KR20070046656A - Method of preparing electron emission display device - Google Patents

Abstract

A manufacturing method of an electron emission display device of the present invention, the manufacturing method comprising: a first substrate on which an electron emission portion is formed and a first substrate disposed at an arbitrary distance from the first substrate to form a vacuum container together with the first substrate; A method of manufacturing an electron emission display device comprising two substrates, the method comprising: forming a black layer in a non-light emitting region set on the second substrate, forming a fluorescent layer in the light emitting region set on the second substrate, and forming the fluorescent layer And a first surface planarization composition comprising a first photosensitive monomer, a first photoinitiator, a first crosslinking agent, and a blowing agent on the black layer to the fluorescent layer to form a first surface planarization layer, and a second photosensitive monomer, A second surface planarization composition comprising a photoinitiator, a second crosslinking agent, and a second solvent is applied to the first surface planarization layer to form a second surface planarization layer; Forming an anode electrode on the planarization layer, and by firing the second substrate comprises the step of removing the surface flattening layer.

The manufacturing method of the electron emission display device of this invention can manufacture an anode electrode so that it may be flat and will not fall, and can improve luminous efficiency and brightness.

Emission display device, foaming agent, surface planarization film, photosensitive monomer, photoinitiator

Description

Manufacturing method of electron emission display device {METHOD OF PREPARING ELECTRON EMISSION DISPLAY DEVICE}

1 is a partially exploded perspective view of an electron emission display device according to an embodiment of the present invention;

2 is an optical picture of the anode electrode formed according to Example 1 of the present invention.

3 is an optical photograph of an anode electrode formed according to a comparative example.

[Industrial use]

The present invention relates to a method of manufacturing an electron emission display device, and more particularly, to a method of manufacturing an electron emission display device that can be manufactured flat without the problem of dropping the anode electrode, thereby improving luminous efficiency and luminance. .

[Prior art]

In general, an electron emission element is classified into a method using a hot cathode and a method using a cold cathode.

Here, the electron emission device using the cold cathode may include a field emitter array (FEA), a surface conduction emitter (SCE), a metal-insulator-metal (metal) -Insulator-Metal (hereinafter referred to as MIM) type and Metal-Insulator-Semiconductor (hereinafter referred to as MIS) type and the like are known.

The dual FEA type electron emission device has an electron emission portion and a driving electrode for controlling electron emission of the electron emission portion, and includes one cathode electrode and one gate electrode, and has a work function as a material of the electron emission portion. Low tip) or high aspect ratio materials, for example, tip-shaped tip structures based on molybdenum (Mo) or silicon (Si), or carbon-based materials such as carbon nanotubes, graphite and diamond-like carbon It uses the principle that electrons are emitted by an electric field in a vacuum using a material.

These electron emission devices are formed in an array on one substrate to form an electron emission device, and the electron emission display device is combined with another substrate having a light emitting unit including a fluorescent layer and an anode electrode to emit electrons. A display device (electron emission display device) is constituted.

That is, a typical electron emission display device includes a plurality of driving electrodes that function as scan electrodes and data electrodes along with an electron emission unit on one substrate, and a light emitting unit on the other substrate. Accordingly, the on / off of electron emission and the amount of electron emission are controlled by the action of the electron emission part and the driving electrodes, and the fluorescent layer is excited by the electrons emitted from the electron emission part to perform a predetermined light emission or display function.

In the above electron emission display device, a metal film such as aluminum may be used as the anode electrode. The anode of the metal is formed to cover the fluorescent layer and the black layer, and serves to increase the brightness of the screen by reflecting the visible light emitted toward the first substrate among the visible light emitted from the fluorescent layer.

However, since the fluorescent layer is formed by stacking phosphor particles having a size of about several micrometers, and the anode electrode should be formed with a thin thickness of about several thousand ohms in consideration of electron transmittance, etc., when directly depositing aluminum on the surface of the fluorescent layer There is a problem in that aluminum does not uniformly cover the surface of the fluorescent layer particles and breakage occurs in the middle, making it difficult to uniformly form the anode electrode.

In order to solve this problem, a surface planarization layer is formed on the fluorescent layer and the black layer of the second substrate, and aluminum is deposited thereon to form an anode electrode. Since the surface planarization layer is removed by firing, the anode electrode after firing is positioned with the fluorescent layer and the black layer interspersed with a predetermined gap, and is smoothly deposited on the surface of the surface planarization layer to reduce breakage and increase reflection efficiency.

However, when the surface planarization layer is removed by firing, a problem arises in that the fluorescent layer and the second substrate are separated from each other, and the fluorescent layer, the surface planarization layer, and the anode electrode are all separated from the second substrate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an electron emission display device which can be formed to be flattened without dropping the anode electrode, thereby improving luminous efficiency and luminance.

In order to achieve the above object, the present invention provides an electron emission display comprising a first substrate having an electron emission portion formed thereon and a second substrate disposed at an arbitrary distance from the first substrate to form a vacuum container together with the first substrate. As a manufacturing method of a device,

A black layer is formed on the non-light emitting region set on the second substrate, a fluorescent layer is formed on the light emitting region set on the second substrate, and a surface planarization layer is formed on the fluorescent layer and the black layer. A method of manufacturing an electron emission display device comprising forming an anode electrode on a planarization layer and baking the substrate to remove the surface planarization layer. In the present invention, the surface planarization layer is formed by applying a first surface planarization composition comprising a first photosensitive monomer, a first photoinitiator and a blowing agent to the fluorescent layer and the black layer to form a first surface planarization layer, A second surface planarization composition comprising a second photosensitive monomer and a second photoinitiator is applied to the first surface planarization layer to form a second surface planarization layer. In this case, the first surface planarization composition is applied, the exposure and development steps are performed, and then the second surface planarization composition may be applied, and only the drying step is performed without performing the exposure and development steps. May be applied.

Hereinafter, the present invention will be described in more detail.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electron emission display device, and in particular, to improve a surface planarization layer manufacturing process for forming an anode electrode, to form a flat surface without dropping the anode electrode, thereby improving luminous efficiency and luminance. The present invention relates to a method for manufacturing an electron emission display device.

The manufacturing method of the electron emission display device of the present invention will be described in detail, and since the first substrate on which the electron emission unit is formed is the same as in the conventional manufacturing process, detailed description thereof will be omitted and disposed at an arbitrary distance from the first substrate. To form a vacuum container together with the first substrate, and only the second substrate on which the anode electrode is formed will be described in detail as follows.

First, a black layer is formed in the non-light emitting region set on the second substrate. This black layer serves to improve the contrast of the display by reducing reflection of external light between the fluorescent film patterns.

The step of forming the black layer may be performed by any method such as electrophoresis, screen printing, spin coating, etc. using the black layer composition. The black layer composition may be formed of a carbon material such as graphite, or metals such as chromium oxide, indium, tin, indium-tin, copper, antimony, titanium, manganese, cobalt, nickel, zinc, lead, chromium, and SiO, SiO ₂ , MgF Dielectric materials such as ₂ and SiN _x (x is an integer of 1 or more).

Subsequently, a fluorescent layer is formed between the black layers, that is, in the set emission region. The fluorescent layer forming step may be performed according to any method as long as it is a conventional fluorescent layer forming step such as spin coating using a phosphor composition. The fluorescent layer composition may include a phosphor, a photosensitive monomer and a photoinitiator. As the phosphor, any material used as a conventional red, green, or blue phosphor may be used, and as the red phosphor, Y ₂ O ₂ S: Eu, Y ₂ O ₃ : Eu, YVO ₄ : Eu, Y (V, P) O ₄ : Eu, (Y, Gd) BO ₂ : Eu, SrTiO ₃ : Pr or mixtures thereof can be used representatively.

In addition, as the green phosphor, as the green phosphor, ZnS: Cu, Al, ZnS: Cu, SrGa ₂ S ₄ : Eu, CaS: Ce, La ₂ O ₂ S: Tb, Y ₂ O ₂ S: Tb, Y _{2 SiO 5: Tb, Gd 2 O} 2 S: Tb, Zn (Ga, Al) 2 O 4: Mn, (Ba, Sr, Mg) O-nAl 2 O 3: Mn, ZnGa 2 O 4: Mn, Zn 2 SiO ₄ : Mn, SrGa ₂ S ₄ : Eu or ZnS: Cu may be used, and the blue phosphor may be SrGa ₂ S ₄ : Ce, ZnS: Ag, Y ₂ SiO ₅ : Ce, Sr ₅ (PO ₄ ) ₃ Cl: Eu, ZnS: Ag, BaMgAl ₁₀ O ₁₇ : Eu or mixtures thereof can be representatively used.

A surface planarization layer is formed on the black layer and the fluorescent layer. In the present invention, the surface planarization layer is formed by applying a first surface planarization composition including a first photosensitive monomer, a first photoinitiator, a first crosslinking agent, a blowing agent, and a first solvent on the black layer and the fluorescent layer to form a first surface planarization layer. Thereafter, a second surface planarization composition including a second photosensitive monomer, a second photoinitiator, a second crosslinking agent, and a second solvent may be applied to the first surface planarization layer to form a second surface planarization layer.

In this case, after applying the first surface planarization composition, after performing the first exposure and first development steps, the second surface planarization composition may be applied, or after applying the first surface planarization composition, exposure and development After performing a drying process without performing a process, you may apply | coat a 2nd surface planarization composition. The said 1st exposure process is performed using an ultraviolet exposure apparatus using a photomask. At this time, the ultraviolet ray to be irradiated is preferably 150 to 500 mJ / cm ² .

The first developing process is generally performed by spraying a developer for 50 to 100 seconds. In this case, a Na ₂ CO ₃ aqueous solution having a concentration of 0.4 to 0.8% is generally used, but is not limited thereto. In addition, in the case of performing the exposure and development processes, the drying process is performed at about 100 ° C. for 10 to 15 minutes.

When the conditions of the exposure, the developing process and the drying process deviate from the above conditions, undeveloped or overdeveloped is not preferable.

Regardless of whether the first exposure and first development steps are performed, the second exposure and second development steps are performed after the second surface planarization composition is applied. The second exposure and the second development steps are performed in the same manner as the first exposure and the first development steps.

Preferred thicknesses of the first and second surface planarization layers may be adjusted according to whether the first exposure and the first development processes are performed, and in the case of implementation, the preferred thickness of the first surface planarization layer is preferably 4 to 6 μm. As for a 2nd surface planarization layer, 1-2 micrometers are preferable. When 1st exposure and a 1st image development process are not implemented, 4-6 micrometers is preferable for a 1st surface planarization layer, and 1-3 micrometers is preferable for a 2nd surface planarization layer.

When the thickness ranges of the first surface planarization layer and the second surface planarization layer are thinner than the above ranges, the luminance decreases, which is undesirable. Don't.

The first and second photosensitive monomers are the same or independently of each other ethylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, Tetramethylol propane trimethacrylate, pentaerythritol tetraacrylate or pentaerythritol tetramethacrylate can be used 1 type or in mixture of 2 or more types.

The first and second photoinitiators are the same or independently from each other benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamino) benzophenone, 2,2 Diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropano-1-one, 2 Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphineoxide or bis (2 Or 4,6-trimethylbenzoyl) phenylphosphine oxide may be used alone or in combination of two or more thereof.

As the blowing agent may be used azodicarbonamide (C ₂ H ₄ N ₄ O ₂ ), but is not limited thereto.

The first and second crosslinking agents are the same or independently of each other ethylene glycol diacrylate, ethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethyl Olpropane tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate or pentaerythritol tetramethacrylate can be used alone or in combination of two or more thereof.

The first and second solvents are the same or independently of each other ethyl carbitol, butyl carbitol, ethyl carbitol acetate, butyl carbitol acetate, texanol, terpin oil, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, di Propylene glycol monomethyl ether acetate, γ-butyrolactone, cellosolve acetate, butyl cellosolve acetate, tripropylene glycol can be used. These solvents may be used alone or in combination of two or more thereof.

In the first surface planarizing composition of the present invention, the content of the blowing agent is most important, and the amount is preferably 5 to 15% by weight based on the total weight of the first photosensitive monomer, the first photoinitiator, the first crosslinking agent and the solvent. If the content of the blowing agent is less than 5% by weight, it may swell in the firing process, and if it exceeds 15% by weight, the luminance is reduced, which is not preferable.

In addition, the mixing ratio of the first photosensitive monomer, the first photoinitiator and the solvent can be appropriately adjusted according to the desired physical properties.

Subsequently, an anode electrode is formed on the surface planarization layer. The anode electrode is formed on the entire surface of the surface planarization layer. The anode electrode is formed by vapor deposition or sputtering of a metal such as aluminum.

The substrate is then baked to remove the surface planarization layer. This baking process is performed at 450-490 degreeC, and is generally performed in air atmosphere. If the temperature of the said baking process is less than 450 degreeC, baking will not be performed completely, and if it exceeds 490 degreeC, deterioration of fluorescent substance will arise and it is unpreferable.

In this firing process, the first surface planarization layer to which the blowing agent is added is foamed to maintain the height of the surface planarization layer, and the first and second surface planarization layers can be more easily removed through pinholes formed due to foaming.

In addition, since the second surface planarization layer does not include a foaming agent, the first surface planarization layer may be flattened by preventing the problem that the surface roughness may increase due to swelling due to the foaming agent.

EMBODIMENT OF THE INVENTION The electron emission display device of this invention is demonstrated with reference to attached drawing.

1 is a partially exploded perspective view of an electron emission display device of the present invention. The electron emission display device includes a first substrate 2 and a second substrate 4 which are disposed in parallel to each other with an internal space therebetween. Among these substrates, the first substrate 2 is provided with a structure for emitting electrons, and the second substrate 4 is provided with a structure for emitting visible light by electrons to perform any light emission or display.

First, cathode electrodes 6, which are first electrodes, are formed on the first substrate 2 in a stripe pattern along one direction (y-axis direction of the drawing) of the second substrate 2, and the cathode electrodes 6 are formed. The first insulating layer 8 is formed on the entire first substrate 2 while covering it. Gate electrodes 10, which are second electrodes, are formed on the first insulating layer 8 in a stripe pattern along a direction orthogonal to the cathode electrode 6 (x-axis direction in the drawing).

In the present invention, when the intersection region of the cathode electrode 6 and the gate electrode 10 is defined as a pixel region, one or more electron emission portions 12 are formed in each pixel region over the cathode electrode 6, and the first insulation is formed. Openings 8a and 10a corresponding to the electron emission portions 12 are formed in the layer 8 and the gate electrode 10 to expose the electron emission portions 12 on the first substrate 2.

The electron emission unit 12 is formed of materials that emit electrons when an electric field is applied in a vacuum, such as a carbon-based material or a nanometer (nm) size material. Preferred materials for use as the electron emitter 12 include carbon nanotubes, graphite, graphite nanofibers, diamond, diamond-like carbon, C ₆₀ , silicon nanowires, and combinations thereof. Screen printing, direct growth, chemical vapor deposition or sputtering may be applied.

In the drawing, the electron emission parts 12 are formed in a circular shape and arranged in a line along the length direction of the cathode electrode 6 in each pixel area. However, the planar shape of the electron emission unit 12, the number and arrangement form per pixel area, etc. are not limited to the illustrated example and may be variously modified.

Meanwhile, in the above, the case in which the gate electrode 10 is positioned above the cathode electrode 6 with the first insulating layer 8 interposed therebetween has been described. In the opposite case, that is, the cathode electrode is positioned above the gate electrode. It is also possible. In this case, the electron emission portion may be positioned in contact with the side of the cathode electrode over the insulating layer.

The second insulating layer 14 and the focusing electrode 16 are formed on the gate electrode 10 and the first insulating layer 8. The second insulating layer 14 and the focusing electrode 16 are also provided with openings 14a and 16a for passing electron beams. For example, one of the openings 14a and 16a is provided for each pixel area so that the focusing electrode 16 can be provided. The electrons emitted by this pixel are collectively focused. At this time, the focusing electrode 16 exhibits an excellent focusing effect as the height difference from the electron emitting part 12 increases, so that the thickness of the second insulating layer 14 is greater than the thickness of the first insulating layer 8. It is preferable.

The focusing electrode 16 is formed on the entire first substrate 2. In addition, the focusing electrode 16 may be formed of a conductive film coated on the second insulating layer 14 or may be formed of a metal plate having an opening 16a.

Next, on one surface of the second substrate 4 facing the first substrate 2, the fluorescent layer 18, for example, the red, green, and blue fluorescent layers 18R, 18G, and 18B may be spaced at random intervals. The black layer 20 is formed between the fluorescent layers 18 to improve contrast of the screen. In FIG. 1, the phosphor layer 18 and the black layer 20 are formed in a stripe pattern, but the phosphor layer 18 is individually provided to correspond to the pixel areas set on the first substrate 2 in one-to-one correspondence. In this case, the black layer 20 is formed on all of the non-light emitting regions except for the fluorescent layer 18.

An anode electrode 22 made of a metal film such as aluminum is formed on the fluorescent layer 18 and the black layer 20. The anode electrode 22 receives a high voltage necessary for accelerating the electron beam from the outside, and reflects the visible light emitted toward the first substrate 2 among the visible light emitted from the fluorescent layer 18 to the second substrate 4 side of the screen. It increases the brightness.

The anode electrode may be made of a transparent conductive film such as indium tin oxide (ITO) instead of a metal film. In this case, the anode electrode may be positioned on one surface of the fluorescent layer facing the second substrate and the black layer, and may be formed in plural in a predetermined pattern.

The first substrate 2 and the second substrate 4 described above are integrally bonded to each other by a sealing material such as glass frit in a state where spacers 24 are disposed therebetween, and the inner space is evacuated to form a vacuum. The electron emission display device is constituted by maintaining it. In this case, the spacers 24 are disposed corresponding to the non-light emitting region where the black layer 20 is located.

The electron emission display device having the above configuration is driven by supplying a predetermined voltage to the cathode electrode 6, the gate electrode 10, the focusing electrode 16, and the anode electrode 22 from the outside, for example, the cathode electrode 6 The scan signal voltage is applied to one of the and gate electrodes 10, the data signal voltage is applied to the other electrode, and the negative electrode voltage of several to several tens of volts is applied to the focusing electrode 16. 22, a positive DC voltage of several hundred to several thousand volts is applied.

Therefore, in the pixels where the voltage difference between the cathode electrode 6 and the gate electrode 10 is greater than or equal to the threshold, an electric field is formed around the electron emission unit 12 to emit electrons from the electrons, and the emitted electrons may cause the focusing electrode 16 to emit. When passing through, the repulsive force is applied and focused to the center of the electron beam bundle, and then attracted by the high voltage applied to the anode electrode to impinge on the corresponding fluorescent layer to emit light.

Hereinafter, preferred examples and comparative examples of the present invention are described. However, the following examples are only preferred embodiments of the present invention and the present invention is not limited by the following examples.

(Example 1)

A black layer was formed in the non-light emitting region on the substrate, and red, green, and blue fluorescent layers were formed between the black layers.

Subsequently, a first surface planarization composition was applied on the fluorescent layer, and the first exposure was performed by irradiating ultraviolet light of about 200 to 300 mJ / cm ² for 70 seconds using an ultraviolet exposure apparatus equipped with a high-pressure mercury lamp, followed by 0.8% with a developer. The first development process was performed for 50 seconds using an aqueous Na ₂ CO ₃ solution at a concentration to form a first surface planarization layer having a thickness of 5 μm.

Subsequently, a second surface planarization composition was applied to the first surface planarization layer and subjected to second exposure and second development to form a second surface planarization layer having a thickness of 2 μm. At this time, the second exposure and the second development steps were performed in the same manner as the first exposure and the first development steps.

The first surface planarizing composition comprises ethylene glycol diacrylate first photosensitive monomer, benzophenone first photoinitiator, pentaerythritol tetramethacrylate crosslinker, azodicarbonamide (C ₂ H ₄ N ₄ O ₂ ) blowing agent and ethyl carbitol An acetate first solvent was used, and the second surface planarization composition was prepared by using an ethylene glycol diacrylate second photosensitive monomer, a benzophenone second photoinitiator, a pentaerythritol tetramethacrylate crosslinker, and an ethyl carbitol acetate second solvent. The containing was used. In this case, the content of the blowing agent in the first surface planarization composition was 10% by weight based on the total weight of the first photosensitive monomer, the first photoinitiator, the crosslinking agent, and the solvent.

Aluminum was sputtered on the second surface planarization layer to form an aluminum anode electrode, and then calcined at 430 ° C. to remove the first and second surface planarization layers.

(Comparative Example 1)

It carried out similarly to Example 1 except not having performed the 1st surface planarization layer formation process.

2 and 3 show optical photographs showing the state of the anode electrode from which the surface planarization layer was removed according to Example 1 and Comparative Example 1, respectively. As shown in FIG. 2, it can be seen that the anode electrode manufactured according to Example 1 is flat, whereas the anode electrode manufactured according to Comparative Example 1 shown in FIG. 3 is removed from the substrate.

The manufacturing method of the electron emission display device of this invention can manufacture an anode electrode so that it may be flat and will not fall, and can improve luminous efficiency and brightness.

Claims (13)

A method of manufacturing an electron emission display device, comprising: a first substrate having an electron emission portion formed thereon and a second substrate disposed at an arbitrary distance from the first substrate to form a vacuum container together with the first substrate; Forming a black layer in the non-light emitting region set on the second substrate; Forming a fluorescent layer in the light emitting region set on the second substrate; A first surface planarization composition comprising a first photosensitive monomer, a first photoinitiator, a first crosslinking agent, a foaming agent, and a second solvent is applied to the fluorescent layer and the black layer to form a first surface planarization layer. ; Applying a second surface planarization composition comprising a second photosensitive monomer, a second photoinitiator, a second crosslinking agent, and a second solvent to the first surface planarization layer to form a second surface planarization layer, Forming an anode electrode on the second surface planarization layer; Firing the second substrate to remove the surface planarization layer A method of manufacturing an electron emission display device comprising the step. According to claim 1, The first surface planarization layer is formed by applying the first surface planarization composition to the fluorescent layer, performing an exposure and baking process, And the second surface flattening layer forming step is formed by applying the second surface flattening composition to the first surface flattening layer, and performing an exposure and baking step. The method of claim 2, The first surface planarization layer has a thickness of 4 to 6㎛, And the second surface planarization layer has a thickness of 1 to 2 mu m. The method of claim 2, The first and second exposure step is carried out by irradiation with ultraviolet rays of 150 to 500 mJ / cm ² , And the first and second developing processes are performed for 50 to 100 seconds using a developing solution. According to claim 1, The first surface planarization layer is formed by applying the first surface planarization composition to the fluorescent layer, drying it, And the second surface flattening layer forming step is formed by applying the second surface flattening composition to the first surface flattening layer, and performing an exposure and baking step. The method of claim 5, The first surface planarization layer has a thickness of 4 to 6 μm, And the second surface planarization layer has a thickness of 1 to 3 mu m. The method of claim 2, The drying process is carried out for 10 to 15 minutes, The first and second exposure step is carried out by irradiation with ultraviolet rays of 150 to 500 mJ / cm ² , And the first and second developing processes are performed for 50 to 100 seconds using a developing solution. According to claim 1, And the blowing agent is azodicarbonamide (C ₂ H ₄ N ₄ O ₂ ). According to claim 1, The first and second photosensitive monomers are the same or independently of each other, ethylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate And tetramethylolpropane trimethacrylate, pentaerythritol tetraacrylate, and pentaerythritol tetramethacrylate, or a mixture of two or more thereof. According to claim 1, The first and second photoinitiators are the same or independently from each other, benzophenone, methyl o-benzoylbenzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamino) benzophenone, 2, 2-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholinopropano-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphineoxide and bis ( 2,4,6-trimethylbenzoyl) phenylphosphine oxide is a method for producing an electron emission display device which is one or a mixture of two or more selected from the group consisting of. According to claim 1, The first and second crosslinking agents are the same or independently of each other ethylene glycol diacrylate, ethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethyl Electron emission display device, which is one or a mixture of two or more selected from the group consisting of allpropane tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetra acrylate and pentaerythritol tetra methacrylate Method of preparation. According to claim 1, The first and second solvents are the same or independently of each other, ethyl carbitol, butyl carbitol ethyl carbitol acetate, butyl carbitol acetate, texanol, terpin oil, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, di Propylene glycol monomethyl ether acetate, γ-butyrolactone, cellosolve acetate, butyl cellosolve acetate and tripropylene glycol. According to claim 1, The amount of the blowing agent is 5 to 15% by weight relative to the total mixed weight of the first photosensitive monomer, the first photoinitiator, the first crosslinking agent and the solvent.

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