KR20070102080A - Catalyst precursor containing resin composition for electro-magnetic shielding and method for preparing metallic pattern using the same - Google Patents

Abstract

A catalyst precursor resin composition for electromagnetic wave shielding and a method for preparing metallic patterns by using the same are provided to improve the deposition property by virtue of sufficient amount and higher uniformity of a catalyst. A catalyst precursor resin composition for electromagnetic wave shielding comprises (a) an organic polymer resin, (b) a polyfunctional monomer having an ethylenically unsaturated bond, (c) a photoinitiator and/or a photointensifier, (d) a silver catalyst precursor for electroless plating and (e) an organic solvent. In the resin composition, the organic polymer resin is a copolymer of a carboxyl group-containing monomer and an unsaturated double bond-containing monomer. A method for preparing metallic patterns comprises the steps of: providing the resin composition, applying the resin composition onto a transparent substrate, developing by exposure of the resin composition applied onto the transparent substrate, and performing electroless plating of the developed film.

Description

Catalyst Precursor Resin Composition for Electromagnetic Shielding and Metal Pattern Manufacturing Method Using the Same {Catalyst Precursor Containing Resin Composition For Electro-Magnetic Shielding and Method for Preparing Metallic Pattern Using the Same}

1 is a cross-sectional profile of a typical pattern film.

2 is a photograph of a copper electroless plated metal pattern according to the Examples and Comparative Examples of the present invention.

The present invention relates to a catalyst precursor resin composition for shielding electromagnetic waves and a method of manufacturing a metal pattern using the same, and more particularly, to produce a fine metal pattern using a silver precursor-containing resin composition, an electromagnetic shielding material obtained therefrom Is excellent in light transmittance, and can be usefully used for shielding electromagnetic waves generated from the front surface of a display such as CRT, PDP, liquid crystal, and EL.

Recently, as various types of displays are commercially available, harmful effects of human body and malfunction of devices due to electromagnetic interference (EMI) generated from such displays are emerging as major problems. In order to solve this problem, a conductive shielding film is formed on the front of the display to distort the traveling direction of the electromagnetic wave, and then grounded and emitted.

As a method of shielding electromagnetic noise generated from the front surface of a display such as a CRT or PDP, a method of depositing a metal or metal oxide on a transparent substrate and forming a thin conductive film is known, but such a method requires that a thin film be deposited to provide transparency. In this case, sufficient electromagnetic shielding effect cannot be obtained because the surface resistance of the conductive layer becomes too large.

In addition, an electromagnetic wave shielding material in which conductive fibers are embedded in a transparent substrate may be manufactured, but this is not suitable for display applications due to impaired transparency, and a method of forming an electromagnetic shielding film by exposing and etching a metal thin film formed on the transparent substrate Although known, this has a problem in that the manufacturing process is complicated and a large amount of etching treatment solution is generated due to the etching process.

In addition, a method of forming an electromagnetic shielding film by patterning conductive pastes or electrolessly or plating the conductive pastes by printing such as screen printing or offset printing has been reported. However, in this case, there is a limitation in the accuracy of the printed circuit and irregularities The problem is that the conductive materials seep into the part.

In addition, a method of forming a metal layer and processing by plating or electroless plating has been proposed, but a photodevelopment method requires several layers, and a complicated process is disadvantageous. The metal catalyst is mixed with a photosensitive resin and developed. It is reported that after performing electroless plating and electrolytic plating, this method does not specifically present a method of using expensive Pd as a catalyst and solving a problem in forming a fine pattern and electroless plating.

Accordingly, the present invention is to solve the problems of the prior art as described above, an object of the present invention is to provide a catalyst precursor resin composition capable of forming a fine metal pattern as well as deposition characteristics during electroless plating with a sufficient amount of catalyst and high uniformity. It is to provide.

It is also an object of the present invention to provide a method for producing a metal pattern using the catalyst precursor resin composition.

Furthermore, an object of the present invention is to provide a transparent electromagnetic shielding material comprising a metal pattern provided according to the above method.

According to the present invention, there is provided a composition comprising (a) an organic polymer resin; (b) polyfunctional monomers having ethylenically unsaturated bonds; (c) photoinitiators and / or photosensitizers; (d) silver precursor catalysts for electroless plating; And (e) an organic solvent comprising a resin composition for shielding electromagnetic waves.

In addition, according to the present invention,

(a) providing a resin composition;

(b) applying the resin composition to a transparent substrate;

(c) exposing and developing the resin composition applied to the transparent substrate; And

(d) electroless plating the exposed and developed film

Provided is a method of manufacturing a metal pattern comprising a.

Furthermore, according to the present invention, there is provided a transparent electromagnetic shielding material including a metal pattern provided according to the manufacturing method.

Hereinafter, the present invention will be described in more detail.

The present inventors have studied for the development of the electromagnetic wave shielding material, when forming a pattern using a specific silver precursor-containing resin composition, and then forming a metal pattern by electroless plating, it is possible to form a uniform and fine metal pattern In addition, by performing electroless plating after the catalyst pattern, it was found that the production process can be manufactured with a simplified metal pattern, thereby completing the present invention.

In one embodiment of the present invention, the resin composition of the present invention (a) an organic polymer resin; (b) polyfunctional monomers having ethylenically unsaturated bonds; (c) photoinitiators and / or photosensitizers; (d) silver precursor catalysts for electroless plating; And (e) an organic solvent.

The organic polymer resin constituting the resin composition of the present invention stabilizes the catalyst in the composition and controls the developability of the composition containing the catalyst. Generally, when the content of the catalyst is large, the deposition rate increases during electroless plating. However, there is a problem that the stability and developability is reduced. In the present invention, in consideration of such a problem, a copolymer of a monomer containing a carboxyl group and a monomer copolymerizable therewith is used. For example, the monomer having a carboxyl group is preferably an unsaturated carboxylic acid, but is not limited thereto. For example, acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethylmaleic acid, isoprenesulfonic acid, Styrenesulfonic acid, 5-norbornene-2-carboxylic acid, and the like. Although it does not specifically limit as a monomer copolymerizable with the said carboxyl group-containing monomer by this, The compound which has an unsaturated double bond is preferable, and the thing which does not have an aromatic functional group from the viewpoint of kneading | mixing with a metal catalyst is suitable. In addition, in order to improve the adhesion between the catalyst-forming layer and the substrate, a polymer resin in which an ethylenically unsaturated compound having an epoxy and a hydroxy group is added to the copolymer may be used, and in order to improve the developing characteristics, the ethylenically unsaturated group may be used as a pendant. The polymer resin which introduce | transduced the added polymer can be used.

The organic polymer resin can be adjusted according to the amount and type of catalyst, but in order to be used for electroless plating, the weight average molecular weight of the organic polymer resin is 3,000 to 50,000, preferably 5,000 to 30,000 and the acid value is 100 to It is preferable for formation of a fine pattern that it is 700 mgKOH / g, Preferably it is 120-500 mgKOH / g.

At this time, when the molecular weight of the organic polymer resin is 3,000 or less, it is difficult to form the adhesive layer at the time of development and to form a catalyst layer of the fine pattern, and when the molecular weight is 50,000 or more, the solubility of the developer may be lowered and development defects may occur.

Moreover, when the acid value of the said organic polymer is 100 mgKOH / g or less, compatibility with a catalyst falls, it is difficult to obtain a uniform metal film after electroless plating, and the solubility of alkaline developing solution is low, and development defects are easy to generate | occur | produce. On the other hand, when the acid value of the organic polymer is 700mgKOH / g or more, solubility is too high to form a fine pattern of the catalyst layer during development, problems such as peeling during electroless plating may occur.

The polyfunctional monomer having an ethylenically unsaturated bond constituting the catalyst precursor resin composition of the present invention is for promoting photocuring and improving developability, and for improving adhesion, chemical resistance, etc. of the catalyst forming film during electroless plating, As such a polyfunctional monomer, for example, ethylene glycol diacrylate, ethylene glycol dimethacrylate, polyethylene glycol diacrylate having the number of ethylene groups 2 to 14, or polyethylene glycol dimethacrylate, trimethylol propane triacryl Latex, trimethylol propanetri methacrylate, pentaerythritol triacrylate, pentaerythritol tri methacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, propylene glycol diacrylate with 2-14 number of propylene groups, Or propylene glycol dimeth Compounds obtained by esterifying polyhydric alcohols such as acrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate and the like with α, β-unsaturated carboxylic acid ; Compounds obtained by adding acrylic acid or methacrylic acid to a compound containing a glycidyl group such as trimethylolpropane triglycidyl ether acrylic acid adduct and bisphenol A diglycidyl ether acrylic acid adduct; hydroxyl group or ethylenically unsaturated such as phthalic acid ester of β-hydroxyethyl acrylate or β-hydroxyethyl methacrylate, toluene diisocyanate of β-hydroxyethyl acrylate or β-hydroxyethyl methacrylate, and the like The ester compound of the compound which has a bond, and polyhydric carboxylic acid, or the adduct of polyisocyanate, etc. are mentioned.

The monomer having a polyfunctional group having an ethylenically unsaturated bond has an excellent developability when the number of functional groups having an ethylenically unsaturated bond is 3 or more, and is more preferable in terms of fine catalyst pattern shape and chemical resistance adhesive properties during electroless plating.

As for the monomer of the polyfunctional group which has the said ethylenically unsaturated bond, 20-150 weight part is suitable with respect to 100 weight part of said organic polymer resins. At this time, when the content of the monomer of the multifunctional group is less than 20 parts by weight, sufficient curing is not performed, so that formation of a fine pattern of the catalyst is difficult, and defects such as dissolution and peeling may occur during electroless plating. On the other hand, when the monomer content of the multifunctional group is 150 parts by weight or more, the coating property is poor and it is difficult to form a fine catalyst pattern because it is not uniformly cured to the inside.

There is no particular restriction on the kind of photoinitiator and / or photosensitizer constituting the catalyst precursor resin composition of the present invention. For example, acetophenones, benzophenones, Michler benzoylbenzoate, α- Amyloxime esters or thioxanthones can be used, and as the photosensitizer, for example, n-butylamine, triethylamine, tri-n-butyl hospine and the like can be used.

The amount of the photoinitiator is preferably 1 to 25 parts by weight, more preferably 5 to 20 parts by weight based on 100 parts by weight of the organic polymer resin. The amount of the photosensitizer is preferably added in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the organic polymer resin and the photoinitiator.

The catalyst constituting the catalyst precursor resin composition of the present invention preferably uses a silver precursor in terms of catalyst performance and production cost of electroless plating, and more preferably silver acetate, silver acetylacetonate, silver benzoate and silver carbonate. , Silver salts such as silver nitrate, silver cyanate, silver acenate, silver bromate, silver chromate, silver cyanide, silver cyclo hexabutyrate or the silver salts described above with ethyl acetoacetate, ethyl 2-chloroacetoacetate, ethyl 4-chloro acetoacetate, ethyl 2-methyl acetoacetate, methyl acetoacetate, methyl 2-chloro acetoacetate, methyl 4-chloro acetoacetate, 2,3-pentanedione, 3-chloro-2,4-pentanedione , 3,5-heptanedione, 5,5-dimethyl-2,4-hexanedione, 1,1,1-trifluoro-2,4-pentanedione Or a silver complex salt compound formed with 5,5-dimethyl-1,1,1, -trifluoro-2,4-hexanedione or the like can be preferably used.

The amount of the silver precursor catalyst in the resin composition is 20 to 120% by weight based on the organic solids (solids of the whole composition). In the resin composition of the present invention, when the amount of the catalyst is less than 20% by weight relative to the organic solids, the amount of the catalyst is not sufficient, so that it takes a long time to manufacture the metal film during electroless plating, and it is difficult to produce a uniform metal film. On the other hand, when the amount of the catalyst is more than 120% by weight, developability is difficult to form a uniform fine catalyst pattern of 20㎛ or less, the adhesion properties may be lowered.

The solvent (e) of the resin composition of the present invention is not particularly limited thereto, for example, alcohols such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, or propylene glycol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone, or n-methyl-2-pyrrolidone; Aromatic hydrocarbons such as toluene, xylene, or tetramethylbenzene; Glycol ethers such as cellosolve, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, propylene glycol ethyl ether, dipropylene glycol monomethyl ether, or dipropylene glycol ethyl ether; And at least one selected from the group consisting of acetates such as ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, propylene glycol monomethyl ether acetate, or propylene glycol ethyl ether acetate. It is possible.

The resin composition of this invention may further contain additive components, such as surfactant for improving applicability | paintability and the adhesive adjuvant for improving the adhesive force with a base material as needed. The compounding quantity of such an additive is not particularly limited as long as it is a range that does not affect the developability or electroless plating properties of the catalyst forming composition of the present invention.

In another embodiment of the present invention, a method of manufacturing a metal pattern by applying a resin composition provided according to the present invention to a transparent substrate, exposing and developing the catalyst layer to form a catalyst layer, and then electroless plating the exposed and developed film. Is provided. In addition, the exposed and developed film prior to electroless plating can be further treated with a reducing agent.

First, the resin composition of this invention provided as above is apply | coated to a base material, and it exposes and develops a catalyst formation layer. The substrate used in the present invention uses a transparent substrate for the production of a transparent electromagnetic wave shielding material, such a transparent substrate, but is not limited to this, for example, glass, polycarbonate, acrylic resin, PET, TAC, polyvinyl chloride Plastic sheets or plastic films such as resins, polyamide resins, polyimide resins, and the like can be used.

The method of applying the resin composition of the present invention to the substrate as described above is not particularly limited, and may vary depending on the characteristics and the coating amount of the coating liquid. For example, roll coating, gravure coating, dip coating, bar coating, spray coating, Or it can carry out by conventional methods, such as spin coating.

The well-known method can be used for the image development and exposure process of this invention. For example, as an exposure process, a contact or non-contact exposure method can be used using a mask having an exposure pattern, and a conventional light source such as a halogen lamp, a high pressure mercury lamp, a metal halide lamp or the like can be used as the light source. The developing process can be developed using a spray method or a dipping method. As for the shape of the catalyst formation pattern manufactured by exposure developing, the width | variety of a line is 30 micrometers or less, Preferably it is 20 micrometers or less. Moreover, the resin composition of this invention is fully applicable also to the fine pattern formation of 10 micrometers or less. In addition, the aperture ratio of visible light is preferably at least 60%, more preferably at least 70%.

The catalyst pattern developed as described above is subsequently applied to the electroless plating, which can use a known electroless plating technique, and copper plating is preferable in terms of price and electromagnetic shielding performance. As the compound used for electroless copper plating, a conventional known plating solution can be used, and for example, a known material such as a metal ion salt such as copper sulfate, a reducing agent such as formalin, and a stabilizer such as EDTA can be used. On the other hand, optionally, ascorbic acid, sodium borohydride, triethylamine and the like may be further treated with a reducing agent or UV to form a metal pattern by exposing and developing the film before the electroless plating treatment.

The thickness of the final electromagnetic shielding film including the metal pattern manufactured as described above is controllable according to the metal salt or metal ion concentration of the plating bath, the plating temperature, the deposition time, and the like, preferably 0.3 μm or more, more preferably 0.5 μm or more. More preferably, 1 micrometer or more is preferable.

As described above, since the metal pattern manufactured using the silver precursor-containing resin composition of the present invention is fine and has excellent uniformity, the electromagnetic wave shielding material including the metal pattern obtained therefrom has high light transmittance, and thus CRT, PDP, liquid crystal It can be usefully used for shielding electromagnetic waves generated from the front surface of a display such as EL and others.

Hereinafter, the present invention will be described in more detail with reference to the following Examples, which do not limit the present invention.

Synthesis Example of Organic Polymer Resin

Synthesis Example  One

In a 250 ml flask, 15.0 g MMA (Methyl methacrylate) and 15.0 g MAA (Methacrylic acid) were dissolved in 75.4 g of DPM (Dipropyleneglycol monomethyl ether), and 0.9 g of 3-MPA (3-mercaptopropionic acid) was added thereto and stirred. The mixed solution was heated to 60 ° C. under a nitrogen atmosphere and then stirred for 1 hour. A solution of 0.9 g AIBN (Azobisisobutyronitrile) dissolved in 10.0 g of the previously used solvent was added to a mixed solution at 60 ° C., and then the reaction was performed at the same temperature for 3 hours. The acid value of the organic polymer resin thus obtained was 348.77 mgKOH / g, and the weight average molecular weight was 7,933.

Synthesis Example  2

The organic polymer solution obtained in Synthesis Example 1 was heated to 80 ° C. and stirred for 30 minutes under oxygen atmosphere. The temperature of the solution was raised to 90 ° C., and then 0.15 g of DMAP (dimethyl amino pyridine) was added to 3 g of DPM. After raising the solution to 110 ℃, 12.4g GMA (glycidyl methacrylate) was added and stirred for 6 hours, the solution was cooled to room temperature. The acid value of the polymer thus obtained was 153.04 mgKOH / g, and the weight average molecular weight was 11,330.

Synthesis Example  3

Polymer synthesis was carried out in the same manner as in Synthesis Example 2, except that the amount of monomer was 21.0 g of MMA and 9.0 g of MAA, and the amount of DMAP was 0.09 g and 6.98 g of GMA. Thus prepared polymer has an acid value of 123.74 mgKOH / g, Mw was 11,635.

Synthesis Example  4

Polymer synthesis was carried out in the same manner as in Synthesis Example 2, except that 15.0 g of MMA and 15.0 g of MAA were used and 19.22 g of GMA were used. Accordingly, the acid value of the polymer was 85 mgKOH / g and Mw was 12,329.

Example

Example  One

The coating solution was prepared in the following composition.

5.81 g of a polymer solution obtained from Synthesis Example 1 and 2.68 g of a DPHA (dipentaerythritol hexa-acrylate) solution (50 wt% in PGMEA), 0.185 g of Taz107 (2,4-bis (trichloromethyl)-(piplronyl) -6-triazine) as a photoinitiator Were mixed and 6.23 g of PGMEA was mixed with additional solvent. 10 g of AgNO ₃ (20 wt% in DMF) was further mixed into the mixed solution to prepare a coating solution. After spin-coating the glass substrate using this coating solution (500 rpm 10 seconds, 1500 rpm 20 seconds), hot plate baking was performed at 90 ° C. for 90 seconds. Thereafter, after performing UV exposure for 20 mW and 9 seconds using a photomask having a line / space = 5 μm / 300 μm, development was performed using an aqueous KOH solution, followed by washing with distilled water. The substrate on which the fine pattern was formed was subjected to chemical reduction for 5 minutes using 0.1 M ascorbic acid aqueous solution, and baked at 100 ° C. for 5 minutes to prepare an electroless plating final specimen. The copper fine pattern was produced using the copper electroless plating solution which uses formaldehyde as an oxidizing agent.

Example  2

A fine catalyst pattern substrate was prepared in the same manner as in Example 1, except that 4.53 g of the polymer solution obtained in Synthesis Example 2 was used and 7.50 g of PGMEA was used as an additional solvent.

Example  3

A fine catalyst pattern substrate was prepared in the same manner as in Example 1, except that 4.98 g of the polymer solution obtained in Synthesis Example 3 was used, and 7.05 g of PGMEA was used as an additional solvent.

Comparative example  One

A fine catalyst pattern substrate was prepared in the same manner as in Example 1, except that 4.14 g of the polymer solution obtained in Synthesis Example 4 was used, and 7.90 g of PGMEA was used as an additional solvent.

Comparative example  2

A substrate was manufactured in the same manner as in Example 1, except that 0.54 g of DPHA solution was used.

Comparative Example 3

A substrate was manufactured in the same manner as in Example 2, except that 1.5 g of AgNO ₃ solution was used.

Comparative Example 4

A substrate was prepared in the same manner as in Example 2, except that 17.0 g of AgNO ₃ solution was used.

Table 1 shows the results of the evaluation of the Examples and Comparative Examples before copper electroless plating using a microscopic observation and a contact thickness gauge α-step (manufactured by Veeco). The presence or absence of line defects is indicated as developability, and each item is shown in FIG. 1. Fig. 2 is a photograph comparing the copper pattern shapes when the copper electroless plating is performed for 1 minute.

TABLE 1

Developability pattern Recidu Thickness ELP Example 1 ○ 545nm 0nm 545nm ○ Example 2 ○ 449 nm 0nm 449 nm ○ Example 3 △ 441 nm 68 nm 509nm ○ Comparative Example 1 Ⅹ Heterogeneity Heterogeneity Heterogeneity - Comparative Example 2 Ⅹ Almost no pattern Almost no pattern Almost no pattern - Comparative Example 3 ○ 660 nm 0nm 660 nm Ⅹ Comparative Example 4 Ⅹ Almost no phenomenon Almost no phenomenon Almost no phenomenon -

In the case of Examples 1 and 2, there was no clear residue in which no residue was left, and in Example 3, there was no great difficulty in pattern formation. In the case of the well-formed embodiment, the electroless copper plating (ELP) was made at a sufficient speed of 75 nm / min, and the copper pattern was well formed. In the case of Comparative Example 1 using an organic polymer resin having a low acid value, Comparative Example 2 containing less polyfunctional monomer (DPHA) having an ethylenically unsaturated bond, and Comparative Example 4 using an excessive amount of silver salt (silver nitride), pattern formation It didn't go right. In Comparative Example 3 using a small amount of silver salt, there was no problem in pattern formation. However, when electroless copper plating was performed, no copper pattern was formed, and the plating rate was not sufficient.

By applying the resin composition for electromagnetic wave shielding according to the present invention to a metal pattern, it is possible to manufacture a fine metal pattern, the electromagnetic wave shielding material obtained therefrom is excellent in light transmittance and can be suitably used for displays such as CRT, PDP, liquid crystal, EL, etc. .

Claims (19)

(a) an organic polymer resin; (b) polyfunctional monomers having ethylenically unsaturated bonds; (c) photoinitiators and / or photosensitizers; A resin composition for electromagnetic shielding, comprising (d) a silver precursor catalyst for electroless plating and (e) an organic solvent. The resin composition for electromagnetic wave shield according to claim 1, wherein the organic polymer resin is a copolymer of a carboxyl group-containing monomer and an unsaturated double bond-containing monomer. 3. The carboxyl group-containing monomer according to claim 2, wherein the carboxyl group-containing monomer is composed of acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethylmaleic acid, isoprenesulfonic acid, styrenesulfonic acid and 5-norbornene-2-carboxylic acid. Resin composition for electromagnetic wave shield, characterized in that selected from the group. The resin composition for electromagnetic wave shield according to claim 1, wherein the organic polymer resin has a weight average molecular weight of 3,000 to 50,000 and an acid value of 100 to 700 mg / KOH / g. The method of claim 1, wherein the polyfunctional monomer having an ethylenically unsaturated bond is ethylene glycol diacrylate, ethylene glycol dimethacrylate, polyethylene glycol diacrylate having 2 to 14 ethylene groups, or polyethylene glycol dimethacryl Rate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, the number of propylene groups 2-14 Polyhydric eggs, such as phosphorus propylene glycol diacrylate or propylene glycol dimethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, and dipentaerythritol hexamethacrylate Compound obtained by esterifying all the α, β- unsaturated carboxylic acid; Compounds obtained by adding acrylic acid or methacrylic acid to a compound containing a glycidyl group such as trimethylolpropane triglycidyl ether acrylic acid adduct and bisphenol A diglycidyl ether acrylic acid adduct; Phthalic acid ester of β-hydroxyethyl acrylate or β-hydroxyethyl methacrylate, hydroxyl group or ethylenically unsaturated bond of an adduct of toluene diisocyanate of β-hydroxyethyl acrylate or β-hydroxyethyl methacrylate It is an ester compound of a compound and polyhydric carboxylic acid, or an adduct of polyisocyanate, The resin composition for electromagnetic wave shielding characterized by the above-mentioned. The resin composition for electromagnetic wave shield according to claim 5, wherein the polyfunctional monomer having an ethylenically unsaturated bond has three or more functional groups having an ethylenically unsaturated bond. The resin composition for electromagnetic shielding according to claim 5, wherein the polyfunctional monomer having an ethylenically unsaturated bond is added in an amount of 20 to 150 parts by weight based on 100 parts by weight of the organic polymer resin. The photoinitiator is acetophenones, benzophenones, Michler benzoyl benzoate, α-amyloxime ester, or thioxanthones, wherein the photosensitizer is n-butylamine, triethyl A resin composition for electromagnetic wave shielding, which is an amine or a tri-n-butyl hose pine. The method of claim 8, wherein the photoinitiator is used in 1 to 25 parts by weight based on 100 parts by weight of the organic polymer resin, the photosensitizer is used in 0.1 to 10 parts by weight based on 100 parts by weight of the organic polymer resin and photoinitiator. Resin composition for electromagnetic wave shielding. The resin composition for electromagnetic shielding according to claim 1, wherein the silver precursor catalyst for electroless plating is silver salt or silver complex salt. The method of claim 10, wherein the silver precursor catalyst for electroless plating is silver acetate, silver acetylacetonate, silver benzoate, silver carbonate, silver nitrate, silver cyanate, silver acenate, silver bromate, silver chromate, At least one silver salt selected from the group consisting of silver cyanide, and silver cyclo hexabutyrate, or the silver salts disclosed above with ethyl acetoacetate, ethyl 2-chloro acetoacetate, ethyl 4-chloro acetoacetate, ethyl 2-methyl Acetoacetate, methyl acetoacetate, methyl 2-chloro acetoacetate, methyl 4-chloro acetoacetate, 2,3-pentanedione, 3-chloro-2,4-pentanedione, 3,5-heptanedione, 5 , 5-dimethyl-2,4-hexanedione, 1,1,1-trifluoro-2,4-pentanedione, and 5,5-dimethyl-1,1,1, -trifluoro With -2,4-hexanedione With the property to be selected from the group of compounds the resin composition for shielding electromagnetic wave, it characterized in that a complex salt compound. The resin composition for electromagnetic shielding according to claim 1, wherein the silver precursor catalyst for electroless plating is added at 20 to 120% by weight based on the organic solids. The method of claim 1, wherein the organic solvent is alcohol, such as methanol, ethanol, n-propanol, isopropanol, ethylene glycol, propylene glycol; Ketones such as acetone, methyl ethyl ketone, cyclohexanone and n-methyl-2-pyrrolidone; Aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; Glycol ethers such as cellosolve, methyl cellosolve, ethyl cellosolve, 3-methoxypropylene acetate, propylene glycol monomethyl ether, propylene glycol ethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol ethyl ether; Ethyl acetate, butyl acetate, cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, propylene glycol monomethyl ether acetate, propylene glycol ethyl ether acetate, a resin composition for electromagnetic shielding, characterized in that. Providing a resin composition according to claim 1; Applying the resin composition to a transparent substrate; Exposing and developing the resin composition applied to the transparent substrate; And Steps to Electroless Plating Method of manufacturing a metal pattern comprising a. 15. The method of claim 14, further comprising treating with the reducing agent after exposing and developing the resin composition. The method of claim 14, wherein the transparent substrate is a plastic sheet or plastic film, such as glass, polycarbonate, acrylic resin, PET, TAC, polyvinyl chloride resin, polyamide resin, polyimide resin, etc. Way. 15. The method of claim 14, wherein the electroless plating is copper plating, and a plating solution such as a metal ion salt such as copper sulfate, a reducing agent such as formalin, or a stabilizer such as EDTA is used. The metal pattern manufactured according to any one of claims 14 to 17. Electromagnetic shielding material comprising a metal pattern according to claim 18.

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