KR20060092644A - Module of transmitting and receiving optical signal based on optical fiber having slanted surface and method of manufacturing the same - Google Patents

Abstract

The present invention relates to an optical transmission / reception module using an optical fiber having an inclined surface structure and a method of manufacturing the same. An optical transceiver module comprising a laser diode and a photodiode, which are optically coupled to an optical fiber having an inclined surface at an end thereof on a semiconductor substrate, the optical transceiver module comprising: a laser diode surface mounted; An optical fiber guiding in a predetermined groove so as to face the laser diode and having an inclined end; And a photodiode surface-mounted such that an optical active region is located directly below the horizontal projection surface of the inclined surface, wherein the inclined surface transmits the transmitted light emitted from the laser diode to the optical fiber and is led through the optical fiber from the outside. The received light is characterized in that the optical fiber coating layer is provided to reflect.

According to the present invention, it is possible to reduce the light weight of the optical transceiver module, shorten the packaging time, and reduce the manufacturing cost, and secure high reliability of the optical transceiver module through simple optical axis alignment.

Optical Transceiver Module, Photo Diode, Laser Diode, Optical Fiber

Description

Optical transmitting / receiving module using an inclined surface optical fiber and a method of manufacturing the same {Module of transmitting and receiving optical signal based on optical fiber having slanted surface and method of manufacturing the same}

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to.

1 is a module configuration diagram schematically showing the structure of an optical transceiver module according to the prior art.

Figure 2a is a plan view showing the configuration of an optical transmission and reception module according to an embodiment of the present invention, Figure 2b is a cross-sectional view taken along the line AA 'of Figure 2a.

3 is a view for explaining the operation of the optical transmission and reception module according to an embodiment of the present invention.

4A to 4D are process diagrams sequentially illustrating a method of manufacturing an optical transceiver module according to an exemplary embodiment of the present invention on an upper portion of a substrate.

5A to 5D are process diagrams sequentially illustrating a method of manufacturing an optical transceiver module according to an embodiment of the present invention in a cross section of a substrate.

<Explanation of symbols for the main parts of the drawings>

100 ... Fiber Optic 110 ... Guide

120.electrode pad 130 ... optical fiber

140 ... photodiode 150 ... laser diode

160 Solder Bump 170 Epoxy

The present invention relates to a heterogeneous wavelength optical transmission / reception module and a method of manufacturing the same, which generate an optical signal having an arbitrary wavelength band, transmit the optical signal to an optical fiber, and detect an optical signal having an arbitrary wavelength band received through the optical fiber. The present invention relates to a heterogeneous wavelength optical transmission / reception apparatus for performing optical signal generation and detection for optical communication using a laser diode and a photodiode, and a method of manufacturing the same.

Recently, researches on optical subscriber networks connecting optical fibers to subscriber units (or terminals) for high speed subscriber networks have been actively conducted. In some regions, optical subscriber test networks have been established for the spread of optical subscriber networks. Operate.

In constructing such an optical subscriber network, a digital signal is converted into an optical signal of an arbitrary wavelength band and transmitted to an optical fiber, and an optical signal of an arbitrary wavelength band received through the optical fiber is detected and inversely converted into a digitized electric signal. An optical transceiver module is required. In the current implementation of the optical transmission and reception module, a laser diode (LD) for generating a corresponding optical signal in response to the electrical signal and a photodiode (PD) for detecting the optical signal received through the optical fiber and inversely converted into an electrical signal It is used.

On the other hand, the optical fiber used for optical communication enables bidirectional communication between the transmitting and receiving sides. In this case, in order to prevent degradation of the signal due to mutual interference between the transmitted and received optical signals, the transmission light and the reception light use different wavelength bands. For example, the wavelength band of the transmission light is allocated to 1300 nm and the wavelength band of the reception light is assigned to 1550 nm or vice versa. Therefore, in order to implement an optical transmission / reception module using a laser diode and a photodiode, a structure capable of transmitting and receiving an optical signal through one optical fiber with a different operating wavelength band is required.

To this end, an optical waveguide, a wavelength division multiplexing (WDM), and an electrode pad are formed on one substrate, and the optical surface of the laser diode LD and the photodiode PD is mounted on the electrode pad. A transmission / reception module has been proposed in the past.

1 schematically illustrates a state in which the heterowavelength optical transceiver module is connected to an optical fiber.

Referring to FIG. 1, a conventional optical transceiver module includes a wavelength separator 20, an optical waveguide 30, a laser diode 40, and a photodiode 50 on a silicon or silica substrate 10. One end of the optical waveguide 30 is coupled to the optical fiber 60 and the other end is split into two via the wavelength separator 20 and then optically coupled to the laser diode 40 or the photodiode 50. do.

In general, the wavelength separator 20 and the optical waveguide 30 are integrally formed with the substrate 10, and the laser diode 40 and the photodiode 50 are integrated by surface mounting on an electrode pad (not shown). do.

The wavelength separator 20 transmits the transmission light generated by the laser diode 40 and transmitted through the optical waveguide 30 to the optical fiber 60, and receives the received light transmitted from a remote place through the optical fiber 60. Transfer to the photodiode 50 through the (30).

On the other hand, the photodiode 50 receives the received light perpendicular to the traveling direction of the optical waveguide 30. Therefore, although not shown in the drawing to allow the optical active region (receiver) of the photodiode 50 to be optically coupled with the received light, one or two points are formed at the point where the optical waveguide 30 is coupled with the photodiode 50. It is common for mirror structures to exist.

Looking at the operation of the conventional optical transmission and reception module having the above configuration, the received light input from the optical fiber 60 is optically coupled to the optical waveguide 30 of one channel formed on the substrate 10 is input. The received light travels along the optical waveguide 30 and passes through the wavelength separator 20 and travels along the optical waveguide 30 having the photodiode 50 coupled to the end thereof. Thereafter, the received light is reflected by the mirror surface structure at the end of the optical waveguide 30 and is optically coupled to the light active region of the photodiode 50 and input. The transmission light output from the laser diode 40 is optically coupled to the optical waveguide 30, and the input transmission light passes through the optical waveguide 30 and the wavelength separator 20 and then optically couples with the optical fiber 60. do.

In the above-described conventional optical transmission / reception module, the wavelength separator 20, the laser diode 40, and the photodiode 50 are spaced apart by a predetermined interval and integrated on the substrate 10, each of which is connected to the optical waveguide 30. Since there is a structure that is interconnected, there is a limit to light and short the optical transceiver module.

In addition, the conventional optical transceiver module includes a plurality of optical elements such as an optical waveguide 30, a wavelength separator 20, a mirror surface structure, in addition to the optical fiber 60, the laser diode 40 and the photodiode 50. Therefore, in the packaging process of the optical transmission and reception module, there is a limit in reducing the manufacturing cost because it must take a lot of cost and time to align the optical axis between the optical elements.

In addition, when the optical elements are arranged in a narrow space, the transmission light from the laser diode 40 is leaked, so that the optical noise (cross talk) generated by incident on the light receiving element side, that is, the photodiode 50 is liable to occur. there was.

The present invention was devised to solve the above problems, and it is possible to reduce the light weight by shortening the optical waveguide, the wavelength separator, and the optical device such as the mirror structure, and to reduce the manufacturing cost and time even in the packaging process. It is an object of the present invention to provide an improved structure of a heterogeneous wavelength optical transceiver module and a method of manufacturing the same.

In addition, an object of the present invention is to provide an optical transmission / reception module and a method of manufacturing the same, which can reduce optical noise caused by leakage of transmitted light and incident to a light receiving device.

An optical transceiver module according to the present invention for achieving the above object, the optical transceiver module comprising a laser diode and a photodiode optically coupled to the optical fiber on a semiconductor substrate, the substrate, a surface-mounted laser diode; An optical fiber guiding in a predetermined groove so as to face the laser diode and having an inclined end; And a photodiode surface-mounted such that an optical active region is located directly below the horizontal projection surface of the inclined surface, wherein the inclined surface transmits the transmitted light emitted from the laser diode to the optical fiber and is led through the optical fiber from the outside. The received light is characterized in that the optical fiber coating layer is provided to reflect.

In the present invention, the laser diode is surface mounted in a laser diode mounting groove formed in the substrate. At this time, the horizontal position and the vertical depth of the laser diode mounting groove and the optical fiber mounting groove are preferably adjusted such that the traveling axis of the transmission light emitted from the laser diode substantially coincides with the central axis of the optical fiber. The laser diode mounting groove may be provided with an electrode pad for applying operating power to the laser diode. In this case, the laser diode is preferably surface-mounted on the electrode pad by a flip chip process.

In the present invention, it is preferable that the surface of the photodiode is provided with a photodiode coating layer for transmitting externally received light through the optical fiber and reflecting the transmission light emitted from the laser diode. In addition, the photodiode is surface mounted in a photodiode mounting groove formed in the substrate. At this time, the horizontal position and the vertical depth of the photodiode mounting groove and the optical fiber mounting groove are adjusted so that the received light from the outside reflected directly downward from the inclined surface is incident on the optical active region of the photodiode. It is preferable. The photodiode mounting groove may be provided with an electrode pad for applying operating power to the photodiode. In this case, the photodiode is preferably surface mounted on the electrode pad by a flip chip process.

In the present invention, the inclined surface, the reception light input from the outside through the optical fiber is incident to the optical active region of the photodiode and the transmission light emitted from the laser diode to the optical fiber is inclined at an angle to the incident to the optical fiber. Do.

In the present invention, the applied refractive index is adjusted to prevent the interface reflection of the optical signal between the transmission light emission region of the laser diode and the inclined surface, and between the optically active region of the photodiode and the optical fiber surface directly below the inclined surface. Epoxy may be further included.

According to another aspect of the present invention, an optical transceiver module having a laser diode and a photodiode optically coupled to an optical fiber on a semiconductor substrate, the substrate comprising: a photodiode surface-mounted; An optical fiber guiding in a predetermined groove so as to face the photodiode and having an inclined surface at an end thereof; And a laser diode surface-mounted directly below a horizontal projection surface of the inclined surface, and the inclined surface reflects the transmitted light emitted from the laser diode to be incident on the optical fiber, and the received light introduced through the optical fiber from the outside is An optical transmission module is provided, characterized in that the optical fiber coating layer is transmitted.

According to another aspect of the present invention, there is provided a method of manufacturing an optical transceiver module including a laser diode and a photodiode optically coupled to an optical fiber having an inclined surface at an end thereof on a semiconductor substrate. (a) forming a laser diode mounting groove, a photodiode mounting groove, and an optical fiber mounting groove on a semiconductor substrate, wherein the horizontal position and the vertical depth of each groove are the axis of the transmission light emitted from the laser diode; Adjusting received light from outside that is substantially coincident with the axis and reflected directly downward from the inclined surface to be incident on the photoactive region of the photodiode; (b) forming electrode pads for applying power to the photodiode and laser diode in the photodiode mounting groove and the laser diode mounting groove, respectively; (c) optically aligning the photodiode and laser diode on corresponding electrode pads to surface mount them; And (d) installing an optical fiber in the optical fiber guide groove so that the optical active region of the photodiode is located directly below the inclined surface of the optical fiber.

Preferably, the photodiode has a photodiode coating layer that transmits externally received light through the optical fiber to the surface and reflects the transmission light emitted from the laser diode.

According to another aspect of the present invention, a method for manufacturing an optical transceiver module comprising a laser diode and a photodiode optically coupled to an optical fiber having an inclined surface at an end thereof on a semiconductor substrate, comprising: (a) mounting a laser diode on a semiconductor substrate A groove, a photodiode-mounting groove and an optical fiber mounting groove, wherein horizontal and vertical depths of the grooves are transmitted from the laser diode from directly below the inclined surface, and the light transmitted from the laser diode is reflected on the inclined surface to enter the optical fiber. Adjusting the traveling axis of the received light incident on the diode to substantially coincide with the central axis of the optical fiber; (b) forming electrode pads for applying power to the photodiode and laser diode in the photodiode mounting groove and the laser diode mounting groove, respectively; (c) optically aligning the photodiode and laser diode on corresponding electrode pads to surface mount them; And (d) installing an optical fiber in the optical fiber guide groove such that a laser diode is positioned directly below the inclined surface of the optical fiber. The manufacturing method of the optical transmitting / receiving module is provided.

In the present invention, the surface mounting of the step (c) is preferably made by a flip chip process using a solder bump.

According to the present invention, after the step (d), the interface reflection of the optical signal between the transmission light emitting region of the laser diode and the inclined surface, and between the optical active region of the photodiode and the optical fiber surface directly below the inclined surface It may further comprise the step of applying and curing the epoxy with a refractive index-controlled to prevent the.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

2A is a plan view of an optical transceiver module according to an exemplary embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line AA ′ of FIG. 2A.

2A and 2B, an optical transceiver module according to the present invention has a structure in which an optical device for optical transmission and reception is integrated on a substrate 70 made of silicon or a compound semiconductor using a surface mount method.

Specifically, the photodiode mounting groove 80, the laser diode mounting groove 90, and the optical fiber mounting groove 100, on which the optical devices are to be placed, are provided on the substrate 70. The photodiode mounting groove 80 and the laser diode mounting groove 90 are connected to each other by the light guide groove 110, and the photodiode mounting groove 80 and the laser diode mounting groove 90 are patterned electrode pads. 120 is provided. The mounting grooves on which each optical device is to be placed are adjusted in position and height so that the devices can achieve optical axis alignment with each other. The optical fiber mounting groove 100 is preferably formed in a V-shape, but the present invention is not limited thereto.

Each of the grooves 80, 90, 100, and 110 may be formed by a photolithography process well known in the art. The electrode pad may be formed by depositing a material film for forming an electrode pad on a front surface of the substrate to a predetermined thickness and then patterning the same by a photolithography process. Au, Ag, Cu, Al or alloys thereof may be employed as the constituent material of the material film, but the present invention is not limited thereto.

The optical fiber mounting groove 100 is composed of a core and a clad, and an optical fiber 130 having an inclined surface at a predetermined angle is installed at one end. Here, the inclined surface preferably has a 45 degree angle. The photodiode 140 and the laser diode 150 are surface-mounted on the electrode pad 120 in the photodiode mounting groove 80 and the laser diode mounting groove 90, respectively.

In the embodiment of the present invention, the photodiode 140 and the laser diode 150 are firmly fixed by a flip chip bonding process using the solder bumps 160, thereby being electrically connected to the electrode pads 120. Through this electrical connection, the photodiode 140 and the laser diode 150 are supplied with power necessary for their operation.

Meanwhile, the photodiode 140 and the laser diode 150 should be precisely controlled in height because the optical axis should be aligned with the optical fiber 130. This precise control of the height precisely controls the amount of solder bumps 160 when the photodiode 140 and the laser diode 150 are electrically connected to the electrode pad 120 by applying a reflow technique in a flip chip bonding process. This can be achieved by.

Preferably, a photodiode coating layer 141 having a predetermined thickness may be provided on the surface of the photodiode 140. The photodiode coating layer 141 is for preventing leakage of the transmitted light into the photodiode 140 when the transmission light leaks from the laser diode 150.

The photodiode coating layer 141 is a wavelength selective mirror and operates as a glass having a reflectance close to 0% in a long wavelength band (eg 1550 nm) and a mirror having a reflectance close to 100% in a short wavelength band (eg 1310 nm). do. The wavelength selective mirror may be manufactured in a photonic crystal structure or a photonic band gap structure using conventional techniques. However, the present invention is not limited thereto.

According to the present invention, the inclined surface of the optical fiber 130 is provided with an optical fiber coating layer of a predetermined thickness. The optical fiber coating layer is another wavelength selective mirror and operates as a mirror having a reflectance close to 100% in a long wavelength band (eg 1550 nm) and a glass having a reflectance close to 0% in a short wavelength band (eg 1310 nm). The wavelength selective mirror may be manufactured in a photonic crystal structure or a photonic band gap structure using conventional techniques. However, the present invention is not limited thereto.

On the other hand, when the received light reflected from the inclined surface of the end of the optical fiber 130 is input to the photodiode 140, and when the transmitted light output from the laser diode 150 is optically coupled to the core of the optical fiber 130, each optical signal At the incident interface of, reflection of unnecessary optical signals is caused. Therefore, in order to prevent this, the bonding epoxy 170 having the refractive index adjusted may be applied over the optical fiber, the photodiode 140, and the laser diode 150. Here, the refractive index of the epoxy can be adjusted using conventional methods such as control of the component ratio. When the epoxy 170 is applied as described above, the secondary effect of firmly fixing the optical fiber to the optical fiber mounting groove 100 may be obtained. In addition, lens means (not shown) may be further provided between the laser diode 150 and the optical fiber 130 to increase the optical coupling efficiency of the transmission light.

Next, the operation of the optical transmission / reception module according to the present invention will be described in detail with reference to FIG. 3. In FIG. 3, only the optical device is illustrated without the illustration of the substrate.

Referring to FIG. 3, the received light input from the outside travels along the core 130a of the optical fiber 130 placed in the optical fiber mounting groove and reaches the inclined surface of the end of the optical fiber 130. Since the received light reaching the inclined surface has a long wavelength band, it is reflected by the wavelength selective mirror of the optical fiber coating layer provided on the inclined surface. Accordingly, the received light passes through the clad 130b of the optical fiber 130 and exits the optical fiber 130.

The emitted light reaches the surface of the photodiode 140 located directly below the inclined surface of the end of the optical fiber 130. Since the received light has a long wavelength band, it passes through the wavelength selective mirror of the photodiode coating layer 141 provided on the surface of the photodiode 140 and enters the photoactive region 190 of the photodiode 140. The incident light thus input is converted into an electrical signal by the photodiode 140 and then output to the signal processing circuit.

Meanwhile, when an epoxy having an appropriate refractive index is interposed between the lower end of the end of the optical fiber 130 and the photodiode 140, the light reflection phenomenon generated at the interface between the dissimilar materials is blocked, so that the clad 130b of the optical fiber 130 is blocked. The received light emitted from the light is optically coupled to the light active region 190 of the photodiode 140 without any loss.

On the other hand, the transmitted light emitted from the laser diode 150 passes through the free space or the epoxy coating layer to reach the inclined surface of the end of the optical fiber 130. In particular, when the transmission light is incident on the inclined surface of the optical fiber 130 through the epoxy coating layer having a controlled refractive index, reflection of the transmission light may be blocked at the incident interface, thereby preventing the loss of the transmission light. Since the transmitted light reaching the inclined surface has a short wavelength band, the light transmitted through the optical fiber coating layer, which is a wavelength selective mirror provided on the inclined surface, is optically coupled to the core 130a of the optical fiber 130. The transmission light optically coupled to the optical fiber 130 is transmitted along the subscriber network.

Meanwhile, since the optical fiber 130, the photodiode 140, and the laser diode 150 are located very close to each other, some transmission light output from the laser diode 140 may be incident to the photodiode 140 through scattering and reflection. There is a possibility. In this case, since the transmission light from the laser diode 150 has a short wavelength band, when the scattered transmission light reaches the photodiode 140, it is reflected by the photodiode coating layer 141 which is a wavelength selective mirror. Accordingly, the transmission light emitted from the laser diode 150 may be prevented from entering the photodiode 140, and as a result, cross talk may be reduced.

On the other hand, when the lens means (not shown) is provided between the laser diode 150 and the optical fiber 130, it is possible to further improve the light coupling efficiency of the transmission light.

In the above optical transmitting / receiving module, the photodiode 140 is positioned directly below the optical fiber 130, and the laser diode 150 is surface-mounted in front of the optical fiber 130, but the laser diode is directly below the optical fiber. It goes without saying that the optical transmission / reception module may be configured in such a way that it is mounted at a location and the photodiode is mounted in front of the optical fiber.

Figures 4a to 4d is a flow chart showing the manufacturing process of the optical fiber transmission module according to the present invention from the top of the substrate, Figures 5a to 5d is a cross-sectional cutting direction AA 'of the manufacturing process of the optical fiber transceiver module according to the present invention It is a process flowchart seen from the line. Hereinafter, a method of manufacturing an optical transceiver module according to the present invention will be described in detail with reference to FIGS. 4A to 4D and 5A to 5D.

First, as shown in FIGS. 4A and 5A, a substrate 70 for manufacturing an optical transceiver module is prepared and a photolithography process is applied to the photodiode mounting groove 80 and the laser diode mounting groove 90 on the substrate. The optical fiber mounting groove 100 and the light guide groove 110 are formed.

In this case, the sidewalls of the grooves are preferably formed to be inclined with the bottom surface. Therefore, when the photolithography process is applied, an anisotropic etching method is preferably employed. In addition, each of the grooves is preferably symmetrical with respect to the cross-section line A-A 'line.

Subsequently, a material film for forming the electrode pad 120 is deposited on the substrate, and then patterned by using a photolithography process, thereby as shown in FIGS. 4B and 5B, the laser diode mounting groove 90 and the photodiode mounting groove. An electrode pad 120 is formed on the bottom surface of 80.

Then, a flip chip process using solder bumps 160 is applied to the electrode pads 120 formed in the photodiode mounting groove 80 and the laser diode mounting groove 90 as shown in FIGS. 4C and 5C. The photodiode 140 and the laser diode 150 are surface mounted, respectively. In this case, the surface-mounted photodiode 140 and the laser diode 150 need to be accurately aligned with the optical axis to be optically aligned with the optical fiber to be installed in the optical fiber mounting groove 100 later. It is preferable to precisely match the height of the photodiode 140 and the laser diode 150 by controlling.

The photodiode 140 is preferably provided with a photodiode coating layer 141 made of a wavelength selective mirror on the surface to prevent optical noise.

Next, as shown in FIGS. 4D and 5D, the optical fiber 130 having the inclined surface coated with the optical fiber coating layer of the wavelength selective mirror is installed in the optical fiber mounting groove 100 formed on the substrate 70. At this time, the installation point of the optical fiber 130 is preferably selected to a position that allows the incident light entering through the optical fiber 130 to be accurately incident on the optical active region of the photodiode 140 after being reflected from the inclined surface.

After the optical fiber 130 is installed as described above, the transmission light output area of the laser diode 150, the light guide groove 110, the space between the photodiode 140 and the optical fiber 130, and the inclined surface area of the optical fiber 130 The epoxy with the refractive index controlled over is applied and then cured. This completes the manufacturing method of the optical transmission / reception module according to the embodiment of the present invention.

In the manufacturing process of the optical transmission module described above, the photodiode 140 is positioned directly below the optical fiber 130, and the laser diode 150 is surface-mounted in front of the optical fiber 130, but the laser diode is an optical fiber. Of course, the optical transmitting and receiving module may be manufactured in a form in which the photodiode is mounted at a position directly below and the photodiode is mounted in front of the optical fiber.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

According to an aspect of the present invention, by reducing the number of optical elements required to manufacture the optical transmission and reception module to the maximum, it is possible to reduce the cost and time required for the packaging process of the optical transmission and reception module.

According to another aspect of the present invention, the optical waveguide structure employed in the conventional optical transmission and reception module, the wavelength separator for separating the transmission light and the reception light and the separate mirror surface structure is omitted, and the inclined surface coated with the wavelength selective mirror By simply configuring the optical path using the provided optical fiber, it is possible to reduce the light and thinning of the optical transmission and reception module.

According to another aspect of the present invention, since the number of optical elements for the configuration of the optical transmission and reception module and the optical path for the optical transmission and reception operation is simple, it is possible to reduce the error of the optical axis alignment in the packaging process of the module, optical transmission module High reliability can be secured.

According to another aspect of the present invention, when the transmission light is scattered and leaks can reduce the optical noise generated by entering the light receiving element can be more qualitatively and accurately made of the optical transmission module.

Claims (18)

An optical transmission / reception module comprising a laser diode and a photo diode optically coupled to an optical fiber on a semiconductor substrate, The substrate may include a surface mounted laser diode; An optical fiber guiding in a predetermined groove so as to face the laser diode and having an inclined end; And a photodiode surface-mounted such that the light active region is located directly below the horizontal projection surface of the inclined surface, And an optical fiber coating layer on the inclined surface to transmit the transmission light emitted from the laser diode to the optical fiber and reflect the reception light introduced from the outside through the optical fiber. The method of claim 1, And the laser diode is surface mounted in a laser diode mounting groove formed in the substrate. The method of claim 2, And a horizontal position and a vertical depth of the laser diode mounting groove and the optical fiber mounting groove are adjusted such that a traveling axis of the transmission light emitted from the laser diode substantially coincides with a central axis of the optical fiber. The method of claim 2, An electrode pad for applying an operating power to the laser diode is provided in the laser diode mounting groove. And the laser diode is surface mounted on the electrode pad. The method of claim 4, wherein And the laser diode is surface mounted by a flip chip process using solder bumps. The method of claim 1, And a photodiode coating layer provided on a surface of the photodiode to transmit external reception light through the optical fiber and reflect the transmission light emitted from the laser diode. The method according to claim 1 or 6, And the photodiode is surface mounted in a photodiode mounting groove formed on the substrate. The method of claim 7, wherein The horizontal position and the vertical depth of the photodiode mounting groove and the optical fiber mounting groove are adjusted so that the received light from the outside reflected directly downward from the inclined surface is incident on the photoactive region of the photodiode. Optical transceiver module. The method of claim 7, wherein An electrode pad for applying operating power to the photodiode is provided in the photodiode mounting groove; And the photodiode is surface mounted on the electrode pad. The method of claim 9, And the photodiode is surface mounted on the electrode pad by a flip chip process using solder bumps. An optical transceiver module comprising a laser diode and a photo diode optically coupled to an optical fiber on a semiconductor substrate, The substrate may include a surface mounted photo diode; An optical fiber guiding in a predetermined groove so as to face the photodiode and having an inclined surface at an end thereof; And a laser diode surface-mounted directly below the horizontal projection surface of the inclined surface, And an optical fiber coating layer on the inclined surface to reflect the transmission light emitted from the laser diode to be incident on the optical fiber, and to transmit the reception light introduced through the optical fiber from the outside. The method according to claim 1 or 11, wherein The inclined surface is an optical transmission and reception module characterized in that the inclination of the received light input from the outside through the optical fiber is incident to the optical active region of the photodiode and the transmission light emitted from the laser diode to the optical fiber inclined at an angle to the optical fiber. . The method according to claim 1 or 11, wherein And further comprising an epoxy having an adjusted refractive index to prevent interfacial reflection of the optical signal between the transmission light emitting region of the laser diode and the inclined surface, and between the photoactive region of the photodiode and the inclined surface of the optical fiber. Optical transmission and reception module characterized in that. A method of manufacturing an optical transceiver module comprising a laser diode and a photo diode optically coupled to an optical fiber having an inclined surface at an end thereof on a semiconductor substrate, (a) forming a laser diode mounting groove, a photodiode mounting groove, and an optical fiber mounting groove on a semiconductor substrate, wherein the horizontal position and the vertical depth of each of the grooves are a central axis of the optical fiber; Adjusting received light from outside that is substantially coincident with and reflected directly downward from the inclined surface to be incident on the photoactive region of the photodiode; (b) forming electrode pads for applying power to the photodiode and laser diode in the photodiode mounting groove and the laser diode mounting groove, respectively; (c) optically aligning the photodiode and laser diode on corresponding electrode pads to surface mount them; And and (d) installing an optical fiber in the optical fiber guide groove such that the optical active region of the photodiode is positioned directly below the inclined surface of the optical fiber. The method of claim 14, And the photodiode has a photodiode coating layer for transmitting externally received light through the optical fiber on the surface and reflecting the transmission light emitted from the laser diode. A method of manufacturing an optical transceiver module comprising a laser diode and a photo diode optically coupled to an optical fiber having an inclined surface at an end thereof on a semiconductor substrate, (a) forming a laser diode mounting groove, a photodiode mounting groove, and an optical fiber mounting groove on a semiconductor substrate, wherein the horizontal position and the vertical depth of each of the grooves are transmitted from the laser diode from directly below the slope; Adjusting the propagation axis of the received light incident on the photodiode to be substantially coincident with the central axis of the optical fiber; (b) forming electrode pads for applying power to the photodiode and laser diode in the photodiode mounting groove and the laser diode mounting groove, respectively; (c) optically aligning the photodiode and laser diode on corresponding electrode pads to surface mount them; And and (d) installing an optical fiber in the optical fiber guide groove such that a laser diode is positioned directly below the inclined surface of the optical fiber. The method according to any one of claims 14 to 16, The surface mounting of the step (c) is carried out by a flip chip process using a solder bump, characterized in that the manufacturing method of the optical transceiver module. The method according to any one of claims 14 to 16, After the step (d), the refractive index for preventing the interface reflection of the optical signal between the transmission light emitting region of the laser diode and the inclined surface, and between the photoactive region of the photodiode and the inclined surface of the optical fiber And applying and curing the adjusted epoxy.

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