KR20070056847A - Donor substrate for flat panel display device and method of fabricating oled using the same - Google Patents

Abstract

A donor substrate for a flat panel display device and a method of fabricating an organic electroluminescence display device are provided to prevent a transfer film from being stuck on a device substrate by patterning an intermediate layer of the donor substrate. A donor substrate includes a base film(55), a light-heat conversion layer(60) positioned on the base film, a transfer layer(70) positioned on the light-heat conversion layer, and a patterned intermediate layer(65) interposed between the light-heat conversion layer and the transfer layer. The patterned intermediate layer corresponds to a device formed on a device substrate, and is made of an acryl resin or an alkyd resin.

Description

Donor substrate for flat panel display device and method of fabricating OLED using the same}

1 is a cross-sectional view illustrating a conventional donor substrate for a flat panel display device.

2 is a cross-sectional view illustrating a donor substrate for a flat panel display device and a method of manufacturing the same according to an embodiment of the present invention.

3 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

       <Explanation of symbols for the main parts of the drawings>

10, 50. Donor substrate 15, 55. Base film

20, 60. Light-to-heat conversion layer 25, 65. Interlayer

30, 70. Transfer layer 100. Device substrate

150. Lower electrode 170. Pixel defining layer

180. Organic film pattern 200. Laser

The present invention relates to a donor substrate for a flat panel display device and a method of manufacturing an organic light emitting device using the same, and more particularly, to coat a patternable material on the intermediate layer of the donor substrate and to correspond to the device formed on the device substrate By using the lithography method, the film transferred from the transfer layer of the donor substrate is prevented from being buried or teared off the device substrate, and the open defect that the transferred film can be generated at the edge of the device substrate is prevented. The present invention relates to a removable donor substrate for a flat panel display device and a method of manufacturing an organic light emitting display device using the same.

In general, an organic light emitting display device as a flat panel display device includes a lower electrode and an upper electrode and an organic layer interposed between the lower electrode and the upper electrode. The organic layer may include at least a light emitting layer, and may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer in addition to the light emitting layer. The organic light emitting diode is divided into a polymer organic light emitting diode and a low molecular organic light emitting diode according to the organic layer, in particular, the light emitting layer.

In the organic light emitting diode, in order to implement a full-color organic light emitting diode, the light emitting layer needs to be patterned. As a method for patterning the light emitting layer, a small metal organic light emitting diode uses a fine metal mask. There is a method, and in the case of a polymer organic electroluminescent device, there is ink-jet printing or laser induced thermal imaging (hereinafter referred to as LITI). Among these, the LITI has the advantage of finely patterning the organic film, and the ink-jet printing is a wet process, whereas the LITI has a dry process.

The method of forming a pattern of the polymer organic film by LITI requires at least a light source, a substrate of an organic light emitting device, that is, a device substrate and a donor substrate, and the donor substrate is a transfer film composed of a base film, a photo-thermal conversion layer and an organic film. It is composed of layers. Patterning the organic film on the device substrate is that light from the light source is absorbed by the light-heat conversion layer of the donor substrate and converted into thermal energy, and the organic film forming the transfer layer is transferred onto the device substrate by the heat energy. Is performed. It is published in Korean Patent Application Nos. 1998-51844 and US Pat. Nos. 5,998,085, 6,214,520 and 6,114,088.

However, as shown in FIG. 1, the donor substrate 10 used in the conventional LITI process includes a flat multilayer organic film, that is, the light-to-heat conversion layer 20, the intermediate layer 25, and the base film 55. Although the transfer layer 30 is formed by stacking the donor substrate 10, the donor substrate 10 may be transferred to a flat substrate. However, when transferring the donor substrate 10 to the AMOLED having a predetermined element formed thereon, the flat donor substrate 10 may be used. Organic electroluminescence, such as drawing being forced due to mismatching of the surface on the substrate with the step difference and sometimes the transfer layer 30 of the donor substrate 10 which cannot withstand stress is monolayered There was a problem that causes a defect of the device.

The present invention is to solve the problems of the prior art, by coating a patternable material on the intermediate layer of the donor substrate and patterning the material using a lithography method to match the stepped device formed on the substrate, This prevents the transfer of the film transferred from the transfer layer of the donor substrate to the device substrate, and prevents the film from being peeled off from the device substrate. An object of the present invention is to provide a donor substrate for a flat panel display device capable of eliminating an open defect and an organic light emitting device using the same.

In order to achieve the above object, the donor substrate for a flat panel display device according to the present invention,

A base film;

A light-to-heat conversion layer (LTHC) positioned on the base film;

A transfer layer on the light-to-heat conversion layer; And

A donor substrate for a flat panel display device comprising: an intermediate layer interposed and patterned between the light-to-heat conversion layer and the transfer layer;

The patterned intermediate layer is formed to correspond to the device formed on the device substrate.

In addition, in order to achieve the above object, a method of manufacturing a donor substrate for a flat panel display device according to the present invention,

Providing a base film;

Forming a light-to-heat conversion layer (LTHC) on the base film;

Forming an intermediate layer on the light-to-heat conversion layer;

Patterning the intermediate layer; And

Forming a transfer layer on the patterned intermediate layer; and a method of manufacturing a donor substrate for a flat panel display device, the method comprising:

The intermediate layer is patterned to correspond to the device formed on the device substrate,

The patterning of the intermediate layer may include patterning by lithography;

The lithography method is characterized in that the exposure source is i-line, KrF, ArF, E-beam and X-ray.

In addition, the manufacturing method of the organic light emitting device according to the present invention using the donor substrate to achieve the above object,

Providing a device substrate;

A donor substrate manufactured by sequentially stacking a base film, a light-to-heat conversion layer, an intermediate layer patterned to match the device substrate, and a transfer layer, which is an organic layer, are sequentially stacked on the substrate film at a predetermined distance from the device substrate. Disposing the device substrate toward the device substrate;

A method of manufacturing an organic light emitting display device comprising forming an organic film pattern on the device substrate by irradiating a laser to a predetermined region of the donor substrate and transferring the transfer layer onto the device substrate;

The organic layer pattern is an electroluminescent organic layer, a hole injection organic layer, a hole transfer organic layer, an electron transfer organic layer, an electron injection organic layer, or a single layer film selected from the group consisting of two or more types of multilayer films. Characterized in that,

The organic layers may be organic layers each including a low molecular material.

Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail. The following embodiments are to be provided as an example to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, lengths, thicknesses, and the like of layers and regions may be exaggerated for convenience.

2 is a cross-sectional view illustrating a donor substrate for a flat panel display device and a method of manufacturing the same according to an embodiment of the present invention.

Referring to FIG. 2, the donor substrate 50 according to the present invention provides a base film 55. The base film 55 is made of a transparent polymer, and the transparent polymer uses polyester such as polyethylene terephthalate, polyacryl, polyepoxy, polyethylene, polystyrene, or the like. Among them, polyethylene terephthalate film is mainly used. The base film 55 should have suitable optical properties and sufficient mechanical stability as a supporting film. The thickness of the base film 55 is preferably 10 to 500 ㎛.

Subsequently, a light-to-heat conversion layer (LTHC) 60 is formed on the base film 55. The light-to-heat conversion layer 60 absorbs light in the infrared-visible light region and converts a part of the light into heat. The light-to-heat conversion layer 60 should have a suitable optical density and include a light absorbing material. The light-to-heat conversion layer 60 includes, for example, a metal film including aluminum oxide or aluminum sulfide as the light absorbing material, and a polymer organic film including carbon black, graphite, or infrared dye as the light absorbing material. In this case, the metal film is preferably formed to a thickness of 100 to 5,000Å by vacuum deposition, electron beam deposition, or sputtering, and in the case of the organic film, roll coating and gravure are common film coating methods. It is preferable to form to a thickness of 0.1 to 10㎛ using extrusion, spin and knife coating method.

Subsequently, an interlayer 65 is formed on the light-to-heat conversion layer 60. The intermediate layer 65 serves to prevent the light absorbing material, for example, carbon black, included in the light-to-heat conversion layer 60 from contaminating the transfer layer 70 formed in a subsequent process. The intermediate layer 65 may be formed of an acrylic resin or an alkyd resin. The formation of the intermediate layer 65 is performed through a general coating process such as solvent coating and a curing process such as ultraviolet curing, and is preferably formed to a thickness of 1 to 2 μm.

Next, the intermediate layer 65 is patterned to correspond to the device formed on the device substrate (100 in FIG. 2). By patterning the intermediate layer 65 as described above, when transferring the film of the transfer layer 70 to the element substrate 100, the protruding element portion is located inside the patterned film, so that the transfer is not carried out. The film of the layer 70 may be transferred to the device substrate 100. The patterning is generally formed by lithography, which is a process of coating, exposure and development, and preferably photolithography. Photoresist (PR) used in the lithography method has high resolution and high sensitivity, and can be divided into negative type PR (negative tone working PR) and positive type PR (positive tone working PR) according to polarity. Type PR is a generic name for PR where the exposed part remains after exposure as a pattern, and is composed of resin, PAG (Photo Acid Generator) and a crosslinking agent. The positive PR has a characteristic that the exposed part is removed by a developer. Resist, which is based on resist, photoresist and dissolution inhibitor.

In addition, the PR may be divided into i-line (365 nm), KrF (248 nm), ArF (193 nm), E-beam, X-ray, and the like depending on the exposure source. The i-line resist is generally referred to as a conventional resist, which is mainly composed of cresol novolak resin and has a photosensitive characteristic with respect to i-line (365 nm). The diazonaphtaquinone (DNQ) compound acts as a photoactive compound (PAC). The KrF resist is also referred to as chemically amplified resist, and chemically amplified resist means a resist having a quantum yield greater than 100%. The KrF resist is based on a resin and a photo acid generator (PAG), and in some cases, inhibitors are used to improve contrast and control solubility.

Subsequently, a transfer layer 70 is formed on the intermediate layer 65. The transfer layer 70 may be a single layer film or one or more multilayer films selected from the group consisting of an electroluminescent organic film, a hole injection organic film, a hole transport organic film, an electron transport organic film, and an electron injection organic film. Can be formed. The electroluminescent organic film, the hole injection organic film, the hole transport organic film, the electron transport organic film, and the electron injection organic film can be used as long as they are generally used materials. Preferably, the electroluminescent organic film is Alq3 (host) / DCJTB (fluorescent dopant), Alq3 (host) / DCM (fluorescent dopant), CBP (host) / PtOEP (phosphorescent organometallic complex), which is a red light emitting material. Low-molecular substances such as) and PFO-based polymers, and polymer materials such as PPV-based polymers can be used.Alq3, Alq3 (host) / C545t (dopant), CBP (host) / IrPPy (phosphorescent organometallic complexes) Low molecular weight materials such as) and high molecular weight materials such as PFO polymers and PPV polymers. In addition, low molecular weight materials such as DPVBi, Spiro-DPVBi, Spiro-6P, distilbene (DSB) and distyrylarylene (DSA), which are blue light emitting materials, and polymer materials such as PFO polymer and PPV polymer may be used. . As the hole-injectable organic film, low molecules such as CuPc, TNATA, TCTA, and TDAPB and polymer materials such as PANI and PEDOT may be used, and as the hole-transporting organic film, arylamine-based low molecules, hydrazone-based low molecules, and stilbene-based low molecules As starburst low molecules, low molecular weights such as NPB, TPD, s-TAD, MTADATA, and carbazole polymers, arylamine polymers, perylene polymers, and pyrrole polymers may be used, such as PVK. As the electron transporting organic film, polymers such as PBD, TAZ, spiro-PBD, and low molecular materials such as Alq3, BAlq, and SAlq may be used. In addition, the electron injection organic layer may be a low molecular material such as Alq3, gallium mixture (Ga complex), PBD or oxadiazole-based high molecular material.

Formation of the transfer layer 70 is coated to a thickness of 100 to 50,000 kPa using a general coating method such as extrusion, spin, knife coating method, vacuum deposition method, CVD, and the like.

3 is a cross-sectional view illustrating a method of manufacturing an organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 3, the device substrate 100 on which the lower electrode 150 is formed is provided. On the other hand, the donor substrate (50 in FIG. 1) is manufactured by sequentially laminating the light-to-heat conversion layer 60, the patterned intermediate layer 65, and the transfer layer 70, which is an organic film, on the base film 55.

Subsequently, the donor substrate 50 is disposed so that the transfer layer 70 faces the device substrate 100 at a position spaced apart from the device substrate 100 by a predetermined distance, and a laser (a laser beam) is disposed in a predetermined region of the donor substrate. 200 is irradiated to transfer the transfer layer 70 onto the lower electrode 150, thereby transferring the transfer layer 70 between the pixel definition layer 170 formed on the lower electrode 150 of the device substrate 100. ) Is formed to form the organic layer pattern 180 on the lower electrode 150.

The organic layer pattern 180 may be a single layer film or two kinds selected from the group consisting of an electroluminescent organic film, a hole injection organic film, a hole transport organic film, an electron transport organic film, and an electron injection organic film. It can be formed from the above multilayer film. The lower electrode 150 is an anode, and when the electroluminescent organic layer pattern 180 is formed on the lower electrode 150 using the donor substrate 50, that is, the light emitting layer is formed. The hole injection layer and / or the hole transport layer may be formed on the lower electrode 150 by spin coating or vacuum deposition. Subsequently, an electron transport layer and / or an electron injection layer may be formed on the emission layer by using LITI, vacuum deposition, or spin coating. Subsequently, a common electrode (not shown), which is a cathode, is formed on the electron transport layer and / or the electron injection layer, thereby completing an organic light emitting display device.

As described above, according to the present invention, the film transferred from the transfer layer of the donor substrate is prevented from being buried or broken off from the element substrate, and the edge of the element (pixel crystal film or the like) formed on the substrate having the transferred film is stepped. Eliminates open defects that may occur at the edges.

Claims (11)

Base film; A light-to-heat conversion layer on the base film; A transfer layer on the light-to-heat conversion layer; And And an intermediate layer interposed and patterned between the light-to-heat conversion layer and the transfer layer. The method of claim 1, And the patterned intermediate layer is formed to correspond to a device formed on the device substrate. The method of claim 1, A donor substrate for a flat panel display device, characterized in that the intermediate layer is formed of an acrylic resin or an alkyd resin. Providing a base film; Forming a light-to-heat conversion layer on the base film; Forming an intermediate layer on the light-to-heat conversion layer; Patterning the intermediate layer; And Forming a transfer layer on the patterned intermediate layer; manufacturing method of the donor substrate for a flat panel display device comprising a. The method of claim 4, wherein And patterning the intermediate layer so as to correspond to a device formed on the device substrate. The method of claim 4, wherein The patterning of the intermediate layer is a method of manufacturing a donor substrate for a flat panel display device, characterized in that for patterning using a lithography method. The method of claim 4, wherein The intermediate layer is a method of manufacturing a donor substrate, characterized in that formed of acrylic resin or alkyd resin. The method of claim 6, The lithographic method is a method of manufacturing a donor substrate for a flat panel display device, characterized in that the exposure source uses i-line, KrF, ArF, E-beam and X-ray. Providing a device substrate; The transfer layer comprises a donor substrate manufactured by sequentially stacking a base film, a light-to-heat conversion layer, an intermediate layer patterned to match the device substrate, and a transfer layer, which is an organic layer, at a position spaced apart from the device substrate by a predetermined distance. Disposing the device substrate toward the device substrate; And forming an organic layer pattern on the device substrate by irradiating a laser to a predetermined region of the donor substrate to transfer the transfer layer onto the device substrate. The method of claim 9, The organic layer pattern is an electroluminescent organic layer, a hole injection organic layer, a hole transfer organic layer, an electron transfer organic layer, an electron injection organic layer, or a single layer film selected from the group consisting of two or more types of multilayer films. Method for manufacturing an organic light emitting device, characterized in that. The method of claim 10, The organic film is a method of manufacturing an organic light emitting device, characterized in that each of the organic film containing a low molecular material.

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