a plasma principle, ion deposition, wet, and dry.

이러한 도금방식은, 플라스틱기판에 도금작업을 행함으로써, 금속대체효과를 얻을 수 있음은 물론, 전자파 차폐기능, 전자회로, 자동차 부품, 인쇄회로기판 등 다양한 산업분야에 적용되고 있다.This plating method is applied to various industrial fields such as electromagnetic shielding, electronic circuits, automobile parts, printed circuit boards as well as to obtain a metal replacement effect by performing a plating operation on the plastic substrate.

예를 들어, 현대사회의 필수적인 휴대폰과 같은 통신기기에 사용되는 안테나의 경우, 이중사출방식에 의해 안테나 몸체를 성형한 후 성형된 안테나 몸체에 도금을 하거나 또는 보다 수신률을 증가시키기 위해 별도의 금속부품을 제작하여 안테나 몸체에 부착하여 안테나로 사용하고 있다.For example, in the case of an antenna used in a communication device such as an essential mobile phone of the modern society, the antenna body is molded by the double injection method, and then the formed antenna body is plated or a separate metal part to increase the reception rate. It is manufactured and attached to the antenna body and used as an antenna.

즉, 이중사출방식에 의해 얻어진 플라스틱 재질의 안테나 몸체에 금속재질의 도금을 행함으로써 전기적인 접지나 신호 감지 등을 수행할 수 있도록 하고 있을 뿐만 아니라, 전자파 차단과 같은 효과를 얻을 수 있도록 하고 있다.That is, by plating the metal material on the antenna body of the plastic material obtained by the double injection method, it is possible not only to perform electrical grounding or signal sensing, but also to obtain effects such as electromagnetic wave blocking.

그러나, 종래 서로 다른 이질의 재질을 용착하여 도금하는 방법은, 대개 플라스틱 제품에 알루미늄과 같은 금속판을 압착시키는 방법에 의해 기판이나 또는 기타의 금속대체물질로 사용하고 있음에 따라, 원하지 않는 부분까지고 금속판을 압착하여 도금함으로써 원가 절감효과를 기대할 수 없는 문제점이 있다.However, the conventional method of welding and plating different heterogeneous materials is usually used as a substrate or other metal substitute material by pressing a metal plate such as aluminum on a plastic product. There is a problem in that cost reduction effect can not be expected by pressing and plating.

더욱이, 서로 다른 이질의 재질 즉, 플라스틱과 같은 합성수지판에 알루미늄과 같은 금속재질을 압착하여 도금하는 방법이 쉽지 않기 때문에, 다양한 종류의 압착장치가 사용되고, 또한 도금방법의 어려워 생산성 및 작업효율성이 크게 저하되는 문제점이 있다.Moreover, since it is not easy to press and plate a different material, that is, a metal material such as aluminum on a synthetic resin plate such as plastic, various kinds of pressing apparatuses are used, and the plating method is difficult, which greatly increases productivity and work efficiency. There is a problem of deterioration.

본 발명은 종래 서로 다른 재질에 도금을 함에 있어 야기되는 문제점을 해결하기 위해 안출된 것으로, 100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무수지5％, 부타디엔고무수지 25％ 를 혼합한 제1조성물과메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물을 적절하게 교반 용융하여 얻어진 정착잉크를, 플라스틱 기판의 도금을 하고자 하는 부분에 먼저 도포하고, 상기 정착잉크가 도포된 부분에 다시 금속재질의 도금액을 도포함으로써, 이질(異質) 재질간의 도금이 원활하게 이루어지도록 할 뿐만 아니라, 원가절감을 유도하고 간단한 인쇄방식에 의해 도금작업이 이루어짐에 따라 생산성 및 작업효율성이 크게 향상될 수 있도록 한 도금정착잉크를 제공함에 그 목적이 있다.The present invention has been made to solve the problems caused by plating the different materials in the prior art, a mixture of 65% acrylic styrene resin, 5% hardener, 5% styrene rubber resin, 25% butadiene rubber resin to 100% by weight The fixing ink obtained by appropriately stirring and melting the first composition and the second composition obtained by mixing 40% of methyl ethyl cattone, 10% of methyl acetate, 10% of ethyl cell solution, and 40% of cellulsolve acetate, is intended to plate the plastic substrate. By first applying to the part, and then applying a plating liquid of a metal material to the part where the fixing ink is applied, not only makes plating between different materials smooth, but also leads to cost reduction and plating by a simple printing method. The purpose of the present invention is to provide a plating fixing ink that can greatly improve productivity and work efficiency as the work is performed.

상기 목적을 이루기 위한 수단으로 본 발명인 도금정착잉크는, 100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무수지5％, 부타디엔고무수지 25％ 를 혼합한 제1조성물과; 메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물과; 상기 제2조성물 1리터에 제1조성물 250 그램을 조금씩 넣어 2-3시간 교반 용융하여 얻어지는 것을 특징으로 한다.As a means for achieving the above object, the plating fixing ink of the present invention comprises: a first composition containing 65% of an acrylic styrene resin, 5% of a curing agent, 5% of a styrene rubber resin, and 25% of butadiene rubber resin; 2nd composition which mixed 40% of methyl ethyl ketone, 10% of benzyl acetate, 10% of ethyl celusolve, and 40% of cellulsolve acetate; 250 g of the first composition is added little by little to one liter of the second composition, followed by stirring for 2-3 hours.

또한, 상기 제1조성물과 제2조성물의 교반 용융시에 사용자가 원하는 색상의 염료가 더 첨가될 수 있다.In addition, a dye of a user's desired color may be further added during stirring and melting of the first and second compositions.

상기와 같은 특징으로 이루어진 본 발명인 도금정착잉크는, 100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무수지5％, 부타디엔고무수지 25％ 를 혼합한 제1조성물과메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물을 적절하게 교반 용융하여 얻 어진 정착잉크를, 플라스틱 기판의 도금을 하고자 하는 부분에 먼저 도포하고, 상기 정착잉크가 도포된 부분에 다시 금속재질의 도금액을 도포함으로써, 이질(異質) 재질간의 도금이 원활하게 이루어지도록 할 뿐만 아니라, 원가절감을 유도하고 간단한 인쇄방식에 의해 도금작업이 이루어짐에 따라 생산성 및 작업효율성이 크게 향상될 수 있는 효과를 얻을 수 있다.The plating fixing ink of the present invention having the above-mentioned characteristics comprises a first composition and 40% of methyl ethyl katone mixed with 65% of acrylic styrene resin, 5% of hardener, 5% of styrene rubber resin, and 25% of butadiene rubber with respect to 100 weight, A fixing ink obtained by appropriately stirring and melting a second composition obtained by mixing 10% of methyl acetate, 10% of ethyl cell solution, and 40% of cellulsolve acetate is first applied to a portion to be plated of a plastic substrate, and then the fixing ink Application of the plating liquid of metal material on the coated part again enables not only smooth plating between dissimilar materials, but also leads to cost reduction and simple printing method for plating and productivity and work efficiency. This effect can be greatly improved.

본 발명의 특징 및 이점들은 첨부도면에 의거한 다음의 상세한 설명으로 더욱 명백해질 것이며, 본 명세서 및 청구범위에 사용된 용어나 단어는 발명자가 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings, and the terminology or words used in the specification and claims are used to explain the invention in its best way. Based on the principle that the concept of can be properly defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

도 1은 본 발명인 도금정착잉크가 기판에 도포되는 것을 나타낸 개략도이고, 도 2는 본 발명인 도금정착잉크가 도포된 기판에 금속 도금액이 도포되는 것을 나타낸 개략도이며, 도 3은 본 발명인 도금정착잉크에 의해 금속 도금액이 도금된 기판을 나타낸 평면도이다.1 is a schematic view showing that the plating fixing ink of the present invention is applied to a substrate, FIG. 2 is a schematic view showing a metal plating solution applied to a substrate to which the plating fixing ink of the present invention is applied, and FIG. 3 is a plating fixing ink of the present invention. It is a top view which shows the board | substrate with which the metal plating liquid was plated.

도시된 바와 같이 본 발명인 도금정착잉크는, 서로 다른 재질을 갖는 이질(異質)간의 도금이 쉽고 용이하게 이루어지도록 하기 위한 것으로, 100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무 5％, 부타디엔고무 25％ 를 혼합한 제1조성물과, 메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물과, 상기 제2조성물 1리터에 제1조성물 250 그램을 조금씩 넣어 2-3시간 교반 용융하여 형성된다.As shown in the present invention, the plating fixing ink of the present invention is for easily and easily plating between dissimilar materials having different materials, and is 65% acrylic styrene resin, 5% hardener, 5% styrene rubber, and 100% by weight. 1st composition which mixed 25% of butadiene rubber, the 2nd composition which mixed 40% of methyl ethyl ketone, 10% of beryl acetate, 10% of ethylcellulose, and 40% of cellulose acetate, and 1 liter of said 2nd compositions 250 grams of one composition is added in small portions to form 2-3 hours of stirring and melting.

또한, 상기 제1조성물과 제2조성물의 교반 용융시에 사용자가 원하는 색상의 염료가 더 첨가된다.In addition, during the stirring and melting of the first composition and the second composition, a dye having a desired color is further added.

이와 같이 형성된 도금정착잉크(10)를 이용하여 기판(20)에 금속 도금액(30)을 도금하는 방법을 설명한다.A method of plating the metal plating solution 30 on the substrate 20 by using the plating fixing ink 10 thus formed will be described.

먼저, 도 1에 도시된 바와 같이 금속 도금을 하고자 하는 기판(20)의 도금을 원하는 부분에 본 발명인 도금정착잉크(10)를 도포한다.First, as shown in FIG. 1, the plating fixing ink 10 of the present invention is applied to a desired portion of the substrate 20 to be plated with metal.

상기 기판(20)에 도금정착잉크(10)를 도포하는 방법은, 프로그램된 인쇄방식에 의해 자동적으로 도포하는 것으로, 이미 사용되고 있는 습식도금방식을 적용한다.In the method of applying the plating fixing ink 10 to the substrate 20, the coating method is applied automatically by a programmed printing method, and a wet plating method that is already used is applied.

이와 같이 기판(20)에 도금정착잉크(10)를 인쇄방식에 의해 도포한 다음, 도포된 도금정착잉크(10)의 상면에 다시 도금하고자 하는 금속 도금액(30)을 인쇄방식에 의해 자동적으로 도포하여 도금한다.In this way, the plating fixing ink 10 is applied to the substrate 20 by the printing method, and then the metal plating solution 30 to be plated on the upper surface of the applied plating fixing ink 10 is automatically applied by the printing method. By plating.

이 때, 상기 기판(20)에 도포된 도금정착잉크(10)의 상면에만 금속 도금액(30)이 도포되어 도금되고, 도금정착잉크(10)가 도포되지 않은 기판(20)에는 서로 다른 재질의 이질성(異質性)에 의해 도금이 이루어지지 않는다.At this time, the metal plating solution 30 is coated and plated only on the upper surface of the plating fixing ink 10 applied to the substrate 20, and the substrate 20 on which the plating fixing ink 10 is not coated is made of different materials. Plating is not performed due to heterogeneity.

따라서, 본 발명인 도금정착잉크(10)에 의해 원하고자 하는 부분에만 도금이 이루어짐으로써, 금속 도금액의 원가절감을 유도할 수 있다.Therefore, plating is performed only on the desired portion by the plating fixing ink 10 according to the present invention, thereby reducing the cost of the metal plating solution.

또한, 간단한 인쇄방식에 의해 자동적으로 도금이 이루어짐에 따라 작업효율성은 물론 생산성이 크게 향상된다.In addition, as the plating is automatically performed by a simple printing method, productivity and productivity are greatly improved.

본 발명인 도금정착잉크(10)의 조성물 중 하나인 상기 아크릴 스틸렌 수지 (acrylic stylene resin)는, 도금 후에 금속액을 잡아주는 역할을 하는 것이고, 경화제는 도금 후 도금정착잉크가 깨지는 현상을 방지한다.The acrylic styrene resin (acrylic stylene resin), which is one of the compositions of the plating fixing ink 10 of the present invention, serves to hold a metal liquid after plating, and a curing agent prevents the plating fixing ink from breaking after plating.

이외에 본 발명인 도금정착잉크(10)의 제1조성물과 제2조성물에 적용되는 각각의 조성물들의 특성은 이미 널리 알려진 바 있는 것으로 이에 대한 구체적인 설명은 생략한다.In addition, the properties of the respective compositions applied to the first composition and the second composition of the plating fixing ink 10 of the present invention is already well known and a detailed description thereof will be omitted.

본 발명인 도금정착잉크는, 도시하고 설명한 것 이외에도 다양하게 변형실시가 가능한 것으로 본 발명의 목적범위를 일탈하지 않는 한, 변형되는 실시예들은 모두 본 발명의 권리범위에 포함되어 해석되어야 한다.As the present invention, the plating fixing ink is capable of various modifications in addition to those shown and described, unless the embodiments depart from the scope of the present invention, all the modified embodiments should be interpreted as being included in the scope of the present invention.

상술한 바와 같이 본 발명인 도금정착잉크는, 100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무5％, 부타디엔고무 25％ 를 혼합한 제1조성물과메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물을 적절하게 교반 용융하여 얻어진 정착잉크를, 플라스틱 기판의 도금을 하고자 하는 부분에 먼저 도포하고, 상기 정착잉크가 도포된 부분에 다시 금속재질의 도금액을 도포함으로써, 이질(異質) 재질간의 도금이 원활하게 이루어지도록 할 뿐만 아니라, 원가절감을 유도하고 간단한 인쇄방식에 의해 도금작업이 이루어짐에 따라 생산성 및 작업효율성이 크게 향상될 수 있는 효과를 얻을 수 있다.As described above, the plating fixing ink of the present invention comprises a first composition obtained by mixing 65% of acrylic styrene resin, 5% of hardener, 5% of styrene rubber, and 25% of butadiene rubber with respect to 100% by weight, methyl ethyl katone 40%, and 10% of methyl acetate. , A fixing ink obtained by appropriately stirring and melting a second composition containing 10% ethyl cell solution and 40% cell solution solution, is first applied to a part to be plated with a plastic substrate, and then to the part to which the fixing ink is applied. By coating the plating liquid of the metal material again, the plating between the different materials can be smoothly performed, as well as the cost reduction and the simple printing method, the plating can be performed, thereby greatly improving productivity and work efficiency. You can get the effect.

Claims (2)

100 중량 대비 아크릴 스틸렌 수지 65％, 경화제 5％, 스틸렌 고무 5％, 부타디엔고무 25％ 를 혼합한 제1조성물과;1st composition which mixed 65% of acrylic styrene resin, 5% of hardening agents, 5% of styrene rubber, and 25% of butadiene rubber with respect to 100 weight; 메틸에틸캐톤 40％, 브틸아세테이트 10％, 에틸셀루솔브 10％, 셀루솔브아세테이트 40％ 를 혼합한 제2조성물과;2nd composition which mixed 40% of methyl ethyl ketone, 10% of benzyl acetate, 10% of ethyl celusolve, and 40% of cellulsolve acetate; 상기 제2조성물 1리터에 제1조성물 250 그램을 조금씩 넣어 2-3시간 교반 용융하여 형성되는 것을 특징으로 하는 도금정착잉크.Plating fixing ink, characterized in that the first composition to 250 grams of the first composition little by little to 2-3 hours of stirring melt formed. 제 1항에 있어서,The method of claim 1, 상기 제1조성물과 제2조성물의 교반 용융시에 사용자가 원하는 색상의 염료가 더 첨가되는 것을 특징으로 하는 도금정착잉크.Plating fixing ink, characterized in that the dye of the user's desired color is further added during stirring melting of the first composition and the second composition.
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