KR20070042394A - Exhaust module of wet station - Google Patents

Abstract

The present invention relates to a wet cleaning apparatus, comprising: a cleaning tank in which a cleaning process of a wafer is performed; A drying chamber in which a drying process of drying the wafer having been cleaned is performed; An IPA bubble unit for supplying IPA vapor for drying the wafer to the drying chamber; When the cleaning process is in progress, the exhaust of the cleaning tank is stopped, and the exhaust chamber for exhausting the drying chamber and the IPA bubble unit, and thus the IPA vapor and N ₂ gas for drying the wafer during the drying process of the wafer Irrespective of the exhaust gas of the IPA steam dryer, the exhaust air flow is kept constant so that various foreign substances remaining in the drying chamber and bubble unit can be discharged. At the same time, the drying defect of the wafer can be prevented in advance.

Description

Exhaust module of wet scrubber

1 is a simplified view showing an exhaust module of the wet cleaning equipment according to the prior art.

Figure 2 is a simplified diagram showing a wet cleaning equipment according to the present invention.

Figure 3 is a simplified diagram showing an exhaust module of the wet cleaning equipment according to the present invention.

Figure 4 is an operation diagram showing the operation of the exhaust module of the wet cleaning equipment according to the present invention.

** Description of the symbols for the main parts of the drawings **

100: wet cleaning equipment

110: washing tank

120: drying chamber

130: shutter

150: IPA Bubble Unit

200: exhaust module

The present invention relates to a wet cleaning equipment, and more particularly, to an exhaust module for performing the discharge of the dry gas is completed the drying process in the wet cleaning equipment.

In general, when the wafer is manufactured in an integrated circuit, a process for cleaning the wafer is required to remove residual materials, small particles, contaminants, etc. generated during various manufacturing processes. In particular, when manufacturing a high density integrated circuit, a cleaning process for removing fine contaminants adhering to the surface of the wafer is very important.

The wafer cleaning process is a chemical solution treatment process in which the wafer is treated with a chemical solution such as APM (Ammonium Peroxide Mixture), Sulfuric Acid Peroxide Mixture (SPM), or Diluted Mixture Hydrofluoric acid (DMF), and a wafer having a chemical solution treated with deionized water ( DIW) can be divided into a washing process and a washing process to dry the washed wafer.

Among these, defects (for example, water spots, etc.) caused by a defect in the drying process are relatively large and are repeatedly generated on the pattern, which is a serious cause of malfunction of the integrated circuit or preventing them from serving as an integrated circuit.

Various wafer drying apparatuses have been proposed and used, but recently, an IPA vapor drying apparatus using a marangoni effect by isopropyl alcohol (hereinafter, referred to as 'IPA') is mainly used.

Such an IPA vapor drying apparatus is to spray IPA vapor on the surface of a wafer washed with washing water (for example, pure water or deionized water) to replace and dry moisture remaining on the wafer. It consists of a bubble unit, a drying chamber in which the wafer is dried, a washing tank filled with washing water, and a main body provided with each component.

In brief, the operation of the IPA steam drying apparatus, the wafer is placed in the cleaning tank, washed, lifted into the drying chamber, and the IPA steam is injected into the drying chamber through the IPA steam supply pipe connected to the drying chamber.

The IPA vapor injected therein replaces the washing water remaining on the wafer surface, and the washing water is dried, and the IPA vapor adsorbed on the wafer is dried by a natural drying method or an N ₂ purge.

On the other hand, the IPA steam drying apparatus as described above is provided with a separate exhaust device for discharging the IPA vapor and N ₂ gas supplied for drying the wafer during the drying process of the wafer to the outside of the IPA steam drying apparatus after the wafer is dried, The exhaust device is provided with a separate exhaust module for controlling IPA vapor and N ₂ gas according to the drying process of the wafer.

1 is a simplified view showing an exhaust module of the wet cleaning equipment according to the prior art.

As shown, the exhaust module 10 according to the related art has a main body 10a forming the exhaust module 10 and a cleaning tank exhaust line 12 connected to a cleaning tank (not shown) on one side of the main body 10a. ), A drying chamber exhaust line 13 connected to a drying chamber (not shown), and a bubble unit exhaust line 14 connected to a bubble unit (not shown) are provided.

In addition, the other side of the main body 10a is provided with a main exhaust line 15 for forming the exhaust pressure of each exhaust line 12, 13, 14, and the main exhaust line 15 inside the main body 10a. A damper 16 for opening and closing the opening is provided.

The exhaust module 10 is provided such that the damper 16 opens and closes the main exhaust line 15 in accordance with the process of the IPA steam drying apparatus to exhaust the IPA steam and the N ₂ gas.

However, the exhaust module 10 according to the related art as described above is formed such that the entire exhaust line 12, 13, 14 is closed when the IPA vapor and the N ₂ gas are exhausted. 13, 14) the air flow of the drying chamber and the bubble unit is stagnant and the fumes remaining in the drying chamber and the bubble unit and the foreign matter are not discharged, but there is a problem of being precipitated or remaining in the drying chamber and the bubble unit.

In addition, there is a problem in that the airflow of the drying chamber and the IPA bubble unit is changed in accordance with the opening and closing of the main exhaust line 15, thereby repeatedly changing the drying environment of the wafer.

The present invention has been made to solve the above problems, regardless of the exhaust of the IPA vapor and N ₂ gas drying the wafer during the wafer drying process to maintain a constant exhaust air flow inside the IPA steam drying apparatus itself It is an object of the present invention to provide an exhaust module of a wet cleaning equipment capable of discharging various foreign substances remaining in the drying chamber and the bubble unit.

Wet cleaning equipment according to the present invention for achieving the above object, the cleaning tank in which the cleaning process of the wafer proceeds; A drying chamber in which a drying process of drying the wafer having been cleaned is performed; An IPA bubble unit for supplying IPA vapor for drying the wafer to the drying chamber; When the cleaning process is in progress, the exhaust of the cleaning tank is stopped, and an exhaust module for exhausting the drying chamber and the IPA bubble unit.

In addition, the exhaust module, the exhaust module body to form an exhaust space; A main exhaust pipe communicating with an exhaust space of the main body and provided with an exhaust pump; It is preferable that a damper for opening and closing the main exhaust pipe is provided, and a cleaning tank exhaust pipe communicating with the cleaning tank is connected to the exhaust space of the main body, and a drying chamber exhaust pipe communicating with the drying chamber is connected to the main exhaust pipe. .

In addition, it is preferable that an IPA bubble unit exhaust pipe communicating with the IPA bubble unit is connected to the drying chamber exhaust pipe.

Exhaust module of a wet cleaning device according to another aspect of the present invention, the body forming an exhaust space; A main exhaust pipe communicating with an exhaust space of the main body and provided with an exhaust pump; A damper for opening and closing the main exhaust pipe is provided, and a cleaning tank exhaust pipe communicating with a cleaning tank in which a wafer cleaning process is performed is connected to an exhaust space of the main body, and drying the wafer after the cleaning process is completed in the main exhaust pipe. A drying chamber exhaust pipe connected to the drying chamber in which the process is performed is connected.

In addition, it is preferable that an IPA bubble unit exhaust pipe communicating with an IPA bubble unit for supplying IPA vapor for drying the wafer to the drying chamber is connected to the drying chamber exhaust pipe.

Hereinafter, with reference to the accompanying drawings will be described in detail the exhaust module of the wet cleaning equipment according to the present invention.

In the following description of the present invention, the terms defined are defined in consideration of functions in the present invention, and should not be understood as a meaning of limiting the technical components of the present invention.

Figure 2 is a simplified view showing the wet cleaning equipment according to the present invention, Figure 3 is a simplified view showing the exhaust module of the wet cleaning equipment according to the present invention.

First, the wet cleaning device according to the present invention will be briefly described. As shown in FIG. 1, the wet cleaning device 100 according to the present invention accommodates the cleaning water for removing impurities remaining on the surface of the wafer (W). The cleaning tank 110, the drying chamber 120 for removing moisture on the surface of the wafer W, the wafer boat (or wafer support unit 140) for supporting the plurality of wafers W, and the wafer W IPA bubble unit 150 for supplying the IPA steam for drying) and an exhaust module 200 for discharging the IPA steam and the carrier gas to proceed drying.

The cleaning tank 110 forms a cleaning space for cleaning a plurality of wafers W stored in the wafer boat 140, an inner tank 110a for accommodating the washing water, and an upper portion of the inner tank 110a. It is arranged to surround the and includes an outer tub (110b) for receiving the washing water overflowing from the inner tub (110a).

An opening is formed in an upper portion of the cleaning tank 110, and both sides of the inner tank 110a are provided with cleaning water for supplying the cleaning water onto the wafers W located inside the inner tank 110a. The nozzle 112 is arranged. A lower portion of the inner tank 110a and the outer tank 110b is provided with a pair of drain pipes 114 for discharging the washing water contained in the inner tank 110a. In addition, the cleaning tank 110 is provided with a cleaning tank exhaust pipe 116 for discharging foreign matter or process gas remaining in the space formed above the inner tank 110a and the outer tank 110b.

The drying chamber 120 is disposed above the cleaning tank 110 to form a drying space for drying the wafers W, and to dry the wafers W at both inner portions of the drying chamber 120. A pair of injection nozzles 122 are arranged for injecting IPA vapor and N ₂ gas. In addition, the drying chamber exhaust pipe 126 for discharging the drying gas in the drying chamber 120 is further provided.

The shutter 130 is disposed between the cleaning tank 110 and the drying chamber 120 to be movable in the horizontal direction, and the cleaning space of the cleaning tank 110 and the drying space of the drying chamber 120 are shutter 130. It is limited by.

The wafer boat 140 supports a plurality of wafers W in a row, and each wafer W is inserted into a slot of the wafer boat 140 and aligned in a vertical direction. The wafers W are transferred to the wafer boat 140 by a wafer transfer robot (not shown), and the wafer boat 140 vertically moves the wafers W between the cleaning tank 110 and the drying chamber 120. It is arranged to move.

Specifically, the wafer boat 140 moves the wafers W downward so that the wafers W are immersed in the washing water contained in the inner tank 110a to clean the wafers W, and the cleaned wafers W are removed. Move upward to dry.

On the other hand, in order to prevent a natural oxide film from being generated on the surfaces of the wafers W while the wafer boat 140 moves the wafers W upwards, the N on the wafers W through the injection nozzle 122. ₂ gases may be supplied.

The washing water includes an aqueous hydrofluoric acid solution or pure water. The hydrofluoric acid aqueous solution is used to remove impurities or natural oxide film remaining on the wafer W surface, and pure water rinses the wafer cleaned by a chemical solution such as particles or hydrofluoric acid aqueous solution remaining on the wafer W. Used for However, the washing water may be variously selected according to the type of impurities remaining on the surface of the wafer (W).

The IPA bubble unit 150 generates IPA vapor by generating bubbles in the IPA by N ₂ gas heated and supplied to the injection nozzle 122 of the drying chamber 120 by a separate carrier gas. Supply. In addition, the IPA bubble unit 150 is further provided with an IPA steam exhaust pipe 156 for discharging the generated IPA steam.

The exhaust module 200 is for discharging residual gas of the drying chamber 120, the cleaning tank, and the IPA bubble unit 150, and each drying chamber 120, the cleaning tank 110, and the IPA bubble unit 150. Each exhaust pipe 116, 126, 156 and the discharge pump (not shown) provided in the) is provided to be connected respectively.

Hereinafter, the exhaust module 200 according to the present invention will be described with reference to FIG. 2. As illustrated in FIG. 2, an exhaust module main body 200a for forming an exhaust space and an exhaust pump (not shown) connected to the exhaust space of the main body 200a to form an exhaust pressure are provided at one side of the main body 200a. The main exhaust pipe 210 is provided, and a damper 220 is provided inside the main body 200a to open and close the main exhaust pipe 210.

In addition, the washing tank exhaust pipe 116 connected to the washing tank 110 is connected to the main body 200a, and the drying chamber exhaust pipe 126 of the drying chamber 120 is connected to the main exhaust pipe 210. do. Here, the IPA vapor exhaust pipe 156 provided in the IPA bubble unit 150 is connected to the drying chamber exhaust pipe 126 in communication.

Accordingly, the operation of the exhaust module of the wet cleaning equipment according to the present invention will be described in detail through the embodiment. Each element mentioned below should be understood with reference to the above description and FIGS. 2 to 3.

Figure 4 is an operation diagram showing the operation of the exhaust module of the wet cleaning equipment according to the present invention.

First, as the process progresses in the wet cleaning apparatus 100 according to the present invention, when the wafer W is immersed in the washing water filled in the cleaning tank 110, the damper 220 of the exhaust module 200 is the main exhaust pipe. When the wafer W cleaned by the washing water is transferred to the drying chamber 120 and dried, the damper 220 of the exhaust module 200 opens the main exhaust pipe 210. (See FIG. 3).

Accordingly, when the wafer W is cleaned, that is, when the main exhaust pipe 210 is closed by the damper 220, the cleaning tank exhaust pipe 116 for exhausting the cleaning tank 110 is closed and cleaned. The process proceeds. However, at this time, each of the exhaust pipes 126 and 156 provided in the drying chamber 120 and the IPA bubble unit 150 is communicated on the main exhaust pipe 210 of the exhaust module 200, so that the damper 220 is connected to the main exhaust pipe 210. ), The exhaust continues.

That is, the foreign matter or the process gas and the like remaining in the drying chamber 120 and the IPA bubble unit 150 maintain a state of being exhausted while forming a constant airflow even during the cleaning process.

Meanwhile, when the wafer W is dried, that is, when the main exhaust pipe 210 is opened by the damper 220, the cleaning tank 110, the drying chamber 120, and the IPA bubble unit (during the drying process) are performed. 150) All are kept exhausted.

Therefore, the drying chamber 120 and the IPA bubble unit 150 stay in the drying chamber 120 and the IPA bubble unit 150 by maintaining a state in which the exhaust gas proceeds while always forming a constant air flow during the cleaning and drying process. The foreign matter and the process gas are discharged, and it is possible to maintain a constant drying environment of the cleaned wafer (W).

Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Therefore, changes in the future embodiments of the present invention will not be able to escape the technology of the present invention.

As described above, according to the exhaust module of the wet cleaning apparatus according to the present invention, regardless of the exhaust of the IPA vapor and N ₂ gas to dry the wafer during the wafer drying process, the exhaust air flow in the IPA steam drying apparatus itself To keep various constants in the drying chamber and bubble unit so that foreign substances and residual gas remaining in the equipment can be discharged to improve the cleaning efficiency of the equipment and prevent wafer dry defects. It can be effective.

Claims (5)

A cleaning tank in which the cleaning process of the wafer is performed; A drying chamber in which a drying process of drying the wafer having been cleaned is performed; An IPA bubble unit for supplying IPA vapor for drying the wafer to the drying chamber; And an exhaust module for stopping the exhaust of the cleaning tank and exhausting the drying chamber and the IPA bubble unit when the cleaning process is performed. The method of claim 1, wherein the exhaust module, An exhaust module body forming an exhaust space; A main exhaust pipe communicating with an exhaust space of the main body and provided with an exhaust pump; A damper is provided to open and close the main exhaust pipe, And a cleaning tank exhaust pipe communicating with the cleaning tank is connected to the exhaust space of the main body, and a drying chamber exhaust pipe communicating with the drying chamber is connected to the main exhaust pipe. The method of claim 2, Wet cleaning equipment, characterized in that the drying chamber exhaust pipe is connected to the IPA bubble unit exhaust pipe communicating with the IPA bubble unit. A main body defining an exhaust space; A main exhaust pipe communicating with an exhaust space of the main body and provided with an exhaust pump; A damper is provided to open and close the main exhaust pipe, A drying chamber connected to a cleaning tank exhaust pipe communicating with a cleaning tank in which a wafer cleaning process is performed in the exhaust space of the main body, and a drying chamber in communication with a drying chamber in which a drying process for drying the wafer is completed. Exhaust module of wet cleaning equipment, characterized in that the exhaust pipe is connected The method of claim 4, wherein And an IPA bubble unit exhaust pipe communicating with the IPA bubble unit for supplying IPA vapor for drying the wafer to the drying chamber to the drying chamber exhaust pipe.

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