KR20070056586A - Plasma display panel and method of making the same - Google Patents

Abstract

A plasma display panel and a method for manufacturing the same are provided to reduce the number of processes and to realize high luminance and efficiency by mixing a barrier rib material and a phosphor to integrally form a barrier rib and a phosphor layer. A binder, a barrier rib material, and a phosphor are mixed to manufacture separate phosphor barrier rib pastes(170a,170b,170c) which correspond to red, green and blue colors, respectively. The phosphor barrier rib pastes are applied onto a rear substrate(140) on which a lower dielectric layer(160) is formed. The phosphor barrier rib pastes are dried by using hot wind. The dried phosphor barrier rib pastes are fired in a high temperature. The binder is manufactured by mixing ethyl cellulose in a mixture solvent of butyl carbitol acetate and terpineol while the barrier rib material is manufactured by mixing ceramic powder or glass particles including PbO, SiO2 and B2O3.

Description

Plasma Display Panel and Method of Making the Same

1 is an exploded perspective view of a PDP according to an embodiment of the present invention;

2 is a layout view of an electrode and a discharge cell according to an embodiment of the present invention;

3 is a vertical cross-sectional view of the PDP according to an embodiment of the present invention (K-K cross-sectional view of Figure 2)

4 is a vertical cross-sectional view of a PDP according to another embodiment of the present invention.

5 is a block diagram of a PDP manufacturing step according to an embodiment of the present invention;

<Description of Symbols for Main Parts of Drawings>

100, 200-PDP 110, 220-Front panel

120, 220-display electrode 122, 222-X electrode

124, 224 Y electrode 130, 230 Upper dielectric layer

135, 235-Protective layer 140, 240-Back board

150, 250-A electrode 160, 260-Lower dielectric layer

170, 270-fluorescent bulkhead

The present invention relates to a plasma display panel and a method of manufacturing the same, and more particularly, by mixing the barrier material and the phosphor in a predetermined ratio to form the barrier rib and the phosphor layer integrally, there is no need to separately form the barrier rib and the phosphor layer. The present invention relates to a plasma display panel having a high brightness and high efficiency and a method of manufacturing the same, as well as solving the problem of narrowing the discharge space due to high resolution.

In general, a plasma display panel (hereinafter referred to as a PDP) is a display device that realizes an image by using visible light generated by excitation of a phosphor by vacuum ultraviolet rays (VUV) emitted from a plasma obtained through gas discharge. to be. Such a PDP can realize an ultra-large screen of 60 inches or more with a thickness of only 10 cm or less, and is a self-luminous display device such as a CRT. In addition, since the manufacturing method is simpler than LCD, it has advantages in terms of productivity and cost, and thus, it is being spotlighted as the next-generation industrial flat panel display and home TV display.

Such a conventional PDP generally includes a front substrate having a plurality of display electrodes and a back substrate having a plurality of address electrodes to intersect the display electrodes. In addition, a plurality of partition walls are formed between the front substrate and the rear substrate so as to partition the plurality of discharge regions. There are various structures of such a partition, such as stripe type, matrix type, and delta type.

Among these, in the case of a PDP having a delta partition, three discharge cells are normally adjacent to each other to form one pixel. Each of the discharge cells has a red (R) fluorescent layer, a green (G) fluorescent layer, and a blue (R) fluorescent layer. Three address electrodes are normally assigned to one pixel.

On the other hand, in recent years, as the resolution of the PDP is increased, that is, as the resolution is increased, the number of address electrodes gradually increases and the pitch between the address electrodes is also reduced. However, as is well known, as the pitch between address electrodes decreases, the capacitance value between address electrodes increases, and energy calculated as approximately CV ² f is consumed between the address electrodes. In other words, it is necessary to increase the power consumption of the address electrode to make a high resolution PDP. Since a discharge voltage much larger than that of the display electrode can be applied to the address electrode, an increase in power consumption of the address electrode is directly related to an increase in power consumption of the entire PDP. Here, C is a capacitance value generated between address electrodes, V is a voltage applied to the address electrode, and f is a frequency applied to the address electrode.

As the size of the cell decreases due to the high resolution, which is a major trend of the PDP technology, the discharge space becomes narrow. Therefore, there is a problem that the wall charges are not sufficiently formed on the electrodes because there is not enough charged particles in the discharge space. However, there is a problem that the discharge voltage is increased when using a gas of high Xe partial pressure. Therefore, there is a need to propose a barrier rib structure and an electrode structure that can reduce capacitance between address electrodes due to high resolution and solve a narrow problem of discharge space due to high resolution.

The present invention has been made to solve the above problems, and in particular, by mixing the barrier material and the phosphor in a predetermined ratio to form the barrier rib and the phosphor layer integrally, there is no need to separately form the barrier rib and the phosphor layer, thereby reducing the process. In addition, the purpose of the present invention is to provide a plasma display panel having a high brightness and high efficiency and a method of manufacturing the same by solving the problem of narrowing the discharge space due to high resolution.

Plasma display panel of the present invention devised to solve the above problems is a front substrate and a rear substrate facing each other; A fluorescent partition wall formed between the front substrate and the rear substrate to partition a discharge space and include a phosphor; First and second display electrodes formed between the front substrate and the rear substrate; Address electrodes formed on the rear substrate; And a lower dielectric layer formed to surround the address electrodes.

In addition, the fluorescent barrier ribs may be formed such that three adjacent discharge cells that emit visible light of different colors form one pixel, and two address electrodes pass through each of the one pixel. In addition, the fluorescent partition wall may be formed on the upper surface of the lower dielectric layer. In this case, the fluorescent barrier is preferably formed with a phosphor content of 20 to 70%, more preferably the fluorescent barrier may be formed with a phosphor content of 30 to 50%.

The fluorescent barrier may include a first type barrier rib that is exposed to the discharge space and a second type barrier rib that is formed to be surrounded by the first fluorescent barrier. The content of the phosphors may be formed to be different from each other. In this case, the first barrier rib may contain at least 70 wt% of the phosphor, and the second barrier rib may be formed to contain 40 wt% or less of the phosphor.

In addition, the manufacturing method of the plasma display panel according to the present invention comprises a paste manufacturing step of manufacturing a separate fluorescent barrier rib paste for each of the red, green, blue by mixing the binder, the barrier material and the phosphor; A paste coating step of applying the fluorescent partition wall paste to a rear substrate on which a lower dielectric layer is formed; A drying step of drying the fluorescent partition wall paste with hot air; And calcining the dried fluorescent barrier paste at a high temperature.

At this time, the paste manufacturing step is to prepare a binder by mixing ethyl cellulose in a mixed solvent of butyl carbitol acetate and terpineol, and to partition the ceramic powder or glass particles including PbO, SiO ₂ , B ₂ O ₃ partition wall Material can be prepared. In addition, the paste coating step may apply a fluorescent partition wall paste separately prepared for each of red, green, and blue in the paste manufacturing step for each color. In addition, the drying step is made at 130 to 200 ℃, the firing step may be made at 450 to 600 ℃.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following drawings, only a delta-type partition wall formed by passing two address electrodes through one pixel is illustrated, but the present invention may be applied to a matrix-type barrier rib or a stripe-type barrier rib. Of course.

First, a PDP according to an embodiment of the present invention will be described.

1 is an exploded perspective view of a PDP according to an embodiment of the present invention, FIG. 2 is a layout view of an electrode and a discharge cell according to an embodiment of the present invention, and FIG. 3 is a PDP according to an embodiment of the present invention. The vertical cross section (KK sectional drawing of FIG. 2) is shown. Hereinafter, the first display electrode 122 and the second display electrode 124 are referred to as a display electrode 120.

1 to 3, the PDP 100 according to an embodiment of the present invention, the front substrate 110, the rear substrate 140 and the first display electrode 122 (hereinafter referred to as X electrode) And second display electrodes 124 (hereinafter referred to as Y electrodes). In addition, the X electrodes 122 and the Y electrodes 124 are covered by the upper dielectric layer 130, and the upper dielectric layer 130 is protected by the protective layer 135. In addition, the address electrodes 150 (hereinafter referred to as A electrodes) are covered by the lower dielectric layer 160, and a fluorescent partition wall 170 is formed on the upper surface of the lower dielectric layer 160. The discharge cells 191, 192, and 193 partitioned by the fluorescent barrier wall 170 are filled with a discharge gas that generates vacuum ultraviolet rays by plasma discharge.

The back substrate 140 is formed of a material such as glass having a predetermined thickness to form the plasma display panel 100 together with the front substrate 110. The rear substrate 140 is formed with the A electrodes 150 disposed in one direction on the upper surface facing the front substrate 110 and the lower dielectric layer 160 applied to cover the A electrodes 150. The partition wall 170 is formed on the dielectric layer 160. The phosphor layer 180 is formed on the lower dielectric layer 160 and the partition wall 170. Hereinafter, the front substrate 110 direction (the + z direction in FIG. 1) will be divided into the upper direction, and the back substrate 140 direction (the -z direction in FIG. 1) will be described in the lower direction.

The front substrate 110 is formed of a transparent material such as soda glass, and is formed to face the rear substrate 140. X electrodes 122 and Y electrodes 124 are arranged side by side under the front substrate 110, and the X electrodes 122 and Y electrodes 124 are covered by an upper dielectric layer 130, The upper dielectric layer 130 is protected by the protective layer 135.

The fluorescent barrier 170 includes a red (R) fluorescent barrier 170a, a green (G) fluorescent barrier 170b, and a blue (B) fluorescent barrier 170c. As shown in FIG. 1, the lower dielectric layer 160 formed on the rear substrate 140 may be formed to have a predetermined thickness, and may be formed separately from the rear substrate 140. The fluorescent barrier wall 170 may be formed of a triangular, square, rhombus, pentagon, hexagonal, and the like. Although the hexagonal fluorescent barrier 170 is shown in the figure, the present invention is not limited to this form. The fluorescent barrier wall 170 maintains a gap between the front substrate 110 and the rear substrate 140 and partitions the discharge cells 191, 192, and 193, and absorbs vacuum ultraviolet rays to emit visible light.

The fluorescent barrier wall 170 is formed such that three discharge cells 191, 192, and 193 that emit visible light having different colors are adjacent to each other in a substantially triangular form to form one pixel 190. Here, two A electrodes 150 are assigned to one pixel 190 divided by the fluorescent barrier wall 170. That is, one A electrode 150 is commonly allocated to two selected discharge cells 192 and 193 among three discharge cells 191, 192 and 193, and the other A electrode is assigned to the other discharge cell 191. 150 may be assigned. The fluorescent barrier 170 may be formed by screen printing, sandblasting, lift-off, etching, etc., but the method of forming the fluorescent barrier 170 is not limited thereto.

In this case, the fluorescent partition wall 170 is formed to include the partition material and the phosphor. In addition, the fluorescent barrier wall 170 may further include a binder. The barrier material is formed of a glass component containing elements such as Pb, B, Si, Al, and O, and is preferably a filler such as zirconium oxide (ZrO 2), titanium oxide (TiO 2), or aluminum oxide (Al 2 O 3). ) And a pigment containing a pigment such as chromium (Cr), copper (Cu), cobalt (Co), iron (Fe) and the like. More preferably, the barrier material is formed by mixing PbO and SiO ₂ B ₂ O ₃ in a 1: 1: 1 ratio. In addition, the binder may be formed by mixing ethyl cellulose in a mixed solvent of butylcarbitol acetate and terpineol in a weight ratio of 3: 7. The phosphor may be a phosphor such as (Y, Gd) BO ₃ : Eu as a red phosphor, Zn ₂ SiO ₄ : Mn as a green phosphor, or BaMgAl: Eu as a blue phosphor. However, the type and content ratio of the barrier material, the binder, and the phosphor are not limited thereto. The fluorescent barrier wall 170 is preferably formed of 20 to 70% by weight of the total weight of the phosphor, more preferably 30 to 50% by weight. The fluorescent barrier wall 170 may have a low phosphorus content when the content of the phosphor is less than 30% by weight, and the efficiency may decrease due to low luminance. When the content of the phosphor is formed to exceed 70% by weight, the partition wall There is a problem that the strength as can be lowered.

Referring to FIG. 3, the fluorescent barrier wall 170 is formed on each of the discharge cells on the upper surface of the lower dielectric layer 160. At this time, the fluorescent barrier 170 is not only a partition but also serves as a phosphor layer, the cross-sectional shape is formed of the wall portion and the bottom portion. Each of the discharge cells contains phosphors of different colors, and boundary surfaces are formed between the fluorescent barrier ribs constituting the discharge cells. The wall parts are preferably formed to have the same thickness as each other based on the boundary surface, but may be formed to have different thicknesses according to the efficiency of the phosphor.

The upper dielectric layer 130 includes the X electrode 122 and the Y electrode 124 to cover the bottom surface of the front substrate 110. The upper dielectric layer 130 may be formed by uniformly screen printing a paste including a low melting point glass powder on the entire lower surface of the front substrate 110. The upper dielectric layer 130, as is well known, is a transparent body, acts as a capacitor during discharge, limits the current, and performs a memory function. In addition, a protective layer 135 may be further formed on the surface of the upper dielectric layer 130 to reinforce durability and to emit many secondary electrons during discharge. The protective layer 135 may be formed by an electron beam method or sputtering using any one selected from magnesium oxide (MgO) or equivalents thereof, but the material of the protective layer and the method of forming the protective layer 135 are not limited thereto.

The lower dielectric layer 160 covers the entire upper surface of the back substrate 140 including the A electrode 150. The lower dielectric layer 160 may also be formed of a material similar to or the same as the upper dielectric layer 130.

The A electrodes 150 are formed on an upper side of the rear substrate 140 toward the upper dielectric layer 130 of the front substrate 110. The A electrode 150 has a predetermined pitch on the top surface of the back substrate 140 and is formed in parallel with each other. The A electrode 150 is formed in a direction substantially crossing the display electrode 120. One A electrode 150 is formed to pass through the discharge cells (191, 192, 193) to emit visible light of different colors, respectively (y direction in FIG. 1). The A electrode 150 may be formed by sputtering, screen printing, photolithography or the like using Ag paste or the like, but the present invention is not limited to the material and method of forming the A electrode 150.

The display electrode 120 has a predetermined pitch on the lower surface of the front substrate 110 and is formed in parallel with each other. The display electrode 120 is a pair of the X electrode 122 and the Y electrode 124. The display electrode 120 is formed of the transparent electrodes 122a and 124a, and low-resistance bus electrodes 122b and 124b may be further formed to prevent voltage drop. The transparent electrodes 122a and 124a may be formed of any one selected from ITO (alloy oxide film of In and Sn) having good light transmittance, nesa film (SnO 2), or an equivalent thereof, but the present invention is not limited thereto. . In addition, the display electrode 120 may be formed mainly by sputtering, but the present invention is not limited thereto. In addition, the bus electrodes 122b and 124b may be formed of any one selected from Cr-Cu-Cr, Ag, or equivalents thereof, but the present invention is not limited thereto.

Referring to FIG. 2, the display electrode 120 is formed in the transverse direction along the partition wall 170. For example, the X electrode X1 is formed while laterally surrounding the R discharge cell and the G discharge cell. The Y electrode Y1 is formed while enclosing the G discharge cells and the B discharge cells laterally. Therefore, discharge cells coated with phosphors having different colors are contacted with the X electrode 122 and the Y electrode 124. For example, the X display electrode X1 forms a boundary between an R discharge cell and a G discharge cell, and also forms a boundary between a G discharge cell and a B discharge cell. The reason why the display electrode 120 is positioned on the fluorescent barrier wall 170 is to solve the problem of narrowing the discharge space according to the high definition of the PDP, and the visible light is blocked by the bus electrodes 122b and 124b to reduce the luminance. This is to prevent the phenomenon of lowering.

The discharge cells 191, 192, and 193 are defined by the lower dielectric layer 160, the fluorescent barrier wall 170, and the upper dielectric layer 130 on the upper surface of the rear substrate 140. The discharge cells 191, 192, and 193 are filled with a discharge gas (eg, a mixed gas including xenon (Xe), neon (Ne), etc.) to cause plasma discharge. In addition, the discharge cells 191, 192, and 193 are partitioned by a fluorescent partition wall 170 in which phosphors that absorb ultraviolet rays and emit visible light are mixed as described above. The discharge cells 191, 192, and 193 may have different widths or lengths depending on the luminous efficiency of each phosphor. In the discharge cells 191, 192, and 193, electrodes which undergo address discharge and sustain discharge are disposed at the center and the bottom thereof.

A plurality of discharge cells 191, 192, and 193 are repeatedly arranged along one A electrode 150, and each discharge cell 191, 192, and 193 is arranged to emit visible light of different colors. have. For example, when centering on the A electrodes 150 in the first column from the left side shown in FIG. 2, the discharge cells R having a red fluorescent layer from the top to the bottom and the discharge cells G having a green fluorescent layer are shown. And the discharge cells B having the blue fluorescent layer may be repeatedly arranged in the vertical direction. In addition, when the A electrode 150 of the second column is centered, the discharge cell G having the green fluorescent layer from the top to the bottom direction G, the discharge cell B having the blue fluorescent layer B, and the discharge cell R having the red fluorescent layer R ) May be arranged in the vertical direction repeatedly. A pair of display electrodes 120 may be allocated to one pixel 190 divided by the fluorescent barrier wall 170. That is, the X1 X electrode and the Y1 Y electrode are commonly allocated to the two discharge cells 191 and 192, and the Y1 Y electrode is allocated to the other discharge cell 193.

Next, a PDP according to another embodiment of the present invention will be described.

4 is a vertical cross-sectional view of a PDP according to another embodiment of the present invention. The embodiment of FIG. 4 is similar to the embodiment of FIG. 3 except that the fluorescent barrier wall 270 includes the first type light barrier wall 272 and the second type light barrier wall 274, and thus, the difference will be described.

According to another embodiment of the present invention, referring to FIG. 4, the PDP 200 includes a front substrate 210, a rear substrate 240, X electrodes 222, and Y electrodes 224. In addition, the PDP 200 includes an upper dielectric layer 230, a protective layer 235, a lower dielectric layer 260, an A electrode 250, a first type light partition wall 272, and a second type light partition wall 274. Is formed. Since the front substrate 210, the rear substrate 240, the upper dielectric layer 230, the protective layer 235, the lower dielectric layer 260 and the A electrode 250 have been described in detail with reference to the embodiment of FIG. Description is omitted.

The fluorescent partition 270 is formed to include a first type light partition 272 and a second type light partition 274. In this case, the first type light partition wall 272 and the second type light partition wall 274 are formed so that the content of the phosphors are different from each other, and the amount of the phosphor contained in the first type light partition wall 272 is formed to be larger. It is preferable.

The first type light partition wall 272 includes a red first type light partition wall 272a, a green first type light partition wall 272b, and a blue first type light partition wall 272c, and is formed to be exposed to a discharge space. In this case, the first type light partition wall 272 is formed of a wall portion and a bottom portion to form a side surface and a lower surface of the discharge cell. The first type light partition wall 272 is formed in a U-shaped cross-sectional shape, it is not limited to the cross-sectional shape of the first type light partition wall 272. An upper surface of the first type light partition wall 272 is formed to contact the surface of the protective layer 235, and a surface not exposed to the discharge space among the side surfaces is formed to contact one side surface of the second type light partition wall 274. . In addition, an opposite surface of the bottom surface of the first type light partition wall 272 is formed to contact the lower dielectric layer 260. The first type light partition 272 is formed such that the phosphor occupies at least 70 wt%. The first type light barrier wall 272 is exposed to the discharge space and directly absorbs the vacuum ultraviolet rays, and since the first type light barrier wall 272 is supported by the second type light barrier wall 274, a large intensity is not required. It is preferable that the weight ratio of the fluorescent material is relatively large as compared with

The second type light partition wall 274 is formed including a red second type light partition wall 274a, a green second type light partition wall 274b, and a blue second type light partition wall 274c. In this case, the second type light partition wall 274 is not directly exposed to the discharge space, and the side surface is formed to be surrounded by the first type light partition wall 272. At this time, the second type light barrier wall 274 is formed such that one side thereof contacts the first type light barrier wall 272 and the other side thereof contacts the second type light barrier wall containing phosphors of different colors. In addition, the second type light partition wall 274 is formed so that the upper surface is in contact with the surface of the protective layer 235, the lower surface is formed in contact with the upper surface of the lower dielectric layer 260. The second type light partition 274 is formed so that the content of the phosphor is 40% by weight or less. Since the second type light partition wall 274 is not exposed to the discharge space, the second type light partition wall 274 is not directly absorbing the vacuum ultraviolet rays, and thus serves to support the fluorescent partition wall 270 and thus requires greater intensity. Therefore, the second type light partition wall 274 is preferably formed to have a lower weight ratio of the phosphor than the first type light partition wall 272.

Next, a method of manufacturing a PDP according to an embodiment of the present invention will be described.

5 is a block diagram of a PDP manufacturing step according to an embodiment of the present invention.

PDP manufacturing method according to an embodiment of the present invention comprises a front panel manufacturing step, a rear panel manufacturing step, the sealing step of the front panel and the rear panel, exhaust and discharge gas injection step and module assembly step. The front panel manufacturing step includes a display electrode forming step, an upper dielectric forming step, and a protective layer forming step. In addition, the rear panel manufacturing step includes an address electrode forming step, a lower dielectric forming step, and a fluorescent partition wall forming step. Hereinafter, a description will be given focusing on the fluorescent partition wall forming step.

The fluorescent partition wall forming step, referring to Figure 5, comprises a paste manufacturing step (S 1), a paste coating step (S 2), a drying step (S 3) and a firing step (S 4).

The paste manufacturing step (S 1) is a step of manufacturing the material of the fluorescent barrier rib, and the barrier rib material is mixed with the phosphor and a binder to prepare a fluorescent barrier rib paste. The binder serves to improve agglomeration between the partition material and the phosphor particles, and is prepared by mixing ethyl cellulose in a solvent in which butylcarbitol acetate and terpineol are mixed at a weight ratio of 3: 7. However, the weight ratio of butyl carbitol acetate and terpineol is illustrative, and the weight ratio is not limited thereto. The barrier material uses ceramic powder or glass particles, and PbO, SiO ₂ , B ₂ O ₃ , Al ₂ O ₃ , TiO ₂ , CaO, ZnO, or a mixture thereof is used. In particular, a barrier material in which PbO, SiO ₂ , and B ₂ O ₃ are mixed in a weight ratio of 1: 1: 1 can be used. In addition, the phosphor may be used as all phosphors used in the PDP, and a phosphor such as (Y, Gd) BO ₃ : Eu as a red phosphor, Zn ₂ SiO ₄ : Mn as a green phosphor, and BaMgAl: Eu as a blue phosphor. Can be. The phosphor may be mixed with a mixture of a binder and a partition material in various weight ratios. The fluorescent barrier paste is separately prepared for each color of the phosphor.

The paste coating step (S 2) is a process of applying the fluorescent barrier rib paste on the back substrate on which the lower dielectric layer is formed. The paste coating step (S 2) is to apply a fluorescent partition wall paste separately prepared for each of red, green, blue in the paste manufacturing step (S 1) for each color. That is, when the red fluorescent barrier paste is applied, the green portion and the blue portion are masked to form only the red fluorescent barrier rib. When applying the green fluorescent barrier paste, the red portion and the blue portion are masked to form only the green fluorescent barrier rib. It is similarly formed when the blue fluorescent partition paste is applied. The paste may be applied by a screen print method, a sand blast method, a lift off method, a photolithography method, or the like.

The screen printing method is a method of printing a desired shape on a substrate by placing a patterned screen on a substrate at a constant interval, compressing a paste necessary for forming a partition wall, and printing the paste on the rear substrate while the back substrate is fixed. The drying process is repeated to form partition walls on the rear substrate. On the other hand, the screen printing method repeats the process of properly adjusting the position of the screen and the substrate every time the paste printing process is repeated, which not only makes the process complicated and time-consuming, but also displaces the position and repeats the resolution during the repeating operation. There is a disadvantage of deterioration.

The sand blasting method is a method of forming a partition by spraying an abrasive on the rear substrate with compressed air or the like, applying a partition material on the rear substrate, coating the photosensitive film on the coated partition material, and masking the photosensitive film on the back substrate. After the fixing, exposure and development are performed, and a protective film for protecting the partition is left on the portion where the partition is to be formed. Thereafter, the abrasive is sprayed to physically remove the portion where the photosensitive film is not protected, and the remaining protective film is rolled out to complete the partition wall. On the other hand, the sandblasting method has the disadvantage that the cost of equipment investment, such as abrasive grinding equipment is increased and the crack of the substrate occurs as a physical impact is applied to the glass substrate.

The lift-off method is a method of forming a partition wall height pattern and then filling the glass paste and firing at a high temperature to leave a glass material and removing the pattern to form a partition wall. A photosensitive film is coated on a back substrate and a mask is mounted on the photosensitive material. The partition is then formed by exposure / development. On the other hand, the lift-off method has a disadvantage in that the formed pattern is torn down or the partition wall cracking may occur during firing, and the photosensitive film remains after firing.

The photolithography method is a method of manufacturing a partition wall by coating a photosensitive partition material on a rear substrate and then exposing and baking the partition panel by applying a photosensitive material on a rear substrate and mounting a mask on the photosensitive material, and then exposing / developing / etching the partition wall. To form. On the other hand, the photolithography method is difficult to form more than 200㎛ of the thickness of the partition wall only by ultraviolet exposure, there is a disadvantage that the photosensitive material used is unstable and expensive.

The drying step (S 3) is a step of drying the fluorescent partition wall paste with hot air, and the firing step (S 4) is a step of baking the dried fluorescent partition wall paste at a high temperature. The drying step is made at 130 to 200 ℃, the firing step may be made at 450 to 600 ℃.

As described above, the present invention is not limited to the specific preferred embodiments described above, and any person having ordinary skill in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Various modifications are possible, of course, and such changes are within the scope of the claims.

According to the PDP and the manufacturing method according to the present invention, by mixing the partition material and the phosphor in a predetermined ratio to form the partition and the phosphor layer integrally, there is no need to form the partition and the phosphor layer separately, the process is reduced as well as fixed It has the effect of having high brightness and high efficiency by solving the problem of narrowing the discharge space according to the miniaturization.

Claims (11)

A front substrate and a rear substrate facing each other; A fluorescent partition wall formed between the front substrate and the rear substrate to partition a discharge space and include a phosphor; First and second display electrodes formed between the front substrate and the rear substrate; Address electrodes formed on the rear substrate; And And a lower dielectric layer formed to surround the address electrodes. The method of claim 1, And wherein the fluorescent barrier ribs are formed such that three adjacent discharge cells that emit visible light of different colors form one pixel, and two address electrodes pass through each pixel. The method according to claim 1 or 2, And the fluorescent barrier rib is formed on an upper surface of the lower dielectric layer. The method according to claim 1 or 2, The fluorescent partition wall is plasma display panel, characterized in that the content of the phosphor is formed from 20 to 70%. The method of claim 4, wherein The fluorescent partition wall is plasma display panel, characterized in that the content of the phosphor is formed in 30 to 50%. The method according to claim 1 or 2, The fluorescent partition wall includes a first type light partition wall exposed to the discharge space and a second type light partition wall formed to be surrounded by the first type light partition wall, and the first type light partition wall and the second type light partition wall are formed of phosphors. Plasma display panel, characterized in that the content is formed to be different from each other. The method of claim 6, And the first barrier rib is formed to contain at least 70 wt% of phosphor, and the second barrier rib is formed to contain 40 wt% or less of phosphor. A paste manufacturing step of mixing a binder, a partition material, and a phosphor to produce a separate type of bulkhead paste for each of red, green, and blue; A paste coating step of applying the fluorescent partition wall paste to a rear substrate on which a lower dielectric layer is formed; A drying step of drying the fluorescent partition wall paste with hot air; And And a firing step of firing the dried fluorescent partition wall paste at a high temperature. The method of claim 8, The paste preparing step is to prepare a binder by mixing ethyl cellulose in a mixed solvent of butyl carbitol acetate and terpineol, and to prepare a partition material by mixing ceramic powder or glass particles including PbO, SiO ₂ , B ₂ O ₃ Method of manufacturing a plasma display panel, characterized in that. The method of claim 8, Wherein the paste coating step is a plasma display panel manufacturing method characterized in that for applying the fluorescent barrier rib paste separately prepared for each of the red, green, blue in the paste manufacturing step. The method of claim 8, The drying step is carried out at 130 to 200 ℃, the firing step is a manufacturing method of the plasma display panel, characterized in that at 450 to 600 ℃.

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