KR20050114065A - Plasma display panel and the fabrication method therof - Google Patents

Abstract

A plasma display panel and a method of manufacturing the same are disclosed. The present invention includes a front substrate; a rear substrate disposed to face the substrate; a dielectric wall disposed between the substrate and defining a discharge space; and an X electrode separately disposed along the circumference of the discharge space and embedded in the dielectric wall. And a sustain electrode having a Y electrode; and an address electrode disposed on the rear substrate and embedded by a dielectric layer; and a red, green, and blue phosphor layer applied in a discharge space. As a multilayer structure having at least two layers having different widths, as the surface area of the dielectric wall becomes wider, the coating area of the protective film layer formed on the side of the dielectric wall increases. Thereby, the secondary electron emission amount of a protective film layer can be improved significantly.

Description

Plasma display panel and its manufacturing method {Plasma display panel and the fabrication method therof}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a plasma display panel having a long discharge path by forming a stepped dielectric wall and a method of manufacturing the same.

In general, a plasma display panel injects and discharges a discharge gas between two substrates on which discharge electrodes are formed, and thereby causes a flat panel display to implement a desired number, letter, or graphic by exciting the fluorescent material of the phosphor layer by the generated ultraviolet rays. It is a flat display device.

The plasma display panel can be classified into a direct current type and an alternating current type according to a type of driving voltage applied to a discharge cell, for example, a discharge type, and can be classified into a counter discharge type and a surface discharge type according to the configuration of the electrodes.

The DC plasma display panel has a structure in which all electrodes are exposed to a discharge space, and charges are directly transferred between corresponding electrodes. On the other hand, in the AC plasma display panel, at least one electrode is embedded in the dielectric layer, and instead of direct charge transfer between the corresponding electrodes, ions and electrons generated by the discharge adhere to the surface of the dielectric layer so that the wall voltage is reduced. (wall voltage) is formed, and the discharge can be maintained by the sustaining voltage.

On the other hand, in the opposite discharge type plasma display panel, a plurality of discharge electrodes are provided to face each unit pixel, and addressing discharge and sustain discharge are generated between the two electrodes. On the other hand, in the surface discharge plasma display panel, an address electrode and corresponding X and Y electrodes are provided for each unit pixel to generate addressing discharge and sustain discharge.

1 illustrates a conventional plasma display panel 100.

Referring to the drawings, the plasma display panel 100 includes a front substrate 110, a rear substrate 120 disposed to face the front substrate 110, and an X formed on an inner surface of the front substrate 110. A sustain electrode 130 having an electrode 131, a Y electrode 132, a bus electrode 133 electrically connected to the X and Y electrodes 131, 132, and the sustain electrode 130. A buried front dielectric layer 140, a passivation layer 150 coated on a surface of the front dielectric layer 140, and formed on an inner surface of the back substrate 120 and intersecting with the sustain electrode 130. An address electrode 160 disposed in the above, a back dielectric layer 170 filling the address electrode 160, a partition wall 180 disposed between the front and back substrates 110 and 120, and the partition wall ( 180, the red, green, and blue phosphor layers 190 coated inside are included.

The plasma display panel 100 having the above structure selects a discharge cell for emitting light by applying an address voltage between the Y electrode 132 and the address electrode 160, and maintains the X and Y electrodes 131 and 132. When the discharge voltage is applied, surface discharge occurs in the front dielectric layer 140 and the discharge region on the surface of the passivation layer 150 to generate ultraviolet rays, and the ultraviolet rays excite the fluorescent material of the phosphor layer 190. Or a video is implemented.

However, the conventional plasma display panel 100 has the following problems.

First, as shown in FIG. 2, the discharge spreads around from a gap of the X and Y electrodes 131 and 132, and the electric field is compared with the distance between the X and Y electrodes 131 and 132. Due to the relatively low partition wall 180, the phenomenon of being blocked by the phosphor layer 190 occurs as indicated by the arrow. Such interference of the electric field causes the phosphor layer 190 due to the impact of ions, thereby reducing the afterimage and the brightness.

Second, since the sustain electrode 130, the front dielectric layer 140, and the passivation layer 150 are formed along the inner surface of the front substrate 110, the transmittance of visible light is less than 60%, resulting in high efficiency flat panel display. There is a problem with the device.

Third, the discharge diffuses from the gaps of the X and Y electrodes 131 and 132 to the surroundings, but mainly along the plane, so that the utilization of the entire discharge space is low.

Recently, in order to improve the problem of the three-electrode surface discharge plasma display panel 100, a plasma display panel having a different structure in which discharge electrodes are disposed is under research and development.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides a plasma display panel and a method of manufacturing the same, which improve discharge efficiency by forming a predetermined step in the dielectric wall embedding the sustain electrode to increase the discharge path. have.

Another object of the present invention is to provide a plasma display panel and a method of manufacturing the same, which have improved discharge characteristics by maintaining the same spacing between a plurality of sustain electrodes and a dielectric wall filling the same.

In order to achieve the above object, the plasma display panel according to an aspect of the present invention,

A front substrate;

A rear substrate disposed to face the front substrate;

A dielectric wall disposed between the front substrate and the rear substrate and defining a discharge space together with the front and rear substrates;

A sustain electrode disposed separately along the circumference of the discharge space and having an X electrode and a Y electrode embedded in the dielectric wall;

An address electrode disposed on the rear substrate and embedded by a dielectric layer;

It includes; red, green, blue phosphor layer applied in the discharge space;

The dielectric wall is a multi-layered structure of at least two layers having different widths.

The dielectric wall may be formed such that the width of the portion embedding the X electrode is relatively wider than the width of the portion embedding the Y electrode.

In addition, the width of the X electrode is characterized in that it is relatively wider than the width of the Y electrode.

In addition, the interval in the thickness direction of the X electrode and the dielectric wall is characterized in that substantially equal to the interval in the thickness direction of the Y electrode and the dielectric wall.

Further, the X electrode is disposed adjacent to the front substrate, the Y electrode is disposed adjacent to the rear substrate, it is characterized in that arranged separately up and down.

In addition, a protective film layer is further formed on the inner surface of the dielectric wall to increase secondary electron emission.

Method of manufacturing a plasma display panel according to another aspect of the present invention,

Preparing a substrate;

Forming a first dielectric wall filling the X electrode on the substrate;

Forming a second dielectric wall on the first dielectric wall, the second dielectric wall having a narrower width and embedding a Y electrode; And

And forming a passivation layer on side surfaces of the first and second dielectric walls.

Further, the first and second dielectric walls are formed to define a discharge space, and the X and Y electrodes are embedded in the first and second dielectric walls along the circumference of the discharge space.

In addition, the width of the X electrode is characterized by being formed wider than the width of the Y electrode.

Further, the gap in the thickness direction of the X electrode and the first dielectric wall is formed to be equal to the gap in the thickness direction of the Y electrode and the second dielectric wall.

Hereinafter, a plasma display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a partial cutaway view of the plasma display panel 300 according to an exemplary embodiment of the present invention.

Referring to the drawings, the plasma display panel 300 includes a front substrate 310 and a rear substrate 320 disposed in parallel with the front substrate 310. The front and back substrates 310 and 320 are sealed together by applying frit glass along edges of opposed inner surfaces.

The front substrate 310 is made of a transparent substrate such as soda lime glass.

The back substrate 320 is also made of the same material as the front substrate 310. An address electrode 330 is disposed on an inner surface of the rear substrate 320. The address electrode 330 is formed of a plurality of strips, disposed in parallel with the Y direction of the substrate 320, and spaced apart from each other by a predetermined interval in the X direction. The address electrode 330 extends across each unit discharge cell and is made of a metal material having excellent conductivity, for example, silver paste.

The address electrode 330 is buried by the dielectric layer 340. The dielectric layer 340 is entirely coated to fill the address electrode 330 using a transparent dielectric such as PbO-B ₂ O ₃ -SiO ₂ . Alternatively, only the patterned portion of the address electrode 330 may be selectively buried.

A dielectric wall 350 is disposed between the front and rear substrates 310 and 320 to define a discharge space therebetween. The dielectric wall 350 is made of a high dielectric material in which various fillers are added to glass paste. The dielectric wall 350 includes a horizontal dielectric wall 351 disposed in a direction (X direction) orthogonal to the address electrode 330, and a vertical dielectric disposed in a direction (Y direction) parallel to the address electrode 330. The wall 352 is included. The vertical dielectric walls 352 extend integrally in opposite directions from the inner walls of the adjacent pair of horizontal dielectric walls 351 to define a grid-shaped discharge space.

Alternatively, the dielectric wall 350 may have various types of embodiments, such as a meander type, a delta type, or a hexagon. In addition, the discharge space defined by the dielectric wall 350 may be replaced with another shape such as a polygon or a circle as long as the discharge space may be partitioned in addition to the quadrangle.

At this time, the dielectric wall 350 is formed stepped so that the cross-sectional area is gradually narrowed.

The storage electrode 380 is disposed in the dielectric wall 350. The sustain electrode 380 includes an X electrode 360 disposed relatively adjacent to the front substrate 310, and a Y electrode 370 disposed relatively adjacent to the rear substrate 320.

The Y electrode 370 is disposed below the X electrode 360. Since the X and Y electrodes 360 and 370 are electrically insulated, different voltages may be applied. The X and Y electrodes 360 and 370 are disposed along the circumference of the discharge space. Accordingly, the X and Y electrodes 360 and 370 form a closed loop for each discharge space.

The inner surface of the dielectric wall 350 is formed of a material such as magnesium oxide (MgO) such that ions generated inside the panel 310 along the four sides of the discharge space emit secondary electrons by interaction with the surface. Formed protective film layer 390 is formed. The protective layer 390 is coated for each discharge space.

A partition wall 410 may be further provided between the dielectric wall 350 and the rear substrate 320. The partition wall 410 is made of a low dielectric material, unlike the dielectric wall 350. The partition wall 410 is disposed in a substantially same shape at a portion corresponding to the dielectric wall 350.

That is, the partition wall 410 is a horizontal partition wall 411 disposed in a direction (X direction) orthogonal to the address electrode 330, and a vertical partition wall disposed in a direction (Y direction) parallel to the address electrode 330. 412 is provided. The horizontal and vertical partitions 411 and 412 are integrally coupled to each other to form a lattice shape.

As such, when only the dielectric wall 350 is formed between the front and back substrates 310 and 320, a single wall defines a discharge space, and the dielectric wall 350 and the partition wall 410 are both front. And when formed between the back substrates 310 and 320, a double wall made of a material having a different dielectric property defines a discharge space.

Meanwhile, in the discharge space partitioned by the front and rear substrates 310 and 320, the dielectric wall 350, and the partition wall 320, neon (Ne) -xenon (Xe) or helium (He) -xenon A mixed gas such as (Xe) is injected.

In addition, red, green, and blue phosphor layers 420 that are excited by ultraviolet rays generated from the discharge gas and emit visible light are formed. In this case, the phosphor layer 420 may be coated on any surface of the discharge space, but is preferably applied to the inner surface of the partition 410 and the upper surface of the dielectric layer 340 with a predetermined thickness.

4 is a view illustrating the discharge electrode of FIG. 3 separately.

Referring to the drawing, the address electrode 330 is disposed in the Y direction. The address electrode 330 has a strip shape and extends across each discharge space S indicated by a dotted line.

The X electrode 360 is disposed in a direction crossing the address electrode 330. The X electrode 360 is disposed in a substantially rectangular structure for each unit discharge cell along the circumference of the discharge space. The X electrodes 360 are connected to each other between adjacent electrodes arranged in the X direction, and the same voltage is applied thereto. In addition, the X electrodes 360 are separated from each other between electrodes arranged in the Y direction, and different voltages are applied thereto.

Accordingly, the X electrode 350 has a ladder structure connected to each other between adjacent electrodes in the X direction, and has a structure in which electrodes having a ladder structure are spaced apart at predetermined intervals along the Y direction.

The Y electrode 370 is separated below the X electrode 360 and has a strip structure disposed in parallel with the X electrode 360. Like the X electrode 360, the Y electrode 370 has a ladder shape connected to each other between adjacent electrodes arranged along the X direction, and the electrodes having a ladder structure are spaced apart from each other by a predetermined interval along the Y direction.

As described above, the X and Y electrodes 360 and 370 are embedded in the dielectric wall 350 in a state where they are separated by a predetermined interval up and down. The X and Y electrodes 360 and 370 are preferably made of a metal material having excellent conductivity, such as silver paste or chromium-copper-chromium (Cr-Cu-Cr).

Here, the width of the X electrode 360 is formed wider than the width of the Y electrode 370.

The X electrode 360 has a quadrangular structure along the circumference of each discharge space, the first X electrode portion 361 or the address electrode 330 disposed to face in parallel with the address electrode 330. The width of the second X electrode part 362, which is disposed to face in a direction orthogonal to the first X electrode part 361 and is integrally connected to the first X electrode part 361 and forms a square structure, is relatively larger than that of the Y electrode 370. Widely formed

In addition, since the width of the first X electrode part 361 or the second X electrode part 362 is increased in the thickness direction of the dielectric wall 350, the Y electrode 370 and the dielectric wall 350 are separated. The thickness of the dielectric wall 350 may be different from each other, and the thickness of the dielectric wall 350 is controlled to be substantially the same.

FIG. 5 illustrates a unit discharge cell cut along a line I-I in a state in which the panel 300 of FIG. 3 is coupled.

Referring to the drawings, a dielectric wall 350 defining a discharge space is disposed between the front and rear substrates 310 and 320. An X electrode 360 and a Y electrode are disposed inside the dielectric wall 350. The electrodes 370 are arranged to be separated up and down. The passivation layer 390 is formed on the inner surface of the dielectric wall 350.

A partition wall 410 having a shape corresponding to the dielectric wall 350 is disposed between the dielectric wall 350 and the rear substrate 320, and red and green are discharged on the inner surface of the partition wall 410 for each discharge cell. A blue phosphor layer 420 is formed.

The red, green, and blue phosphor layers 420 are formed of respective phosphors, and the red phosphor layer is composed of (Y, Gd) BO ₃ ; Eu ⁺³ , and the green phosphor layer is Zn ₂ SiO _4. It is preferable that it is made of: Mn ²⁺ and the blue phosphor layer is made of BaMgAl ₁₀ O ₁₇ : Eu ²⁺ .

In this case, the dielectric wall 350 is formed stepped to have different cross-sectional areas in order to increase the secondary electron emission amount by increasing the coating area of the protective layer 390.

That is, the dielectric wall 350 has a first dielectric wall 353 formed with a predetermined width from the inner surface of the front substrate 310. An X electrode 360 is embedded in the first dielectric wall 353.

A second dielectric wall 354 is formed with a narrower width than the surface of the first dielectric wall 353. Since the second dielectric wall 354 has a narrower width than the first dielectric wall 353, the cross-sectional area of the second dielectric wall 354 is smaller than that of the first dielectric wall 353. A Y electrode 370 is embedded in the second dielectric wall 354.

The first and second dielectric walls 353 and 354 are patterned to gradually narrow the width of the dielectric wall 350 in the process of forming the dielectric wall 350 while stacking a plurality of dielectric material for the dielectric wall. It is possible to form stepped. Although the dielectric wall 350 of the two-layer structure is shown in this embodiment, at least two or more stepped dielectric walls may be formed.

Since the dielectric wall 350 having the first and second dielectric walls 353 and 354 having different cross-sectional areas increases in surface area in the stepped portion, the coating area of the protective layer 390 increases accordingly. Done.

On the other hand, as the first dielectric wall 353 has a relatively wider width than the second dielectric wall 354, the thickness of the X electrode 360 and the Y electrode 370 and the dielectric wall 350 is increased. In order to prevent the distance from each other, the width W ₁ of the X electrode 360 is formed to be relatively wider than the width W ₂ of the Y electrode 370.

As a result, the distance a ₁ (a ₂ ) in the thickness direction of the X electrode 360 and the first dielectric wall 353 is in the thickness direction of the Y electrode 370 and the second dielectric wall 354. It can be kept equal to the interval b ₁ (b ₂ ).

In addition, the left and right intervals a ₁ (a ₂ ) in the thickness direction of the X electrode 360 and the first dielectric wall 353 are the same, and the Y electrode 370 and the second dielectric wall 354 are the same. The left and right spacings b ₁ and b _{2 in} the thickness direction of are also the same.

As such, the X electrode 360 is formed to be wider than the Y electrode 370, and the distances in the thickness direction of the X and Y electrodes 360 and 370 and the dielectric wall 350 are equal to each other.

Alternatively, although not shown, the X electrode 360 is formed to be relatively wider than the Y electrode 370, so that the center portion of the X electrode 360 sags downward and the left and right ends thereof are raised. In order to prevent the formation of an edge curl portion, the X electrode 360 includes a first X electrode portion disposed inwardly of the discharge space by forming an opening in a center thereof, and a first X electrode portion disposed between the openings. It may also be separated by a second X electrode portion disposed outward of the 2 X electrode portion.

6A through 6G sequentially illustrate a method of manufacturing the plasma display panel 300 according to an exemplary embodiment of the present invention.

As shown in FIG. 6A, a front substrate 310 made of transparent glass is prepared, and a primary dielectric wall 353a is printed on a surface of the front substrate 310. Hereinafter, the dielectric wall 350 is manufactured by various manufacturing methods, such as a method of printing a dielectric paste in a predetermined pattern in advance, and a method of removing unnecessary portions by a process such as sand blasting after the entire surface of the dielectric paste is printed. It is possible.

After the primary dielectric wall 353a is dried, the X electrode 360 is formed on the surface of the primary dielectric wall 353a as shown in FIG. 6B. The X electrode 360 is patterned using a metal material having excellent conductivity such as silver paste.

Subsequently, as shown in FIG. 6C, the secondary dielectric wall 353b filling the X electrode 360 is printed. In this case, the widths of the portion of the primary dielectric wall 353a formed between the X electrode 360 and the rear substrate 310 or the portion of the secondary dielectric wall 353b filling the X electrode 360 are the same. As such, the primary and secondary dielectric walls 353a and 353b form the first dielectric wall 353.

Next, as shown in FIG. 6D, the tertiary dielectric wall 354a is printed on the surface of the secondary dielectric wall 353b. The width of the tertiary dielectric wall 354a is patterned to be relatively narrower than the width of the secondary dielectric wall 353b.

After the tertiary dielectric wall 354a is dried, the Y electrode 370 is formed on the surface of the tertiary dielectric wall 354a as shown in FIG. 6E. In this case, the width of the Y electrode 370 is formed to be relatively narrower than the width of the X electrode 360. The Y electrode 370 may be manufactured by the same material as the X electrode 360 and a manufacturing method.

After the Y electrode 370 is formed, as shown in FIG. 6F, the fourth dielectric wall 354a filling the Y electrode 370 is printed. At this time, the width of the portion of the third dielectric wall 354a formed between the secondary dielectric wall 353b and the Y electrode 370 or the portion of the fourth dielectric wall 354b filling the Y electrode 370 is mutually different. same. As such, the tertiary dielectric wall 354a and the quaternary dielectric wall 354b constitute the second dielectric wall 354.

Accordingly, the first dielectric wall 353 filling the X electrode 360 and the second dielectric wall 354 filling the Y electrode 370 are formed to be stepped with each other, and the width of the first dielectric wall 353 is increased. It is possible to form relatively wider than the width of the second dielectric wall 354.

In addition, the gap in the thickness direction of the X electrode 360 and the first dielectric wall 353 may be patterned such that the gap in the thickness direction of the Y electrode 370 and the second dielectric wall 354 is the same. .

Next, as shown in FIG. 6G, the passivation layer 390 is formed on side surfaces of the first dielectric wall 353 and the second dielectric wall 354. The passivation layer 390 is formed to have a uniform thickness, including stepped portions of the first and second dielectric walls 353 and 354 having different widths.

Through this process, a dielectric wall 350 having a stepped portion is formed, and X and Y electrodes 360 and 370 having different widths are embedded in the dielectric wall 350, and the dielectric wall ( The formation of the protective layer 390 is completed on the side surface of the 350.

The operation of the plasma display panel 300 having the above structure will be described below with reference to FIG. 5.

First, when a predetermined address voltage is applied between the address electrode 330 and the Y electrode 370 from an external power source, the discharge cell to emit light is selected. Wall charges are accumulated on the Y electrode 370 of the selected discharge cell.

Subsequently, when a voltage of “+” is applied to the X electrode 360 and a voltage higher than this is applied to the Y electrode 370, the wall is formed by the voltage difference applied between the X and Y electrodes 360 and 370. The charge will move.

The movement of the wall charges generates a plasma by colliding with the discharge gas atoms in the discharge space, and this discharge may occur from the gap between the X electrode 360 and the Y electrode 370 in which a relatively strong electric field is formed. Becomes high.

As a result, since the X electrode 360 and the Y electrode 370 are formed along the four sides of the discharge space, the possibility of discharge is greatly increased.

Subsequently, if the voltage difference between the X electrode 360 and the Y electrode 370 is still sufficiently large as time passes, the electric field formed between the two electrodes 360 and 370 is gradually concentrated so that the discharge is discharged. It spreads throughout the space.

Since the discharge in this embodiment is generated at four sides of the discharge space and diffuses to the center of the discharge space, the diffusion range is greatly increased. In addition, since the plasma generated by the discharge is formed along the side of the discharge space and diffused to the center portion, the volume thereof is greatly increased, the amount of visible light is greatly increased, and the plasma is concentrated in the center portion of the discharge space, thereby utilizing the space charge. It is possible to achieve low voltage driving, and the effect of improving luminous efficiency can be obtained.

If the voltage difference between the X and Y electrodes 360 and 370 is lower than the discharge voltage after the discharge is formed in this manner, the discharge no longer occurs, and the space charge and the wall charge are formed in the discharge space. At this time, if the polarities of the voltages applied to the X and Y electrodes 360 and 370 are changed to each other, the discharge is generated again with the help of the wall charge. If the polarities of the X and Y electrodes 360 and 370 are immediately changed, the first discharge process is repeated. The discharge is stably generated while repeating this process.

At this time, the ultraviolet rays generated by the discharge excite the fluorescent material of the phosphor layer 490 applied to each discharge space. Through this process, visible light is obtained. The generated visible light is radiated into the discharge space to realize an image.

At this time, since the dielectric wall 390 includes the first dielectric wall 353 and the second dielectric wall 354 having different cross-sectional areas, the coating area of the protective layer 390 is increased. Accordingly, the secondary electron emission amount of the passivation layer 390 is increased.

In addition, due to the stepped portion of the dielectric wall 350, the discharge distance between the X electrode 360 and the Y electrode 370 is increased, thereby increasing the utilization efficiency of wall charges.

In addition, since the X electrode 360 disposed along the circumference of the discharge space is formed relatively wider than the Y electrode 370, the distance between the X electrode 360 and the first dielectric wall 353 is Y electrode 370. ) And the second dielectric wall 354 can be maintained at the same distance. As a result, the sustain discharge voltage between the X electrode 360 and the Y electrode 370 can be made smooth, and the discharge start voltage can be brought uniformly.

As described above, the plasma display panel and the method of manufacturing the same according to the present invention can provide the following effects by forming a stepped dielectric wall and having an X electrode width wider than the width of the Y electrode.

First, as the surface area of the dielectric wall becomes wider, the coating area of the protective film layer formed on the side of the dielectric wall increases. Thereby, the secondary electron emission amount of a protective film layer can be improved significantly.

Second, according to the formation of the stepped dielectric wall, the discharge distance between the X and Y electrodes is increased to improve the utilization efficiency of the wall charges. As a result, the discharge efficiency is increased.

Third, since the gap between the X electrode and the dielectric wall is kept the same as the gap between the Y electrode and the dielectric wall, it is possible to prevent the phenomenon that the dielectric wall is destroyed due to uneven thickness.

Fourthly, stable sustain discharge between the X electrode and the Y electrode is enabled.

Fifth, the discharge surface is greatly expanded along the side of the discharge space.

Sixth, the aperture ratio is greatly improved as the discharge electrode or the dielectric layer filling it is not formed on the inner surface of the substrate facing the discharge space.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is an exploded perspective view illustrating a portion of a plasma display panel according to a conventional example;

2 is a cross-sectional view showing a unit discharge cell of FIG.

3 is an exploded perspective view of a plasma display panel partially cut out according to an embodiment of the present invention;

4 is an exploded perspective view illustrating the discharge electrode of FIG. 3 separately;

FIG. 5 is an enlarged cross-sectional view of a unit discharge cell of the plasma display panel of FIG. 3; FIG.

6A through 6G sequentially illustrate a process for manufacturing the front panel of FIG. 3.

6A is a cross-sectional view showing a state after forming a first dielectric wall on a substrate;

6B is a cross-sectional view showing a state after forming an X electrode on the first dielectric wall of FIG. 6A;

6C is a cross-sectional view illustrating a state after forming a second dielectric wall on the X electrode of FIG. 6B;

6D is a cross-sectional view illustrating a state after forming a third dielectric wall on the second dielectric wall of FIG. 6C;

6E is a cross-sectional view showing a state after forming a Y electrode on the third dielectric wall of FIG. 6D;

6F is a cross-sectional view illustrating a state after forming a fourth dielectric wall on the third dielectric wall of FIG. 6D;

6G is a cross-sectional view showing a state after coating a protective film layer on the surface of the dielectric wall of FIG. 6F;

<Brief description of symbols for the main parts of the drawings>

300 ... plasma display panel 310 ... front substrate

320 ... back substrate 330 ... address electrode

340 Dielectric Layer 350 Dielectric Wall

360 ... X electrode 370 ... Y electrode

380 holding electrode 390 protective layer

410 bulkhead 420 phosphor layer

Claims (13)

A front substrate; A rear substrate disposed to face the front substrate; A dielectric wall disposed between the front substrate and the rear substrate and defining a discharge space together with the front and rear substrates; A sustain electrode disposed separately along the circumference of the discharge space and having an X electrode and a Y electrode embedded in the dielectric wall; An address electrode disposed on the rear substrate and embedded by a dielectric layer; It includes; red, green, blue phosphor layer applied in the discharge space; And the dielectric wall has at least two or more multilayer structures having different widths. The method of claim 1, And the dielectric wall is formed such that the width of the portion embedding the X electrode is relatively wider than the width of the portion embedding the Y electrode. The method of claim 1, And the width of the X electrode is relatively wider than the width of the Y electrode. The method of claim 3, wherein And the gap in the thickness direction of the X electrode and the dielectric wall is substantially the same as the gap in the thickness direction of the Y electrode and the dielectric wall. The method of claim 1, And the X electrode is disposed adjacent to the front substrate, and the Y electrode is disposed adjacent to the rear substrate and disposed upside down from each other. The method of claim 1, The sustain electrode extends in one direction, and the address electrode extends to intersect the sustain electrode in a discharge space. The method of claim 1, And the X and Y electrodes have a ladder structure electrically connected between other X and Y electrodes arranged in adjacent discharge spaces in one direction. The method of claim 1, And a partition having a shape corresponding to the dielectric wall between the dielectric wall and the back substrate, and the phosphor layer is applied to an inner surface of the partition wall. The method of claim 1, And a passivation layer is further formed on the inner surface of the dielectric wall to increase secondary electron emission. Preparing a substrate; Forming a first dielectric wall filling the X electrode on the substrate; Forming a second dielectric wall on the first dielectric wall, the second dielectric wall having a narrower width and embedding a Y electrode; And Forming a passivation layer on side surfaces of the first and second dielectric walls. The method of claim 10, Wherein the first and second dielectric walls are formed to define a discharge space, and the X and Y electrodes are embedded in the first and second dielectric walls along the circumference of the discharge space. The method of claim 10, A width of the X electrode is formed to be wider than the width of the Y electrode. The method of claim 10, The gap in the thickness direction of the X electrode and the first dielectric wall is the same as the gap in the thickness direction of the Y electrode and the second dielectric wall.