KR20060021557A - Line structure for display and display apparatus using said line structure - Google Patents

Abstract

The present invention is to provide a wiring structure for maximizing the effective contact area even in the case of misalignment, thereby forming a wiring contact portion that the wiring contacts with a variable width structure.

Through such a structure, the effective contact area of the wiring is maximized, and even though there is a misalignment, the area of the contacting part is large so that the liquid crystal display operates normally, the process success rate is increased, and the alignment margin is improved.

Wiring, Contact, OLB, Liquid Crystal Display, Wiring Structure

Description

Wiring structure for display device and display device using the same {LINE STRUCTURE FOR DISPLAY AND DISPLAY APPARATUS USING SAID LINE STRUCTURE}

FIG. 1 is a diagram schematically illustrating a display device in which a thin film transistor array panel, a driving chip film, and a PCB substrate are connected.

2 is an enlarged view of a portion A of FIG. 1 according to an embodiment of the present invention.

3 is an enlarged view of a wiring contact part according to an exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10, 20: wiring contact 11: first part

12: second part 15: connecting portion

100: data driving chip film 150: data driving chip

200: gate driving chip film 250: gate driving chip

300: PCB 500: thin film transistor display panel

The present invention relates to a wiring structure for a display device and a display device using the same.

In general, various types of display devices exist. Among them, a liquid crystal display (LCD) is a typical flat display device.

The LCD device includes a thin film transistor array panel on which gate lines, data lines, thin film transistors, and pixel electrodes are formed, and an upper substrate facing the color filter and a common electrode, and between the thin film transistor array panel and the upper substrate. And a liquid crystal layer.

In the LCD device, light transmittance changes as the liquid crystal rotates due to an electric field formed between the pixel electrode and the common electrode, and an image is displayed according to the change of the transmittance. The electric field formed between the pixel electrode and the common electrode is controlled by the pixel electrode, and the voltage of the pixel electrode is controlled through a switching element called a thin film transistor. Here, the thin film transistor transfers or blocks the image signal transmitted along the data line to the pixel electrode by the scan signal transmitted along the gate line.

The gate line and the data line receive scan signals and image signals from the gate driving chip and the data driving chip, respectively. The signal applied to the driving chip is generated in a timing controller (T-con) on a separate printed circuit board (PCB) and transmitted to the driving chip through wiring on a flexible printed circuit (FPC) film. .

The gate driving chip and the data driving chip are connected to the thin film transistor array panel in various ways.

First, the gate driving chip is simpler in structure than the data driving chip, and is connected to the thin film transistor array panel in various ways. Currently, a method of controlling a gate driving chip from a T-con on a PCB that removes a separate PCB controlling a gate driving chip, forms a gate driving chip on a film, and controls a data driving chip is used. In addition, a method of directly forming a gate driving chip on a thin film transistor array panel instead of a film is used.

In contrast, the data driving chip has a complicated structure, and is generally controlled using a PCB and a data driving chip film.

Currently, data driving chips are mainly formed of chip on film (COF) and tape carrier package (TCP) structures. The COF and TCP structures use a method of forming a data driver chip on a film and attaching it to a thin film transistor array panel. The data driver chip film is connected to a PCB including a T-con, and includes a wiring for transmitting a signal from the T-con to the data driver chip and then transmitting the signal to the data line of the thin film transistor array panel.

PCB, driving chip film and thin film transistor array panel of such display device are electrically connected. Generally, bonding between thin film transistor array panel and data and gate driving chip film is performed through outer lead bonding (OLB) process. Tape Automated Bonding (TAB) bonding is performed between the data driving chip films.

At this time, the width of the contact portion of the wiring during the OLB process or the TAB process is constant, the entire wiring contact portion is formed to be constantly shifted in the case of misalignment, the problem of reducing the width of the contact wiring occurs, the problem of signal transmission due to the alignment error occurs .

 An object of the present invention is to provide a wiring structure and a display device using the same that can maximize the effective contact area even when misalignment.

In order to solve this problem, in the present invention, the wiring contact portion is formed in a structure of varying width. That is, since the success rate of the OLB process or the Tab process increases as the contact area to be connected increases, a wide part is formed and arranged at the wiring contact part.

Specifically, a plurality of wirings are arranged having a wide contact portion including a wide first portion, a second portion narrower than the first portion, and a connection portion connecting the first portion and the second portion, The wiring is for a wiring structure for a display device in which the first portion is arranged to correspond to the second portion of an adjacent wiring,

The plurality of first wires formed on the thin film transistor array panel have a first contact portion having a wider width, a second portion narrower than the first portion, and a wire contact portion including a connection portion connecting the first portion and the second portion, The wirings are arranged such that the first portions correspond to the second portions of the adjacent wirings, and the plurality of second wirings formed on the driving chip film connected to the first wirings have a wide third portion and the third portions. A wiring contact portion including a fourth portion having a narrower width than the portion and a connecting portion connecting the third portion and the fourth portion, wherein the wiring is arranged such that the third portion corresponds to the fourth portion of the adjacent wiring; The first portion is in contact with the third portion connected thereto, and the second portion is for the display device in contact with the fourth portion connected thereto.                     

The plurality of first wirings formed on the driving chip film have a first contact portion having a wider width, a second portion narrower than the first portion, and a wiring contact portion including a connection portion connecting the first portion and the second portion, The wiring is arranged such that the first portion corresponds to the second portion of the adjacent wiring, and the plurality of second wirings formed on the printed circuit board connected to the first wiring include a third portion and a third portion that are wider. A wiring contact portion including a fourth portion having a narrower width than the portion and a connecting portion connecting the third portion and the fourth portion, wherein the wiring is arranged such that the third portion corresponds to the fourth portion of the adjacent wiring; The first part may be in contact with the third part connected thereto, and the second part may be in contact with the fourth part connected thereto.

DETAILED DESCRIPTION Embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like parts are designated by like reference numerals throughout the specification. When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the other part being "right over" but also another part in the middle. On the contrary, when a part is "just above" another part, there is no other part in the middle.                     

A wiring structure of a substrate and a film for a display device according to an exemplary embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

First, FIG. 1 is a diagram illustrating a display device in which a thin film transistor array panel, a driving chip film, and a PCB substrate are connected.

FIG. 1 illustrates a gate driving chip film 200, a data driving chip film 100, and a PCB 300 connected to the thin film transistor array panel 500. As illustrated, the data driving chip film 100 is formed along the long axis direction of the thin film transistor array panel 500. In addition to wiring, the data driving chip 150 is mounted on the data driving chip film 100, and the PCB 300 is connected to the opposite side of the thin film transistor array panel 500.

The PCB 300 is provided with a T-con (not shown) for controlling a display of an image by transferring a signal from the outside to the data driving chip 150 and the gate driving chip 250.

The wiring of the data driving chip film 100 transmits a signal from the T-con of the PCB 300 to the data driving chip 150, and transmits the signal of the data driving chip 150 to the data line of the thin film transistor array panel. It is formed to be transmitted.

In addition, a wiring for transferring a signal transmitted to the gate driving chip 250 among the signals of the T-con to the gate connection wiring is included.

The gate driving chip film 200 is formed along a short axis direction of the thin film transistor array panel 500. The gate driving chip film 200 is formed with a gate driving chip 250 as well as wiring. The signal coming into the gate driving chip 250 is a signal transmitted from the T-con and is transmitted through a gate connection wiring formed on the thin film transistor array panel 500.

The gate driving chip 250 and the data driving chip 150 transfer the signal transmitted from the T-con to the gate line and the data line of the thin film transistor array panel. The thin film transistor transmits or blocks a signal of the data line to the pixel electrode based on the signal of the gate line.

In this embodiment, as shown in relation to the gate drive, but showing the embodiment of the structure to form only the gate drive film 200, and does not form a separate PCB for the gate drive, but additionally the PCB for the gate drive Various gate driving methods may be applied, such as forming the gate driving chip in the gate driving film 200 directly on the thin film transistor array panel.

2 and 3 showing an embodiment of the present invention will be described below.

2 is an enlarged view of a portion A of FIG. 1 according to an embodiment of the present invention, and FIG. 3 is an enlarged view of a wiring contact unit according to an embodiment of the present invention.

3 shows a wiring contact 10 according to an embodiment of the invention.

The wiring contact portion 10 according to the embodiment of the present invention will be described in detail by dividing it into three parts. The wiring contact portion 10 first has a first portion 11 whose width is wider than the width of the wiring, and a second portion 12 whose width is narrower than the width of the wiring. And a connecting portion 15 connecting the second portion 12 and gradually decreasing in width. In this embodiment, one side of the connection portion 15 forms a vertical line, but the other side is formed to form an oblique line, but an embodiment in which both sides of the connection portion form an oblique line is also possible.

The second portion 12 should be formed in consideration of the minimum width at which the signal wiring can operate.

The wiring contact 10 having the above shape is formed at the wiring ends of the PCB 300, the driving chip films 100 and 200, and the thin film transistor array panel 500 to improve the contact of the wiring.

2 illustrates a structure and a connection in which the wiring contact 10 is arranged using the PCB 300 and the data driving chip film 100 as an example.

First, the wiring contact portion formed at the end of the PCB 300 wiring uses reference numeral 10, and the wiring contact portion formed at the wiring end of the data driving chip film 100 will be described using reference numeral 20.

First, the wiring contact part 10 formed on the PCB 300 will be described.

The wiring contact portion 10 includes a wiring contact portion 10-1 shown in FIG. 3 (the first wiring contact portion) and a wiring contact portion 10-2 that rotates the wiring contact portion 10-1 shown in FIG. 3 by 180 degrees. Wiring contacts) are alternately arranged. Therefore, the adjacent first wire contact portion 10-1 and the second wire contact portion 10-2 face each other with straight sides or refracted sides with each other. That is, the first portion 11 of the first wiring contact portion 10-1 and the third portion 13 of the second wiring contact portion 10-2 correspond to each other, and the second wiring contact portion 10-1 may correspond to each other. The third portion 13 and the first portion 11 of the second wiring contact portion 10-2 correspond to each other.

The first wiring contact portion 10-1 and the second wiring contact portion 10-2 facing the straight sides are formed with a predetermined distance d from each other. The first wiring contact portion 10-1 and the second wiring contact portion 10-2 facing the refracted sides are formed so as to coincide with each other by horizontally moving their refracted sides, and the clearance gap d 'therebetween. It is preferable to form so as to have). This is because the wiring contact 10 of the PCB 300 is connected to the wiring contact 20 of the data driving chip film 100 due to misalignment and the first wiring contact 20-1 of the data driving chip film 100 and the PCB. The second wiring contact portions 10-2 formed at 300 are electrically connected to each other. However, the clearance gap d 'may not be formed.

In addition, the intervals d and d 'may be formed at equal intervals.

The wiring structure of the PCB 300 formed as described above is identically formed on both the data driving chip film 100, the gate driving chip film 200, and the thin film transistor array panel 500.

The wiring of the PCB 300 and the wiring of the data driving chip film 100 formed as described above will be described.

As shown in FIG. 2, the first portion 11 of the wiring contact portion 10 is in contact with the first portion 11 of the other wiring contact portion 20 to be connected, and the connecting portion 15 is connected to the connecting portions 15. , The second portion 12 is in contact with the second portions 12.

Thus, since the area of the first portion 11, which is the contact portion, is enlarged, there is no problem in the electrical connection between the two wiring contacts 10 and 20 even if some misalignment occurs. In FIG. 2, even when the l-l 'line of the data driving chip film 100 is connected to the l' '-l' '' line of the PCB 300 by misalignment, the first portion of the PCB 300 wiring contact part 10 is connected. (11) Since a part of the data driving chip film 100 and the wire contacting part 20 of the first part 11 are in contact with each other, a sufficient margin for the signal transmission is sufficient.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of rights.

By interconnecting with the wiring structure as described above, the effective contact area is maximized, and even though there is a misalignment, the area of the contacting part is wide so that the liquid crystal display device operates normally. This increases process success and improves alignment margins.

Claims (5)

A plurality of wirings are arranged having a wide first portion and a wiring contact portion including a second portion narrower than the first portion and a connection portion connecting the first portion and the second portion, And wherein the wiring is arranged such that the first portion corresponds to the second portion of the adjacent wiring. In claim 1, When the wiring is connected, the first portion of the wiring contact portion is in contact with the first portion of another wiring connected thereto, and the second portion is in contact with the second portion of the other wiring connected thereto. Wiring structure. In claim 1, A wiring structure for a display device, wherein the distance between the first portion and the second portion of the adjacent wiring is formed to be constant. The plurality of first wires formed on the thin film transistor array panel have a first contact portion having a wider width, a second portion narrower than the first portion, and a wire contact portion including a connection portion connecting the first portion and the second portion, The wiring is arranged such that the first portion corresponds to the second portion of an adjacent wiring, The plurality of second wirings formed on the driving chip film connected to the first wiring may include a third portion having a wider width, a fourth portion having a narrower width than the third portion, and a connection portion connecting the third portion and the fourth portion with the third portion. A wiring contact portion, wherein the wiring is arranged such that the third portion corresponds to the fourth portion of an adjacent wiring, And the first portion is in contact with the third portion connected thereto and the second portion is in contact with the fourth portion connected thereto. The plurality of first wirings formed on the driving chip film have a first contact portion having a wider width, a second portion narrower than the first portion, and a wiring contact portion including a connection portion connecting the first portion and the second portion, The wiring is arranged such that the first portion corresponds to the second portion of the adjacent wiring, The plurality of second wirings formed on the printed circuit board connected to the first wiring may include a third portion having a wider width, a fourth portion having a narrower width than the third portion, and a connection portion connecting the third portion and the fourth portion. A wiring contact portion, wherein the wiring is arranged such that the third portion corresponds to the fourth portion of an adjacent wiring, And the first portion is in contact with the third portion connected thereto and the second portion is in contact with the fourth portion connected thereto.

Images