KR20080003613A - Substrates and substrates adhesion apparatus - Google Patents

Abstract

A substrate and a substrate adhesion apparatus are provided to prevent a control error by separately forming a space where bubbles included in liquid crystals flow and remain or providing a thermal resource for preventing generation of bubbles to the substrate adhesion apparatus. An upper substrate(130) and a lower substrate(140) are prepared such that they are attached to each other. A buffer space is formed in counter surfaces of the upper and lower substrates. Bubbles included in liquid crystals injected in the attachment of the upper and lower substrates move into the buffer space. The buffer space is formed at an edge of at least one of the upper and lower substrates. The buffer space includes depressed portions(132,142).

Description

Substrate and Substrate Bonder {SUBSTRATES AND SUBSTRATES ADHESION APPARATUS}

1 is a cross-sectional view schematically showing the structure of a liquid crystal display device.

Figure 2 is a front sectional view showing a conventional substrate bonding machine.

3 is a front cross-sectional view illustrating a substrate combiner according to an embodiment of the present invention.

4 is a cross-sectional view schematically showing the structure of a substrate which is a liquid crystal display device bonded by the substrate bonding machine of the present invention.

<Description of Symbols for Main Parts of Drawings>

130, 140: upper and lower substrates 132, 142: main part

150: sealing material 160: liquid crystal layer

170: heating means

The present invention relates to a substrate and a substrate combiner, and more particularly, to form a space remaining after the air bubbles contained in the liquid crystal flow to the substrate separately, or to provide a heat source so that bubbles do not occur in the substrate combiner The present invention relates to a substrate and a substrate joining machine which prevents poor control by the present invention.

As the information society develops, the demand for display devices is increasing in various forms. In response, various flat panel display devices such as liquid crystal devices (LCDs) and plasma display panels (PDPs) have been studied. It is used as a display device in various equipments.

Generally, a liquid crystal display device is formed between an upper substrate 30, which is a TFT (Thin Film Transistor) substrate, on which an electrode is formed, and a lower substrate 40, which is a color filter substrate coated with phosphors, as shown in FIG. 1. A liquid crystal layer 60 into which liquid crystal is injected is formed in the liquid crystal layer 60.

Of course, a sealing material 50 for confining the liquid crystal material is provided at the edges of both substrates 30 and 40, and the gap between the substrates 30 and 40 is maintained at predetermined intervals between the substrates 30 and 40. Spacer (not shown in the figure) for positioning.

The liquid crystal display is driven by applying power to the liquid crystal material. Since the liquid crystal material has anisotropic dielectric constant, the liquid crystal display device displays an image by controlling the intensity of the power to control the amount of light transmitted through the substrate.

Therefore, in manufacturing a liquid crystal display device, it is an essential and very important process to bond the two substrates and inject the liquid crystal material into the space therebetween after the TFT substrate and the color filter substrate are manufactured.

As shown in FIG. 2, the conventional substrate joining apparatus is generally disposed on the upper and lower sides of the upper and lower chambers 10 and 20 and the upper and lower chambers 10 and 20 in which the interior is changed into a vacuum state and an atmospheric pressure state. Two substrates (color filter substrate and TFT array substrate (hereinafter referred to as "upper and lower substrate": 30, 40)) carried in the upper and lower chambers 10 and 20, which are formed of upper and lower stages 12 and 22 provided. Is arranged horizontally on the upper stage 12 and the lower stage 22, and is then joined up and down.

The upper chamber 10 moves up and down when the upper and lower substrates 30 and 40 are brought in or taken out, and the loaded upper and lower substrates 30 and 40 are seated on the lower part of the upper stage 12 and the upper part of the lower stage 22. A plurality of lift pins 14 and 24 for absorbing and adsorbing are provided, and the lift pins 14 and 24 are uniformly moved by one plate provided at upper and lower portions thereof.

In addition, one end of the upper and lower substrates 30 and 40 is brought into contact with the liquid crystal, and at the same time, nitrogen gas N2, which is an inert gas, is injected into the upper and lower chambers 10 and 20 to reach an atmospheric pressure state. And left for several hours or more to complete the injection of the liquid crystal.

However, in the process of injecting the liquid crystal through the injection hole after bonding the upper and lower substrates 30 and 40 by the substrate adhering device, the outside air (air and nitrogen gas) remaining in the upper and lower chambers 10 and 20 is injected into the liquid crystal. Bubbles are generated in the liquid crystal layer 60 by flowing into the space, and thus, there is a problem in that the control of the liquid crystal display device is impossible at the bubble generated portion.

The present invention has been made to solve the above problems, the object is to form a space remaining after the air bubbles contained in the liquid crystal when the substrate is bonded to the substrate separately or to prevent the generation of bubbles in the substrate bonding The present invention provides a substrate and a substrate bonder that provide a heat source to prevent poor control.

In order to achieve the above object, the present invention, in the substrate provided up and down to be bonded, the buffer in which the bubbles contained in the liquid crystal injected when the substrate is bonded to the opposite surface of the upper and lower substrates (Buffer Since the space is formed, it is preferable to prevent poor control due to bubble generation.

Moreover, since the said buffer space in this invention is a recessed part formed in the edge of at least one of the said upper and lower board | substrates, it is preferable because the bubble contained in a liquid crystal collects in the said recessed part.

Moreover, the board | substrate bonding machine which adhere | attaches the upper and lower substrates in this invention, Comprising: Chamber; Upper and lower stages provided inside the chamber to respectively adsorb the upper and lower substrates; Heating means for providing a heat source to the upper and lower substrates to prevent the generation of bubbles when bonding the substrate; In this case, the temperature is increased between the upper and lower substrates by the heating means provided in the substrate adhering device and the pressure is increased to inject the nitrogen gas into the liquid crystal injection space in the process of injecting nitrogen gas into the chamber. It is preferable because it prevents it from occurring.

Hereinafter, an embodiment will be described with reference to the accompanying drawings of the substrate and the substrate adapter of the present invention.

As shown in FIG. 3, a substrate according to an exemplary embodiment of the present invention is provided between an upper substrate 130 that is a thin film transistor (TFT) substrate and a lower substrate 140 that is a color filter substrate coated with phosphors. A liquid crystal layer 160 in which a liquid crystal is injected into the liquid crystal layer 160 is formed.

Of course, a sealing material 150 for confining the liquid crystal material is provided at the edges of the upper and lower substrates 130 and 140 as in the related art, and both substrates 130 and 140 are spaced at predetermined intervals between the upper and lower substrates 130 and 140. Spacers (not shown in the figure) are positioned to maintain the gap therebetween.

Here, at least one of the upper and lower substrates 130 and 140 is formed at the edge of the opposite surface, recesses 132 and 142, which are buffer spaces in which bubbles contained in the liquid crystal injected when the substrates are bonded, are moved. do.

The recesses 132 and 142 are buffers in which bubbles included in the liquid crystal are moved to the outer periphery of the upper and lower substrates 130 and 140 and are collected when the liquid crystal is injected into the upper and lower substrates 130 and 140. Space.

As a result, bubbles included in the liquid crystal are moved and positioned to the recesses 132 and 142 to prevent an error from occurring during the control of the liquid crystal display.

As shown in FIGS. 3 and 4, the substrate combiner of the present invention is composed of the upper and lower chambers 110 and 120 and the upper and lower stages 112 and 122, and the upper and lower chambers 110 and 120. Since the same structure and function as the conventional one, detailed description thereof will be omitted.

However, heating means 170, which is a heat source for generating heat by an applied power source, is provided in the upper and lower stages 112 and 122 where the upper and lower substrates 130 and 140 are adjacent to each other. The upper and lower substrates 130 and 140 adsorbed on the opposite surfaces of the upper and lower substrates 122, and the temperature is increased by a predetermined value, and then the liquid crystal is injected into the upper and lower substrates 130 and 140, and the liquid crystal is heated above the isotropic temperature. The liquid crystal molecule array loses orientation and increases fluidity.

As the temperature and pressure of the bonded interior of the upper and lower substrates 130 and 140 rise and the volume expands due to the heat source of the heating means 170, the upper and lower chambers 110 and 110 are formed during the liquid crystal injection and sealing process. In the process of injecting nitrogen gas and the like into the liquid crystal display 120, bubbles are prevented from being generated through the liquid crystal injection space.

As a result, the liquid crystal constituting the liquid crystal layer 160 is dropped evenly under the atmospheric pressure and then uniformly diffused and filled on the upper surface of the lower substrate 140, thereby enabling stable bonding, so that the upper and lower substrates 130 and 140 are different from each other. When bonding, the inside of the lower chamber does not have to be formed in a vacuum state.

Here, the heating means 170 is a lower stage to which a heating wire is grafted and is provided in at least one of the upper and lower stages and the liquid crystal moves along the lower substrate 140 so that the lower substrate 140 is adsorbed. It is preferable to be provided in 122.

Therefore, the substrate and the substrate joining device of the present invention have recessed portions 132, 132, at the edges of the opposite surfaces of the upper and lower substrates 130 and 140 before bonding the upper and lower substrates 130 and 140 to inject liquid crystal into the upper and lower substrates 130 and 140. Even if bubbles are included in the liquid crystal injected and formed 142, the liquid crystal moves in an outward direction, and bubbles included in the liquid crystal move to the recesses 132 and 142 and are collected to form the liquid crystal layer of the upper and lower substrates 130 and 140. There is no bubble remaining in 160).

In addition, the upper and lower stages 112 and 122 are further provided with a heating means 170 to heat the upper and lower substrates 130 and 140 before injecting liquid crystal into the upper and lower substrates 130 and 140. When the liquid crystal is injected after heating to a proper temperature by the heat source of the means 170, the temperature and pressure in the bonding space of the upper and lower substrates 130 and 140 rise and the volume expands, and external nitrogen flows into the bubble. Prevent it.

As a result, in the process of injecting the liquid crystal after bonding the upper and lower substrates 130 and 140, the recesses 132 and 142 are formed on the edges of the opposite surfaces of the upper and lower substrates 130 and 140, respectively, before the bubbles are included in the liquid crystals. As it is accommodated in the recesses 132 and 142 in the moving process, bubbles are not generated in the liquid crystal layer 160.

In addition, the heating means 170 is provided on the upper and lower stages 112 and 122 so that the upper and lower substrates 130 and 140 are heated by the heating means 170 when the upper and lower substrates 130 and 140 are bonded together. When the liquid crystal is injected into the liquid crystal in the preheated state, the liquidity of the liquid crystal molecules lost the direction is increased to move to the edges of the opposite surfaces of the upper and lower substrates 130 and 140, and further, between the upper and lower substrates 130 and 140 bonded together. Liquid crystal is injected into the upper and lower substrates 130 and 140 by temperature and pressure rise and volume expansion, and nitrogen is injected into the upper and lower chambers 110 and 120 when the sealing process is performed. Prevents bubbles from occurring.

Here, reference numerals 114 and 124 not described herein are lift pins.

Such a substrate and the substrate combiner of the present invention can prevent poor control by forming a space remaining after the air bubbles contained in the liquid crystal flow to the substrate separately or providing a heat source to prevent the generation of bubbles in the substrate bonder It has an effect.

In addition, the substrate of the present invention has the effect of reducing the weight by forming a buffer space in accordance with the trend that the substrate is enlarged.

Claims (6)

In the substrate provided up and down so as to be bonded, And a buffer space in which bubbles contained in the liquid crystal injected when the substrates are bonded to opposite surfaces of the upper and lower substrates may be moved. The method of claim 1, wherein the buffer space, A substrate, characterized in that formed on the edge of at least one of the upper and lower substrates. The method of claim 2, The buffer space is a substrate, characterized in that the recess. In the substrate joining machine for joining the upper and lower substrates, chamber; Upper and lower stages provided inside the chamber to respectively adsorb the upper and lower substrates; Heating means for providing a heat source to the upper and lower substrates to prevent the generation of bubbles when bonding the substrate; Substrate bonder comprising a. The method of claim 4, wherein the heating means, And at least one of the upper and lower stages. The method of claim 5, And the heating means is a hot wire.

Images