KR20060031030A - Light-emitting diode package with a heat sink and method of manufacturing the same - Google Patents

Abstract

Disclosed are a light emitting diode package having a phantom sink and a method of manufacturing the same. The light emitting diode package includes a package housing having an opening and a through hole exposed by the opening. On the other hand, the lead frame is exposed in the inner portion of the opening of the package housing, extends from the inner portion is located protruding the outer portion to the outside of the package housing. In addition, the bolt sink is coupled to the bottom of the package housing. Part of this chop sink is exposed by the opening of the package housing. Therefore, by mounting a light emitting diode chip on the volt sink, it is possible to improve the heat radiation efficiency of the heat generated by the light emitting diode chip.

Package Housing, Leadframe, Bolt Sync, Hanging Jaw

Description

LIGHT-EMITTING DIODE PACKAGE WITH A HEAT SINK AND METHOD OF MANUFACTURING THE SAME

1A is a plan view and a sectional view of a conventional LED lead panel for mass production of a light emitting diode package;

1B is a plan view and a cross-sectional view showing a state in which a molding material is molded in a conventional LED lead panel for mass production of a light emitting diode package;

2 is a perspective view and a cross-sectional view showing a conventional light emitting diode package;

3 is a plan view and a cross-sectional view showing an LED lead panel for mass-producing a light emitting diode package according to the present invention;

4 is an exploded perspective view showing a light emitting diode package having a volt sink according to the present invention;

5 is an enlarged plan view and side view illustrating a state in which a light emitting diode package having a volt sink according to the present invention is formed on an LED lead panel;

6 is a top perspective view and a bottom perspective view showing a light emitting diode package with a volt sink according to the present invention;

7 is a sectional view showing a light emitting diode package having a volt sink according to the present invention;

8 is a cross-sectional view illustrating a molding material and a light emitting lens molded in a light emitting diode package having a volt sink according to the present invention.

♣ Explanation of symbols for main part of drawing ♣

40: lead frame, 41: connecting frame,

42: panel support, 44 hollow part,

50: first package housing, 51: second package housing,

52: lead frame receiving groove, 53: bolt sink,

54: insertion protrusion, 55: through hole of the second package housing,

56: LED seat, 57: ant sink seat,

58: through hole of the first package housing, 59: stepped portion

The present invention relates to a light emitting diode package having a phantom sink and a method of manufacturing the same. More particularly, the LED chip is mounted on a light emitting diode package which is assembled from an LED lead panel, and the heat generated from the LED chip can be discharged to the outside. The present invention relates to a light emitting diode package capable of improving a heat dissipation efficiency by providing a volt sink and a method of manufacturing the same.

In general, an LED chip is a semiconductor device that converts electrical energy into optical radiation, and the LED chip is selectively formed on a printed circuit board (PCB) or a lead terminal on which a thin film pattern is selectively formed depending on the purpose of use or shape. After mounting, the LED chip and the substrate or the lead terminal are electrically connected to each other, and a mold molding part is formed by using an epoxy or the like on top thereof, or a light emitting diode package can be manufactured by assembling a lens made of plastic or glass in advance. have.

It is well known that the structure, growth method, and material of the chip vary according to the color emitted from the light emitting diode package. In addition, the light emitting diode package (Light Emitting Diode Package) is generally used as a display element and a backlight (Back Light), the application of the mobile phone, personal digital assistants (PDAs) in recent years, the trend is increasing. .

In other words, the LED package protects the LED chip that can emit light when the power is supplied from various external environments such as dust, moisture, electrical and mechanical load, and optimizes and maximizes the electrical performance of the LED chip. Refers to the formation of signal input / output terminals to the main board using a lead frame or a printed circuit board (PCB), and molding using an encapsulant.

Such light emitting diode package can be classified into insert type and surface mount type according to the method of mounting on the main board, and as insert type, Single In-Line Package (DIP) Dual In-line Package (DIP) and Pin Grid Array (PGA) The surface mount type includes a quad flat package (QFP), a ball grid array (BGA) package, a bottom leaded package (BLP), and the like. Recently, with the miniaturization of electronic products, the size of the LED chip and the light emitting diode package has also become smaller, and surface mount packages are widely used rather than insert packages to increase the mounting density of the motherboard.

As a method for mass production of the surface mount light emitting diode package, an assembly method using the LED lead panel illustrated in FIG. 1A is applied. That is, the LED lead panel (1) made of copper alloy material having good electrical conductivity and thermal conductivity is manufactured in the form of a thin sheet having a strength of a certain level or more, and the LED lead panel (1) thus manufactured has a chip terminal on which an LED chip is mounted. (2) and the lead frame 3 are integrally formed with the form of a series of repetitive units.

The lead frame 3 is divided by a frame boundary hole 4 formed in the LED lead panel 1 so that the lead frame 3 is electrically disconnected, and the chip terminal 2 and the lead frame 3 of a series of repetitive units are separated. ) Is separated by the unit boundary hole (5). In addition, in order to mold the package molding material to be described later, the LED lead panel 1 may have upper and lower packages when the package molding material is attached and fixed to both sides of the chip terminal 2 on which the lead frame 3 is not formed. Packaging holes 6 are perforated in which the molding materials can be attached in contact with each other.

Referring to the manufacturing process of the light-emitting diode package mass-produced using the LED lead panel 1 of the above form as follows.

First, as shown in FIG. 1B, a package molding material 10 made of a thermally conductive plastic material is molded on a portion of the chip terminal 2 integrally formed with the lead frame 3 formed on the LED lead panel 1. . The molding material 10 is divided into an upper portion 10a and a lower portion 10b and molded in such a manner that the upper and lower portions of the LED lead panel 1 are compressed by high temperature and high pressure, and the upper portion 10a of the molding material 10 is formed. An inclined reflecting surface 11 is formed in the LED chip to serve as a reflecting plate.

As described above, after the molding material 10 is molded in the chip terminal 2 portion of the LED lead panel 1, the LED chip 20 is mounted on the chip terminal 2, and the LED chip 20 is After the mounting, the common terminal 2a is electrically connected to the wire 30 by polarity.

As described above, after the LED chip 20 is mounted on the chip terminal 2 and electrically connected to the common terminal 2a with a wire 30, the reflective surface of the upper portion 10a of the molding material 10 is formed. The light emitting lens (not shown) is fixed to 11 or molded with an LED molding material (not shown) such as transparent epoxy or silicon.

When the above-described series of assembly processes are completed and a plurality of light emitting diode package units are completed, as shown in FIG. 2 (a), each light emitting diode package unit is cut out from the LED lead panel 1 and taken out. After the lead frame 3 is bent properly to be inserted into the main board (not shown).

However, the light emitting diode package manufactured by the conventional manufacturing technique described above is manufactured from the LED lead panel 1, as shown in FIG. 2 (b), and includes the lead frame 3, the chip terminal 2, and the like. Since the common terminal 2a is integrally formed and the package molding material 10 is formed to completely surround the lead frame 3, heat emitted from the LED chip 20 is not sufficiently discharged.

In particular, a heat transfer slug or heat sink for dissipating heat emitted from the LED chip 20 must be configured in a high-brightness power LED package having a relatively high heat generation, but the above-described conventional LED lead In the process of assembling and producing a high brightness power LED package by applying the panel 1, since the lead frame 3 is configured in a form in which the lower part is completely wrapped by the lower molding material 10b, heat from the LED chip 20 is removed. There is a problem in that it does not generate heat in the downward direction, and it is difficult to separately install a phantom sink for discharging such heat downward.

Therefore, assembling and manufacturing a high-brightness power LED package using the conventional LED lead panel 1 does not properly release heat emitted from the power LED chip, which leads to premature heat loss of the LED chip 20 and significantly shortens the life of the LED package. There is a problem.

In order to solve the above problems of the prior art, the present invention forms a package housing on the LED lead panel formed with a lead frame, and then insert and fix the gasket sink from the bottom, and bonding the LED chip to the assembly of the LED package Therefore, the heat emitted from the LED chip is smoothly discharged to the bottom, and the heat dissipation efficiency is improved to provide a light emitting diode package that can be applied to a high brightness light emitting diode package and its manufacturing method.

In order to achieve the above object, the present invention provides a light emitting diode package having a phantom sink and a method of manufacturing the same. A light emitting diode package according to an aspect of the present invention includes a package housing having an opening and a through hole exposed by the opening; A lead frame having an inner part exposed in the opening of the package housing and an outer part extending from the inner part and protruding to the outside of the package housing; And a gasket sink coupled to a lower portion of the package housing and partially exposed by the opening. By mounting the light emitting diode chip on the phantom sink exposed by the opening, the heat dissipation efficiency of the heat generated by the light emitting diode chip is improved.

In addition, the package housing may include a first housing portion and a second housing portion coupled to each other with the lead frame therebetween. The opening may be formed by the first housing part.

A stepped portion may be formed on an inner wall of the opening. In addition, the second housing part may have a receiving groove accommodating the lead frame thereon.

The bolt sink may include a bolt sink body corresponding to a bottom surface of the package housing and an insertion protrusion inserted into the through hole of the package housing upwardly protruding from the center portion of the bolt sink body. The bolt sink body and / or the insertion protrusion may have a coupling jaw. The engaging jaw prevents the bolt sink from being separated from the package housing after it is coupled to the package housing.

The material of the package housing may be plastic or ceramics. The ceramics may be one selected from alumina (Al ₂ O ₃ ), silicon carbide (SiC), or aluminum nitride (AlN).

The light emitting diode package manufacturing method according to another aspect of the present invention includes providing a lead panel having LED lead frames each having a hollow portion in the center thereof. Package housings are formed around the hollow portions of the LED leadframes. In this case, each of the package housing has an opening for exposing a portion of the hollow portion and the LED lead frame and a through hole in the lower portion of the hollow portion. A chop sink is coupled to the bottom of the package housing. A portion of the chop sink is exposed by the opening. An LED chip is mounted on the phantom sink exposed by the opening. A part of the LED lead frame exposed to the LED chip and the opening is electrically connected. Thereafter, the LED leadframes are cut in the lead panel and separated into individual devices.

On the other hand, the gasket sink may be coupled to protrude further than the lower surface of the package housing.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view and a cross-sectional view showing an LED lead panel for mass-producing a light emitting diode package according to the present invention, Figure 4 is an exploded perspective view for explaining a light emitting diode package having a phantom sink according to the present invention, Figure 5 is A plan view and a side view showing an enlarged state in which a light emitting diode package having a volt sink according to the present invention is formed on an LED lead panel.

As shown in FIG. 3, a plurality of units formed of a lead frame 40 and a connection frame 41 are formed at a predetermined interval in the LED lead panel 1a for manufacturing the LED package according to the present invention. The lead frame 40 is integrally formed with the connection frame 41 in a pair, and the connection frame 41 is formed in a symmetrical structure to form a hollow portion 44 having a predetermined shape in the center. Separating the lead frame 40 and the connecting frame 41 is for easily explaining the structure of the lead frame, the "lead frame" can be used as a meaning including both the lead frame 40 and the connecting frame 41. have.

In addition, the connection frame 41 forming the hollow portion 44 in the center as described above is supported by the panel support 42 to be fixed to the LED lead panel (1a), which is the first and second packages to be described later When the housing (50, 51) is fixed to serve to fix the position of the connecting frame (41).

On the other hand, in the embodiment of the present invention, but the hexagonal shape of the space portion 44 formed in the center of the connecting frame 41 forming a symmetrical structure, which can be applied to polygons of circular or square or more.

After the LED lead panel 1a for manufacturing the light emitting diode package according to the present invention is formed in the above-described configuration, the first and second package housings 50 and 51 and the configuration as shown in FIG. The bolt sink 53 is fixed sequentially.

That is, the first package housing 50 having a predetermined shape (a square shape in the embodiment of the present invention) is formed on an upper portion of the pair of connection frames 41 integrally formed with the lead frame 40 on the LED lead panel 1a. The second package housing 51 is positioned below the connection frame 41.

A central portion of the first package housing 50 is recessed to accommodate the molding material, and has a through hole 58 exposing the terminal portion and the hollow portion 44 of the connection frame 41 at the bottom thereof. The through hole 58 may have the same area as the recessed portion, but may have a narrower area as shown. The recessed portion and the through hole 58 then form an opening in the package housing. The stepped portion 59 is formed on the inner wall of the recessed portion to accommodate the molding material of the LED package, which will be described later.

The upper surface of the second package housing 51 is formed with a receiving groove 52 of the same shape as the connecting frame 41 to accommodate the connecting frame 41, the lower surface of the gasket sink to be described later A bolt sink seating groove 57 into which the 53 is inserted can be formed.

In addition, a circular through hole 55 is formed in the center of the second package housing 51 formed as described above to accommodate the insertion protrusion 54 of the gant sink 53. The inner space of 54 is to be the LED mounting portion 56 to which the LED chip 60, which will be described later, is fixed.

Meanwhile, the first and second package housings 50 and 51 constituting the present invention may use thermal conductive plastics or high thermal conductive ceramics as materials thereof. In the thermally conductive plastic, and the like, ABS (Acrylonitrile Butadiene Styrene), LCP (Liquid Crystalline Polymer), PA (Polyamide), PPS (Polyphenylene Sulfide), TPE (Thermoplastic Elastomer), highly thermally conductive ceramic is alumina (Al ₂ O ₃ ), Silicon carbide (SiC), aluminum nitride (AlN), and the like. Among the ceramics, aluminum nitride (AlN) has the same physical properties as that of alumina, and is more widely used than alumina in thermal conductivity.

When the material of the applied first and second package housings 50 and 51 is a thermally conductive plastic, the first package housing 50 and the second package housing 51 are formed in the symmetrical configuration of the LED lead panel 1a. It is located in the upper and lower parts of the connecting frame 41 to be pressed at a high temperature to take a fixed manner. Here, an important consideration is in the form of the through hole 58 and the stepped portion 59 formed inside the first package housing 50. That is, the first and second package housings 50 and 51 are positioned in the LED lead panel 1a, and then the compression means having protrusions corresponding to the shapes of the through holes 58 and the stepped portion 59 are formed. The high-temperature compression is used to form the through hole 58 and the stepped portion 59.

On the other hand, when the materials of the first and second package housings 50 and 51 to be applied are ceramics, the first package housing 50 and the second package housing 51 are already manufactured in the correct dimensions and shapes. That is, since the ceramics are impossible to be molded into the desired shape in the final application step due to the properties that are manufactured in the desired shape at a high temperature of 1000 ° C. or higher, the first and second package housings 50 and 51 are already manufactured in the correct dimensions and shapes. Will be done. In this case, the through hole 58 and the stepped portion 59 should be formed in the first package housing 50 manufactured.

Therefore, the first and second package housings 50 and 51 made of ceramic material as described above are positioned above and below the connection frame 41 of the LED lead panel 1a and attached using an adhesive having a large adhesive strength. It will be fixed.

The light emitting diode package of the present invention, which is assembled to the LED lead panel 1a with the configuration as described above, as shown in FIG. 5, the lead frame 40 formed on the LED lead panel 1a and a unitary and symmetrical type It is formed in each unit consisting of a connecting frame 41 formed of.

In addition, at least one LED chip 60 is attached to and fixed to the LED seating part 56, which is the center of the volt sink 53 constituting the light emitting diode package of the present invention formed as described above, which is connected to the connection frame 41. It is electrically polarized to the connecting wire 62.

In addition, a zener diode 61 may be mounted on the LED seat 56 to electrically protect the mounted LED chip 60, and may be polarly connected to the connection wire 62. This Zener diode (60) is a semiconductor device utilizing the phenomenon that when a relatively large reverse voltage is applied to a semiconductor pn or np junction, a large current begins to flow at a certain voltage and the voltage is kept constant. In addition, when applied to LED package, it can maintain the constant voltage even when static electricity or rapid current is supplied, thereby increasing the reliability of the product.

6 is a top perspective view and a bottom perspective view showing a light emitting diode package having a volt sink in accordance with the present invention, FIG. 7 is a cross-sectional view showing a light emitting diode package having a volt sink in accordance with the present invention, and FIG. A cross-sectional view showing a molding material and a light emitting lens molded in a light emitting diode package having a volt sink according to the present invention.

A plurality of light emitting diode packages according to the present invention are formed on the LED lead panel 1a through the above-described manufacturing process, and each of the formed light emitting diode packages is formed around the first and second package housings 50 and 51. It is cut out from the LED lead panel 1a and taken out.

In each of the light emitting diode packages according to the present invention, as shown in FIG. 6, the lead frame 40 is bent at a predetermined length and angle so as to correspond to the connection terminal of the applied PCB.

In addition, as shown in FIGS. 6B and 7, the light emitting diode package according to the present invention is formed in a shape in which the bolt sink 53 is inserted and fixed from the lower portion of the second package housing 51. It protrudes from the lower surface of the second package housing 51. That is, when the light emitting diode package is manufactured and actually applied, the surface of the gt sink 40 protruding lower than the lower surface of the second package housing 51 directly contacts the heat dissipation member (not shown) to maximize the heat dissipation effect. to be.

In addition, in the light emitting diode package according to the present invention, as shown in FIG. 7, a stepped portion 59 is formed in the inner space of the first package housing 50, which is molded by the package molding material described later. Or to act as a fixing jaw required for mounting the light emitting lens.

In addition, the outer surface portion of the insertion protrusion 54 of the bolt sink 53 constituting the light emitting diode package according to the present invention is inserted into a recess formed in the inner wall of the through hole 55 of the second package housing 51. A locking jaw 54a is formed to be fixed so that the insertion protrusion 54 of the gart sink 53 can be firmly fixed to the through hole 55 of the second package housing 51. The catching jaw 54a may be formed in the main body of the wick sink. The locking jaw 54a may be formed at an uppermost edge of the insertion protrusion 54 of the heat sink 53. At this time, the locking jaw 54a is coupled to the upper surface of the second package housing 51 to fix the gant sink 53.

On the other hand, the light emitting diode package having a phantom sink according to the present invention transmits the light emitted from the LED chip 60 while protecting the LED chip 60 and the connection wire 62 in the inner space of the first package housing (50). The molding material 65 to be molded is molded.

As shown in FIG. 8A, the molding material 65 may be an epoxy resin, and may include a fluorescent material for converting light emitted from the LED chip 60.

In addition, the molding material 65 may contain a diffuser for even distribution of light.

In addition, as shown in (b) of FIG. 8, when the molding material 65 is an epoxy resin containing a fluorescent substance, further molding treatment is performed as an epoxy resin 67 on the top thereof for a more stable molding effect. can do.

In addition, as shown in (c) of FIG. 8, the light emitting diode package according to the present invention is molded as a molding material 65 as shown in (a) and (b) of FIG. The light emitting lens 66 may be fixed to the upper step portion 59b of the first package housing 50 in order to more stably protect the internal package (LED chip and bonding wire).

The present invention has been applied to the specific embodiments as shown in each of the above drawings, the present invention is not limited to these specific embodiments, and various modifications can be made without departing from the spirit of the present invention.

As described above, the present invention forms a package housing in the upper and lower portions of the lead frame and the connecting frame formed on the LED lead panel, and then manufacturing a light emitting diode package in which a bolt sink in which the LED chip is mounted is inserted into and fixed to the inner space thereof. There is an advantage that mass-efficient light emitting diode package can be mass produced. In addition, a monochromatic or white light emitting diode may be realized by molding the internal space of the package housing of the light emitting diode package with an epoxy resin or an epoxy resin mixed with a fluorescent material. The method of manufacturing a light emitting diode package of the present invention is similar to a conventional top light emitting diode package, so that a large amount of light emitting diode packages can be mass produced at high speed.

Claims (7)

A package housing having an opening and a through hole exposed by the opening; A lead frame having an inner portion exposed in the opening of the package housing and an outer portion extending from the inner portion and protruding to the outside of the package housing; And And a volt sink coupled to a lower portion of the package housing and partially exposed by the opening. The light emitting diode package of claim 1, wherein the package housing includes a first housing part and a second housing part coupled to each other with the lead frame interposed therebetween, wherein the opening is formed in the first housing part. The light emitting diode package of claim 2, wherein a stepped portion is formed on an inner wall of the opening. The light emitting diode package of claim 2, wherein the second housing portion has a receiving groove accommodating the lead frame thereon. 3. The fan sink of claim 1 or 2, wherein the bolt sink comprises: a bolt sink body corresponding to a lower surface of the package housing; And an insertion protrusion protruding upward from a center portion of the phantom sink body and inserted into a through hole of the package housing. The LED package of claim 5, wherein the bolt sink has a coupling jaw on at least one side of outer surfaces of the bolt sink body and the insertion protrusion. A lead panel having LED lead frames each having a hollow portion in the center thereof, Package housings are formed around the hollow portions of the LED lead frames, wherein each of the package housings has an opening for exposing the hollow portion and a portion of the LED lead frame and a through hole in the lower portion of the hollow portion, Couple a bolt sink to the bottom of the package housing, a portion of the bolt sink is exposed by the opening, Mounting an LED chip in the phantom sink exposed by the opening, Electrically connecting a portion of the LED lead frame exposed to the LED chip and the opening; The LED package manufacturing method comprising cutting the LED lead frames in the lead panel to provide a separate device.

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