KR20080005818A - Method for manufacturing printed circuit board and printed circuit board manufactured by the same - Google Patents

Abstract

A PCB and a manufacturing method thereof are provided to suppress an erroneous wiring due to burrs by removing burrs on an edge portion of the window slit and a circuit pattern. A circuit pattern for forming a control circuit for a PCB(Printed Circuit Board) is formed on first surfaces of at least two bases(S1). A window slit is used to electrically couple the circuit pattern with an element which is mounted on the PCB(S2). A basic member is formed on the PCB(S3). The basic member for the window slit to connect elements on the PCB with the circuit pattern is removed(S4), so that the window slit is formed. The bases are pressurized against each other by using an insulation material, so that the circuit patterns are arranged to face each other. An insulation film is formed on a position for the base, after the base is removed. A via is formed to electrically couple the circuit patterns on both sides of the PCB with each other.

Description

TECHNICAL FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY THE SAME

1 is a cross-sectional view illustrating a process of forming a mask for forming a circuit pattern on a base during a process of forming a window slit of a printed circuit board according to an exemplary embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a state in which a circuit pattern is formed on a base by using the mask shown in FIG. 1.

3 is a cross-sectional view illustrating a process of forming a window slit forming member by forming another mask on an upper portion of a base on which the circuit pattern shown in FIG. 2 is formed.

4 is a cross-sectional view illustrating a state in which a window slit forming member is formed by FIG. 3.

FIG. 5 illustrates a state in which a base with a circuit pattern as shown in FIG. 2 and a base with a circuit pattern as shown in FIG. 4 are bonded together as one of processes of forming a printed circuit board base member. It is a cross section.

FIG. 6 is a cross-sectional view illustrating an insulating layer formed so that a part of a circuit pattern is exposed at a position where a base is disposed after removing a base as one of processes of forming a printed circuit board base member.

7 is a cross-sectional view illustrating a via formed to electrically connect a circuit pattern separated by an insulating material.

8 is a cross-sectional view showing a state in which another mask is formed to remove the window slit forming member.

9 is a cross-sectional view illustrating a structure of a printed circuit board on which a window slit is formed by removing the window slit forming member.

FIG. 10 is a plan view of the printed circuit board of FIG. 9.

FIG. 11 is a cross-sectional view illustrating a state in which elements are mounted and wired to the printed circuit board illustrated in FIG. 9.

12 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.

FIG. 13 is a flowchart specifically illustrating a process of forming a printed circuit board foundation member during the process illustrated in FIG. 12.

* Description of the main parts of the drawings *

10 ... first base 10-1 ... second base

11 ... first circuit pattern 11-1 ... second circuit pattern

12 ... window slit forming member 12-1 ... window slit

13 ... insulating member 14 ... first insulating film

14-1 ... Second insulating film 15 ... Via

20,30 ... mask 40 ... first mask

40-1 ... Second Mask 100 ... Printed Circuit Board

100a, 100b, 100c, 100d ... printed circuit board foundation member

110 ... element 111 ... connection wire

The present invention relates to a printed circuit board manufactured by a method of manufacturing a printed circuit board and a method of manufacturing a printed circuit board.

A printed circuit board, generally called a printed circuit board (PCB), is a component that is configured to allow various devices to be mounted or to make an electrical connection between devices due to integrated wiring.

BACKGROUND ART With the development of technology, printed circuit boards having various shapes and functions have been manufactured. Among these types of printed circuit boards, printed circuit boards such as RAM, main board, LAN card, etc. have been produced. In particular, products that require high computational performance, such as RAM, have been commercialized using board-on-chip (BOC), which replaces a conventional lead frame to further increase transmission speed.

The BOC forms a window slit formed in the printed circuit board as a through hole from one circuit pattern to another circuit pattern, and mounts a device that forms a circuit together with the printed circuit board in the window slit. The printed circuit board element is configured to be electrically connected. The BOC configured as described above has to form a through hole (i.e., window slit) in the area where the device of the printed circuit board is to be mounted. In order to form such a window slit, conventionally, a routing processing method or a punching processing method using a mold Etc. are used.

However, all of these processing methods for forming window slits have the following problems. That is, according to the routing processing method, there is a problem in that a burr is generated by a router bit in which a circuit pattern formed adjacent to the edge of the window slit rotates at high speed for wiring with an element. The burrs generated as described above may cause wiring defects, and may also cause a problem of causing electrical shorts and peripheral circuit patterns. Therefore, in the related art, in order to remove burrs generated in the process of forming the window slit by the routing processing method, the shaving routing process (a kind of polishing process) must be performed.

In addition, in the case of the punching processing method using a die, a burr is generated even by the punching process because the circuit pattern formed adjacent to the edge of the window slit is not neatly cut for wiring with the device even by the punching. There is a problem. The burr generated as described above may cause wiring defects, and may also cause a problem of causing electrical shorts and peripheral circuit patterns. Therefore, even in the punching method, the shaving routing process (a kind of polishing process) must be performed in order to remove burrs generated in the process of forming the window slit.

In addition, in the case of punching processing using a mold, the mold to be provided is very expensive, and the trouble of finely adjusting the tolerance between the mold and the circuit pattern occurs. In addition, the punching tolerance causes a larger tolerance between the window slit and the circuit pattern, so that the wiring defect can be increased.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and an object thereof is to form a window slit while preventing a defective factor such as burrs from occurring in a circuit pattern adjacent to the edge of the window slit.

Another object of the present invention is to minimize the tolerance between the window slit and the circuit pattern when processing the window slit formed on the printed circuit board of the board on chip (Board On Chip) structure.

Yet another object of the present invention is to provide a window slit formed on a printed circuit board having a board on chip structure through a simpler process.

Yet another object of the present invention is to provide a window slit formed on a printed circuit board having a board on chip structure through a lower cost process.

The present invention provides a method of manufacturing a printed circuit board and a printed circuit board manufactured by the method for solving the above problems and at the same time achieving the objects according to the present invention.

In the method of manufacturing a printed circuit board according to an embodiment of the present invention, a circuit pattern for forming a control circuit of a printed circuit board is formed on at least one surface of at least two bases, and thereafter, between the circuit pattern and an element mounted on the printed circuit board. Forming a window slit base member for forming a window slit for wiring; In the process of forming the base member of the printed circuit board, the method may include forming the window slit by removing the window slit base member for wiring between the circuit pattern and the device mounted on the printed circuit board.

In addition, the printed circuit board Z according to another embodiment of the present invention may include the technical features described above. Such a printed circuit board is formed of an insulating layer for protecting a circuit pattern and a plurality of layers in which a portion of the insulating layer is opened to expose a portion of the circuit pattern to the outside, and a contact member is opened. Dielectrics are laminated so that the circuit patterns of each layer are electrically separated from each other between the circuit patterns, and are insulated by the dielectric and penetrated for mounting vias and devices for electrical connection of the circuit patterns between the layers. A window slit formed for mounting of the device to a printed circuit board including a window slit of may be formed by the above method.

Here, the process of forming the base member of the printed circuit board includes the steps of bonding the two or more bases using an insulator so that the circuit patterns face each other; Removing the base and forming an insulating film where the base was present; The method may include forming vias so that circuit patterns on both sides formed to face each other are electrically connected to each other.

The window slit base member may be formed through a deposition or plating process using a mask formed of a resist material, or may be formed of a material different from a resist material used as a mask using a mask formed of a resist material. It may also be formed from another resist material which is removed.

In this case, when the window slit base member is formed through the deposition or plating process, the window slit base member may be removed through the etching process. In this case, the window slit base member may be deposited or plated and etched. Can also be used. And copper can also be used as such a metal.

The window foundation member may also be removed before or after forming the vias to form window slits.

Some areas of the circuit pattern may be formed so as to be buried in the insulating member so that one side thereof is exposed to the outside for electrical connection with the device or another printed circuit board.

In addition, the device may be mounted on the printed circuit board by wiring for electrical connection between the circuit pattern of any one side through the window slit.

Hereinafter, the printed circuit board manufactured by the method of manufacturing the printed circuit board and the method of manufacturing the printed circuit board according to the present invention will be described through the embodiments of the present invention to help the understanding of the features of the present invention as described above. .

The present invention is not limited by the embodiments described below, but the present invention can be implemented as an example as described below. That is, the present invention may be modified in various ways within the scope of the present invention through the embodiments described below, and such modified embodiments fall within the scope of the present invention.

In order to help the understanding of the embodiments described below, in the reference numerals described in the accompanying drawings, among the components that will act the same in each embodiment, the related components are denoted by the same extension line numbers.

In addition, the embodiments described below will be described based on the embodiments most suitable for understanding the technical features of the present invention. In addition, in the embodiments described below, a process of manufacturing a circuit board composed of a plurality of layers will be fully understood through the embodiments described below, although it will be described based on a printed circuit board having a multilayer structure.

Referring to FIG. 1, the mask 20 is formed to form a circuit pattern. The mask 20 is formed using the photosensitive photoresist or the like on the bases 10 and 10-1 for forming the circuit patterns 11 and 11-1 and the circuit patterns 11 and 11-1 according to the circuit design. A mask 20 having the same pattern is formed (S1).

Although shown in FIG. 1 based on the first base 10, a mask formed on the second base 10-1 bonded to the first base and the insulating member 13 as described below. The second circuit pattern 11-1 may be formed through the same process. However, the second circuit pattern 11-1 may be formed in a pattern different from the first circuit pattern 11 according to a design specification. Here, the base 10 may be made of a metal material to facilitate the deposition or plating process when the window slit base member 12 is formed of a metal material as described below, the metal As one example of the material, copper may be used to facilitate the removal of the base as described below.

The first circuit pattern 11 and the second circuit pattern 11-1 may be formed on the base 10 and 10-1 by a generally known process such as a deposition or plating process using the mask 20. Is formed.

As described above, a mask is formed on one base on which the circuit pattern is formed to further form a base member for forming the window slit on the same surface on which the circuit pattern is formed. In the presently described embodiment, the first base 10 in which the window slit base member 12 is formed to form the window slit 12-1 will be described.

After the step S1, as described above, the window slit base member 12 is formed on the same surface as the surface on which the first circuit pattern 11 of the first base 10 is formed. The mask 30 is formed to form a. The mask 30 may be formed using a photosensitive photoresist, such as the mask 20 for forming the first circuit pattern 11 described above. The window slit base member 12 may be formed through the mask 30 through a deposition or plating process. In this case, the window slit base member 12 must be formed of a material that can be etched to remove the window slit base member 12 through an etching process as in step S4 described later. As such a material, a metal may be suitable, and copper may be used which is most easily etched among the metals. However, as described below, since the window slit base member 12 may be formed of other materials, the material applied to the window slit base member 12 is not limited to metal.

That is, the window slit base member 12 is a resist of another material that can be removed by a material different from the mask 30 for forming the window slit base member 12 in addition to being formed in the deposition or plating process. It may be formed using.

That is, the window slit base member 12 is not limited to any particular material, but may be applied as long as it is a material that can facilitate the process. In addition, the process of forming the window slit base member 12 may also be carried out in a process suitable for the applicable material in addition to the above-mentioned process.

After the window slit base member 12 is formed through the mask 30 through vapor deposition, plating, or resist, the mask 30 for forming the window slit base member 12 is removed to be shown in FIG. 4. Likewise, the window slit base member 12 is formed on one surface of the first base 10 on the same surface as the first circuit pattern 11. The window slit base member 12 is formed at a position where the window slit 12-1 is to be formed. In this case, the window slit base member 12 is exposed to the outside of the first circuit pattern 11 or the second circuit pattern 11-1. It may be formed in a range adjacent to or in contact with the region of the circuit pattern.

As described above, after the circuit pattern is formed on one base, and the circuit pattern and the window slit base member are formed on the other base, the two bases are configured to include an insulating member, and the circuit pattern between the two bases is in accordance with the narrow design specification. In accordance with the configuration to be electrically connected to form a printed circuit board base member (S3).

As described above, after the window slit base member 12 is formed in the first base 10, the second base 10-different from the first base 10 is formed. 1) is bonded to each other by the insulating member 13 to be electrically spaced (S3a).

As described above, after the base on which the circuit pattern is formed and the base on which the circuit pattern and the window slit base member are formed through the insulating member 13 are bonded together, the bases 10 and 10-1 are removed. The insulating layers 14 and 14-1 are formed at positions where the bases 10 and 10-1 are removed to prevent the circuit patterns 11 and 11-1 from being exposed to the outside (S3b). In this case, each of the insulating layers 14 and 14-1 may include the first circuit in a position adjacent to the window slit base member 12 as well as the window slit base member 12 or in contact with the window slit base member 12. A portion of the pattern 11 or the second circuit pattern 11-1 may be exposed.

After the insulating layers 14 and 14-1 are formed as described above, as shown in FIG. 7, the via 15 may be electrically connected to the first circuit pattern 11 and the second circuit pattern 11-1. It is formed. In this case, the via 15 may be formed by forming a hole through a drilling operation and then forming an electrically conductive layer in the hole formed by the drilling operation through plating or the like.

In contrast, the process of forming the via 15 is performed after removing the first base 10 and the second base 10-1 and before forming the first insulating film 14 and the second insulating film 14-1. May be The reason why the step of forming the via 15 is selectable is that the circuit patterns 11 and 11-1 are formed on one surface of each base 10 and 10-1, so that the remaining portions except the one side are insulated. It is possible because it is formed in the state buried in (13). In addition, as described above, since the circuit patterns 11 and 11-1 are formed so as to be buried in the insulating member 13, the degree of coupling between the contact members (not shown) and the circuit patterns 11 and 11-1 themselves. Peeling phenomenon can also be prevented.

The window base member is removed (S4). After the via 15 is formed as described above, the first mask 40 and the second mask 40-1 are formed to remove the window slit base member 12 as shown in FIG. 8. The first mask 40 and the second mask 40-1 are for removing the window slit base member 12, and the first mask 40 and the second mask 40-1 are windowed through an etching process. It is preferable to apply when the slit base member 12 is removed. Therefore, when the window slit base member 12 is removed by a process other than the etching process, the first mask 40 and the second mask 40-1 may not be formed. That is, as described above, when the first mask 40 and the second mask 40-1 are formed of a material such as, for example, a photosensitive photoresist, the first mask 40 and the second mask 40 are formed. It is possible to remove the window slit base member 12 without forming -1).

When the window slit base member 12 is removed through the step S4, as shown in FIG. 9, the printed circuit board 100 has the window slit 12 at the position where the element 110 is mounted according to the design specification. -1) is formed.

Since the window slit 12-1 for mounting the device 110 is formed through such a process without mechanical processing, the circuit patterns 11 and 11-1 are not subjected to physical force, and thus no burrs are at all. It will not occur. In other words, it can be seen that no problem due to a defective wiring or a tolerance between the window slit and the circuit pattern occurs.

After the printed circuit board 100 is manufactured through the above process, the device 110 is mounted on one side of the printed circuit board 100, and one circuit pattern, for example, the first circuit pattern 11 is mounted. The device 110 and the circuit pattern 11 are electrically connected to the exposed region (ie, the connection terminal) of the connection line 111. Through this process, the printed circuit board 100 having a board-on-chip structure can be configured.

The method of manufacturing the printed circuit board described above does not have to be manufactured by sequentially performing each of the above-described steps, but the steps of each of the processes according to design specifications include various modifications within the scope of the technical idea of the present invention. May be optionally mixed to perform the same.

As described above, according to the present invention, when the element is mounted and the window slit formed on the printed circuit board of the board-on-chip structure is formed, no physical force is applied to the circuit pattern adjacent to the edge of the window slit. No burrs are generated in the circuit pattern. Therefore, the defect of wiring by a burr can be prevented at the source.

In addition, according to the present invention, since the window slit formed on the printed circuit board of the board on chip structure is formed without physical force being applied, the tolerance between the window slit and the circuit pattern is maximized during processing. Can be reduced.

Further, according to the present invention, since the formation of the window slit is formed together with the process of forming the printed circuit board base member, a simple process can be simplified.

In addition, according to the present invention, it is possible to reduce the manufacturing cost since it is not necessary to fix the work using a mold and to eliminate ancillary processes such as shaving routing.

Claims (16)

After forming a circuit pattern for constituting a control circuit of a printed circuit board on at least one surface of one or more bases, a window slit base member is formed to form a window slit for wiring between the circuit pattern and an element mounted on the printed circuit board. Making a step; Forming a window slit by removing the window slit base member for wiring between the circuit pattern and the elements mounted on the printed circuit board in the process of forming the base member of the printed circuit board. Manufacturing method. The method of claim 1, wherein the forming of the base member of the printed circuit board is performed. Bonding two or more bases using an insulator so that the circuit patterns face each other; Removing the base and forming an insulating film where the base was present; A method of manufacturing a printed circuit board comprising the step of forming a via so that the circuit patterns on both sides formed to face each other are electrically connected. The method of claim 1, wherein the window slit base member is formed by a deposition or plating process using a mask formed of a resist material. The method of claim 1, wherein the removing of the window slit base member is performed by etching. The method of manufacturing a printed circuit board according to claim 1, wherein the window slit base member is made of a metal capable of vapor deposition, plating and etching. 6. The method of claim 5, wherein the metal is copper. The method of claim 1, wherein the window slit base member is formed of another resist material removed from a material different from the resist material used as a mask by using a mask formed of a resist material. . The method of claim 1, wherein the window foundation member is removed before or after forming the vias. The method of claim 1, wherein the circuit pattern is formed in a state buried in an insulating material, a portion of the circuit pattern is formed so that one side is exposed to the outside for electrical connection with the device or another printed circuit board. Method of manufacturing a printed circuit board. The printed circuit board of claim 1, further comprising, after the window slit is formed, mounting the device on the printed circuit board by performing wiring for electrical connection between the circuit pattern on either side and the device. Manufacturing method. A circuit of each layer is formed between an insulating layer for protecting the circuit pattern and a portion of the insulating layer is opened to expose a portion of the circuit pattern to the outside, and a plurality of layers of the contact member is opened. Dielectric stacked so that the patterns are electrically separated from each other, the printed circuit board comprising a window slit in the through state for the mounting of the via and the device for the electrical connection of each of the interlayer circuit pattern in a state insulated by the dielectric A window for wiring between the circuit pattern and a device mounted on the printed circuit board after the window slit formed for mounting the device forms a circuit pattern for constituting a control circuit of the printed circuit board on at least one surface of at least two bases. Forming a window slit base member for forming the slit; Window slit formed by the manufacturing method comprising the step of forming a window slit by removing the window slit base member for wiring between the circuit pattern and the elements mounted on the printed circuit board in the process of forming the base member of the printed circuit board Printed circuit board, characterized in that. The method of claim 11, wherein the forming of the base member of the printed circuit board is performed. Bonding two or more bases using an insulator so that the circuit patterns face each other; Removing the base and forming an insulating film where the base was present; Printed circuit board, characterized in that the window slit formed by the manufacturing method comprising the step of forming a via so that the circuit patterns on both sides formed to face each other electrically connected. 12. The printed circuit board of claim 11, wherein the window slit base member is a window slit formed by a manufacturing method made of a metal capable of vapor deposition, plating, and etching. 12. The method of claim 11, wherein the window slit base member is a window slit formed by a manufacturing method formed of another resist material removed with a material different from the resist material used as a mask using a mask made of a resist material. Printed circuit board. 12. The printed circuit board of claim 11, wherein the window base member is a window slit formed by a manufacturing method that is removed before or after forming the via. The window formed by the manufacturing method of claim 11, further comprising, after forming the window slit, mounting a device on a printed circuit board by performing wiring for electrical connection between the circuit pattern on either side and the device. Printed circuit board, characterized in that the slit.

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