KR20070098011A - Photomask for fabricating barrier rib of pdp and method of fabricating pdp using the photomask - Google Patents

Abstract

A photomask for manufacturing a barrier rib of a PDP(Plasma Display Panel) and a method of manufacturing the PDP using the photomask are provided to increase the size of a discharge cell by arranging an auxiliary pattern on a corner of a main pattern. A barrier rib film(113) is formed on a substrate(110). A photoresist layer(117) is formed on the barrier rib film. The photoresist layer is exposed to light by using an exposure mask, which includes plural optical transmittance adjusting patterns. The optical transmittance adjusting pattern contains a main pattern and an auxiliary pattern, which is formed on a corner of the main pattern. An aperture(117p) for exposing the barrier rib film is formed inside the photoresist layer. The exposed barrier rib film is etched by using the photoresist layer as an etching mask such that a barrier rib for defining discharge cells is formed.

Description

Exposure mask for barrier rib manufacturing of plasma display panel and method for manufacturing plasma display panel using same {Photomask for fabricating barrier rib of PDP and method of fabricating PDP using the photomask}

1 is a partial perspective view of a plasma display panel according to an embodiment of the present invention.

2A through 2B are cross-sectional views sequentially illustrating a method of manufacturing a plasma display panel using an exposure mask according to an embodiment of the present invention.

<Brief description of symbols for the main parts of the drawings>

100: plasma display panel

110: back substrate 114: partition wall

116: phosphor layer 120: front substrate

115: address electrode 127: dielectric layer

125y: scan electrode 125z: sustain electrode

133: protective film 150: discharge cell

The present invention relates to a method of manufacturing an exposure mask and a plasma display panel, and more particularly, to an exposure mask for manufacturing a partition wall having an auxiliary pattern and a method of manufacturing a plasma display panel using the same.

Plasma display panel is a display panel that displays images by using gas discharge phenomenon. It is excellent in various display ability such as brightness, contrast, afterimage, and viewing angle, and it is being spotlighted as next generation large display panel because of its thin and large display. .

The plasma display panel includes a plurality of discharge cells corresponding to each pixel. The discharge cells are defined by partition walls, which serve to maintain the discharge distance and prevent electro-optical crosstalk between the discharge cells.

The method of forming such a partition is as follows. First, a barrier rib forming layer is laminated on a substrate, and a DFR (Dry Film Resist) is attached to the barrier forming layer, and the DFR is exposed using an exposure mask having a light blocking pattern to form a mask pattern by the DFR. . The barrier rib forming layer is etched using the mask pattern as a mask to form a barrier rib.

Due to the scattering effect of the exposure light in the exposure process, the mask pattern may not be formed in the same manner as the light blocking pattern but may have rounded corners. In addition, when the corner portion of the mask pattern is formed roundly, the partition wall formed correspondingly may also have the corner portion rounded. In this case, there is a disadvantage that the area of the light emitting cell is reduced.

The present invention provides an exposure mask capable of improving the shape of a barrier rib pattern and a method of manufacturing a plasma display panel using the same.

In order to achieve the above technical problem, an aspect of the present invention provides a method of manufacturing a plasma display panel. First, a partition film is formed on a substrate, and a photoresist layer is formed on the partition film. Openings for exposing the barrier film in the photoresist layer by exposing the photoresist layer as a mask using an exposure mask including a plurality of light transmittance control patterns including a main pattern and an auxiliary pattern at a corner of the main pattern as a mask. Form. By using the photoresist layer as an etching mask, the barrier film exposed in the opening is etched to form a barrier rib pattern defining a light emitting cell.

The light emitting cell may be formed such that its corners are angled. The photoresist layer may be a negative photoresist, and the auxiliary pattern may be a pattern protruding from an edge portion of the main pattern.

In order to achieve the above technical problem, another aspect of the present invention provides an exposure mask for manufacturing partition walls of a plasma display panel. The exposure mask includes a plurality of light transmittance control patterns including a main pattern and an auxiliary pattern at edge portions of the main pattern.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to describe the present invention in more detail. In the figures, where a layer is said to be "on" another layer or substrate, it may be formed directly on the other layer or substrate, or a third layer may be interposed therebetween. Like numbers refer to like elements throughout the specification.

1 is a partial perspective view of a plasma display panel according to an embodiment of the present invention.

Referring to FIG. 1, the plasma display panel 100 includes a first substrate 110 and a second substrate 120 spaced apart from each other and disposed to face each other. The first substrate 110 is a rear substrate, and the second substrate 120 corresponds to a front substrate.

The plurality of address electrodes 115 parallel to each other on the surface of the rear substrate 110 facing the front substrate 120 are arranged in a stripe shape extending in the X-axis direction. The light reflection layer 112 may be disposed on the back substrate 110 including the address electrodes 115. The light reflection layer 112 prevents visible light generated in a discharge cell, which will be described later, from being emitted to the outside through the back substrate 110. The light reflection layer 112 may be a white dielectric.

The partition wall 114 defining the light emitting cell 150 is disposed on the light reflection layer 112. The partition wall 114 is a lattice-shaped partition wall having a first rear partition wall 114a and a second rear partition wall 114b crossing the first rear partition wall 114a. Such a lattice partition can increase the area of the invention and thus has the advantage that the brightness can be increased. The partition wall 114 is illustrated as being rectangular, but is not limited thereto and may be a polygon of a square, a pentagon, or a hexagon. That is, the edge portion of the partition 114 is not a round shape but an angular shape. Therefore, the area of the light emitting cell 150 defined by the partition wall 114 can be increased.

The phosphor layer 116 is disposed on the sidewall of the partition wall 114 and the light reflection layer 112 exposed by the partition wall 114. The phosphor layer 116 includes phosphors that receive ultraviolet rays to generate visible light. The red phosphor layer includes phosphors such as Y (V, P) O ₄ : Eu, and the green phosphor layer is Zn ₂ SiO _4. Phosphors such as: Mn, YBO ₃ : Tb, and the like, and the blue light emitting phosphor layer includes phosphors such as BAM: Eu and the like.

On the other hand, the scanning electrode 125y and the sustaining electrode 125z are alternately arranged in parallel with each other in a direction crossing the address electrode 115 on the surface of the front substrate 120 facing the rear substrate 110. do. The scan and sustain electrodes 125y and 125z may be formed as a double layer of the transparent conductive layers 125y_1 and 125z_1 and the bus conductive layers 125y_2 and 125z_2. The transparent conductive layers 125y_1 and 125z_1 may be indium tin oxide (ITO) or indium zinc oxide (IZO), and the bus conductive layers 125y_2 and 125z_2 may be Ag or Cu.

A dielectric layer 127 is disposed on the front substrate 120 to cover the scan and sustain electrodes 125y and 125z. The dielectric layer 127 may be formed using a material having a high light transmittance in order to improve the opening ratio toward the front substrate 120.

The protective layer 133 covering the dielectric layer 127 is disposed on the dielectric layer 127. The protective layer 133 prevents plasma particles from damaging the dielectric layer 127 and lowers the discharge voltage by emitting secondary electrons. The protective layer 133 may be a magnesium oxide (MgO) layer.

Edges of the front substrate 120 and the rear substrate 110 are coupled to each other by a sealing member such as frit glass, and the discharge cells 150 are discharge gas, that is, Ne, Xe, or a mixture thereof. Is charged.

2A through 2B are cross-sectional views sequentially illustrating a method of manufacturing a plasma display panel using an exposure mask according to an embodiment of the present invention.

Referring to FIG. 2A, a plurality of address electrodes 115 extending in one direction may be formed on the rear substrate 110, and the light reflection layer 112 may be formed on the substrate 110 including the address electrodes 115. Form. The address electrode 115 may be formed using silver, copper, or aluminum.

The partition film 113 is formed on the light reflection layer 112 as a whole. The partition film 113 may be formed using a partition paste. The photoresist layer 117 is formed on the barrier film 113. The photoresist layer 117 may be a dry film resist (DFR). The photoresist layer 117 may be a negative photoresist layer in which a portion irradiated with light remains or a positive photoresist layer in which a portion not irradiated with light remains, but is preferably a negative photoresist.

Subsequently, the exposure mask P is aligned on the back substrate 110 on which the photoresist layer 117 is formed. The exposure mask P includes a light transmittance control pattern 200p. The light transmittance control pattern 200p may be a light blocking pattern that blocks light or a light transmission pattern that transmits light, but is preferably a light blocking pattern. The light transmittance control pattern 200p includes a main pattern 200p_a and an auxiliary pattern 200p_b at an edge portion of the main pattern 200p_a. When the light transmittance control pattern 200p is a light blocking pattern, the auxiliary pattern 200p_b may be a pattern protruding to the outside of the main pattern 200p_a, as shown in FIG. In the case of the light transmission pattern, the auxiliary pattern 200p_b may be a pattern recessed into the main pattern 200p_a. In addition, the auxiliary pattern 200p_b is illustrated as having a rectangular shape, but is not limited thereto.

Subsequently, light is irradiated onto the exposure mask P. As a result, an opening 117p for exposing the partition film 113 is formed in the photoresist layer 117. The opening 117p has an angled edge. This is because the auxiliary pattern 200p_b cancels the scattering effect of the exposure light during the light irradiation process.

Referring to FIG. 2B, the barrier film 113 is etched using the photoresist layer 117 having the opening 117p as a mask. Etching the partition film 113 may be performed using a sand blasting method. As a result, the partition wall 114 in which the discharge cells 150 are defined is formed in the partition film 113. The shape of the discharge cell 150 corresponds to the opening 117p. Thus, the discharge cell 150 also has an angular edge. As a result, the area of the light emitting cell 150 defined by the partition wall 114 may be increased.

Subsequently, the phosphor layer 116 is formed on the sidewalls of the partition wall 114 and the light reflection layer 112 exposed in the discharge cell 150.

As described above, according to the present invention, the light transmittance control pattern of the exposure mask for manufacturing the partition wall has a main pattern and an auxiliary pattern at the corners of the main pattern, and by forming the partition wall using such an exposure mask, an angled edge It is possible to form a discharge cell having a. As a result, the area of the light emitting cell can be increased.

Although described above with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and changed within the scope of the invention without departing from the spirit and scope of the invention described in the claims below I can understand that you can.

Claims (5)

Forming a barrier film on the substrate, Forming a photoresist layer on the barrier film, Openings for exposing the barrier film in the photoresist layer by exposing the photoresist layer as a mask using an exposure mask including a plurality of light transmittance control patterns including a main pattern and an auxiliary pattern at a corner of the main pattern as a mask. Forming, And forming a barrier rib defining a light emitting cell by etching the barrier rib film exposed in the opening using the photoresist layer as an etching mask. The method of claim 1, The light emitting cell is a manufacturing method of the plasma display panel, characterized in that the corner portion thereof is formed. The method of claim 1, The photoresist layer is a negative photoresist, And wherein the auxiliary pattern is a pattern protruding from an edge portion of the main pattern. An exposure mask for manufacturing barrier ribs of a plasma display panel, the apparatus comprising: a main pattern and a plurality of light transmittance control patterns including auxiliary patterns at edge portions of the main pattern. The method of claim 4, wherein And the auxiliary pattern is a pattern protruding from an edge portion of the main pattern.

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