KR20070006438A - Interlayer sound insulation device of building structure and its installation method - Google Patents

Abstract

The present invention relates to an interlayer sound insulation device for a building structure and a method of installing the same.

The present invention provides a soundproofing device provided in an interlayer slab of a building, wherein rectangular panels are in close contact with each other to form a floor structure, and a plurality of grooves are formed to be opened downward in the bottom surface of each panel, and the dust-proof material is formed in the grooves. The pad is fitted to the panel so as to maintain a predetermined gap from the bottom surface, and the anti-vibration pad coupled to the groove of the panel is characterized in that the buffer space is vertically penetrating or upwardly open in the axial center.

Description

Interlayer sound insulation device of building structure and its installation method {INTER LAYER SOUND ABSORBING EQUIPMENT OF THE BUILDING STRUCTURE AND SETTING METHOD THEREOF}

1 is an exploded perspective view showing an interlayer sound insulation device of a building structure according to the present invention.

Figure 2 is a cross-sectional view of the coupled state of FIG.

3 is a plan view of FIG. 1 or 2;

4 is a bottom view of FIG. 3.

Figure 5 is a longitudinal sectional view of the anti-vibration pad having a buffer space penetrated up and down in the interlayer sound insulation of the building structure according to the invention.

Figure 6 is a longitudinal cross-sectional view of the anti-vibration pad having an up buffer space in another embodiment according to the present invention.

Figure 7 is a longitudinal cross-sectional view of the anti-vibration pad in which the inner wall of the buffer space in a tapered angle in another embodiment according to the present invention.

Figure 8 is a longitudinal cross-sectional view of the anti-vibration pad showing that the upper and lower bent portion is formed inside the buffer space in another embodiment according to the present invention.

9 is a bottom view of FIG. 7 or 8.

10 is another embodiment of a dustproof pad according to the present invention.

11 is a bottom view of FIG. 10.

12 is a cross-sectional view of the installation state of the interlayer sound insulation device of a building structure according to the present invention.

<Description of the symbols for the main parts of the drawings>

100,100a: panel 110: groove

120: seating jaw 122: pinhole

130: seating groove 132: pin

140: groove 150: projection line

200: dustproof pad 210: buffer space

220: taper angle 222: cushion projection

230: bend

The present invention relates to an interlayer sound insulation device and a sound insulation method of a building structure, and more particularly, a dustproof pad in which an airtight pad is formed on an interlayer slab of a multi-layered building such as an apartment to maintain a sound insulation panel. The present invention relates to an interlayer sound insulation device and a sound insulation method of a building structure to improve the effect of blocking and absorbing interlayer noise and impact sound, and to maintain such effects even after a long period of time after construction.

Currently, multi-layered building structures, such as apartments, have a tendency to restrict the noise level of building structures strictly as the desire for comfort of the living space is increased.

Recently, various structures and construction methods thereof have been proposed to solve the noise of the interlayer structures. For example, a surface buffering method made by placing a floor finishing material on a flexible material, such as carpet or foamed vinyl, increases the weight of the floor slab. Heavy-duty rigid flooring method, floating floor method to block the transmission path of the floor impact sound, double ceiling method to ensure a sufficient air layer between the slab and the ceiling of the lower floor and the like has been proposed and constructed.

The floating floor method is a structure in which the air between the floating floors absorbs the impact sound, and is recently applied as a sound insulation material in an apartment or the like, but it is necessary to place the floor structure at a predetermined height from the slab. There is a need for a support and the support is not enough to solve the noise problem as the impact sound generated from the floor structure is delivered to the slab as it is. In addition, the support of the floor structure has a problem that the sound insulation effect is lowered because the elastic support for vibration or impact sound is weakened after a long period of time after construction.

Accordingly, the present invention was devised to solve the above problems, and an object of the present invention is to completely absorb the noise or impact sound generated at the upper floor of the building and to be absorbed through the dustproof pad while simultaneously absorbing the noise or impact sound. It is to create a structure of a soundproof panel and a dustproof pad having high durability that can block and maintain the sound insulation effect semi-permanently.

In addition, the panel supporting the floor structure of the building is to ensure that the installation of the operator can be easily assembled in a simple manner.

In order to achieve the above object, the present invention, in the sound insulation device provided in the interlayer slab of the building, the rectangular panel is in close contact with each other to form a floor structure, so that a plurality of grooves are formed to open downward on the bottom of each panel. , The dustproof pad of the resin material is fitted into the groove, characterized in that the panel is to maintain a predetermined gap from the bottom surface.

Here, the seating jaw having pinholes on both sides of one edge of the panel is extended in a stepped shape, and the seating jaw of the other panel is engaged with both bottoms of the corners corresponding to the corners to maintain the same plane. It is preferable that the mounting groove and the pin hole coupling pin are formed to protrude.

In addition, a plurality of grooves for reducing weight are formed to be opened downward in the bottom of the panel.

In addition, the upper surface of the panel, so that the projection line formed to cross each other in the diagonal direction so as to prevent the sliding when installing the other structure to be formed.

In addition, the anti-vibration pad coupled to the groove of the panel, it is preferable to form a buffer space that is open upward in the axial center.

In addition, the anti-vibration pad coupled to the groove of the panel may allow a plurality of cushioning projections to be formed on the bottom circumference.

Here, the buffer space of the vibration pad, the taper angle is formed in which the upper inner diameter is gradually larger than the lower inner diameter.

As another example, the buffer space, it is possible to be formed so that the bent portion of the inner diameter of the upper and lower concave-convex shape is formed.

In addition, the prevention pad coupled to the groove of the panel may be formed so that the upper and lower buffer space is formed in the axial center.

In addition, the anti-vibration pad coupled to the groove of the panel, the buffer space is opened upwardly in the axial center is formed, it is possible to combine the cushion portion of the urethane material formed with a plurality of cushion projections circumferentially formed on the bottom of the lower end. .

Meanwhile, the interlayer sound insulation structure of the building structure installed as the interlayer sound insulation device of the building structure has a structure in which at least one sound insulation layer is seated and coupled to the upper surface of the panel coupled to each other.

In this case, the sound insulation material layer, a material such as woven paper, urethane is applied.

The interlayer sound insulation device of the building structure, the step of forming the interlayer slab of the building structure, the panel assembly step of placing a plurality of dust-resistant pads coupled to the bottom surface close to each other at a predetermined height of the upper surface of the slab, the assembled It is installed by performing a sound insulating material layer joining step of seating at least one sound insulating material layer on the upper surface of the panel, and a bottom surface forming step of installing a bottom structure on the top of the sound insulating material layer.

At this time, the anti-vibration pad is formed in the buffer space is opened upward in the axial center, it is preferable to have a plurality of cushion projections formed in the circumferential shape on the bottom of the lower end, the sound insulation material layer is applied to the material, such as textile paper, urethane do.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the interlayer sound insulation of the building structure according to the present invention will be described in detail. In the description of the present invention, a detailed description of the interlayer floor structure such as a known interlayer slab will be omitted.

The present invention relates to a sound insulation device provided between an interlayer slab and an upper floor floor structure of a building.

1 to 4, the sound insulation device includes a plurality of panels 100 and 100a and a dustproof pad 200 for placing the panels 100 at a predetermined height from the slab.

The panel 100 is formed of a synthetic resin material in a square shape in a plate-like structure, as shown in Figure 2 or 3, and maintains the same plane to form an interlayer floor structure when in close contact with each other, A plurality of downwardly open grooves 110 are formed, and the upper end of the dustproof pad 200 is fitted into the grooves 110.

There is no need to perform a separate bonding process using an adhesive or the like when the dustproof pad 200 is coupled, and the dustproof pad 200 is hermetically crimped to the panel groove 110 by simply being fitted.

At least four grooves 110 may be formed on the bottom surface of the panel 100 so that the grooves 110 may be stably positioned on the ground when the dustproof pad 200 is coupled.

In addition, seating jaws 120 having pinholes 122 are formed on both sides of one corner of the panel 100 in a stepped manner, and the other panel 100a is disposed on both bottom surfaces of the other corners corresponding to the corners. The mounting jaw 120 of the) is engaged to the mounting groove 130 and the mounting groove 130 in the pinhole 122 so that the panel 100, 100a to maintain the same plane when they are mutually coupled Pins 132 to be coupled are formed to protrude downward.

Here, the seating jaw 120 on both sides from the edge of the panel 100 is formed only to a position where both ends are spaced apart by the width of the seating jaw 120 than the end of the other corner, respectively, the panel 100 When the panel 100a and another panel 100a overlap each other, that is, when the seating groove 130 and the seating jaw 120 are coupled to each other, the panels 100 and 100a may be arranged in a horizontal and vertical direction.

Accordingly, the upper and lower gaps between the panels 100 and 100a may be blocked, and the pins 130 and the pinholes 122 may be easily coupled and fixed.

In addition, a plurality of grooves 140 for lowering the weight of the panel 100 are formed to be opened downward on the bottom surface of the panel 100, and at this time, the panel (through the rib between the grooves 140 and the grooves 140). The vertical strength of 100 is further improved.

In addition, the upper surface of the panel 100, the projection line 150 is formed to cross each other in an oblique direction to prevent the rolling during the installation of the floor structure.

5 to 11 is a view showing an embodiment of a dustproof pad according to the present invention.

As shown, the anti-vibration pad 200 is made of a solid or hollow circular member made of an elastic rubber material. In addition, the axial center is formed in the buffer space 210 is vertically penetrated or upwardly open to reduce the transmission of shock waves due to the minimization of the contact area, as well as the shock sound transmitted through the dust-proof pad filled with air In addition to absorbing effectively, the durability of the elastic force is enhanced to reinforce the buffering force and maintain a stable appearance when a load is generated.

That is, the buffer space 210, the air is filled therein to have a cushioning force when the shock occurs and to absorb the noise when the shock sound is transmitted.

In addition, even when the durability of the anti-vibration pad 200 decreases, the air filled in the inside ensures a support force when a load is generated, thereby maintaining the elastic force and rigidity of the anti-vibration pad.

In addition, the cushioning space of the vibration pad may be filled with a buffer material having excellent properties of absorbing shock and elasticity of the impact sound may be coupled to the lower groove of the pad.

As shown in Figure 5 to 9, the bottom surface of the vibration pad may be formed with a plurality of cushioning projections on the circumference.

As shown, when the bottom surface of the anti-vibration pad 200 is formed of a plurality of cushioning projections 222, the contact area between the sound insulation device of the present invention and the slab in the lower layer can be reduced to minimize the transmission of interlayer noise or impact sound. , Even if a load other than a vertical load is generated, the sliding protrusion may be prevented through the contact of the cushion protrusion formed on the bottom surface of the dustproof pad 200.

As illustrated in FIG. 7, the buffer space 210 is formed with a taper angle 220 having an upper inner diameter gradually larger than a lower inner diameter so that its inner circumferential surface can support an impact load, thereby minimizing contact area. Support for load is improved, resulting in structural stability. The dustproof pad of this structure can be suitably used for a building structure in which a large load is transmitted between floors.

FIG. 8 illustrates a curved portion 230 having an inner diameter up and down uneven shape as another example of the buffer space 210, which provides a multi-stage buffering force during shock load or shock wave transmission to completely absorb vibration and noise. do. The dustproof pad of this structure can be used suitably for building structures with high interlayer vibration.

10 and 11 illustrate another example of the anti-vibration pad 300. The buffer space 310 upwardly opened at the axial center is formed, and a plurality of cushioning protrusions 322 are formed at the lower end of the vibration pad 300. The cushion portion 320 of the material is to be combined.

When the protrusion is formed on the bottom surface of the anti-vibration pad, when the load is concentrated on the protrusion and a long time elapses after construction, the elastic force of the anti-vibration pad may decrease. To prevent this, the lower end 320 of the anti-vibration pad having the protrusion is formed. It may be made of a urethane material having excellent durability against elastic force. However, since the urethane material is a material that is more expensive than general rubber or synthetic resin material, it may be preferable in terms of cost to form the bottom part of the dustproof pad having protrusions formed thereon.

When the anti-vibration pad of such heterogeneous material is manufactured, it is preferable to mold one of the upper body or the cushion part 320 of the anti-vibration pad 300 and then combine the other.

The installation process of the interlayer sound insulation device of the building structure constituted as above will be described in detail with reference to the accompanying drawings.

First, during assembly, as shown in FIGS. 1 to 3, the panels 100 and 100a may be seated on the upper surface of the slab, in which the grooves 110 are formed in the respective panels 100 and 100a. After each of the anti-vibration pads 200 is fitted, the mounting grooves 130 of the other panel 100a correspond to the seating jaw 120 formed in one panel 100, and then the pins 130 and the pinholes 122 are aligned. ) To fit together to be assembled into a puzzle shape.

Between the mounting jaws coupled to each other in the assembling process is coated with an adhesive (for example, adhesive silicone, etc.) having a waterproof and soundproof function and then coupled to each panel by engaging. As a result, each panel is coupled between each other in a sealed form. As a result, the bonding force between the panels is strengthened, and the sound insulation and waterproof effect can be maintained even between the panels.

On the other hand, in the coupling between the panel 100, 100a, the installation of the anti-vibration panel 200 may be omitted on the mounting jaw 120 side of the mounting jaw 120, 120a is engaged with each other. This is because the seating jaw 120a engaged with the bottom may support the panel 100 of the seating jaw 120 engaged with the top. Installation in this way can reduce installation costs.

As described above, after the panel assembly step is completed, if the upper layer bottom structure is installed on the upper surface of the panels 100, the installation of the sound insulation device is completed.

As another example, after completion of the panel 100 structure, at least one sound insulation material layer 400 may be installed on an upper surface thereof, and a bottom structure may be installed on the upper surface of the sound insulation material layer 400.

That is, the sound insulation device in which the sound insulation layer 400 is installed performs floor interlayer slab formation step of the building structure during installation and successively closes the panel 100 and 100a in which a plurality of dustproof pads 200 are coupled to the bottom. The floor surface for installing the floor structure on the sound insulating material coupling step and the sound insulating material layer 400 is seated and coupled to the top surface of the panel 100 continuously assembled while performing a panel assembly step to place on the surface Perform the installation step to install.

Here, the sound insulating material layer 400 is applied to the material, such as woven paper, urethane, etc. having a shock-absorbing and buffering function as the material, it may be formed of a plurality of layers.

Although the above has been described and described with respect to preferred embodiments of the present invention, the present invention is not limited thereto, and the present invention can be variously modified and equivalent to other embodiments by those skilled in the art. .

The above-described interlayer sound insulation device and sound insulation method of the building structure according to the present invention, the interlayer sound insulation of the building structure is such that the panels provided in the interlayer slab are mutually bonded through the pins and pinholes and these panels from the upper surface of the slab through the dustproof pad The noise is generated from the upper side by being installed while maintaining a predetermined gap is transmitted to the panel and absorbed through the dust pad, thereby completely blocking the path of the noise.

In addition, the shock-absorbing dustproof pad is provided with a buffer space for air filling inside, which not only absorbs shock sound but also maintains the elastic force of the dustproof pad even after a long period of construction. It is possible to maintain a buffer action without a volume change, and also to minimize the upper contact area of the dustproof pad has an effect that can further block the transmission of shock waves.

In addition, the anti-vibration pad is provided on the bottom of the cushion portion of the urethane material is a release material has the effect of minimizing the shock wave when the impact occurs. In addition, there is an effect that can further prevent the slip and shock wave transmission path through the contact of the cushion projection formed on the bottom of the cushion portion even if a non-normal load is generated.

In addition, the panels supporting the floor structure of the building can be stably assembled in a simple manner through the pinhole formed on the seating jaw and the pin formed on the bottom of the panel, and the process of joining the dustproof pad to the panel is simple without additional bonding process. It is effective to increase the work efficiency by fitting.

Claims (15)

In the sound insulation provided in the interlayer slab of the building, Square panels are in close contact with each other to form a bottom structure, and a plurality of grooves are formed to be downwardly opened on the bottom of each panel, and a dustproof pad made of a resin material is fitted to the grooves so that the panel has a predetermined gap from the bottom surface. Interlayer sound insulation of a building structure, characterized in that it is formed to maintain. The method according to claim 1, A seating jaw having pinholes on both sides of one corner of the panel is extended in a step shape, and the seating jaws of the other panels are engaged on both bottoms of the corners corresponding to the corners, so that the joined panels maintain the same plane. An interlayer sound insulation device of a building structure, characterized in that the mounting groove and the pinhole coupling pin are formed to protrude. The method according to claim 2, Interlayer sound insulation of the building structure, characterized in that formed in the bottom of the panel a plurality of grooves for reducing the weight is opened downward. The method according to claim 3, On the upper surface of the panel, the interlayer sound insulation device of the building structure, characterized in that the protrusion line formed to cross each other in the diagonal direction so as to prevent the sliding when installing the other structure. The method according to any one of claims 1 to 4, The anti-vibration pad coupled to the groove of the panel is an interlayer sound insulation device of a building structure, characterized in that a buffer space is opened upwardly in the axial center. The method according to claim 5, The anti-vibration pad is an interlayer sound insulation device of a building structure, characterized in that a plurality of cushion projections are formed on the bottom circumference. The method according to claim 6, The buffer space is an interlayer sound insulation device of a building structure, characterized in that the upper inner diameter is formed to form a taper angle gradually larger than the lower inner diameter. The method according to claim 6, The buffer space is an interlayer sound insulation device of a building structure, characterized in that the inner diameter is formed by the bent portion of the upper and lower irregularities. The method according to any one of claims 1 to 4, The prevention pad coupled to the groove of the panel, the sound insulation device of the building structure, characterized in that the buffer space penetrated up and down in the axial center. The method according to any one of claims 1 to 4, The anti-vibration pad coupled to the groove of the panel has a buffer space open upward in the center of the axial direction, and the cushion portion of the urethane material formed with a plurality of cushion projections circumferentially formed on the bottom of the lower end of the building structure, characterized in that Interlayer sound insulation. The interlayer sound insulation structure of the building structure according to claim 6, wherein at least one sound insulation layer is seated and coupled to the upper surface of the mutually coupled panel. The method according to claim 11, The sound insulation material layer, interlayer sound insulation structure of the building structure, characterized in that any one of a woven paper, urethane. Forming an interlayer slab of a building structure; A panel assembly step of placing the panels in which the plurality of dustproof pads are coupled to the grooves formed in the bottom to closely contact each other to be positioned at a predetermined height of the upper surface of the slab; A sound insulating material layer joining step of seating and coupling at least one sound insulating material layer to an upper surface of the assembled panel; A bottom surface forming step of installing a bottom structure on the sound insulating material layer; Is installed by doing The anti-vibration pad is an interlayer sound insulation method of the building structure, characterized in that the buffer space is opened upwardly formed in the axial center. The method according to claim 13, The anti-vibration pad is an interlayer sound insulation method of the building structure, characterized in that a plurality of cushion projections are formed in the circumferential bottom surface. The method according to claim 13 or 14, The sound insulation material layer, interlayer sound insulation method of the building structure, characterized in that any one of a paper, urethane.

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