KR20050113117A - Mold for fabricating barrier ribs and a method for fabricating two-layered barrier ribs using the same - Google Patents

Abstract

        The present invention relates to a mold for the production of a separation partition and a method for manufacturing a double-layer separation partition using the same, specifically, having an intaglio portion having a shape corresponding to an embossment of the separation partition to be manufactured and a shape corresponding to the intaglio of the separation partition to be manufactured. A mold for separating partition walls and a double layer separating partition wall using the same, wherein the protrusions protrude from the intaglio portion, and both sides have a tapered relief portion, and the relief portions and the intaglio portions are regularly arranged at predetermined intervals. The method for manufacturing a separation partition wall of the present invention enables the production of an inkjet double layer separation partition wall in a simple process and at a low cost by a single embossing process.

Description

Mold for separating barrier ribs and method for manufacturing double layer barrier ribs using the same {Mold for fabricating barrier ribs and a method for fabricating two-layered barrier ribs using the same}

The present invention relates to a mold for the production of a separation partition and a method for manufacturing a double-layer separation partition using the same, and more particularly, a plurality of tapered relief portions on both sides and an intaglio portion having a shape corresponding to the relief of the separation partition to be manufactured. And a method for producing a double-layer separation partition for inkjet by a simple process of low cost using such a mold.

As shown in FIG. 1, the conventional separation partition wall has a vertical and horizontal stripe structure for separating RGB pixels on the glass substrate 2, and the space between the separation partition walls is completely empty. Therefore, light is transmitted. In the case of a color filter for a liquid crystal display device, an organic black matrix manufactured on a glass substrate may be an example of a separation partition structure. There are various methods of manufacturing color filters for liquid crystal display devices, such as pigment dispersion method, printing method, dyeing method, electrodeposition method, inkjet printing method, among which inkjet printing method is red (R), green (G) and blue. Since the color filter of (B) can be made at the same time, the process has been attracting attention because of the advantages such as a simple process, a low manufacturing cost, and a reduction in the amount of material used.

According to the inkjet printing method, a mold for separating partition walls is formed in which a positive pattern is formed on a substrate in a positive / negative manner, and a color filter is manufactured by coloring a negative part of the separated partition walls by an inkjet method. In such an inkjet printing method, a mold having a predetermined pattern is formed in advance, and the composition for separating and partitioning barrier ribs is taken and cured rather than a mold, and then embossing or imprinting to remove the mold to form a pattern. Is carried out. That is, by applying an embossing process to the mold, it is possible to manufacture a fine pattern or separation partition. Embossing can be classified into hot embossing, which is applied by curing with heat, and UV embossing, which is cured by irradiation with UV, depending on a method of obtaining a solidified pattern. In addition, in the case of hot embossing, if the separation barrier material is a thermoplastic material, heat is applied above the glass transition temperature of such material to make the material of the separation barrier flowable. Then remove the mold. On the other hand, in the case of using a thermosetting material, the separation partition material is embossed in a low flow state, then heat is applied to cure and the mold is removed.

As a method for preventing the spread of resin of an inkjet printed color filter in the related art, Japanese Patent Laid-Open No. 2001-42313 discloses a method for making the ink adhere well to the ink receiving structure between the separating partitions (Fig. 2).

That is, as shown in FIG. 2, the separating partition walls are patterned into two layers 12 and 13 by using the photoresist method (PR method) on the glass substrate 11, which is hydrophilic toward the glass substrate 11. In order to easily receive the ink, the lower layer 12 of the separating partition wall is formed of a hydrophilic material which is ink affinity, and the upper layer 13 is formed of a hydrophobic material which is aversible to ink. However, when the separation barrier ribs are manufactured by the above-described method, there are problems in that a plurality of complicated coating processes and exposure processes are required.

In addition, there are methods for introducing or treating materials having different surface properties in order to easily receive ink in a manner similar to that described in Japanese Patent Laid-Open No. 2001-42313, for example Japanese Patent Laid-Open No. 2000-89022 Arc discloses a method of covering and exposing an ink receiving layer with a black matrix formed of a resin composition having light shielding properties. Japanese Patent Laid-Open No. 2000-28819 discloses a method of polishing and flattening an ink receiving layer, and Japanese Patent Laid-Open No. 11-194211 discloses a method of forming a second layer on a metal black matrix. 2001-110183 discloses a method for treating surfaces with plasma.

However, all of the above methods additionally require a separate photolithography process which requires a high cost by surface treatment or using expensive equipment and a large amount of fine chemicals, and thus, a mold capable of manufacturing a separation partition by a low cost simple process. And the development of a method for producing a separation partition wall using such a mold is urgently required.

Accordingly, the present inventors have made a thorough study to solve the problems of the above-described prior art, and as a result, a mold for separating partition walls comprising a plurality of tapered relief portions and a plurality of intaglio portions provided by the present invention is used. By using a conventional embossing process, the present inventors have found that a double-layer separation partition for an inkjet composed of an ink affinity layer and an ink aversive layer can be manufactured in a single embossing process, compared to the prior art, and has completed the present invention.

It is therefore an object of the present invention to provide a mold for the production of a separation partition which makes it possible to produce a double layer separation partition in a single embossing process.

Another object of the present invention is to provide a method for producing a double-layer separation barrier consisting of an ink affinity layer and an ink aversive layer in a single embossing process using a mold for the production of the separation barrier rib.

In addition, another object of the present invention is to provide an ink jet double layer separation partition manufactured by the separation partition production method.

 One aspect of the present invention for achieving the above object is a mold for manufacturing a partition partition is arranged regularly arranged with a plurality of reliefs and a plurality of indentations,

 The intaglio portion has a shape corresponding to the embossment of the separation partition to be manufactured,

 The embossed portion has a shape corresponding to the intaglio of the separating partition to be manufactured, and protrudes with respect to the engraving portion, and relates to a mold for forming the separating partition, wherein both sides are tapered.

 Another aspect of the present invention for achieving the above object is

 (i) applying an ink affinity material on the transparent substrate to form a lower ink affinity layer;

 (ii) applying an ink aversive material on the ink affinity layer to form an ink aversive layer on top;

 (ii) placing the mold for preparing the separation barrier rib of claim 1 on the ink aversive layer and allowing the mold to stand for a predetermined time;

(iii) curing the back of the transparent substrate by applying UV or heat; And

and (iv) removing the mold.

Another aspect of the present invention relates to a separating partition manufactured by the above method.

Hereinafter, with reference to the accompanying drawings will be described in more detail with respect to the present invention.

The present invention relates to a mold used for the production of a separation barrier such as an organic black matrix of an inkjet liquid crystal display. The mold of the present invention has a relief portion protruding from an intaglio portion, and both sides of the relief portion are tapered, According to the mold of the present invention, by pressing the bilayer constituting the separation barrier at a time, it is possible to manufacture the separation barrier in the form of a double layer in a simple and inexpensive manner by a single embossing process.

Figure 3a is a three-dimensional structural diagram of a mold for producing a partition partition of the present invention. Referring to FIG. 3A, the mold 30 for manufacturing the partition partition of the present invention has a predetermined pattern 31 in which a plurality of relief portions 31a and a plurality of intaglio portions 31b are regularly arranged at regular intervals. As shown in FIG. 3B, the relief portion 31a has a shape corresponding to the intaglio of the separation partition to be manufactured, protrudes from the intaglio portion 31b, and both sides thereof are tapered. 3C and 3D are three-dimensional structural diagrams of a mold for preparing a separating partition wall manufactured by one embodiment of the present invention using a confocal laser scanning microscope. As shown in Figures 3c and 3d, the tip of the embossed portion 31a of the mold of the present invention may be pointed (Fig. 3c) or rounded (Fig. 3d) where both sides meet to form an angle. Can be. In the present invention, the mold may be made of any material, such as a metal, a semiconductor, an insulator.

Another aspect of the present invention is characterized by applying the above-described mold for producing a partition partition and an embossing method for the production of an ink jet double layer partition partition consisting of an ink affinity layer and an ink aversion layer. Hereinafter, a method of manufacturing a separation barrier of a double layer structure will be described as an example, but the method of the present invention can be applied to a separation barrier of a multilayer structure of two or more layers.

4 is a view for explaining a process for producing a separation partition in a single embossing process using the mold 21 for manufacturing a partition partition of the present invention. Referring to FIG. 4, in order to manufacture the separation barrier rib of the inkjet double layer structure using the separation barrier rib mold 21 of the present invention, an ink affinity material is coated on the transparent substrate 24 to form a lower ink affinity layer ( "Bottom layer": 23 is formed, and then an ink aversive material is applied on the ink affinity layer 23 to form an ink aversive layer ("top layer", 22) at the top.

The material of the transparent substrate used in the production of the separation partition wall of the present invention is not particularly limited, and an inorganic substrate or an organic substrate may be appropriately selected and used according to the use purpose of the partition wall.

The method for forming the ink aversive layer 22 or the ink affinity layer 23 is also not particularly limited, and an appropriate method (for example, spin coating or dip coating) may be used as necessary.

In the case of using a hydrophilic ink, the ink affinity layer 23 is formed of a hydrophilic material, and the ink affinity layer 22 is formed of a hydrophobic material, and in the case of using an oil ink, the ink affinity layer 23 is made of a hydrophobic material. The aversive layer 23 is formed of a hydrophilic material. At this time, the ink aversive material constituting the ink aversive layer 22 has a low viscosity under the temperature at the time of molding, and the ink affinity material constituting the ink affinity layer 23 uses a high viscosity under the temperature at the time of molding.

Examples of hydrophobic materials usable in the present invention are isoprene, styrene, fluorine-containing acrylates or fluorine-containing methacrylates or monomers, oligomers, homopolymers or copolymer materials or organic-inorganic composites comprising silicones. And the like, but are not necessarily limited thereto. A specific example of the preferred hydrophobic material is ORMOCER from Microresist, which crosslinks a polymer containing silicon with an acrylic unit.

Examples of hydrophilic materials that can be used in the present invention are polyethyleneglycol, polyurethane, polyamide, polyhydroxyethyl methacrylate (poly (2-hydroxy ethyl methacrylate)) monomers, oligomers For example, the homopolymer or the copolymer may be, but is not limited to.

The ink aversive layer 22 and the ink hydrophilic layer 23 may be added with inorganic materials such as silicon or carbon nanotubes surface-modified to control hydrophilicity and hydrophobicity, but the type of such materials is not particularly limited. In addition, in the present invention, the ink aversive layer or ink affinity layer composition may include a UV initiator (eg, Irgacure 184), a thermal initiator (eg, AIBN: 2,2′-AzobisIsoButyrroNitrile), a crosslinking agent, a pigment, Dyestuffs, surfactants and the like may be added, but the kind thereof is not particularly limited. As the material for forming the ink aversive layer 22 and the ink affinity layer 23, a material that is more flexible and capable of deformation or flow than the mold 21 for separating partition wall is used.

After forming the ink affinity layer 23 and the ink aversive layer 22 on the transparent substrate 24, the ink aversive layer 22 and the embossed portion of the separation partition manufacturing mold 21 according to the present invention face each other. If necessary, heat or pressure or heat and pressure are applied together so that the mold contacts the ink aversive layer 22 and is left for a predetermined time. As shown in FIG. 4B, when the separation barrier rib mold 21 is placed on the ink aversive layer 22 and a predetermined pressure is applied to the aversive layer, the ink aversive layer 22 material becomes an ink affinity layer. Since the viscosity is lower than that of the (23) material, the stress is concentrated only on the ink aversive layer 22 so that the flow 25 occurs only in the ink aversive layer. At this time, the pressure to be applied may vary depending on the height of the desired separation partition.

As shown in FIG. 4C, even when the mold is in contact with the lower layer and the deformation occurs, the upper layer and the lower layer may not be mixed due to the difference in viscosity, and after a predetermined time, the upper and lower layers may reach the final deformation state while maintaining the order of the upper and lower layers. (D in FIG. 3).

As shown in FIG. 4D, the back of the transparent substrate is irradiated with UV 26 or heated to harden the separation barrier structure, and then the mold is removed. Finally, the structure as shown in FIG. An ink affinity ink receiving layer 28a is formed on the substrate, and the ink affinity ink affinity partition wall portion 28b is formed at the bottom of the separation partition wall structure, and the ink affinity separation partition 27 is formed at the top.

The present invention may adjust or eliminate the height of the ink affinity partition wall portion 28b by adjusting the amount of the ink affinity layer material of FIG.

5 shows the deformation (flow) form of the mold and the bilayer at the actual embossing instant. When the mold is treated with a surface treatment or coating to have hydrophilicity or hydrophobicity such as an ink affinity layer (lower layer), a high angle θ value formed between the ink affinity mold and the lower layer with a low viscosity ink aversive layer (upper layer) is formed with the mold. Because of its value, the top layer does not push down during embossing. In addition, under normal embossing conditions, the Reynords number of the top layer is roughly as follows:

Therefore, there is no turbulence flow or secondary flow so that the embossed upper portion of the embossed mold does not remain.

After leaving the mold according to the present invention for a predetermined time, the back surface of the transparent substrate is irradiated with UV or heat to cure the ink curable layer and the ink aversive layer composition. Finally, removing the mold from the substrate yields a separation partition of the present invention.

The mold of the present invention is a display of a color filter for display by the inkjet printing method, a display portion of a polymer electroluminescent display, or a flexible display display portion such as a separation partition, an electrophoretic display, and an electrowetting display used when manufacturing an organic TFT. It can be used as a subpixel of PDP or as a cell isolation partition of PDP, or a partition of a combination test plate.

Example

Hereinafter, the present invention will be described in more detail with reference to examples, but the following examples are for the purpose of explanation and are not intended to limit the present invention.

Example 1.   Example of Preparation of Double Separating Bulkhead for Inkjet Printing Color Filters with UV Embossing Lower Layer Hydrophilic and Upper Layer Hydrophobic

Solvent-free, hydrophilic, UV curable material with 70% by weight aliphatic urethane-acrylate telechelic oligomer (Ebecryl 284 from UCB) with a viscosity of 10,000 mPas; 0.7 mm thick glass substrate by further mixing 0.75% by weight of bisacylphosphine oxide (BAPO) with respect to the total monomer mixture as a photoinitiator to the monomer mixture of% hexane diol diacrylate (HDBA of UCB). It coated on the said at 500 rpm for 30 second, and the ink affinity layer (lower layer) of thickness 8micrometer was formed. 2,2,3,3-tetrafluoropropyl containing 0.1% by weight and 1.0% by weight of BAPO as a hydrophobic UV-curable material, also a solvent-free fluorinated surfactant (3M FC-430) on the ink affinity layer A methacrylate (2,2,3,3-tetrafluoropropyl methacrylate) monomer (viscosity 10 mPas) was blade coated to a thickness of 1 μm to form an ink aversive layer (upper layer). Subsequently, the mold for preparing the separating partition wall as shown in FIG. 3A of the present invention was pressed against the front layer, and pressed at a pressure of 50 kgf / cm ² , and left for 30 minutes. Subsequently, 1 kW of UV was exposed for 3 minutes from the back of the glass substrate using a UV exposure machine, and the mold was removed.

Example 2.   Fabrication of Separating Bulkheads for Ink-jet Printing OLEDs Using UV / Hot Embossing Method with Lower Hydrophobicity and Upper Hydrophilicity

Coated with a fluorine-containing surfactant (DuPont's Zonyl ^®) to the surface of the mold with a hydrophobic, and was baked at 200 ^o C. Poly 2,2,3,3-tetrafluoropropyl methacrylate (poly (2,2,3,3-tetrafluoropropyl methacrylate)) (glass transition temperature of about 66 ^o C) having a molecular weight of 100,000 was converted to methyl isobutyl ketone (MIBK). ) Was dissolved at a concentration of 5% by weight, and the lower layer was applied on the glass substrate at a rotational speed of 2000 rpm. The hydroxyethyl methacrylate (2-hydroxy ethyl methacrylate) oligomer which melt | dissolved Irgacure 184 and superposed | polymerized to the viscosity of 1,000 mPa (room temperature) by UV polymerization was apply | coated at the rotation speed of 2000 rpm. Thereafter, the mold for preparing the separating partition wall of the present invention was brought into close contact with the entire upper layer, and then embossed at a temperature of 145 ^° C. and a pressure of 50 kgf / cm ² , and then left for 30 minutes. Subsequently, 1 kW of UV was exposed for 3 minutes from the back of the glass substrate using a UV exposure machine, and the mold was removed.

Example 3 Example of Preparation of Separating Bulkheads for Inkjet Printing OLEDs in which the Lower Layer is Hydrophobic and the Upper Layer is Hydrophilic Using UV Embossing

Coated with a fluorine-containing surfactant (DuPont's Zonyl ^®) to the surface of the mold with a hydrophobic, and was baked at 200 ^o C. ORMOCER B59 of Microresist, a hydrophobic organic-inorganic hybrid UV curable resin, was applied onto a glass substrate at a rotational speed of 3000 rpm. Hydroxyethyl methacrylate (HEMA) monomer containing Irgacure 184 was applied thereon in 1 ml drops using a pipette. Thereafter, the mold for preparing the separating partition wall of the present invention was brought into close contact with the entire upper layer, and then embossed at a pressure of 50 kgf / cm ² at room temperature, and immediately exposed 1 kW of UV from the back of the glass substrate using a UV exposure machine for 3 minutes. The mold was then removed.

SEM photographs of the partition walls prepared in Example 3 are shown in FIGS. 6A and 6B. 6A and 6B, the mold of the present invention may have a tapered shape at both sides of the embossed portion and a rounded tip portion. In order to know the distribution of ORMOCER and HEMA in the cross section of the mold prepared in Example 3, Raman (Micro Laman) measurement was performed and the results are shown in FIGS. 7A to 7D. As shown in FIG. 7A, a peak appearing only in the ORMOCER was obtained by Raman image mapping, and a distribution like FIG. 7C was obtained as a result of mapping in the direction of FIG. 7B (Nanofinder 30 Tokyo Instrument) in the patterned cross section. . At this time, the experimental conditions were diode laser 785 nm, point 100, step 100, the shift speed 2, and exposure time 0.5 second. 7c shows the result of FIG. 7c as the graph of FIG. 7d. HEMA is distributed on the surface because the ORMOCER peak is almost zero at the upper layer, and only the ORMOCER is distributed at the lower layer because the ORMOCER peak is close to 100. . Thus, it was confirmed that different bilayers were produced by a single embossing process by the method of the present invention.

By using the mold for the production of the separation partition wall of the present invention, the separation partition of the double-layer structure having different physical and chemical properties without the use of complicated process procedures, expensive lithography equipment, high pressure pressing equipment, etc. is used once by a single low-cost process. It can manufacture in. According to the mold for separating partition having both sides of the present invention having a tapered relief, a precise pattern can be easily and accurately produced.

1 is a schematic diagram of a separation partition for a display,

2 is a schematic cross-sectional view of a conventional double-layer separating partition wall,

Figure 3a is a three-dimensional structural diagram of a mold for producing a partition partition of the present invention,

3B is a cross-sectional view along the line AA ′ of FIG. 3A;

Figure 3c and 3d is a three-dimensional structural diagram measured by using a confocal laser scanning microscope (Confocal Laser Scanning Microscope) for the separation barrier manufacturing mold prepared according to an embodiment of the present invention,

4 is a manufacturing process diagram of a double-layer separating partition wall using the mold for manufacturing a partition partition of the present invention;

5 is a schematic diagram showing a modified form of a mold and a double layer at the time of embossing of the double-layer separation partition manufacturing process according to the present invention;

6a and 6b is a SEM photograph of the separation partition prepared by one embodiment of the present invention,

Figure 7a is a Raman (Raman) measurement results of the separation partition prepared by one embodiment of the present invention,

7b is a schematic diagram of a separation partition used for Raman measurement,

7C is a result of mapping in the direction of FIG. 7B in the patterned cross section of FIG. 7A,

FIG. 7D graphically illustrates the results of FIG. 7C.

* Description of the symbols for the main parts of the drawings *

21: Mold for separating partition wall

21a: embossed part of the mold for the production of separation bulkhead

21b: Engraved part of the mold for producing a partition partition 22: Upper layer of the partition wall

23 separation barrier lower layer 24 transparent substrate

27: Separation partition of ink aversive 28a: Ink receiving layer

28b: ink affinity partition wall 30 mold for separating partition wall

31a: embossed part of the mold for the production of separation bulkhead

31b: Engraved part of the mold for the production of separation bulkhead

Claims (14)

      A mold for separating partition walls, in which a plurality of embossed portions and a plurality of engraved portions are regularly arranged at regular intervals,        The intaglio portion has a shape corresponding to the embossment of the separation partition to be manufactured,      The embossed portion has a shape corresponding to the intaglio of the separation partition to be manufactured, and protruding with respect to the intaglio portion, both sides of the mold for producing a partition partition, characterized in that tapered.       The separation partition according to claim 1, wherein the mold is made of a material selected from the group consisting of a metal, a semiconductor, and an insulator, and a tip of the embossed portion is formed at an angle or rounded at both sides thereof. Mold for manufacturing. (i) applying an ink affinity material on the transparent substrate to form a lower ink affinity layer; (ii) applying an ink aversive material on the ink affinity layer to form an ink aversive layer on top; (ii) placing the mold for preparing the separation barrier rib of claim 1 on the ink aversive layer and allowing the mold to stand for a predetermined time; (iii) curing the back of the transparent substrate by applying UV or heat; And (iv) removing the mold.         4. The method of claim 3, wherein the ink aversive material has a lower viscosity than the ink affinity material.         4. The method of claim 3, wherein the second step comprises applying heat, pressure or heat and pressure simultaneously after placing the mold.        The ink affinity layer according to claim 3 or 4, wherein the ink affinity layer is formed of a hydrophilic material when the hydrophilic ink is used, and the ink aversive layer is formed of a hydrophobic material, and ink affinity when the oil ink is used. The layer is formed of a hydrophobic material, and the ink aversive layer is formed of a hydrophilic material.        7. An organic-inorganic composite according to claim 6, wherein said hydrophobic material comprises isoprene, styrene, fluorine-containing acrylates or fluorine-containing methacrylates or monomers, oligomers, homopolymers or copolymer materials or silicones thereof. Method for producing a bilayer separation partition wall, characterized in that at least one copolymer selected from the group consisting of.        The method of claim 6, wherein the hydrophilic material is a polyethyleneglycol, polyurethane, polyamide, polyamide, polyhydroxyethyl methacrylate (poly (2-hydroxy ethyl methacrylate)) homopolymer or Method of producing a bilayer separation barrier, characterized in that the material selected from the group consisting of copolymers.        5. The method of claim 3 or 4, wherein the method further comprises surface treating or coating the surface of the mold with a material such as the ink affinity layer.        4. The method of claim 3, further comprising the step of cooling to cure between steps (ii) and (iii) when one or both of the ink aversive and ink affinity materials is a thermoplastic material. The manufacturing method of the double-layer separating partition wall.         Separating partition manufactured by the method of claim 3.         The separation barrier according to claim 11, wherein the separation barrier is used for manufacturing a color filter for display, a polymer electroluminescent display, or an organic thin film transistor by inkjet printing.         12. The separation partition according to claim 11, wherein the separation partition is used as a display partition of a flexible display such as an electrophoretic display or an electrowetting display or as a separation partition of a PDP.        12. The separating partition of claim 11 wherein said separating partition is used for a combination assay plate.