KR20060073149A - Quick drain rinse bath for wafer wet cleaning - Google Patents

Abstract

The present invention relates to a QDR bath (Quick Drain Rinse bath) for wafer wet cleaning.

The present invention is a QDR bath for wet cleaning wafers by spraying the ultra-pure water in a shower method to the wafer loaded therein, which includes an opening and closing door for opening and closing the open upper surface, the lower surface side of the opening and closing door At least one downflow nozzle for spraying the ultrapure water in the downward direction is characterized in that it is provided.

Therefore, since the chemical solution on the wafer can be efficiently cleaned and removed within a faster time, productivity can be improved by shortening the process time, and the quality and yield of the wafer can be improved.

Cleaning, ultrapure water, DIW, quick drain rinse, bath, cleaning bath, wafer, semiconductor

Description

QUICK DRAIN RINSE BATH FOR WAFER WET CLEANING}

1 is a cross-sectional view of a conventional QDR bath for wafer wet cleaning,

2 is a plan view illustrating a conventional QDR bath for wet wafer cleaning;

3 is a cross-sectional view of a QDR bath for wet wafer cleaning in accordance with the present invention;

4 is a plan view for explaining a QDR bath for wet wafer cleaning in accordance with the present invention;

5 is a side view of one use state of the QDR bath for wet wafer cleaning in accordance with the present invention.

<Description of the symbols for the main parts of the drawings>

10: QDR Beth 12: Upflow Nozzle

14: upper side shower nozzle 16: opening and closing door

16a: hinge means 18: downflow nozzle

DIW: Ultrapure Water W: Wafer

The present invention relates to a QDR bath (Quick Drain Rinse bath) for wafer wet cleaning, and more particularly, to a QDR bath for wafer wet cleaning, which can efficiently clean and remove chemical solutions existing on a wafer in a faster time. It is about.

In general, a plurality of cleaning processes are essentially performed in the semiconductor device manufacturing process, and a wet cleaning method is mainly used.

The wet cleaning method removes contaminants on the wafer surface by chemical reaction in a chemical bath containing chemical solution, and then uses ultra-pure water as a shower to remove the chemical solution remaining on the wafer surface. (DIW; De-Ionized Water) is cleaned by performing a Quick Drain Rinse (hereinafter referred to as "QDR") which discharges instantaneously.

1 is a schematic cross-sectional view showing a conventional QDR bath, and FIG. 2 is a schematic plan view thereof.

The QDR bath 10 has a rectangular parallelepiped shape in which an upper surface forming an internal space is opened, and a guider (not shown) in which a plurality of wafers W can be placed at a constant distance in a central portion on the bottom surface thereof in a longitudinal direction. And a pair of up-flow nozzles 12 for spraying ultrapure water upward along the longitudinal direction on both sides of the bottom surface, and also along the longitudinal direction on both sides of the upper surface. A pair of side shower nozzles 14 is provided for spraying ultrapure water toward the center in a range of about 30 to 60 degrees.

Therefore, when a plurality of wafers W are transferred by a robot (not shown) and loaded on the guider on the bottom surface thereof, the plurality of wafers W are loaded at the center from the upflow nozzle 12 and the side shower nozzle 14. Ultrapure water is simultaneously sprayed toward the wafer W to remove the chemical solution on the wafer W within a short time.

However, in such a conventional QDR bath 10, ultrapure water is injected only from the bottom surface and both sides, so that the ultrapure water does not evenly contact the entire surface of the wafer W, so that the cleaning efficiency is low, and the cleaning time is long (usually 10 There was a problem that process delay occurs due to extra).

The present invention has been made to solve the above problems, and provided with a door that can open and close the upper surface, provided with a plurality of downflow nozzles on the lower surface of the door and also spraying ultrapure water downward It is an object of the present invention to provide a QDR bath for wafer wet cleaning that enables the wafer to be cleaned efficiently in a shorter time.

The present invention for achieving the above object, in the QDR bath for wet cleaning wafers by spraying ultrapure water in a shower method to the wafer loaded therein in a short time, comprising an opening and closing door for opening and closing the open upper surface On the lower side of the open / close door, at least one downflow nozzle for spraying ultrapure water in a downward direction is provided, which provides a QDR bath for wafer wet cleaning.

The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the invention described below with reference to the accompanying drawings by those skilled in the art.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Prior to the description, the same parts as in the prior art will be omitted.

3 is a cross-sectional view of a QDR bath for wet cleaning wafers according to the present invention, FIG. 4 is a schematic plan view thereof, and FIG. 5 is a side view of the one use state thereof.

According to the present invention, the opening and closing door 16 capable of selectively opening and closing the opened upper surface of the QDR bath 10, which is conventionally provided with upflow nozzles 12 on the bottom surface and upper side shower nozzles 14 on both sides. ) Is provided, the opening and closing door 16 is provided with a plurality of down flow nozzles (down flow nozzle) 18 which can spray the ultrapure water in the downward direction in the closed state on the lower surface side.

Here, the opening and closing door 16 may be provided to be rotatable using a hinge means (16a) with respect to the upper end of one side wall, such as an air cylinder that can open and close the opening and closing door 16 automatically Drive means (not shown) may be provided as appropriate.

Preferably, the plurality of downflow nozzles 18 provided on the lower surface side of the opening / closing door 16 are provided at positions opposite to the upflow nozzles 12 on the bottom surface, and at the center positions therebetween. It may be configured to be provided, each downflow nozzle 18 may be sprayed ultrapure water to widen in the form of a cone (cone).                     

As a result, as shown in FIG. 3, ultra pure water is injected to all surfaces of the plurality of loaded wafers W in a short amount of time without gaps, thereby greatly reducing the washing time and improving productivity. As the cleaning efficiency increases, the quality and yield of the wafer W can be improved.

In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

According to the present invention, since the chemical solution can be efficiently cleaned and removed on the wafer in a faster time, productivity can be improved by shortening the process time, and the effect of improving the quality and yield of the wafer can be achieved. have.

Claims (2)

In the QDR bath for wafer wet cleaning, which sprays ultrapure water with a shower method on a wafer loaded therein, and cleans in a short time, Equipped with an opening and closing door to open and close the open upper surface, QDR bath for the wafer wet cleaning, characterized in that the lower surface side of the opening and closing door is provided with at least one downflow nozzle for spraying ultrapure water in the downward direction. The method of claim 1, The downflow nozzle, QDR bath for wet wafer cleaning, characterized in that each provided on one side and the center position.

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