KR20070108013A - Led sign board - Google Patents

Abstract

A sign board for using a light emitted diode is provided to irradiate light into an interior of a transparent substrate from one side of the transparent substrate to entirely display the information of a display on a back surface of the transparent substrate. A sign board for using a light emitted diode includes a transparent substrate(110) having a display part and an inclined part. The display part is horizontally extended to a horizontal direction with a same thickness and a predetermined length. The inclined part is extended with a thickness gradually decreased from an end part of the display part. A side coupling frame(120) is assembled to the transparent substrate. A plurality of light emitted diodes are assembled to a plurality of light source mounting hole(135). The light sources are formed on a body of a main profile along a direction vertical from a protrusion direction of a coupling lib.

Description

Sign board using light emitting diodes {LED sign board}

1 is an exploded perspective view showing a separated sign board using a light emitting diode according to the present invention,

2 is an enlarged perspective view of the side frame of FIG. 1;

3 is a cross-sectional view showing a state in which the sign board of FIG.

4 is a partially enlarged view for explaining a light emitting structure from the light emitting diode by the inclined portion of the transparent substrate of FIG.

FIG. 5 is a cross-sectional view illustrating a state in which the first and second coupling ribs of the main profile of FIG. 1 are bent to reduce the separation width and are coupled to the transparent substrate.

6 is a cross-sectional view illustrating a state in which the first and second coupling ribs of the main profile of FIG. 1 are bent to enlarge the separation width and are coupled to the transparent substrate.

7 is a cross-sectional view illustrating an example of a light emitting diode applied to the sign board of FIG. 1.

<Description of Symbols for Main Parts of Drawings>

110: transparent substrate 120: side frame

140: circuit board 150: light emitting diode

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sign board using a light emitting diode, wherein a sign board using a light emitting diode is configured to display the display information formed by dye on the back side of the transparent substrate by irradiating light into the transparent substrate from the side of the transparent substrate. It is about.

Signboards, commonly called signboards, are used to display display information, and have been mainly used with fluorescent lights or neons inserted therein for identification at night.

However, fluorescent or neon lamps require a ballast for current control, have a short lifespan, and are large in size. Various proposals have been made.

In Korea Registration Utility Model No. 0399436, Korea Registration Utility Model No. 00253939, Korea Patent Application Publication No. 2003-0026657, Korea Registration Utility Model No. 0390836, and Korea Patent Application Publication No. 1998-074066 on one side of the transparent substrate Disclosed is a signboard in which display information can be displayed by a light emitting diode provided in a frame so that light can be irradiated therein. However, there is a disadvantage that the frames of the signboards disclosed are not adapted to be adaptively coupled to the thickness of the transparent substrate.

The present invention has been made to improve the above problems, and an object of the present invention is to provide a sign board using a light emitting diode structured to be able to combine the frame in accordance with the thickness of the transparent substrate.

Still another object of the present invention is to provide a sign board using a light emitting diode capable of increasing light utilization efficiency.

In order to achieve the above object, a sign board using a light emitting diode according to the present invention has a display portion extending horizontally with the same thickness horizontally and an inclined portion extending so that the thickness gradually decreases at the end of the display portion. A transparent substrate having display information formed on one surface of the display portion; The first and second coupling ribs spaced apart from each other to allow a portion of the display portion to enter from the inclined portion of the transparent substrate are formed to protrude from the body to form a first accommodating groove. Opposite the first and second coupling ribs, the main profile having third and fourth coupling ribs extending in a direction opposite to the protruding direction of the first and second coupling ribs, and the third and fourth of the main profile. And a cover profile formed to be fitted with the coupling rib to close the second receiving groove from the body with respect to the protruding direction of the third and fourth coupling ribs, and the transparent substrate through the first receiving groove. Coupled side engagement frames; A plurality of light emitting diodes mounted on the body of the main profile through a plurality of light source mounting holes spaced apart from each other along a direction perpendicular to the direction in which the coupling ribs protrude; And a circuit board electrically connected to the light emitting diode mounted in the second accommodation groove to drive the light emitting diode, wherein the main profile is formed of a metal material, and the first and second couplings are provided. A plurality of vertically extending along the extending direction of the body formed to be pulled from the surface on a position spaced apart from each other to each of the first and second coupling ribs to be able to expand or reduce the separation width of the rib by bending It is provided with a bending guide groove.

Preferably, the light emitting diode and an anti-reflection filling layer filled with a transparent material are further provided between the end of the inclined portion of the transparent substrate.

In addition, a reflection layer is further formed on an inner surface of the body opposite to the end of the inclined portion.

More preferably, the housing of the light emitting diode is tightly coupled to the main profile around the light source mounting hole so as to radiate heat through the main profile.

Hereinafter, a sign board using a light emitting diode according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a separated sign board using a light emitting diode according to the present invention, Figure 2 is an enlarged perspective view of the side frame of Figure 1, Figure 3 is shown in a combined state of the sign board of Figure 1 It is a cross section shown.

1 to 3, the sign board 100 includes a transparent substrate 110, a side frame 120, a circuit board 140, and a light emitting diode 150.

The transparent substrate 110 may be formed of a variety of known transparent materials, such as transparent acrylic material, glass.

The transparent substrate 110 has a display portion 112 that extends a certain length horizontally and the same thickness, and an inclined portion 114 that extends gradually in thickness at the end of the display portion 112.

The inclined portion 114 may be formed in an oblique shape as shown in the example, or may be formed in a curved shape.

In addition, in the illustrated example, the structure in which the side frame 120 is coupled to each of the left and right sides of the transparent substrate 110 is illustrated. Alternatively, in the case in which the side frame 120 is coupled to only one side of the left and right sides, The other side is not coupled to the inclined portion 114 may be omitted, a high reflectance material may be a coating or a film of a reflective material or a structure attached to the reflecting plate may be applied.

In addition, when the side frame 120 is coupled to the upper and lower portions of the transparent substrate 110, the upper and lower portions may also be applied to have the inclined portion 114 shown.

On the back surface 112a of the display portion 112, display information formed by forming letters or patterns in an intaglio form and applying a dye such as paint or ink is formed in the grooves 118 formed in the intaglio form.

Alternatively, paint may be applied to the back surface 112a of the display portion 112, or a film (not shown) corresponding to the display target information may be attached.

The side frame 120 is composed of a main profile 121 and a cover profile 137.

The main profile 121 is preferably formed of a metal material, for example, aluminum.

The main profile 121 is formed in one body, and functionally divided, has a body 123, the first to fourth coupling ribs (125 to 128).

The first and second coupling ribs 125 and 126 are spaced apart from each other to allow a portion of the display portion 112 to enter from the inclined portion 114 of the transparent substrate 110 and protrude from the body 123. have.

The first receiving groove 131 formed between the first and second coupling ribs 125 and 126 becomes a space for inserting and coupling the transparent substrate 110.

Each of the first and second coupling ribs 125 and 126 is formed with a bending guide groove 132 spaced apart from each other at corresponding positions on the inner side and the outer side.

The bending guide groove 132 may include an inner surface of the first and second coupling ribs 125 and 126 so as to expand or reduce the separation width of the first and second coupling ribs 125 and 126 by bending. It is formed to be pulled in from the surface of the outer surface, respectively, is formed to extend vertically along the extending direction of the body (123).

Accordingly, when the thickness of the transparent substrate 110 is narrower or wider than the width of the first and second coupling ribs 125 and 126 that are parallel to each other, the bent guide groove 132 is formed as shown in FIGS. 5 and 6. By using the portion, the first and second coupling ribs 125 and 126 may be bent in two stages to reduce or expand to correspond to the thickness of the transparent substrate 110.

The third and fourth coupling ribs 127 and 128 are provided with the first and second coupling ribs 125 and 126 opposite the first and second coupling ribs 125 and 126 around the body 123. Is formed to extend in the direction opposite to the protruding direction of the second receiving groove 134.

The separation widths of the third and fourth coupling ribs 127 and 128 may be determined so as to accommodate the circuit board 140 therein, and the coupling pieces 127a and 128a may protrude in opposite directions at ends. ) Is formed. The coupling pieces 127a and 128a are not limited to the structure shown, but are coupled to the cover profile 137, which will be described later, and the cover frame 137 and various structures that can be mutually coupled by sliding the cover frame. Of course, it can be applied corresponding to (137).

The body 123 is an element that couples the coupling ribs 125 to 128 to each other across the direction from the first coupling rib 125 to the third coupling rib 127, and protrudes from the coupling ribs 125 to 128. A plurality of light source mounting holes 135 are formed along an extension direction perpendicular to the direction.

Preferably, a reflective layer 136 made of a material having a high reflectance is further formed on a side surface of the body 123 to form the first accommodation groove 131. The reflective layer 136 may be formed of a thin plate made of aluminum, for example, aluminum foil.

When the main profile 121 is formed of an aluminum material having a high reflectance, the side of the body 123 facing the end of the inclined portion 114 of the transparent substrate 110 may be polished to have a low roughness, and the reflective layer ( 136 may be omitted.

In addition, the body 123 is the body 123 of the housing 153 of the light emitting diode 150 mounted to be inserted through the light source mounting groove 135 from the circuit board 140 embedded in the second receiving groove 134. It may be installed in close contact with the light emitting diode 150 so as to form a heat dissipation path from the housing 153 of the light emitting diode 150 to the side frame 120. In the illustrated example, the second receiving groove 134 is formed. Expansion portion 123b extending in the direction from the first flat portion 123a on the side to the third and fourth coupling ribs 127 and 128, and the third and fourth coupling ribs vertically in the expansion portion 123b. A structure having a vertical portion 123c extending to 127 and 128 was applied.

The light emitting diodes 150 are mounted on the circuit board 140.

The light emitting diodes 150 may be mounted on the circuit board 140 in rows at intervals that may be inserted through the light source mounting holes 135 formed in the body 123 of the main profile 121.

The light emitting diodes 150 may be coupled to the circuit board 140 such that a single color or color display light emitting diode chip is embedded in one housing 153 or that red, green, and blue light emitting diodes are mixed with each other. In addition, the light emitting diode 150 may be a light emitting diode having a structure in which a YAG phosphor (not shown) is coated on a light emitting surface of a light emitting diode chip 152 emitting white light, for example, blue light.

Preferably, the light emitting diodes 150 may include a light emitting diode chip 152 mounted on a metal housing 153 but having a heat transfer path from the light emitting diode chip 152 to the housing 153. As shown in FIG. 7, the light emitting diodes 150 are inserted with insulating beads 158 made of an insulating material so as to be spaced apart from each other, and inserted into the housing 153 made of a metal material having good heat dissipation. Through the lead frame 157 is installed, the light emitting diode chip 152 mounted in the receiving groove in the housing 153 is electrically insulated through the insulating bead 158 through the lead frame 157 The heat generated from the light emitting diode chip 152 can be discharged through the housing 153. The first portion 153a having the first outer diameter or the second portion 153b having the second outer diameter extended than the first portion 153a of the housing 153 of the light emitting diode 150 is formed in the body 123. When closely attached to the inclined portion 123b, heat generated from the light emitting diode chip 152 may be radiated to the main profile 121 through the housing 153.

The structure of the light emitting diode 150 capable of dissipating heat from the light emitting diode chip 152 through the housing 153 may be variously known in addition to the illustrated example.

The circuit board 140 is a substrate for driving the light emitting diodes 150.

The circuit board 140 may be fixed to the main profile 121 by screws or other fixing means.

The cover profile 137 is configured to close the second receiving groove 134 of the main profile 121 in a direction opposite to the body 123. In the illustrated example, the third and fourth coupling ribs 127 are formed. It has been applied to a structure having a 'U' shaped fitting groove 137a at both ends so that the engaging pieces 127a and 128a of (128) can be inserted.

Although not shown, a cap for completely closing the first and second receiving grooves 131 and 134 may be applied to the upper and lower portions of the side frame 120. Alternatively, a cap (not shown) for closing both the upper and lower surfaces of the transparent substrate 110 and the upper and lower portions of the side frame 120 may be applied.

The anti-reflection filling layer 162 is formed to be filled with a transparent material between the light emitting diode 150 and the end of the inclined portion 114 of the transparent substrate 110.

The refractory filling layer 162 may be formed of a transparent material having the same or similar refractive index as the material of the lens 156 of the light emitting diode 150 or the transparent substrate 110. As an example, the repression suppression filling layer 162 may be epoxy material or silicon material.

When the refractory filling layer 162 is omitted, the light emitting diodes 150 are formed by air existing between the light emitting diodes 150 and the transparent substrate 110 inserted into the first receiving grooves 131 of the side frame 120. Some of the light exiting through the air and incident on the inclined portion 114 of the transparent substrate 110 is reflected by Snell's reflection law due to the difference in refractive index between the air and the transparent substrate 110. Occurs. The reflected light varies depending on the refractive index of the transparent substrate 110 and the beam diffusion angle around the light emission center axis of the light emitting diode 150, but is generally generated at about 4 to 10% with respect to the light beam emitted from the light emitting diode 150.

Therefore, when the refractive inhibitor filling layer 162 is filled between the light emitting diodes 150 and the transparent substrate 110, the reflected light may be reduced to increase light utilization efficiency.

On the other hand, the angle of inclination of the inclined portion 114 of the transparent substrate 110 is in accordance with Snell's law so that the light emitted from the light emitting diode 150 and incident on the transparent substrate 110 can be totally reflected in the transparent substrate 110. Therefore, it is preferable to determine the inclination angle inclined more than the critical angle that determines the total reflection condition.

Preferably, when the angle between the extension line of the display portion 112 and the inclined portion 114 is an inclination angle θ, the inclination angle θ of the inclined portion 114 is based on the extension line of the display portion 112. To be inclined at 15 ° to 50 °.

On the other hand, when the side frame 120 and the transparent substrate 110 is not coupled to each other by the cap described above, the side frame 120 and the transparent substrate 110 to strengthen the coupling force of the side frame 120 and the transparent substrate 110 Of course, it can be finished with a tacky sealant along the lines which are in contact with each other.

The sign board 100 has the light suppressing filling layer 162 from the light emitting diode 150 installed to be exposed to the first receiving groove 131 of the side frame 120 toward the side of the transparent substrate 110. The light enters into the transparent substrate 110 and enters into the transparent substrate 110, and the dye of the groove 118 formed on the back 112a of the display portion 112 is reflected in the transparent substrate 110. The arrived light is scattered and projected onto the front surface 112b of the transparent substrate 110 to display display information.

As described above, the sign board using the light emitting diode according to the present invention provides an advantage of being able to variably couple to the thickness of the transparent substrate while increasing the light utilization efficiency.

Claims (4)

A transparent substrate having a display portion extending horizontally the same length horizontally and an inclined portion extending gradually from the end of the display portion, the display information being formed on one surface of the display portion; The first and second coupling ribs spaced apart from each other to allow a portion of the display portion to enter from the inclined portion of the transparent substrate are formed to protrude from the body to form a first accommodating groove. Opposite the first and second coupling ribs, the main profile having third and fourth coupling ribs extending in a direction opposite to the protruding direction of the first and second coupling ribs, and the third and fourth of the main profile. And a cover profile formed to be fitted with the coupling rib to close the second receiving groove from the body with respect to the protruding direction of the third and fourth coupling ribs, and the transparent substrate through the first receiving groove. Coupled side engagement frames; A plurality of light emitting diodes mounted on the body of the main profile through a plurality of light source mounting holes spaced apart from each other along a direction perpendicular to the direction in which the coupling ribs protrude; And a circuit board electrically connected to the light emitting diode mounted in the second accommodation groove to drive the light emitting diode. The main profile is formed of a metal material and has a surface on a position spaced apart from each other to each of the first and second coupling ribs so as to expand or reduce the separation width of the first and second coupling ribs by bending. And a plurality of bent guide grooves formed to be pulled in from and extending vertically along the extending direction of the body. The sign board using a light emitting diode according to claim 1, further comprising a refractory filling layer filled with a transparent material between the light emitting diode and the end of the inclined portion of the transparent substrate. The sign board according to claim 2, wherein a reflection layer is further formed on an inner surface of the body opposite to the end of the inclined portion. 4. The sign board of claim 3, wherein the housing of the light emitting diode is closely coupled with the main profile around the light source mounting hole to radiate heat through the main profile.

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