KR20060098888A - Wire clamp - Google Patents

Abstract

The present invention relates to a wire clamp, the wire clamp of the present invention is formed at the other end of the body, one end is mounted to the wire bonding device, the jaw through which the wire passes, the jaw is installed inside the jaw clamping the wire with a piezoelectric driving force The piezoelectric drive unit has a piezoelectric drive unit to reduce the overall weight of the wire clamp, as well as a considerably simple structure, which makes the wire clamp very easy to manufacture and use. In addition, it is possible to make a very good contribution to securing an excellent clamping time, thereby improving process speed and bonding quality.

Description

Wire clamp

1 is a perspective view showing a bonding head link provided with a conventional wire clamp.

2 is a perspective view of a wire clamp according to an embodiment of the present invention.

3 is an enlarged view of a portion A of FIG. 2.

4 is a cross-sectional view taken along line II ′ of FIG. 3.

FIG. 5 is a cross-sectional view of another embodiment taken along the line II ′ of FIG. 3.

* Description of the symbols for the main parts of the drawings *

100: wire clamp

120: jaw

130: piezoelectric drive part

400: wire

The present invention relates to a wire clamp, and more particularly, to a wire clamp of a wire bonding apparatus used for bonding a die bonding pad and a lead frame.

In general, a wire bonding operation in a semiconductor manufacturing process refers to a process of separating a die from a wafer, attaching a die to a lead frame, and then connecting a die between the bonding pad of the die and the lead frame with gold or copper wire.

The wire bonding apparatus for such wire bonding operation uses a high speed, high rigidity wire clamp that can accurately match the bonding timing. The wire clamp performs the function of feeding the wire and clamping the wire to be cut at the bottom of the capillary. A prior art disclosed wire clamp technique is US Pat. No. 5,277,355.

Referring to the '355 patent with reference to Figure 1 wire clamp 10 is installed with an ultrasonic transducer 24 having a capillary in the bonding head link. The installation position is located above the ultrasonic transducer 24. The bonding head link 11 is rotatably installed on an axis (not shown) to impart a movement in the vertical direction to the capillary.

The wire clamp 10 has a fixed lever 15 and a movable lever 16. The fixed lever 15 supports the movable lever 16 through a bearing shaft 17 of an ear 18 extending from the movable lever 16. The entire wire clamp assembly is mounted on the bonding head link 11 via an adapter 19 and a pair of cap screws 21, which extend through the top of the fixing lever 15 to allow the adapter ( 19) with screws. The movable lever 16 is operated by the voice coil motor provided in the fixed lever 15.

This operation actuates the push rod assembly in which the voice coil assembly 22 is forced to the end of the movable lever 16. The adjusting screw 25 is adapted to apply an action force to the rear surface of the movable jaw 26. The movable jaw 26 vibrates or pivots on a fixed jaw 27 fixedly mounted on the assembly mounting arm. Numeral 31 is a glass feed tube through which a gold wire can be fed so that it can be bitten between the jaws.

On the other hand, if the movable lever 16 is repeatedly operated for the operation of the movable jaw 26 as in the '355 patent, significant vibration occurs in the entire wire clamp, thereby deteriorating the contact stability of the wire. As a result, the bonding quality is degraded. The jaws 26 and 27 must also be aligned in surface contact with considerable precision. If the surface contact is not maintained and the alignment of the upper and lower ends is misaligned, unnecessary cutting of the wire may occur at the upper and lower edges of the jaws 26 and 27. When such a cut occurs, an operational problem arises in that the wire is set again to the clamp.

The present invention is to solve the above-mentioned problems, an object of the present invention is to use a piezoelectric actuator as the operating source for clamping to minimize the mechanical operation in unnecessary parts, to reduce the weight of its own more bonding efficiency It is to provide a wire clamp to improve.

Wire clamp according to the present invention for achieving the above object is one end is mounted to the wire bonding device, the jaw is formed on the other end of the body and the wire passes through, the inside of the jaw is provided with a piezoelectric driving force It is provided with a piezoelectric driving portion for clamping.

Preferably, the jaw has a first clamping portion and a second clamping portion in contact with the first clamping portion and allowing the wire to pass through the first clamping portion, wherein the piezoelectric driving portion is installed inside the first clamping portion and the second clamping portion. It is provided with a clamping plate for operating the secondary side to clamp the wire, and a piezoelectric driver for transmitting power to the clamping plate to advance the clamping plate.

Also preferably, a supporting plate in contact with the clamping plate is installed inside the second clamping portion.

Preferably, the jaw has a first clamping portion and a second clamping portion which is in contact with the first clamping portion and allows a wire to pass through the first clamping portion, and the piezoelectric driving portion is installed inside the first clamping portion and the second clamping portion. A first clamping plate for actuating the secondary side to clamp the wire, a first piezoelectric driver for transmitting power to the clamping plate for advancing the first clamping plate, and a second clamping unit installed inside the second clamping unit and operating toward the first clamping unit And a second piezoelectric actuator for transmitting power to the second clamping plate for advancing the second clamping plate.

Hereinafter, an embodiment of a wire clamp of a wire bonding apparatus according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, the wire clamp 100 according to the exemplary embodiment of the present invention includes a body 110 having one end mounted to the wire bonding apparatus. Body 110 is provided with a long rectangular shape and the jaw 120 is provided to the wire 400 to pass through the front end. And at the rear end of the body 110, a coupling hole 140 is formed to penetrate up and down to couple the body 110 to the head link (not shown) of the bonding apparatus.

In addition, the slit 150 is formed by extending from the coupling hole 140 to the jaw 120, and the jaw 120 penetrates to the side of the body 110 at the rear of the jaw 120 among the sides of the body 110. The adjusting hole 160 for adjusting and maintaining the spacing of the 120 is formed. Screws or bolts are fastened to the adjustment holes 160. Here, the body 110 may extend the front and rear ends of the slit 150 to allow the body 110 to be separated at both sides.

Subsequently, as shown in FIG. 3, a support 170 is formed at the rear of the jaw 120 of the upper surface of the body 110, the end of which extends upwardly of the jaw 120. And the end of the support portion 170 is provided with a supply tube 180 is passed through and supported by the wire 400 is supplied to the jaw 120 to pass through.

Meanwhile, the jaw 120 is provided with a piezoelectric driving unit 130 as shown in FIG. 4. The piezoelectric drive unit 130 enables clamping of the wire 400 in a local operation in the jaw 120 without mechanical operation of the body 110.

In order to install the piezoelectric driving unit 130, the jaw 120 is in contact with the first clamping unit 121 and the first clamping unit 121, and the wire 400 passes between the first clamping unit 121. The second clamping part 122 is provided. The piezoelectric driving unit 130 includes a clamping plate 131 installed inside the first clamping unit 121. The clamping plate 131 is installed at a position in contact with the second clamping part 122 to clamp the wire 400.

Inside the clamping plate 131, a piezo actuator 132 is provided. The piezoelectric driver 132 is for providing power to the clamping plate 131 is advanced to the second clamping portion 122 to clamp the wire 400.

The clamping plate 131 is preferably attached to the piezoelectric actuator 132, and the material is appropriately implemented in a non-conductive manner. In addition, a support plate 133 facing the clamping plate 131 is installed inside the second clamping part 122. That is, the wire 400 is positioned between the clamping plate 131 and the support plate 133 to clamp the wire 400 when necessary.

The piezoelectric driver 132 is provided with two thin plate-like piezoelectric elements 132a and an intermediate plate 132b provided between the piezoelectric elements 132a. The piezoelectric element 132a has a natural state such as quartz, tourmaline, Rochelle's salt, and artificial crystals made of barium titanate, ammonium dihydrogen phosphate, ethyl diamine tartrate and the like. These exhibit very good piezoelectric phenomena.

Therefore, when the voltage is applied to the piezoelectric element 132a, the piezoelectric element 132a extends in one direction. When the voltage is cut off, the piezoelectric element 132a is restored to its original state, and when the voltage is applied in the other direction, the piezoelectric element 132a contracts in the opposite direction. Thus, the clamping of the wire 400 by the clamping plate 131 is possible. The intermediate plate 132b provided between the piezoelectric elements 132a is preferably made of a non-conductive material for insulation between the piezoelectric elements 132a.

On the other hand, the piezoelectric element 132a may be installed in a larger number in order to obtain a larger driving force, or the piezoelectric element 132a may be elastically vibrated with electric vibration in a state in which there is an intrinsic vibration so that a stronger driving force may be generated. can do. Alternatively, as shown in FIG. 5, piezoelectric elements may be separately installed in the clamping parts 121 and 122.

Another embodiment of the present invention will be described with reference to FIG. 5. First, a jaw 120 is provided with a first clamping part 200 and a second clamping part 210 as in the first embodiment. The piezoelectric drive unit 210 includes a first clamping plate 212 installed inside the first clamping unit 200, and a first piezoelectric driver 211 installed inside the first clamping plate 212. A second clamping plate 214 installed inside the second clamping unit 220 and a second piezoelectric driver 213 installed inside the second clamping plate 214 are provided.

The first piezoelectric driver 211 and the second piezoelectric driver 213 have the same configuration as the piezoelectric driver in the first embodiment described above. That is, since the intermediate plate (unsigned) and the piezoelectric element (unsigned) refer to the first embodiment for a detailed description. And the operation is made in a direction facing each other so that the clamping of the wire 400 is made.

Hereinafter will be described the operating state of the wire clamp according to an embodiment of the present invention.

The wire clamp 100 of the present invention according to the first embodiment first sets the wire to the wire clamp 100. That is, the wire is interposed in the jaw 120 through the supply tube 180, and then penetrates through the capillary 310 of the ultrasonic transducer 300.

In this state, the wire bonding is first applied to the bottom of the wire 400 to take a ball shape. Thereafter, when the lower end of the wire contacts the bonding pad of the die, and the vibration is applied through the ultrasonic transducer 300, the wire 400 is bonded to the bonding pad of the die.

Then, when the ultrasonic transducer 300 and the wire clamp 100 are moved, the wire 400 extends to the lead of the lead frame, and the wire 400 is positioned at the bonding position of the lead to the ultrasonic transducer 300. When the wire 400 is pressed by applying ultrasonic vibration, the wire 400 is bonded to the lead frame. Thereafter, when the ultrasonic transducer 300 and the wire clamp 100 are lifted upward, the clamping operation of the wire clamp 100 is performed, and the cutting of the wire 400 bonded to the lead frame is performed by this clamping operation.

The clamping operation at this time provides a voltage to the piezoelectric driver 132 installed in the first clamping unit 121 in the first embodiment. Then, the clamping plate 131 of the piezoelectric actuator 132 is advanced to the second clamping part 122, whereby the wire 400 positioned between the clamping plate 131 and the support plate 133 is clamped.

In the second embodiment, the first piezoelectric driver 211 and the second piezoelectric driver 213 installed in the first clamping unit 200 and the second clamping unit 220 are provided with a voltage. The first clamping plate 212 of the driver 211 and the second clamping plate 214 of the second piezoelectric driver 213 operate in a direction facing each other, whereby the wire 400 interposed therebetween is Clamped.

As described above, the wire clamp 100 of the present invention is clamped by the clamping operation of the piezoelectric actuator 130 in the jaw 120. Therefore, the clamping of the wire 400 is performed at the correct timing without complicated and large mechanical operation as in the prior art.

In addition to the above-described embodiment of the present invention, each component may be modified by some modifications. That is, the number and arrangement of the piezoelectric elements and the material or configuration of the clamping plate and the shape of the jaws may be modified differently. However, if the modified embodiment basically includes the essential elements of the present invention, it should be considered that they are all included in the technical scope of the present invention.

The wire clamp according to the present invention as described above can not only reduce the overall weight of the wire clamp by using a piezoelectric actuator but also have a considerably concise structure, making the wire clamp very easy to manufacture and use, and also in the case of piezoelectric elements, the reaction speed is high. It's very fast and can produce a lot of force against mass. In addition, since the precise control is possible, it is possible to make a great contribution to securing an excellent clamping time, thereby improving the process speed and bonding quality.

Claims (4)

A body, one end of which is mounted to the wire bonding apparatus; A jaw formed at the other end of the body to allow a wire to pass therethrough; And a piezoelectric driving part installed inside the jaw and clamping the wire with a piezoelectric driving force. The method of claim 1, wherein the jaw comprises a first clamping portion, a second clamping portion in contact with the first clamping portion and the wire to pass through between the first clamping portion, The piezoelectric drive part is provided with a clamping plate installed inside the first clamping part and acting toward the second clamping part to clamp the wire, and a piezoelectric driver for transmitting power to the clamping plate to move the clamping plate forward. Characterized by a wire clamp. The wire clamp of claim 2, wherein a supporting plate is provided inside the second clamping portion to contact the clamping plate. The method of claim 1, wherein the jaw comprises a first clamping portion, a second clamping portion in contact with the first clamping portion and the wire to pass through between the first clamping portion, The piezoelectric driving part is installed inside the first clamping part and is operated to the second clamping part side to clamp the wire to the first clamping plate; A first piezoelectric driver for transmitting power to the clamping plate to move the first clamping plate forward; A second clamping plate installed inside the second clamping part and operating toward the first clamping part to clamp the wire; And a second piezoelectric actuator for transmitting power to the second clamping plate so that the second clamping plate advances.

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