KR20070017738A - A solid electrolytic condenser and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a solid electrolytic capacitor and a method of manufacturing the same, comprising: forming an anode lead frame and a plate-shaped cathode lead frame having a structure from a conductive metal plate; Bonding the anode lead frame to the anode wire of the condenser element having a cathode wire protruding on one side and a cathode layer formed on an outer surface thereof; Adhering the negative lead frame to the negative electrode layer of the condenser element; Forming an epoxy case by molding the capacitor, the cathode, and the anode lead frame with epoxy; And removing unnecessary anode and cathode leadframes by dicing or cutting the epoxy case. Therefore, the anode lead frame adhered to the anode wire of the condenser element and the cathode lead frame adhered to the cathode layer of the condenser element are simultaneously formed by using one etching process or press compression process. The number of processes can be reduced and manufacturing costs can be reduced.

Tantalum element, solid electrolytic capacitor, anode, cathode, lead frame, wire

Description

Solid Electrolytic Capacitor and Manufacturing Method Thereof {A SOLID ELECTROLYTIC CONDENSER AND METHOD OF MANUFACTURING THE SAME}

1 to 7 is a manufacturing process diagram of a solid electrolytic capacitor according to the prior art,

 1 is a plan view (a) and a cross-sectional view (b) of the anode lead frame 10,

2 is a plan view (a) and a cross-sectional view (b) illustrating a state in which a connection reinforcing material is welded to one side of the anode lead frame 10,

3 is a plan view (a) and a cross-sectional view (b) showing the welding of the anode lead frame 10 to the anode wire 30 of the capacitor element 20,

4 is a plan view (a) and a cross-sectional view (b) showing a state of cutting the anode lead frame 10,

5 is a plan view (a) and a cross-sectional view (b) showing a state in which the negative electrode terminal 40 is connected to the condenser element 20,

6 is a plan view (a) and a cross-sectional view (b) showing a state in which a mold is formed on a capacitor device 20 to which the anode lead frame 10 and the cathode terminal 40 are connected.

FIG. 7 is a plan view (a) and a cross-sectional view (b) illustrating a state in which unnecessary anode and cathode lead frames are removed by dicing and cutting the capacitor device 20.

8 to 11 are manufacturing process diagrams of the solid electrolytic capacitor according to the present invention.

8 is a plan view (a) and a cross-sectional view (b) for explaining a method of forming the positive lead frame 110 and the negative electrode terminal 140,

9 is a plan view (a) and a cross-sectional view (b) for explaining a method of connecting the positive lead frame 110 and the negative electrode terminal 140 to the capacitor device 120,

10 is a plan view (a) and a cross-sectional view (b) showing a state in which a mold is formed on the capacitor device 120 to which the anode lead frame 110 and the cathode terminal 140 are connected.

FIG. 11 is a plan view (a) and a cross-sectional view (b) illustrating a state in which unnecessary anode and cathode lead frames are removed by dicing and cutting the capacitor device 120.

<Description of Major Symbols in Drawing>

100: conductive metal plate 110: anode lead frame

120: capacitor element 130: anode wire

140: cathode lead frame 150: epoxy case

160a: upper welding electrode 160b: lower welding electrode

The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same, and more particularly, to a solid electrolytic capacitor and a method for manufacturing the same, which can reduce the manufacturing cost by reducing the number of manufacturing processes.

In general, a solid electrolytic capacitor is an electronic component used for the purpose of blocking direct current and passing an alternating current in addition to a function of accumulating electricity, and the most representative tantalum capacitor among these solid electrolytic capacitors uses a rated voltage as well as general industrial equipment. It is used in low-range application circuits, and is especially used for noise reduction in circuits or portable communication devices where frequency characteristics are problematic.

1 to 7 is a manufacturing process diagram of a solid electrolytic capacitor according to the prior art, Figure 1 is a plan view (a) and a cross-sectional view (b) of the anode lead frame (10a), Figure 2 is one side of the anode lead frame (10a) Is a plan view (a) and a cross-sectional view (b) showing a state of welding the connection reinforcing material (10b) to, Figure 3 is a view showing the welding of the anode lead frame 10 to the anode wire 30 of the capacitor element 20 4 is a plan view (a) and a cross-sectional view (b), and FIG. 4 is a plan view (a) and a cross-sectional view (b) showing a state in which the positive lead frame 10 is cut. ) Is a plan view (a) and a cross-sectional view (b) showing the connection state, Figure 6 is a mold (Mold) on the capacitor element 20 is connected to the positive lead frame 10 and the negative terminal 40 7A and 7B are a plan view (a) and a cross-sectional view (b) of FIG. 7, and FIG. 7 shows a capacitor in which unnecessary positive and negative lead frames are removed by dicing and cutting the capacitor device 20. A top view (a) and a sectional view (b) showing a.

First, as shown in FIG. 7, the solid electrolytic capacitor is easily mounted on a capacitor device 20 and a printed circuit board (PCB) made of a dielectric powder material that determines the capacity and characteristics of the capacitor. Positive and negative lead frames 10 and 40 connected to the condenser element 20 and an epoxy case 50 to protect the condenser element 20 from an external environment. Here, the capacitor element 20 has a rod-shaped anode wire 30 protruding to a predetermined length on one side. In addition, the anode wire 30 is provided with a pressure surface 32 having a flat outer surface to increase the contact ratio between the anode lead frame 10 and to prevent left and right shake during welding.

Here, in the process of manufacturing the condenser element 20, the dielectric powder is formed into a rectangular parallelepiped in the press process and sintered. It is formed by thermal decomposition of a manganese dioxide layer of solid electrolyte on cotton.

The process of manufacturing a solid electrolytic capacitor using the condenser element 20 is as follows.

First, the anode lead frame 10a is formed as shown in FIG. 1, and then the connection reinforcement 10b is welded to one side of the anode lead frame 10a as shown in FIG. 2.

Next, as shown in FIG. 3, the connection reinforcing member 10b of the anode lead frame 10 is attached to the pressure hole 32 of the anode wire 30 of the condenser element 20 by welding.

Next, the anode lead frame 10 is cut and cut as shown in FIG. 4.

Next, as shown in FIG. 5, a conductive adhesive is applied between the outer surface of the condenser element 20 and the negative electrode lead frame 40, and then cured to take out the negative electrode terminal.

Next, as shown in FIG. 6, an epoxy case 50 is formed by molding an epoxy in the capacitor device 20 to which the positive and negative lead frames 10 and 40 are connected. As shown in Fig. 7, the solid electrolytic capacitor is completed through the dicing process.

However, according to the conventional method of manufacturing a solid electrolytic capacitor as described above, after forming the anode lead frame 10a as shown in FIG. 1, the connection reinforcing material 10b is disposed on one side of the anode lead frame 10a as shown in FIG. 2. Further welding was needed. In addition, by separately forming the anode lead frame 10a and the cathode lead frame 40, there are a number of manufacturing processes, which has the disadvantage that the manufacturing cost increases.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to form a solid electrolytic capacitor which can reduce the manufacturing cost by reducing the number of manufacturing processes by forming the positive and negative lead frames integrally by one process. To provide.

Another object of the present invention is to provide a method for producing the solid electrolytic capacitor.

According to an aspect of the present invention, there is provided a method of manufacturing a solid electrolytic capacitor, the method including: forming an anode lead frame and a plate-shaped cathode lead frame having a structure from a conductive metal plate; Bonding the anode lead frame to the anode wire of the condenser element having a cathode wire protruding from one side thereof and a cathode layer formed on an outer surface thereof; Adhering the negative lead frame to the negative electrode layer of the condenser element; Forming an epoxy case by molding the capacitor, the cathode, and the anode lead frame with epoxy; And removing unnecessary anode and cathode leadframes by dicing or cutting the epoxy case.

Here, the anode lead frame is characterized in that formed in the etching (Etching) process from the conductive metal plate.

The cathode lead frame may be formed simultaneously with the anode lead frame by the etching process from the conductive metal plate.

In addition, the anode lead frame is characterized in that formed in the press (press) pressing process from the conductive metal plate.

The cathode lead frame may be formed simultaneously with the anode lead frame by the press crimping process from the conductive metal plate.

The anode lead frame may be bonded to the anode wire of the condenser element by any one of an electric spot, ultrasonic welding, and laser welding.

In addition, the negative lead frame is characterized in that the adhesive is bonded to the negative electrode layer of the capacitor using silver (Ag) paste (paste).

Furthermore, the solid electrolytic capacitor according to the present invention for achieving the above object is characterized by being produced by at least one of the above-described manufacturing method.

Therefore, the anode lead frame adhered to the anode wire of the condenser element and the cathode lead frame adhered to the cathode layer of the condenser element are simultaneously formed by using one etching process or press compression process. The number of processes can be reduced and manufacturing cost can be reduced.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

Example

8 to 11 are manufacturing process diagrams of the solid electrolytic capacitor according to the present invention, and FIG. 8 is a plan view (a) and a cross-sectional view (b) for explaining a method of forming the anode lead frame 110 and the cathode terminal 140. 9 is a plan view (a) and a cross-sectional view (b) for explaining a method of connecting the positive lead frame 110 and the negative electrode terminal 140 to the capacitor device 120, and FIG. 10 is the positive lead frame 110. ) Is a plan view (a) and a cross-sectional view (b) showing the mold (Mold) on the capacitor device 120 is connected to the negative electrode terminal 140, Figure 11 is dicing and cutting the capacitor device 120 ( A plan view (a) and a cross-sectional view (b) showing a state in which unnecessary positive and negative lead frames are removed by cutting) are shown.

As shown in FIG. 11, the solid electrolytic capacitor according to the present invention includes a capacitor device 120 made of a dielectric powder material for determining the capacity and characteristics of the capacitor, and the capacitor device so as to be easily mounted on a printed circuit board (PCB). An anode and cathode lead frames 110 and 140 connected to the 120 and an epoxy case 150 to protect the capacitor 120 from an external environment. Here, the condenser element 120 has a rod-shaped anode wire 130 protruding to a predetermined length on one side. In addition, the anode wire 130 is provided with a pressure surface 132 having a flat outer surface to increase the contact ratio between the anode lead frames 110 and to prevent left and right shaking during welding.

Here, although the present invention will be described later, the anode lead frame 110 is formed by one process, and the cathode lead frame 140 is integrally formed when the anode lead frame 110 is formed. At this time, the negative lead frame 140 has a flat structure in order to increase the volume ratio therein.

Then, the manufacturing method of the solid electrolytic capacitor by this invention is demonstrated.

First, as shown in FIG. 8, the anode lead frame 110 having a single structure is formed of a conductive metal plate, unlike the plate lead cathode 140 and the connection reinforcing material 10b of the related art. Using 100 to form at the same time in one process. Here, the process of simultaneously forming the cathode lead frame 140 and the anode lead frame 110 in one process may be formed using an etching process or a press crimping process. Here, the hatched portions in FIG. 8 represent portions to be removed during an etching process or a press bonding process.

In the present invention, the plate-shaped cathode lead frame 140 and the anode lead frame 110 formed of the single structure are simultaneously formed through an etching process or a press crimping process. The process of welding the connection reinforcing material (10b) on one side of the frame (10a) was further required, and the number of processes was required by forming the anode lead frame 10a and the cathode lead frame 40 separately.

Next, as shown in FIG. 9, the plate-shaped negative lead frame 140 is bonded to the negative electrode layer of the condenser element 120 using silver paste, and the positive electrode of the condenser element 120 is attached. The anode lead frame 110 is welded and attached to the pressure surface 132 of the wire 130. At this time, the welding may be any one of electric spot, ultrasonic welding and laser welding, but electric spot welding is preferable. Reference numerals 160a and 160b, which are not described in the drawings, indicate upper and lower welding electrodes.

Next, as shown in FIG. 10, an epoxy case 150 is formed by molding an epoxy to the capacitor device 120 to which the anode and cathode lead frames 110 and 140 are connected.

Next, as illustrated in FIG. 11, unnecessary cathode and anode frames are removed by dicing and cutting the cathode and anode lead frames 140 and 110 to complete the solid electrolytic capacitor.

In conclusion, in the related art, a process of welding the connection reinforcement 10b to one side of the anode lead frame 10a was additionally required, and the process was formed by separately forming the anode lead frame 10a and the cathode lead frame 40, respectively. It took a lot.

However, in the present invention, the anode lead frame 110 adhered to the anode wire 130 of the capacitor device 120 is formed in one structure, and the anode lead frame 110 and the capacitor device formed as one structure are formed. By simultaneously forming the plate-shaped cathode lead frame 140 adhered to the cathode layer of 120 using one etching process or a press crimping process, the number of manufacturing processes can be reduced and manufacturing cost can be reduced. There is an advantage to reduce.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, according to the solid electrolytic capacitor according to the present invention and a method of manufacturing the same, one etching of the anode lead frame adhered to the anode wire of the capacitor element and the cathode lead frame adhered to the cathode layer of the capacitor element By simultaneously forming using an etching process or a press crimping process, the number of manufacturing processes can be reduced and manufacturing costs can be reduced.

Claims (8)

Forming an anode lead frame and a plate-shaped cathode lead frame having a structure from a conductive metal plate; Bonding the anode lead frame to the anode wire of the condenser element having a cathode wire protruding on one side and a cathode layer formed on an outer surface thereof; Adhering the negative lead frame to the negative electrode layer of the condenser element; Forming an epoxy case by molding the capacitor, the cathode, and the anode lead frame with epoxy; And And removing unnecessary anode and cathode leadframes by dicing and cutting the epoxy case. The method of claim 1, The anode lead frame is formed by an etching process from the conductive metal plate. The method of claim 2, The cathode lead frame is formed from the conductive metal plate at the same time as the anode lead frame by the etching process. The method of claim 1, The anode lead frame is formed by a press crimping process from the conductive metal plate. The method of claim 4, wherein The cathode lead frame is formed from the conductive metal plate at the same time as the anode lead frame by the press bonding process. The method of claim 1, The anode lead frame is bonded to the anode wire of the capacitor element by any one of electric spot, ultrasonic welding and laser welding. The method of claim 1, The cathode lead frame is bonded to the cathode layer of the capacitor element by using silver (Ag) paste (paste). The solid electrolytic capacitor characterized by what was manufactured by the method in any one of Claims 1-7.

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