KR20070013100A - Semiconductor manufacturing equipment and cooling method of showerhead using the same - Google Patents

Abstract

Equipment for fabricating a semiconductor device is provided to maintain a shower heat at a predetermined temperature by adjusting the flowrate of cooling fluid so that the temperature variation of the shower head varying with the position of a heater clock is controlled. While a heater block on which a wafer is placed is elevated toward a shower head to perform a predetermined process, cooling fluid is supplied to the shower head. The temperature of the shower head elevated by the heater block is measured by a temperature gauge(S20). It is determined whether the temperature value of the shower head measured by the temperature gauge is a predetermined temperature value(S30). If so, a process is continuously performed(S40). If not, the flowrate of the cooling fluid is adjusted to control the temperature of the shower head(S50).

Description

Semi-conductor manufacturing equipment and cooling method of showerhead using the same}

1 is a block diagram illustrating a semiconductor device manufacturing facility according to the present invention.

2 is a block diagram illustrating a method of cooling a shower head using a semiconductor device manufacturing apparatus according to the present invention.

** Description of the symbols for the main parts of the drawings **

100: semiconductor device manufacturing equipment

110: process chamber

120: shower head

130: heater block

200: cooling device

210: chiller

215: cooling fluid supply source

220: cooling fluid supply line

230: cooling fluid discharge line

240: controller

250: flow control valve

260: temperature gauge

270 cooling path

The present invention relates to an apparatus for manufacturing a semiconductor device and a process method using the same. More particularly, a semiconductor device manufacturing facility for cooling a shower head of a process chamber requiring a high temperature atmosphere in order to manufacture a semiconductor device, and the same. It relates to a cooling method of the shower head used.

In general, a semiconductor device stacks at least one conductive layer, semiconductor layer, non-conductive layer, etc. by selectively repeating a process such as photolithography, etching, ashing, diffusion, chemical vapor deposition, ion implantation, and metal deposition on a wafer. To be combined.

In the semiconductor device manufacturing process, the etching, ashing, diffusion, chemical vapor deposition, and metal deposition processes supply process gases into a process chamber in a vacuum or high temperature atmosphere and convert these process gases into a plasma state or other process. Coupling with the process gas allows the desired reaction to occur on the wafer.

On the other hand, the process chamber forming a high-temperature atmosphere is provided with a shower head for supplying the process gas into the process chamber, the wafer transferred to the process chamber inside the process chamber is seated and the seated wafer A heater block for heating to a predetermined temperature is provided.

Here, the heater block is provided with a lifting unit for elevating the heater block toward the shower head, and inside the process chamber, the heater block on which the wafer is seated is raised toward the shower head by using the elevating unit to form a high temperature atmosphere. The process will be carried out.

Meanwhile, in the process of the process, the temperature of the shower head is increased by raising the heater block, and a cooling device for lowering the temperature of the shower head raised by the heater block is provided.

At this time, the cooling device is provided inside the shower head, and the cooling channel through which the cooling fluid is circulated, the external chiller supplying the cooling fluid to the cooling channel, the cooling fluid supply line connecting the chiller and the cooling channel, and the cooling fluid. It consists of a discharge line.

However, in the conventional semiconductor device manufacturing equipment, the temperature of the shower head is changed according to the distance between the shower head and the heater block, and the conventional cooling apparatus uniformly supplies a constant temperature and a certain amount of cooling fluid to the shower head. Therefore, the conventional cooling apparatus does not cope with the temperature of the shower head that varies depending on the position of the heater block to be elevated, and thus there is a problem that the temperature deviation of the shower head becomes large.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a semiconductor device manufacturing facility that can cope with a change in temperature of a shower head and a cooling method of a shower head using the same.

According to a first aspect of the present invention for realizing the above object, the process chamber, a heater block provided at a lower portion of the process chamber, and a wafer seated thereon, are spaced apart a predetermined distance from an upper portion of the process chamber so as to face the heater block. Provided is a semiconductor device manufacturing apparatus including a shower head for supplying a predetermined process gas on a wafer, and a cooling device for controlling a temperature of the shower head by adjusting a flow rate of a cooling fluid supplied to the shower head.

Here, the cooling device is provided on one side of a cooling flow path provided in the shower head, a chiller for supplying a cooling fluid to the cooling flow path, a flow control valve for adjusting the flow rate of the cooling fluid supplied to the cooling flow path, and a shower head. It includes a temperature gauge that measures the temperature of the head.

At this time, the chiller is connected to the cooling fluid supply source, the cooling fluid supply source and the cooling flow path in which the cooling fluid is stored, the cooling fluid supply line for supplying the cooling fluid to the cooling flow path, and the cooling fluid supply source and the other side of the cooling flow path for cooling It consists of a cooling fluid discharge line for recovering the cooling fluid from the flow path to the cooling fluid supply source. In addition, the flow control valve is preferably provided on the cooling fluid supply line.

The temperature gauge is preferably a thermocouple gauge.

On the other hand, according to the second aspect of the present invention for achieving the above object, the step of raising the heater block on which the wafer is seated toward the shower head to perform a predetermined process and supplying a cooling fluid to the shower head, Measuring the temperature of the shower head raised due to the rise of the heater block by the temperature gauge, determining whether the temperature value of the shower head measured by the temperature gauge is a preset temperature value and the temperature value of the shower head in advance If the temperature is set to provide a cooling method of the shower head using a semiconductor device manufacturing equipment comprising the step of continuously performing the process.

In addition, the cooling method of the shower head using the provided semiconductor device manufacturing facility further includes controlling the temperature of the shower head by adjusting the flow rate of the cooling fluid if the temperature value of the shower head is not a preset temperature value.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the spirit of the present invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

1 is a block diagram showing a semiconductor device manufacturing equipment according to the present invention.

Referring to FIG. 1, in a semiconductor device manufacturing apparatus 100 according to the present invention, a cooling apparatus for cooling a process chamber 110 in which a predetermined process is performed and a shower head 120 inside the process chamber 110 to be described later. 200 is provided.

Here, the process chamber 110 is provided with a heater block 130 on which the wafer W transferred to the inside of the process chamber 110 is seated, and the heater block 130 is provided on the heater block 130. The shower head 120 is provided at positions spaced apart from each other to face each other. In addition, a slit valve door 115 is provided at one side of the process chamber 110 to allow the wafer transfer device (not shown) to enter and exit the heater block 130.

In this case, the heater block 130 includes a plurality of heaters 135 for heating the wafer W seated on the heater block 130, and a lift for seating the wafer W on the heater block 130. The pin 140 is provided to pass through. In addition, a lifting unit 150 is provided below the heater block 130 to elevate the heater block 130 toward the shower head 120 to perform a predetermined process.

In addition, the shower head 120 is provided with a process gas passage 125 for supplying a predetermined process gas into the process chamber 110 to cause a predetermined reaction on the wafer W seated on the heater block 130. .

On the other hand, the cooling device 200 is a cooling fluid 270 largely provided inside the shower head 120, the temperature gauge 260 and the cooling flow path 270 for measuring the temperature of the shower head 120 to cool the cooling fluid. It consists of a chiller 210 to supply.

At this time, the cooling passage 270 is provided inside the shower head 120 to cool down the cooling fluid supplied from the chiller 210 along the cooling passage 270 to lower the temperature of the shower head 120.

And, the temperature gauge 260 is provided on one side of the shower head 120, such as the cooling flow path 270 serves to measure the temperature of the shower head 120. In this case, the temperature gauge 260 may be a thermocouple gauge capable of measuring temperature according to the potential difference between the two electrode plates.

In addition, the chiller 210 is disposed outside the process chamber 110, and the chiller 210 is electrically connected to the cooling fluid supply source 215 in which the cooling fluid is stored, and the temperature gauge 260 described above. The controller 240 receiving the temperature value measured by the temperature gauge 260 is provided.

Here, one side of the cooling fluid supply source 215 of the chiller 210 and the cooling flow path 270 provided in the shower head 120 is connected to the cooling fluid supply line 220 of the cooling fluid, and the cooling fluid supply source 215 and Cooling fluid discharge line 230 is connected to the other side of the cooling flow path 170, respectively. At this time, the cooling fluid supply line 220 and the cooling fluid discharge line 230 serve as a passage for supplying or recovering the cooling fluid from the cooling fluid supply source 215 to the cooling flow path 270.

Then, on the cooling fluid supply line 220 described above, the flow rate control valve 250 to control the flow rate of the cooling fluid supplied to the cooling flow path 270 of the shower head 120 through the cooling fluid supply line 220. Is prepared. At this time, the flow control valve 250 is electrically connected to the controller 240, the controller 240 received the temperature value of the shower head 120 from the temperature gauge 260 to control the flow control valve 250 The flow rate of the cooling fluid supplied to the cooling passage 270 is to be adjusted. Here, the above-described flow control valve 250 is preferably embedded in the chiller 210, the flow control valve 250 to the rotation of the flapper (not shown) installed on the cooling fluid supply line 220. It may be a throttle valve to adjust the flow rate of the fluid according.

Hereinafter, a cooling method of a shower head using a semiconductor device manufacturing apparatus according to the present invention will be described with reference to the accompanying drawings.

First, in order to perform a predetermined process, the wafer W is transferred into the process chamber 110, and the transferred wafer W is seated on the heater block 130. Subsequently, when the wafer W is seated, the process chamber 110 raises the heater block 130 to the shower head side 120 using the lifting unit 150, and the process gas flow path 125 of the shower head 120. The predetermined process gas is supplied into the process chamber 110 through). In this case, the shower head 120 continuously maintains a process in which the cooling fluid supplied from the cooling fluid supply source 215 of the cooling device 200 is constantly supplied to and discharged back to the cooling fluid supply source 215, and thus the shower head 120. Cool the temperature (S10).

On the other hand, the heater block 130 is raised toward the shower head 120 by the operation of the lifting unit 150 in the above process, the temperature of the shower head 120 is changed according to the position of the heater block 130. .

In this case, in order to prevent a process defect from occurring due to the temperature change of the shower head 120, the present invention first measures the temperature of the shower head 120 using the temperature gauge 260 of the cooling device 200. Perform the process (S20).

Thereafter, the temperature value of the shower head 120 measured by the temperature gauge 260 is transmitted to the controller 240, and the controller 240 determines whether the measured temperature value of the shower head 120 is a preset temperature value. It is made (S30).

In this case, when the temperature value of the shower head determined by the controller 240 is a preset temperature value, the semiconductor device manufacturing facility continuously performs a predetermined process (S40).

However, when the temperature value of the shower head 120 determined by the controller 240 is out of the preset temperature value, the controller 240 controls the flow control valve 250 to distribute the cooling fluid to the cooling flow path 270. The temperature of the shower head 120 is adjusted to a set temperature by adjusting the flow rate of the heater head 120. For example, when the heater block 130 approaches the shower head 120 by the lifting unit 150, the heater block ( Due to the temperature of the shower head 120 is increased due to 130, the flow rate of the cooling fluid supplied to the cooling flow path 270 should be increased, and when the heater block 130 is moved away from the shower head 120, the shower head ( The temperature of 120 is lowered so that the flow rate of the cooling fluid supplied to the cooling channel 270 should be reduced (S50).

On the other hand, the present invention has been described with reference to the illustrated drawings, which are merely exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

As described above, the semiconductor device manufacturing apparatus and the shower head cooling method using the same according to the present invention set the temperature of the shower head by controlling the flow rate of the cooling fluid by changing the temperature of the shower head according to the position of the heater block. It has the effect of maintaining at temperature.

Claims (6)

Process chamber; A heater block provided under the process chamber and on which wafers are seated; A shower head spaced apart from each other at a predetermined interval so as to face the heater block and supplying a predetermined process gas onto the wafer; And And a cooling device configured to control a temperature of the shower head by adjusting a flow rate of the cooling fluid supplied to the shower head. The method of claim 1, The cooling device includes a cooling flow path provided inside the shower head, a chiller for supplying a cooling fluid to the cooling flow path, a flow control valve for controlling a flow rate of the cooling fluid supplied to the cooling flow path, and one side of the shower head. Provided is a semiconductor device manufacturing facility comprising a temperature gauge for measuring the temperature of the shower head. The method of claim 2, The chiller is connected to one side of the cooling fluid supply source and the cooling fluid supply source, the cooling fluid supply source and the cooling fluid supply line for supplying the cooling fluid to the cooling flow path and the other side of the cooling fluid supply source and the cooling flow path and And a cooling fluid discharge line for recovering cooling fluid from the cooling flow path to the cooling fluid supply source. The flow rate control valve is a semiconductor device manufacturing equipment, characterized in that provided on the cooling fluid supply line. The method of claim 2, The temperature gauge is a semiconductor device manufacturing equipment, characterized in that the thermocouple gauge. Raising a heater block on which a wafer is seated toward the shower head to perform a predetermined process, and supplying cooling fluid to the shower head; Measuring a temperature of the shower head raised by the heater block by a temperature gauge; Determining whether a temperature value of the shower head measured by the temperature gauge is a preset temperature value; If the temperature value of the shower head is a predetermined temperature value, the method of cooling the shower head using a semiconductor device manufacturing equipment comprising the step of continuously performing the process. The method of claim 5, If the temperature value of the shower head is not a predetermined temperature value further comprises the step of controlling the temperature of the shower head by adjusting the flow rate of the cooling fluid further comprises the step of adjusting the temperature of the shower head.

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