KR20080041414A - Disk of pad conditioner and method for manufacturing the disk, and chemical mechanical polishing apparatus and method with the pad conditioner - Google Patents

Abstract

A disk of a pad conditioner is provided to uniformly polish a substrate by increasing the contact ratio of a disk of a pad conditioner with a polishing pad during a polishing process. A disk(110) included in a pad conditioner of a CMP apparatus has a lower surface that comes in contact with a polishing pad during a polishing process. The lower surface has a shape with a different height in a manner that has a different contact degree according to the region of the polishing pad. The lower surface is tilted upward or downward as it goes away from the center of the lower surface.

Description

DISC OF PAD CONDITIONER AND METHOD FOR MANUFACTURING THE DISK, AND CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD WITH THE PAD CONDITIONER}

1 is a block diagram of a chemical mechanical polishing apparatus according to the present invention.

FIG. 2 is a block diagram of the pad conditioner shown in FIG. 1.

3 is a block diagram of a pad conditioner according to another embodiment of the present invention.

4 is a block diagram of a pad conditioner according to another embodiment of the present invention.

5A and 5B are diagrams for explaining the disk manufacturing method according to the present invention.

6 is a perspective view of a cover according to another embodiment of the present invention.

7 is a perspective view of a cover according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

1: chemical mechanical polishing apparatus 100: pad conditioner

10: polishing station 110: disk

12: platen 120: drive member

14: drive unit 200: plating treatment unit

16 slurry supply member 210 housing

20: head assembly 220: cover

22: polishing head

24: drive shaft

The present invention relates to a disk of a pad conditioner, a method of making the disk, and a chemical mechanical polishing apparatus and method including the pad conditioner.

In recent years, the structure of semiconductor devices has been multilayered with high integration. Accordingly, during the manufacturing process of the semiconductor device, a polishing process for planarizing each layer of the semiconductor wafer is essentially performed. A chemical mechanical polishing (CMP) device for simultaneously performing chemical and mechanical polishing of a wafer for performing the above polishing process is widely used.

Common chemical mechanical polishing devices include platens, polishing heads, pad conditioners, and slurry supply members. The platen is a rotatable table, and a polishing pad is attached to the upper surface of the platen. The polishing head mounts the wafer so that the processing surface of the wafer faces downward during the process, and presses and rotates the wafer on the polishing surface of the polishing pad. In this case, the slurry supply member injects a slurry for chemical polishing of the wafer onto the surface of the polishing pad. The pad conditioner performs pad conditioning of the polishing pad. Pad conditioning is a process of restoring the roughness of the surface of the polishing pad to maintain the profile of the polishing pad in a steady state. The pad conditioner has at least one disk. The disk contacts the polishing surface of the polishing pad during the polishing process to scrape off the polishing pad surface to restore the roughness of the polishing pad.

However, the chemical mechanical polishing apparatus having the above-described structure is difficult to obtain uniform flatness of the wafer processing surface during the polishing process. That is, due to the limitation of pad conditioning during the polishing process, the profile of the surface of the polishing pad cannot be restored normally, resulting in unevenness of the wafer processing surface. The limitation of such pad conditioning is that the disk of the pad conditioner is in contact with the polishing pad, so that when the conditioning is performed, the front surface of the disk is not uniformly in contact with the polishing pad. In this case, the pad conditioning efficiency of the disk is lowered because it is not completely in contact with the.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a disk of a pad conditioner that performs uniform polishing of a substrate, a method of manufacturing the disk, and a chemical mechanical polishing apparatus and method including the pad conditioner. .

It is also an object of the present invention to provide a disk of a pad conditioner for improving the pad conditioning efficiency of the pad conditioner during the polishing process, a method of manufacturing the disk, and a chemical mechanical polishing apparatus and method including the pad conditioner.

In addition, the present invention provides a disk of the pad conditioner to prevent the phenomenon that the front surface of the disk is not in uniform contact with the polishing pad during the pad conditioning of the disk, and a method of manufacturing the disk, and a chemical mechanical polishing apparatus having the pad conditioner and It is an object to provide a method.

The disk provided in the pad conditioner according to the present invention for achieving the above object has a lower surface that the disk is in contact with the polishing pad during the polishing process, the lower surface is in contact with the area of the polishing pad It has a shape different in height so as to be different.

According to an embodiment of the present invention, the lower surface has a convex shape downward.

According to an embodiment of the invention, the lower surface has a concave down shape.

According to an embodiment of the present invention, the lower surface is stepped.

According to an embodiment of the present invention, the lower surface is inclined upwardly or downwardly inclined toward the center of the lower surface.

According to an embodiment of the invention, the lower surface is rounded.

The disk manufacturing method according to the present invention for achieving the above object is provided in the pad conditioner of the chemical mechanical polishing apparatus so that the height of the lower surface in contact with the polishing pad of the disk to perform the conditioning of the polishing pad for each region While manufacturing, the first portion of the lower surface area to be formed to be plated high, and then the first half of the lower surface is plated.

According to an embodiment of the present invention, in the disk manufacturing method, the central region of the lower surface contacting the polishing pad is first plated, and the entire lower surface of the lower surface is secondarily plated to obtain the central region of the lower surface. To protrude from the lower surface than the edge region of the lower surface.

According to an embodiment of the present invention, in the disk manufacturing method, the edge region of the lower surface in contact with the polishing pad is first plated, and the entire lower surface of the lower surface is secondly plated so that the edge region of the lower surface is formed. The lower surface protrudes more than the central area of the lower surface.

Chemical mechanical polishing apparatus according to the present invention for achieving the above object is a platen with a polishing pad attached to the top, mounting the substrate so that the processing surface of the substrate facing down during the polishing process, and the processing surface of the substrate A polishing head pressed and rotated by a polishing pad, and a pad conditioner for conditioning the surface of the polishing pad, wherein the pad conditioner is in contact with the polishing pad during the polishing process, and contacts along the area of the polishing pad. And a disk having a lower surface having a different height to be different from each other and a rotating member for rotating the disk.

The chemical mechanical polishing method according to the present invention for achieving the above object is to press and rotate the processing surface of the substrate to the polishing pad to polish, and the disk of the pad conditioner is in contact with the polishing pad to perform the polishing process However, the polishing pad is conditioned by using a disk having a different shape so that the lower surface of the polishing pad is in contact with the polishing pad according to the area of the polishing pad.

According to an embodiment of the present invention, the conditioning of the polishing pad is performed by using a disc which protrudes from the lower surface more than a portion where the degree of contact with the polishing pad is weaker than a portion where the degree of contact of the polishing pad is strong.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure may be made thorough and complete, and to fully convey the spirit of the invention to those skilled in the art. Portions denoted by like reference numerals denote like elements throughout the specification.

In addition, in the present embodiment, a semiconductor substrate, that is, an apparatus for chemically polishing a wafer has been described as an example, but the present invention may be applied to an apparatus for polishing various kinds of substrates.

(Example)

1 is a block diagram of a chemical mechanical polishing apparatus according to the present invention, Figure 2 is a block diagram of the pad conditioner shown in FIG.

1 and 2, a chemical mechanical polishing apparatus 1 according to the present invention includes a polishing station 10 and a head assembly 20. The polishing station 10 includes a platen 12, a driving member 14, a slurry supply member 16, and a pad conditioner 100.

The platen 12 has a generally cylindrical shape. The platen 12 is rotated at the process speed in the polishing process. The rotation of the platen 12 is made by the drive 14. A polishing pad 12a is attached to the upper surface of the platen 12. The polishing pad 12a contacts the processing surface of the substrate W during the polishing process to planarize the processing surface of the substrate W. FIG. The polishing pad 12a is a polishing cloth having a mechanical polishing element made of polyurethane, and a plurality of protrusions may be formed on a surface thereof.

The slurry supply member 16 supplies a slurry to the upper surface of the polishing pad 12a during the polishing process. The slurry is an abrasive for chemical polishing of the substrate (W). In addition, the pad conditioner 100 performs a conditioning process of the polishing pad 12a during the process. Conditioning is a process to restore the roughness of the pressed pad surface of the polishing pad 12a. That is, conditioning is a process of restoring the profile of the polishing pad 12a by continuously maintaining the steady state of the polishing pad. The pad conditioner 100 will be described in detail later.

The head assembly 20 includes a polishing head 22 and a driving motor 24. The polishing head 22 supports the substrate W so that the processing surface of the substrate W faces downward. In addition, the polishing head 22 is rotated after pressing the processing surface of the substrate (W) to the polishing pad 12a during the polishing process. The drive motor 24 rotates the polishing head 22 at a process speed.

Subsequently, the pad conditioner 100 according to the present invention will be described in detail. Referring to FIG. 2, the pad conditioner 100 according to the present invention includes a disk 110 and a rotating member 120. The disk 110 contacts the surface of the polishing pad 12a during the polishing process to restore the roughness of the surface of the polishing pad 12a. The disk 110 is rotated by the rotating member 120. The rotating member 120 rotates the disk 110 at a predetermined rotation speed during the polishing process.

Disk 110 has at least one body 112. Body 112 has a generally cylindrical shape. The body 112 has a bottom surface 114 in contact with the surface of the polishing pad 12a during the polishing process. The bottom surface 114 has a convex shape downward. That is, when the lower surface 114 is in contact with the polishing pad 12a during the polishing process, the degree to which the center region X of the lower surface 114 is in contact with the polishing pad 12a rather than the edge region Y is stronger. It has a shape that protrudes downward so as to. The disk 110 having the bottom surface 114 having such a shape is such that the edge region Y of the disk 110 is more in contact with the polishing pad 12a when conditioning the polishing pad 12a. The lowering compensates for the degree of contact of the center region X of the disk 110 with the polishing pad 12a. Therefore, the disk 110 has a uniform contact with the polishing pad 12a at the front of the lower surface 114 during conditioning of the polishing pad 12a.

In the present embodiment, the disk 110 has a lower surface 114 of the convex shape as an example, but the lower surface 114 of the disk 110 may be manufactured in various shapes. For example, referring to FIG. 3, disc 110 ′ according to another embodiment of the present invention has a bottom surface 114 ′ concave downward. That is, when the lower surface 114 ′ contacts the polishing pad 12a during the polishing process, the extent that the edge region Y of the lower surface 114 ′ contacts the polishing pad 12a rather than the center region X It has a shape that protrudes downward to be strong. The disk 110 'having the lower surface 114' of this shape has the center area X of the disk 110 'contacting the polishing pad 12a even more when conditioning the polishing pad 12a. By lowering the degree to compensate for the degree of contact of the edge region (Y) of the disk (110 ') with the polishing pad (12a).

Alternatively, the disk 110 ″ according to another embodiment of the present invention has a bottom surface 114 ″ shaped to protrude optional regions. That is, referring to FIG. 4, the lower surface 114 ″ of the disk 110 ″ has a shape in which specific regions Z protrude. Particular areas Z are areas where the disk 110 ″ is in contact with the polishing pad 12 a of the lower surface of the disk 110 ″ when conditioning the polishing pad 12 a. In this case, the specific regions Z may be formed in an annular shape on the lower surface 114 ″ of the disk 110 ″, and the heights of the specific regions Z may be different from each other. The disk 110 ″ having the bottom surface 114 ″ of this shape has a specific area Z of the disk 110 ″ when the conditioning of the polishing pad 12a is performed. The degree of contact with 12a) is enhanced to compensate for the degree of contact with the polishing pad 12a in specific regions Z of the disk 110 ″.

In addition, the disk 110 may have various shapes of lower surfaces 114 for uniform contact between the front surface of the lower surface 114 of the disk 110 and the polishing pad 12a when the polishing pad 12a is conditioned. have. To this end, the disk may include a bottom surface having a stepped shape and a specific area rounded in addition to the bottom surfaces 114, 114 ′ and 114 ″ of the shape described above.

Next, the manufacturing process of the disk 114 mentioned above is demonstrated. 5A and 5B are views for explaining a disk manufacturing method according to the present invention. Disk 110 according to an embodiment of the invention is made by performing a plurality of electroplating. That is, referring to FIG. 5A, the disk 110 is manufactured by a plating treating member 200. The plating treatment part 200 includes a housing 210 and a cover 220. The housing 210 has a container shape with an open top. The inside of the housing 210 is filled with a solution (s) containing ions to be plated on the body 112 of the disk 110. The cover 220 is a mold for forming the lower surface 114 on the body 112 of the disk 110. The cover 220 generally has a plate shape, and a hole 222 is formed at the center thereof. The hole 222 is an opening for forming the protruding center region X of the lower surface 114. The diameter and shape of the hole 222 may be variously changed and modified according to the size and shape of the lower surface 114 to be formed.

When the plating processing unit 200 having the above-described configuration is started, the plating processing is started, and after applying the cathode power to the body 112 of the disk 110, it is immersed in the housing 210. Then, the cover 220 is disposed so as to be adjacent to the portion of the body 112 to form the lower surface 114 or spaced apart a certain distance. Then, when a current flows through the solution in the housing 110, ions to be plated are coated on the body 112 through the holes 222 of the cover 220. When the primary plating process is completed, as shown in FIG. 5B, one surface of the body 112 is coated only on the central region X. FIG. After that, once again, the entire body 112 is plated, and a disk 110 having a bottom surface 114 on which a central area X is convexly protruded is formed on one surface of the body 112.

In addition, the manufacturing method of the disk 110 ′ according to another embodiment of the present invention and the disk 110 ″ according to another embodiment is performed in the same manner as the above-described embodiment, but the cover 220 ′, 220 ''). That is, referring to FIG. 6, the cover 220 ′ used to manufacture the disc 110 ′ according to another embodiment of the present invention has an annular shape for plating the edge region Y of one surface of the body 112. Holes 222 'are formed. Since the cover 220 ′ is capable of plating only the edge region Y on one surface of the body 112 during the first plating of the body 112, the shape of the cover portion 220 ′ protrudes from the edge region Y of one surface of the body 112. It is possible to manufacture a disk 110 'having a bottom surface 114'. In addition, referring to FIG. 7, the cover 220 ′ used to manufacture the disc 110 ″ according to another embodiment of the present invention may have an annular shape for plating a specific region of one surface of the body 112. Holes 222 ″ are formed. The size and thickness of each of the holes 222 ″ and the width may be different from each other. Since the cover 222 ″ may be selectively plated only on a specific region Z of one surface of the body 112, the bottom surface 114 ″ having a shape in which the specific region Z of one surface of the body 112 protrudes. It is possible to manufacture a disk 110 '' having

In the above-described embodiments, the plating process is performed on the entire body 112 after the first plating on the central region, the edge region, and the specific region of the body 112 of the disk, but as an example. The recovery of the plating treatment may be performed three or more times. When the plating is performed three or more times, the number of covers will increase, and the holes formed in each cover may have different diameters and shapes.

Hereinafter, the polishing process of the chemical mechanical polishing apparatus 1 having the above-described configuration will be described in detail. Here, the same reference numerals for the same components as the above-described components are the same, and detailed description of the components is omitted.

When the polishing process is started, the polishing head 22 of the head assembly 20 mounts the substrate W so that the processing surface of the substrate W faces downward. Then, the processing surface of the substrate W is pressed against the polishing pad 12a attached to the upper surface of the platen 12 to be rotated, and then rotated at a process speed. At this time, the slurry supply member 16 supplies a predetermined amount of slurry to the surface of the polishing pad 12a. Therefore, the substrate W simultaneously undergoes mechanical polishing by friction with the polishing pad 12a and chemical polishing by slurry. The pad conditioner 100 performs conditioning of the polishing pad 12a.

When the pad conditioner 100 performs conditioning of the polishing pad 12a, the lower surface 114 of the disk 110 is rotated by the rotating member 120 after contacting the surface of the polishing pad 12a. do. In this case, the lower surface 114 of the disk 110 has a shape in which the central region X protrudes downward. Accordingly, the lower surface 114 of the disk 110 has a greater degree of contact of the center region X with the polishing pad 12a than the edge thereof. This is because the edge region Y of the disk 110 is in contact with the processing surface of the polishing pad 12a in comparison with the center region X when conditioning the polishing pad 12a. In order to solve the phenomenon in which (X) is not normally involved in the conditioning of the polishing pad 12a, the disk 110 is the central region X of the polishing pad 12a by the lower surface 114 of the convex shape. ) Is normally in contact with the polishing pad 12a. Accordingly, the pad conditioner 100 may be in uniform contact with the polishing pad 12a on the entire surface of the lower surface 114 of the disk 110 when conditioning the polishing pad 12a, so that the effective pad conditioning of the pad conditioner 100 is performed. Do this.

If the edge area Y of the lower surface of the disk is in contact with the polishing pad 12a when the polishing pad 12a is conditioned, the pad conditioning is performed using the disk 110 'according to another embodiment of the present invention. When the edge region Y of the lower surface 114 ′ of the disk 110 ′ which is less in contact with the polishing pad 12 a is in contact with the polishing pad 12 a, the contact area with the polishing pad 12 a is enhanced. If the specific area Z of the lower surface of the disk is in contact with the polishing pad 12a during pad conditioning, the polishing pad may be polished during pad conditioning using the disk 110 ″ according to another embodiment of the present invention. The specific region Z of the lower surface 114 ″ of the disk 110 ″ which is less in contact with the 12a is strengthened to the contact with the polishing pad 12 a.

As described above, the pad conditioner and the chemical mechanical polishing apparatus and method including the same according to the present invention allow the entire lower surface of the disk of the pad conditioner to be in uniform contact with the polishing pad to perform effective conditioning of the polishing pad. can do. In particular, the pad conditioner according to the present invention can perform effective conditioning of the polishing pad by using a disk made of a different height so that the lower surface contact of the disk according to the conventional polishing pad area.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are intended to illustrate the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above, the chemical mechanical polishing apparatus and method having the pad conditioner according to the present invention improves the ratio of the disk of the pad conditioner to the polishing pad during the polishing process, thereby performing effective pad conditioning of the polishing pad to Uniform polishing can be performed.

In addition, the chemical mechanical polishing apparatus and method having a pad conditioner according to the present invention uses a disk formed at a different height so that the lower surface contacting the polishing pad during the polishing process is different depending on the area of the polishing pad, Effective conditioning of the polishing pad can be performed. That is, in the pad conditioning, effective conditioning of the polishing pad is performed by compensating for the portion of the lower surface of the disk which is in contact with the polishing pad to be in contact with the polishing pad more than the portion where the polishing pad is in strong contact.

In addition, the method of manufacturing the disk of the pad conditioner in the present invention can produce a disk in which the height of the lower surface in contact with the polishing pad during the polishing process varies depending on the region. Such a disk may compensate for a portion of the lower surface of the disk that is in contact with the polishing pad during pad conditioning in the polishing process to be in contact with the polishing pad more than a portion where the polishing pad is in strong contact.

Claims (12)

In the disk provided in the pad conditioner of the chemical mechanical polishing apparatus, The disk, And a lower surface contacting the polishing pad during the polishing process, wherein the lower surface has a shape having a different height so that the degree of contact is different according to an area of the polishing pad. The method of claim 1, The lower surface is, Disc having a convex shape down. The method of claim 1, The lower surface is, And a disk having a concave down shape. The method of claim 1, The lower surface is, A disk characterized by a stepped shape. The method of claim 1, The lower surface is, The disk, characterized in that the further inclined toward the center of the lower surface is inclined upwardly or downwardly inclined shape. The method of claim 1, The lower surface is, A disk characterized by having a round shape. In the pad conditioner of the chemical mechanical polishing apparatus, the lower surface of the disk contacting the polishing pad of the disk for conditioning the polishing pad is manufactured to have a different height for each region, And plating the entire surface of the lower surface after first plating a portion to be formed higher in the region of the lower surface. The method of claim 7, wherein The disk manufacturing method, The center region of the lower surface in contact with the polishing pad is first plated, and the entire lower surface is plated secondly so that the center region of the lower surface protrudes further from the lower surface than the edge region of the lower surface. Disc manufacturing method characterized in that. The method of claim 8, The disk manufacturing method, The edge area of the lower surface contacting the polishing pad is first plated, and the entire lower surface is plated secondly so that the edge area of the lower surface protrudes further from the lower surface than the center area of the lower surface. Disc manufacturing method characterized in that. In chemical mechanical polishing apparatus, Platen with a polishing pad attached to the top, A polishing head for mounting the substrate so that the processing surface of the substrate faces downward during the polishing process, and pressing and rotating the processing surface of the substrate to the polishing pad; Including a pad conditioner for conditioning the surface of the polishing pad, The pad conditioner is, A disk having a lower surface having a different height so as to be in contact with the polishing pad during the polishing process and different in contact with the area of the polishing pad; And a rotating member for rotating the disk. The process surface of the substrate is polished by pressing and rotating the polishing pad, and the disk of the pad conditioner is in contact with the polishing pad to condition and perform the polishing process. Conditioning of the polishing pad, And a disk having a shape having a different height such that a lower surface contacting the polishing pad is in contact with the polishing pad according to a region of the polishing pad. The method of claim 11, Conditioning of the polishing pad, And a portion having a weaker contact with the polishing pad using a disk protruding from the lower surface than a portion having a strong contact with the polishing pad.

Images