KR20060031136A - Coating layer by thermal spray for vacuum plasma chamber and fabrication method thereof - Google Patents

Abstract

The present invention provides a metal and ceramic mixed coating film by thermal spraying as a protective film for a vacuum plasma chamber and its internal parts used in semiconductor / LCD manufacturing. The mixed layer prevents cracking, pore generation, and peeling of the coating film formed by thermal spraying, thereby improving corrosion resistance of the vacuum plasma chamber and its internal parts, and extending the service life to further secure product reliability. do.

Thermal spraying, mixed coating layer, cracking, peeling

Description

Thermal spray coating film for vacuum plasma chamber and manufacturing method thereof {COATING LAYER BY THERMAL SPRAY FOR VACUUM PLASMA CHAMBER AND FABRICATION METHOD THEREOF}

1 is a vertical cross-sectional view of a chamber and an interior of a plasma etching equipment, which is one of semiconductor / LCD manufacturing equipment.

2 shows a plasma gun portion of the plasma spray equipment.

3A and 3B are crack photographs of oxide coating films formed by a thermal spraying technique.

Figure 4 is a photograph of the surface observation of the incompletely filled oxide coating film coated by a thermal spraying technique.

FIG. 5 is a cross-sectional photograph of a metal / ceramic mixed coating film thermally coated by mixing a metal and a ceramic. FIG.

FIG. 6 is a cross-sectional photograph of a metal / ceramic mixed coating (tilt coating) layer prepared by gradually changing an injection rate of a metal powder and a ceramic coating powder in a thermal spray coating.

Figure 7 is a result of measuring the degree of bending of the base material when the thermal spray coating by mixing a metal and ceramic.

8 is a result of measuring the degree of bending of the base material when the thermal spray coating (tilt coating) while gradually changing the injection speed of the metal powder and ceramic powder.

9 is a result of measuring the degree of bending of the base material when the thermal spray coating of the ceramic powder on the metal base material.

FIG. 10 illustrates a plasma gun and a powder injection system in which metal powder injection holes and ceramic powder injection holes are respectively provided and powder injection positions are different from each other.

11 illustrates a plasma gun and a powder injection system in which a ceramic powder inlet is installed inside a plasma gun and a metal powder inlet is separately installed.

FIG. 12 shows an example of a vacuum plasma component to which the inner side should be coated.

The present invention relates to a thermal spray coating film for a vacuum plasma chamber and a method of manufacturing the same.

Vacuum plasma chambers are used in the field of processing for semiconductor / LCD manufacturing or other ultrafine shapes. For example, plasma enhanced chemical vapor deposition (PECVD) equipment for forming a deposited film by a chemical vapor deposition method on a substrate, sputtering equipment for forming a deposited film by a physical method, and etching a substrate or a coated material on the substrate in a desired pattern. And a vacuum plasma chamber for dry etching equipment.

In the vacuum plasma chamber, high temperature plasma is generated to shorten the lifespan of the chamber and its internal components, as well as to generate specific elements and contaminating particles from the surface of the chamber and its components, which is likely to contaminate the chamber. In particular, since the plasma etching equipment injects reactive gases including F and Cl into the plasma atmosphere, the chamber inner wall and its internal parts are placed in a very corrosive environment. This corrosion causes serious problems such as shortening the life of the chamber and its internal parts, degrading the product quality by increasing the defective rate of the final product due to the generation of contaminants and particles, and increasing the production cost due to the interruption of operation for parts replacement / cleaning. do.

The problem of corrosion of the vacuum plasma chamber will be described in detail using the plasma dry etching apparatus illustrated in FIG. 1 as an example.

Plasma dry etching equipment is used to etch a specific location of a substrate such as a semiconductor wafer or glass for LCD or a thin film formed for the substrate to implement a desired circuit or shape on the substrate.

Looking at the components and the operating principle of the equipment as follows. The etching gas is introduced into the chamber through the hole 14 installed in the gas distribution plate 13. RF current is applied to the upper electrode 2 and the lower electrode 9 to generate a plasma to increase the reactivity of the introduced etching gas, and then collide with the substrate 15 placed on the substrate support 8 to thereby A portion of the coated membrane is etched. Examples of the etching gas include C4F ₈ , C ₅ H ₈ , CH ₂ F ₂ , CF, CF ₂ , CF ₃ , CF ₄ , SF ₆ , NF ₃ , F ₂ , CH ₂ F ₂ , CHF ₃ , C ₂ F Gas containing F such as ₆ and gas containing Cl such as Cl ₂ , BCl ₃ , SiCl ₄ , HCl, gas containing Br such as HBr, Br ₂ , CF ₃ Br and other SiN ₄ , O ₂ , Ar, H _And a gas in which one or more of _two gases is mixed.

The upper electrode 2 may take the form of a flat plate or a coil and may be installed on the upper surface of the insulating window 3, but may be installed inside the vacuum chamber. The gas distribution plate 13 may be integrally formed with a gas nozzle, a gas ring, or the like, or may be added as a heterogeneous body to evenly distribute the etching gas into the chamber. In some cases, the gas dispersion plate 13 may be provided in the substrate support 8. .

In addition, the chamber wall 1 may be provided with a liner 11 such as a cylindrical or conical inclined at an angle to prevent the chamber wall 1 from being directly exposed to the etching gas and the plasma atmosphere. In addition, the liner 11 may be manufactured in two separate parts to protect the upper chamber and the lower chamber, respectively. In order to maintain the surface temperature of the liner at a temperature above room temperature (preferably between room temperature and 300 ° C.), a liner heating device 12 is provided to heat the liner 11 to attach contaminants generated during etching to the liner. Instead, it can be removed in a gaseous state with a vacuum pump through a connection porter 7 at the bottom of the chamber or through a passage (not shown) provided separately under the chamber. In the chamber, a separate inner supporter 5 and an outer supporter 6 may be installed to fix the liner 11.

The plasma screen 10 may be provided to prevent the plasma from flowing out through the empty space between the liner 11 and the substrate support 8. The screen 10 may be provided with a plurality of holes so that the etching gas and the etching reactant can move toward the vacuum pump.

A substrate transfer passage (not shown) for transferring the substrate 15, which is an object to be etched, such as a semiconductor wafer and a glass substrate for LCD into the chamber is provided in the chamber wall 1, the inner and outer supports 5, 6, and the liner 11. Installed through one or more side surfaces, it is possible to reduce the time required to insert and remove the substrate 15.

The substrate 15 is fixed to the substrate support by the fixing chuck 16. Recently, the fixing chuck using an electrostatic force is widely used. The focus ring 17 surrounding the substrate 15 serves to uniformly irradiate the plasma generated inside the chamber over the entire substrate 15.

The above description of the operation principle of the plasma etching apparatus and the components thereof is merely an example, and it is well known that the structure of the equipment and its components may be variously modified, and the types thereof are not limited to the above components. to be. For example, although not shown in FIG. 1, components included in a vacuum plasma chamber include a substrate transfer module, a lift system, a load lock, a door system, a robot arm, and a fastener.

The chamber of the etching equipment and its internal components are subjected to chemical / physical damage by the extreme atmosphere inside the chamber during the semiconductor / LCD manufacturing process. The chamber inner wall and the inner parts are damaged by the same process as the damaged part is removed after the physical-chemical impact by the etching process on the part or the front surface of the substrate to damage. That is, the chamber and the internal parts are subjected to chemical attack by the reaction gas activated by the plasma. At the same time, ionized gas particles are accelerated by RF electromagnetic fields and damaged by physical attacks that bomb the surface of the part.

As such, when the chamber and the internal parts are damaged by the above process, some of the etching equipment must be replaced or cleaned / repaired first, so additional costs are required, and additionally, the process line must be stopped for replacement or cleaning / repair. The processing time of the product is increased. In addition, when the contaminants generated on the damaged chamber and the surface of the internal parts contaminate the wafer or the LCD glass substrate to be etched, the defect rate of the semiconductor and the LCD increases.

A typical method for preventing corrosion of a conventional vacuum plasma chamber and its internal components will be described below.

The vacuum plasma chamber and internal components are selected in consideration of many characteristics such as corrosion resistance, processability, fabrication ease, price, and insulation, and generally, stainless steel or aluminum alloy is used as the chamber material. Although the chamber is preferably manufactured integrally by casting or the like, the chamber may be fabricated integrally, but may be assembled after being processed into several parts in consideration of productivity and manufacturing cost. Metals used for chambers generally have low corrosion resistance, so that they may be resistant to plasma and chemical gases by thermal spraying ceramics (eg Al ₂ O ₃ , Y ₂ O ₃ , Al ₂ O _3). / Y ₂ O ₃ , ZrO ₂ , AlC, TiN, AlN, TiC, MgO, CaO, CeO ₂ , TiO ₂ , BxCy, BN, SiO ₂ , SiC, etc.) may be a coating film.

2 is a schematic diagram of a plasma gun that is the core of a thermal spray coating equipment. The operating principle of the plasma gun 20 is as follows. Plasma gases (Ar, N ₂ , H ₂ , He, etc.) introduced through the gas inlet 21 are the cathode 22 and the anode 24 to which a high voltage DC high power (typically 30-100KV, 400-1000A) is applied. A portion of the injection gas dissociates through the gaps between them to form a high temperature plasma flame 25 of 5,000-15,000 ° C. The cathode 22 is typically made of tungsten or tungsten-reinforced metal material to prevent erosion of the cathode end, which is the plasma generator, and the anode 24 is made of copper or copper alloy and has a cooling passage 23 therein. ) To prevent the life of the anode from being shortened by high temperature plasma.

It is possible to coat homogeneous or heterogeneous materials on the surface of various materials such as metals and ceramics by plasma thermal spraying, and the coating material may be a metal or ceramic made of powder or wire. In general, the material to be coated is prepared in powder form and then injected into the hot plasma flame 25 through the powder injection hole 27. The powder inlet 27 is fixed to the plasma gun by the support 26. The powder injected through the powder inlet 27 is completely melted or partially melted by a high temperature plasma flame to fly toward the coating object 30 at a high speed (200 to 700 m / s) to form the coating film 29. do.

Plasma thermal spray coating of oxide ceramic materials may be performed in the air, but metal materials such as oxidized reactions or easily decomposed at high temperatures, carbides, nitrides, etc. are subjected to plasma thermal spray coating in a vacuum / low pressure chamber. Is recommended.

However, the coating film by the thermal spraying is insufficient to solve the problems occurring in the actual semiconductor / LCD manufacturing process. 3A and 3B are enlarged photographs showing the surface of the Al ₂ O ₃ coated film due to thermal spraying, and it can be seen that fine cracks are formed. In the Al ₂ O ₃ coating layer by thermal spraying, micro cracks may be provided as diffusion paths of the reaction gas, and may act as defects that do not protect the base material from external physical / chemical shocks.

Figure 4 is an enlarged image of the Al ₂ O ₃ film by the thermal spraying coating under abnormal conditions, the powder injected into the plasma flame during the thermal spraying coating is not heated enough or these particles do not reach the sufficient flight speed It shows what happens when laminated to the surface of the base material. In the thermal spray coating film that does not have sufficient density, the reaction gas easily moves inside through the interface between the powder and the powder that is not sufficiently adhered, and the coating film is easily damaged by the physical / chemical impact applied during the semiconductor process or cleaning. .

Accordingly, it is an object of the present invention to provide a vacuum plasma chamber and a coating film for internal components thereof, which can improve corrosion resistance and extend the life of components.

In particular, it is an object of the present invention to provide a new method and a coating film according to this, which can solve the crack and pore formation of the coating layer inevitably generated in the thermal spray coating, and a decrease in adhesion to the base material.

In order to achieve the above object, the present invention uses a material used as a vacuum plasma chamber or its internal components as a base material, and includes a metal powder and ceramic powder mixed coating layer formed by thermal spraying on the surface of the base material. It provides a thermal spray coating film.

In addition, the present invention is a material to be used as a vacuum plasma chamber or its internal components as a base material to be coated, and metal powder and ceramic powder are injected into the plasma gun to form a mixed coating layer of metal and ceramic by thermal spraying on the surface of the base material. It provides a method for producing a thermal spray coating film for a vacuum plasma chamber comprising a.

The present invention is a technique for effectively preventing the internal cracks and pore formation of the thermal spray coating layer, increase the adhesive strength with the base material, and improve the working speed, an oxide on the surface of the metal (typically Al, Fe and its alloys) base material It can be applied to the production of a chamber made of a material having a coating film and its internal parts.

Thermal spray coating is a technique of forming a film by injecting a metal or ceramic powder into a hot plasma flame and heating it, and then laminating it on the surface of the base material in a completely molten or semi-melted state. In this case, the powder used may be a monolithic powder having a size of 10 to 100 micrometers or an agglomerated powder in which primary micropowders of several tens of nanometers to several micrometers are aggregated to the size. The monolithic powder and the agglomerated powder are heated by hot plasma flame, scattered, laminated to the base material surface, and then rapidly cooled.

Due to this process characteristic, the ceramic material has an internal crack as shown in FIG. 3A or 3B due to the rapid cooling rate after lamination or the residual stress formed when it is cooled after being laminated to different materials having different thermal expansion coefficients. In addition, the residual stress thus formed may cause peeling of the base material and the coating layer. In addition, when a single powder or agglomerated powder is not sufficiently heated by the plasma flame or the flying speed is insufficient, a large number of pores are formed or laminated between the powder and the powder due to incomplete filling of the powder in the ceramic protective coating film. Defects due to incomplete contact at the interface (coagulation may also be formed between the primary fine powders) are formed to reduce the durability of the coating and provide a diffusion path of metal atoms derived from the reaction gas or the film underlayer. Problems may occur such as the formation of compounds of Cl reactant gas ions and metal elements.

In the present invention, by forming an intermediate coating layer in which a metal and a ceramic are mixed between the ceramic coating film and the metal base material, the above problems, that is, cracking and pore generation of the coating layer and peeling of the coating film can be solved.

The outermost ceramic coatings include Al ₂ O ₃ , Y ₂ O ₃ , Al ₂ O ₃ / Y ₂ O ₃ , ZrO ₂ , AlC, TiN, AlN, TiC, MgO, CaO, CeO ₂ , TiO ₂ , BxCy, BN , SiO ₂ , SiC, YAG, Mullite and the like can be used. The metal material of the mixed coating layer may be a pure metal such as Al, Ni, Cr, Fe, Cu, or an alloy containing some other metals or semimetal elements with these as main components, and the ceramic material of the mixed coating layer may be It may be one or a mixture of ceramic coating materials.

5 is a vertical cross section of the mixed coating layer (metal + ceramic layer) formed in the middle between the base material and the ceramic coating film according to the present invention, the white part is Ni-20Cr metal, the dark gray is Al ₂ O ₃ ceramic to be.

In general, ceramics tend to be undeformed and destroyed when a force is applied inside or outside. On the other hand, most metals cause plastic deformation by the forces applied inside / outside to solve the forces (stress) applied from inside / outside. When the thermal spraying by mixing the ceramic and metal powder as in the present invention, the residual stress formed in the ceramic and the metal is solved by the plastic deformation of the metal portion, not only suppressing the internal crack formation of the ceramic portion, but also relatively melting point compared to the ceramic This low metal is sufficiently dissolved to fill the incompletely laminated portion of the ceramic powder to form a high density coating layer.

More preferably, the metal contacting material is mainly composed of metal, and the outer contacting surface of the ceramic film forms a mixed coating layer composed mainly of ceramic material. Most preferably, the metal material is 100% and has a thickness of several micros to several tens of micrometers. After coating gradually increasing the content of the ceramic to finally change to 100% ceramic material continuously to form a mixed coating layer, the mixed layer formed as described above is shown in Figure 6 according to one embodiment. In FIG. 6, the white part is Ni-20Cr metal, and the dark gray is Al ₂ O ₃ ceramic.

As shown in FIG. 6, a coating film is formed in which an intermediate boundary layer between the metal and the ceramic cannot be identified. Such a thermal spray coating method is called a gradient coating. In the mixed coating formed by the gradient coating method, a metal coating having a relatively small amount of pores and cracks is formed at the bottom of the mixed coating film, thereby preventing the reaction gas ions such as Cl and F from entering the lower coating film of the base material or the mixed coating layer. In addition, the effect of preventing the diffusion of elements such as Al, which are highly reactive with Cl and F ions, from the base material or the lower coating film to the upper coating film can be obtained.

As shown in FIG. 5, a heterogeneous material (especially metal and ceramic) having different thermal expansion coefficients is formed by forming an intermediate layer in which a metal and a ceramic are mixed, or performing a mixed coating having a large metal content on the base material side and a ceramic content on the ceramic coating side as shown in FIG. 6. The interfacial peeling phenomenon due to contact can be suppressed. Peeling of the coating film is caused by residual stress formed on the base material and the coating film during the thermal spray coating and cooling after the coating operation.

During the coating and during the cooling after coating, the thermal spray coating is carried out by moving the plasma gun reciprocally in the longitudinal direction of the substrate to measure the residual stress of the substrate and the coating layer. The degree of curvature of was measured in-situ. FIG. 7 shows the degree of curvature of the Al base material when forming the mixed coating film of FIG. 5 and FIG. 8 when forming the mixed coating film (tilt coating film) of FIG. 6. The positive direction bends toward the coating film side and the negative direction bends toward the base material direction. During the thermal spraying process, the base material bends in the negative direction when the surface temperature of the base material rapidly rises due to the hot plasma flame and the powder heated to the high temperature, and the base material bends in the positive direction after the plasma gun passes. This is because the hot ceramic, which is cooled and simultaneously coated on the surface, cools and shrinks. Increasing the degree of deflection in the positive direction during repeated thermal spray coatings indicates that the base material is sufficiently heated to decrease the expansion rate of the surface of the base material by surface heating, while the thickness of the ceramic coating film becomes thicker, resulting in a high temperature ceramic coating layer. This is because the tensile stress due to volume shrinkage increases. It can be seen that the curvature of the base material reaches almost zero while the base material is cooled after the thermal spray coating is finished. The degree of warpage of the base material being close to zero means that the coated material is almost straightened and the stress remaining between the base material and the coating film is close to zero. In this case, the probability of peeling of the coating film due to residual stress is very low.

For comparison, Fig. 9 shows the result of measuring the degree of warping when the thermal spray coating of ceramics directly on the aluminum metal base material. When the base material is completely cooled after the end of the coating, the base material maintains the negative warpage state. Able to know. At this time, the base material is subjected to tensile stress, and the coating film is subjected to compressive stress so that the coating film can be easily peeled off when an impact is applied from the outside.

In order to form the mixed coating film according to the present invention, a preferable thermal spray coating equipment and coating method are proposed as follows.

In general, metals widely used in vacuum plasma components have low melting points (e.g., Fe is 1530 ° C, Ni is 1450 ° C, Cr is 1860 ° C, Al is 660 ° C, etc.) and alloys generally have lower melting points than pure metals. Ceramics have a high melting point (eg Al ₂ O ₃ is about 2000 ° C, Y ₂ O ₃ is about 2400 ° C, ZrO ₂ is 2680 ° C, etc.). Therefore, in order to obtain a coating film having low internal defects by applying low power, it is preferable to inject the ceramic powder into the high temperature portion of the plasma flame and the metal powder into the low temperature portion of the plasma flame. For this purpose, it is preferable to install metal and ceramic powder inlets at regular intervals at the ends of the plasma gun.

Fig. 10 shows the positions of the preferred plasma gun and the powder inlet. The inlet 50 of the high melting point ceramic powder has a separation distance 52 from the end of the plasma gun within 0 to 30 mm, and the metal powder has a low melting point. It is preferable that the injection hole 51 of is provided with the distance 53 from the ceramic powder injection hole 50 being 0-40 mm. In order to inject metal and ceramic powder into each powder inlet, it is preferable to have two powder injectors.

Meanwhile, the plasma gun may be modified and used in various forms. As illustrated in FIG. 11, the ceramic powder injection hole 50 may be positioned at a point extending to the anode 24 of the plasma gun. In addition, an end portion of the plasma gun is formed to form a shield 54 and is oxidized or decomposed in a high temperature oxidizing atmosphere by controlling the atmosphere inside the shield 54 using a gas such as Ar or N ₂ . It is also possible to coat metal and ceramic materials which are likely to be used. When the ceramic powder inlet 50 is installed inside the plasma gun, the ceramic powder may be efficiently heated by the high temperature heat source of the plasma, thereby providing a high density coating layer using lower power. At this time, the preferred structure of the plasma gun and the powder inlet is provided with a ceramic powder inlet 50 with an interval 55 in the range of 0 to 40 mm from the end of the plasma gun to the inside, the metal powder inlet 51 is the end of the plasma gun It is recommended to install the separation distance 56 from 0 to 40mm out of the range.

Alternatively, the metal powder and the ceramic powder may be premixed and supplied, or may be mixed with each other while passing through the powder conveying tube from each powder storage chamber (hopper) and injected into the plasma flame through one powder supply. have. In addition, a method of simultaneously thermally spraying a metal powder and a ceramic powder using two plasma guns may be used.

On the other hand, the present invention proposes a vacuum plasma chamber consisting of a base material / mixed coating layer (including a gradient coating layer) / ceramic coating layer structure or its internal components, but as a modified coating structure, a base material / metal coating layer / mixed coating layer (including a slope coating layer) / It is also possible to comprise a ceramic coating layer, a base material / metal coating layer / mixed coating layer (including a sloped coating layer), a base material / mixed coating layer (including a sloped coating layer).

The metal powder used in the metal coating layer or the mixed coating layer proposed in the present invention may be the same material as the base material or Al, Ni, Cr, Fe, Cu, Zr, Mo, W and alloys thereof, and may be used in the ceramic coating layer and the mixed coating layer. The ceramic powder is Al ₂ O ₃ , Y ₂ O ₃ , Al ₂ O ₃ / Y ₂ O ₃ , ZrO ₂ , AlC, TiN, AlN, TiC, MgO, CaO, CeO ₂ , TiO ₂ , BxCy, BN, SiO ₂ , SiC, YAG, Mullite, AlF ₃ or a mixture thereof.

Applying the same material as the base material to the mixed coating or the metal coating is advantageous for improving the adhesive strength, and metal chloride when using a material with low reactivity with reactive gas ions (Cl, F ions, etc.) such as Ni, Cr, and alloys thereof. Or there is an advantage that can prevent the formation of metal fluoride.

Inner coating of cylindrical parts using W, Mo and its alloys with very low coefficient of thermal expansion helps to reduce the peeling of the film from the base material due to the compressive stress acting on the outermost ceramic coating layer even when the temperature rises. For example, if a metal coating layer such as W, Mo, etc. is formed on the inner surface of a cylindrical (or conical, polygonal, etc.) component, and a mixed coating layer and a ceramic coating layer are formed thereon, the metal coating layer may be formed when the internal temperature of the vacuum chamber rises. By suppressing the expansion of the mixed coating film or the ceramic coating film it is possible to prevent the local peeling of the ceramic coating film and the formation of contaminated particles through it.

The metal powder used for forming the mixed coating layer may be different from the metal powder used for the metal coating layer, and the ceramic powder used for forming the mixed coating layer may be different from the ceramic constituting the outermost ceramic coating layer, which is a functional aspect. And may be selected in consideration of economic aspects. Thus, if the type of the metal powder and ceramic powder used in the mixed coating layer is different from the material of the metal coating layer and the outermost ceramic coating layer may be further provided with a powder supply device.

The metal coating layer, metal / ceramic mixed coating layer, and ceramic coating layer mentioned above depend on the cost and usage conditions for coating, but it is preferable to control the thickness of each in the range of 20 micrometers to 400 micrometers.

Meanwhile, in the thermal spray coating, the coating powder is heated and accelerated while passing through a high temperature plasma, and is laminated on the surface of the base material. In order for the injected powder to be heated and accelerated at a constant temperature and speed, a certain amount (about 10 cm or more) is applied. Spray distance required. However, in the case of cylindrical (conical, polygonal) parts, there is a part that is difficult to secure a sufficient spray distance when trying to coat the inner surface. If the thermal spray coating is performed in a state in which a sufficient spray distance is not secured, defects due to incomplete filling of the powder are formed as shown in FIG. 4.

In the present invention, as shown in Figure 12, by dividing the parts 60 having the inner coating surface 61, which is difficult to secure a sufficient spraying distance into two or more parts to propose a method of using them in combination. That is, when the part having the inner surface 61 to be coated is cut into two or more parts, the coating surface 61 is exposed to the outside to secure a sufficient spray distance, thereby easily forming a high-density coating surface. do. On the other hand, the parts manufactured by dividing the two or more in this way to facilitate the connection of the joint portion 63 to match each other step, groove, install a keyhole or the inner surface in contact with the plasma and the reaction gas A third auxiliary (which can be made of a ceramic or surface treated metal material) can be provided in the to prevent damage to the seam portion caused by the reaction gas and the plasma.

Forming an intermediate layer with W and Mo materials with a low thermal expansion coefficient as a metal coating material and coating a component having a difficult internal coating into two or more parts is conventional conventional heat without a mixed coating film of metal and ceramic. It may also be applied to a thermal spray coating.

On the other hand, in order to completely remove the pores inside the film which is inevitably present in the coating layer of the base material formed by the technology disclosed in the present invention, the above-mentioned internal pores are heterogeneous materials (for example, metal fluoride salts, organic acid salts, Si , SiO ₂ , polymers, etc.). If the coating layer is formed of one or more multilayers, it is preferable to seal the outermost coating film, and if necessary, sealing can be performed without distinguishing each layer. Preferably Si or it is recommended to fill the coating pores by SiO _2, which Si or SiO ₂ is by the reaction gas _{SiF 2, SiF 4, SiCl 2} , to form a volatile product of SiCl such as ₄ easily easily removed from the chamber Because it can be.

On the other hand, the coating film formation method proposed in the present invention can be equally applicable to the newly produced vacuum plasma chamber and its internal parts as well as the regeneration process performed in order to secure the reliability of the parts damaged or periodically cleaned during use.

 Although the present invention has been described above with reference to specific embodiments, the present invention is not limited thereto, and various modifications and improvements may be made by those skilled in the art without departing from the scope of the following claims.

According to the present invention, the chamber and the internal parts are formed by forming a high adhesion strength / high density spray coating layer having a mixed coating layer of a metal and a ceramic, which inevitably cracks and forms pores of the coating layer, and decreases adhesion to the base material. Protective film is peeled off by internal / external mechanical / thermal / chemical impact or particles formed by surface damage are released to prevent the contamination of the chamber, and F, Cl ions, etc. are diffused to the base material or lower coating film or vice versa. By preventing the diffusion of metal atoms of the base material or the bottom coating to the top coating side, it is possible to prevent the formation of metal chlorides or fluoride, thereby prolonging the replacement cycle and cleaning cycle of the vacuum plasma component, thereby increasing the incidence of internal pollutants It can reduce the quality and reliability of semiconductor / LCD and reduce manufacturing cost. You can expect the effect.

Claims (13)

The base material is used as a vacuum plasma chamber or its internal components, Consists of a metal powder and a ceramic powder mixed coating layer formed by thermal spraying on the surface of the base material Thermal spray coating film for vacuum plasma chamber. The thermal spray coating film of claim 1, wherein the mixed coating layer is inclinedly coated with a metal content as the metal is closer to the base metal side, and the ceramic content as the material is far from the base metal. The vacuum plasma chamber of claim 2, wherein the mixed coating layer is coated with metal and ceramic at a continuous content change rate such that the metal content is 100% on the base material side and the ceramic content is 100% on the far side of the base material. Thermal spray coating film. The thermal spray coating film of claim 1, wherein a metal layer is included between the base material and the mixed coating layer. The thermal spray coating film of claim 1, wherein a ceramic layer is further formed on the mixed coating layer.  The thermal spray coating film of claim 1, wherein the metal component of the mixed coating layer is made of the same material as the base material or selected from Al, Ni, Cr, Fe, Cu, Zr, Mo, W, and alloys thereof. The ceramic component of claim 1, wherein the ceramic component of the mixed coating layer is Al ₂ O ₃ , Y ₂ O ₃ , Al ₂ O ₃ / Y ₂ O ₃ , ZrO ₂ , AlC, TiN, AlN, TiC, MgO, CaO, CeO ₂ , TiO ₂ , BxCy, BN, SiO ₂ , SiC, YAG, Mullite, AlF ₃ or a thermal spray coating film for a vacuum plasma chamber selected from a mixture thereof. The material to be used as the vacuum plasma chamber or its internal components is used as the base material to be coated, Injecting the metal powder and ceramic powder into the plasma gun to form a mixed coating layer of the metal and ceramic by thermal spraying on the surface of the base material Method of manufacturing a thermal spray coating film for a vacuum plasma chamber. The method of claim 8, wherein the mixed coating layer is formed of a gradient coating such that respective contents of the metal and the ceramic are gradually changed. The method of claim 8, wherein when the base material is large, the mixture is divided into two or more parts to form a mixed coating layer on each of them, and then the respective parts are bonded to each other. 11. The thermal sprayed thermal spraying chamber as claimed in claim 10, wherein each of the portions has a stepped portion, a groove, a key hole in the coupling portion, or a third protective material at the joint portion to facilitate fastening after forming the coating layer. Coating film production method. The heat of the vacuum plasma chamber according to claim 8, wherein when the metal powder and the ceramic powder are injected into the flame portion of the plasma gun, the injection position of the ceramic powder is changed so that the metal powder is injected into the low temperature portion. Spray coating film production method. The method of claim 8, further comprising filling the pores in the coating film with a dissimilar material such as metal fluoride salt, organic acid salt, Si, SiO ₂ , and polymer after forming the coating film.

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