KR20050108044A - Camera lens module for mobile and manufacturing method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera lens module for mobile devices and a method of manufacturing the same. A circuit pattern for performing electrical connection with an image sensor and a flexible printed circuit board (FPCB) for performing photoelectric conversion at one end of a housing constituting the camera lens module. And it relates to a hair work camera lens module and a method of manufacturing the integrally formed FPCB connection terminal.

Description

Camera lens module for mobile and manufacturing method thereof

The present invention relates to a mobile camera lens module and a method of manufacturing the same.

More specifically, the present invention relates to a hair camera lens module and a method of manufacturing the same, in which a circuit pattern having a predetermined shape for electrically connecting the image sensor is formed at one end of the housing constituting the camera lens module.

Recently, models with cameras have become available commercially amid the rapid increase in the value of mobile phones as information terminals. However, mobile phone cameras have a limitation that they can be applied to mobile phones only when the size of the optical module is significantly smaller than that of a digital camera or a PC camera.

In particular, the camera module for a cellular phone is in a state in which it cannot be mounted in a cellular phone currently being used unless its thickness (the size in the optical axis direction) is suppressed to 5 mm to 7 mm or less.

In addition, since the size of the camera module will be further increased if a megapixel or more effective pixel is to be applied in the future, researches are being made to reduce the size of the camera module including a lens by incorporating new technology.

As a method of reducing the size of the camera module, adoption of a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor, reduction of the appearance of the lens, reduction of pixel spacing of the image sensor, and improvement of the packaging method have been considered. .

In general, a camera module is provided for recognizing an image in a video camera, an electronic still camera, a PC camera, a terminal, a PDA, and the like. The detailed structure thereof, as shown in FIG. It has a housing (housing) is provided.

A holder 20 is interposed in one end of the housing 10, and a lens 21 for accurately focusing an image is embedded in the holder 20.

On the other hand, on the space portion 11 of the housing 10, an aperture, that is, an iris filter (IR filter) 30 is adhesively fixed through an epoxy resin 40, and at the end, the ceramic circuit board 50 is also epoxy It is fixedly installed through the resin 40. An image sensor 51 is provided on the upper surface of the circuit board 50.

In this case, the image sensor 51 is installed on the circuit board 50 through die bonding and then wire bonding.

However, in such a conventional image pickup device package, since the wire bonding must be performed through die bonding in order to couple the image sensor 51, an area for performing the wire bonding is required.

Therefore, there is a limit to reducing the size of the entire product, causing a problem that can not be slimmed down the product.

In addition, there is a problem in that productivity is lowered by having to package each part separately.

In addition to these problems, since the coil used for wire bonding is formed of gold, it is a cause of unit price increase.

On the other hand, Japanese Patent Laid-Open No. 2001-78064 provides a camera module having an image pickup device and an optical module having a camera system and an optical device using the same as shown in FIG.

2 is a side cross-sectional view of a camera module according to the prior art, wherein the illustrated camera module 82 is composed of a substrate 90, an imaging device 91, and a lens unit 92.

The through hole 94 for light transmission is provided in the board | substrate 90. FIG. This through hole 94 is provided with the flexible wiring board 84 and the metal plate 93, and is provided in the center part of the butt | matching part.

In addition, the through hole 94 has a size substantially the same as that of the light receiving portion of the imaging element 84 described later, and is opened in a rectangle (spherical shape). On the other hand, the edge part of the wiring pattern of the flexible wiring board 84 is arrange | positioned corresponding to the electrode position of the imaging element 91 in the peripheral part of the said through-hole 94.

In addition, the metal plate 93 mechanically reinforces the mounting portion in order to mount the imaging element 91 and the lens unit 92 on the substrate 90 as described later, while the lens unit in the optical axis direction ( 82) is to ensure the alignment accuracy.

Therefore, when the thickness of the flexible wiring board 84 can be thickened and sufficient strength (stiffness) can be obtained, it is not necessary to provide the metal plate 93. Moreover, as a board | substrate material, you may comprise all or one part of the board | substrate 90 with a polyimide organic material, a glass epoxy organic material, or a ceramic material.

However, even when any substrate material is employed, it is necessary to provide a wiring pattern for electrical connection with the imaging element 91.

The imaging element 91 is, for example, a CCD imaging element, a CMOS imaging element, etc., and has a light receiving unit 95 in which a plurality of reading pixels are arranged two-dimensionally on the periphery thereof.

Moreover, the some electrode part which consists of aluminum pads is formed in the peripheral part of the imaging element 91 in the state which surrounds the said light receiving part 95, for example. The imaging device 91 is mounted (flip tip mounted) on one surface (lower surface of the flexible wiring board 84) of the substrate 90 via the bump 96 in a bare chip state. As a result, the electrode portion of the imaging element 91 and the wiring pattern of the flexible wiring board 84 are electrically connected through the bump 96.

Moreover, about this mounting state, it is arrange | positioned in the state which the light receiving part 95 of the imaging element 91 exposes from the through-hole 94 of the board | substrate 90. FIG.

Furthermore, the sealing resin 97 is apply | coated to the peripheral part of the imaging element 91 over the all directions. This sealing resin 97 raises the mechanical strength of the electrical connection part (bump junction part) of the imaging element 91 and the board | substrate 90, and serves to prevent the entry of the dust from such a clearance.

As sealing resin 97, it is preferable to use the resin material with little generation | occurrence | production of gas as a characteristic, for example, a glass epoxy resin. The reason for this is that if the gas generated from the encapsulating resin 97 adheres to the lens described later, the lens surface is clouded, which adversely affects the imaging performance.

The lens unit 92 is composed of a holder 98, a barrel 99, an optical filter 100, and a lens 101. The holder 98 forms a cylindrical structure, and the barrel 99 is fitted to the inner circumferential side thereof.

Threads are formed on the inner circumferential surface of the holder 98 and the outer circumferential surface of the barrel 99 as necessary. When the screw thread is formed and the holder 98 and the barrel 99 are screwed together, both of them can be relatively moved in the central axis direction (optical axis direction) to achieve focusing.

The tip portion of the barrel 99 is bent at right angles to the central axis side, whereby a fastening portion 19A for restricting incident light is formed in the conductor.

The optical filter 100 is a so-called infrared cutoff filter which fulfills the function which cuts an infrared part among incident light incident through the said fastening part 99A, for example.

The optical filter 100 is fixed to the tip set of the barrel 99 in close proximity to the fastening portion 19A. The lens 101 is for forming the light incident through the fastening portion 99A and the optical filter 100 into the light receiving portion 95 of the imaging element 91.

The lens 101 is attached to the inside of the barrel 99 together with the optical filter 100 in a state where the tightening part 99A is positioned as a reference.

However, there is a problem that the camera module as described above requires an additional encapsulation process to secure the reliability of the connection portion.

The present invention provides a mobile camera lens module integrating a circuit pattern and a connection terminal for performing electrical connection with an image sensor and a flexible printed circuit board (FPCB) at one end of the housing to solve the problems as described above; It is providing the manufacturing method.

Mobile camera lens module according to the present invention for achieving this object, the active region for converting the external incident light into an electrical signal is formed in the center, the bump for transmitting the electrical signal generated from the active region to the outside An image sensor in which a bonding pad to which the adhesive is attached is formed; One end is open with respect to the optical path direction, the other end is bonded to the image sensor and at the same time the circuit pattern and the FPCB connection terminal integrally formed with a circuit pattern for electrical connection with the bump attached to the bonding pad of the image sensor ; A flexible printed circuit board (FPCB) connected to an FPCB connection terminal formed at the other end of the housing and transferring an electrical signal formed from the image sensor to an external device; And a lens holder inserted into and fixed to one end of the housing and holding a lens for focusing an optical signal incident from the outside to an active region of the image sensor.

In addition, a method of manufacturing a camera lens module for a mobile device according to the present invention comprises: a first sensor for manufacturing an image sensor having an active region for performing photoelectric conversion and a bonding pad to which a bump is attached to the active region and attached to a bump; step; A second step of manufacturing a housing plate including a plurality of housings in which a circuit pattern for electrically connecting the image sensor and an FPCB connection terminal are integrally formed; Bonding each circuit pattern of each housing constituting the housing plate with the bumps attached to the bonding pads of the image sensor; A fourth step of attaching and fixing an IR filter to one end of each housing to perform a dicing process for each housing after a sealing treatment; A fifth step of connecting a flexible printed circuit board (FPCB) to an FPCB connection terminal formed at the other end of the housing separated by a dicing process; And a sixth step of inserting and mounting a lens holder holding a lens for focusing incident light on the active region of the image sensor at one end of the housing.

Hereinafter, a mobile camera lens module and a method for manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

The camera lens module according to the present invention comprises a circuit pattern and a connection terminal of a predetermined shape for performing electrical connection with an image sensor and a flexible printed circuit board (FPCB) at one end of the housing. As illustrated, the image sensor 100, the housing 200, the infrared filter 300, the flexible printed circuit board (FPCB) 400, and the lens holder 500 are configured to be included.

First, the configuration and operation of the image sensor according to the present invention will be described in detail with reference to FIG. 4.

4 is a top view illustrating an image sensor plate 1000 in which a plurality of image sensors 100 according to the present invention are arranged.

The image sensor 100 generates an electrical signal corresponding to the light amount of incident light incident from the outside. As illustrated in FIG. 4, the image sensor 100 generates an electrical signal by performing photoelectric conversion on incident light incident through the optical path of the housing. The active region 110, and the active region 110 and the wire 130 are bonded to each other, are formed in the periphery thereof, and a bump 140 for transferring an electrical signal generated from the active region 110 to the outside is attached thereto. The bonding pads 120 are integrally formed.

Here, the active region 110 is located in the center of the image sensor 100 to generate an electrical signal corresponding to the light amount of incident light incident through one end of the housing 200, which will be described later. CCD (Charge Coupled Device).

In addition, the active region 110 generates an electrical signal corresponding to the amount of incident light as described above, and then transfers the electrical signal to the bump 140 formed on the bonding pad 120 connected to the wire 130. do.

The bonding pads 120 are positioned at the periphery of the image sensor 100 and are electrically connected to each other by the active region 110 and the wire connection 130.

In addition, the bonding pad 120 includes a bump 140 for transmitting an electrical signal generated in the active region 110 to a circuit pattern 210 having a predetermined shape integrally formed at the other end of the housing 200 to be described later. ) Is attached.

Here, the bump 140 formed on the bonding pad 120 is bonded to each other by a circuit pattern 210 of a predetermined shape integrally formed at one end of the housing 200 to be described later to perform electrical connection.

Hereinafter, the configuration and operation of the housing according to the present invention will be described in detail with reference to FIG. 5.

5A is a view illustrating a bottom surface of a housing plate 2000 in which a housing according to the present invention is integrally formed by extrusion molding, and FIG. 5B is a circuit pattern 210 separated from the housing plate 200. The FPCB connection terminal 220 is a cross-sectional view of the housing 200 integrally formed.

The housing 200 has a space portion through which incident light incident from an external light source proceeds, and an infrared filter (IR filter) 300 for filtering infrared wavelengths among the incident light has a predetermined adhesive member, More specifically, it is adhesively fixed by epoxy resin.

Therefore, the housing 200 is sealed by an IR filter 300 adhesively fixed by an epoxy resin and sealed from an external environment.

In addition, one end of the housing 200 is open with respect to the optical path direction, and a lens 510 for accurately concentrating incident light on the active region 110 of the image sensor 100 is held at an upper side of the one end. A predetermined coupling member, more specifically, a screw thread or the like, is inserted to insert and mount the lens holder 500.

Therefore, the lens holder 500 to be described later is inserted and mounted to one end of the housing 200 by the screw line.

In addition, an FPCB connection terminal 220 to which a circuit pattern 210 having a predetermined shape bonded to the image sensor 100 and a flexible printed circuit board (FPCB) 400 which will be described later are connected to the other end of the housing 200. ) Is integrally formed.

Here, the circuit pattern 210 formed at the other end of the housing 200 is electrically connected to the bump 140 attached to the bonding pad 120 of the image sensor 100 to the image sensor 100. After receiving the electrical signal formed in the active region 110, the wire 230 transfers it to the FPCB connection terminal 220 to which the flexible printed circuit board (FPCB) 400, which will be described later, is connected.

Thereafter, the electrical signal is transmitted to an external device through the flexible printed circuit board (FPCB) 400 connected to the FPCB connection terminal 220.

 The flexible printed circuit board (FPCB) is connected to the FPCB connection terminal 220 formed at the other end of the housing, and receives an electrical signal formed in the active area of the image sensor through the FPCB connection terminal and then receives a predetermined external signal. It serves to deliver to the device.

In this case, the FPCB connection terminal 220 integrally formed in the housing is bonded to the circuit pattern 210 and the wire 230.

The lens holder 500 is inserted and mounted at one end of the housing 200 through a coupling member such as a screw thread formed on one end of the housing 200, and activates external incident light of the image sensor 100. One or more lenses 510 are focused that hold the area 110.

Hereinafter, a method of manufacturing a mobile camera lens module according to the present invention will be described in detail with reference to FIG. 6.

First, an image sensor plate including a plurality of image sensors 100 including an active region 110 performing photoelectric conversion in a wafer level step and a bonding pad 120 bonded to the active region 9110 and the wire 130 ( A dicing process for 1000 is performed to form individual image sensors 100 (see FIG. 6A).

That is, in the image sensor 100, an active region 110 for generating an electrical signal corresponding to incident light focused by the lens 510 held by the lens holder 500 is formed at a central portion thereof. Bonding pads 120 are bonded to the wires 130 and electrically connected to 110, and are formed on side portions of the active region 110.

Thereafter, the electrical signal formed in the active region 110 on the bonding pad 120 formed in the side region of the image sensor 100 is transferred to the circuit pattern 210 formed on the other end surface of the housing 200. By attaching bumps 140 for forming the image sensor 100 in the final wafer level stage.

After forming the final wafer-level image sensor 100 configured as described above, one end is open by extrusion molding or the like, and the other end is a circuit pattern in which the image sensor 100 is bonded A housing plate 2000 consisting of a plurality of housings 200 in which 210 and FPCB connection terminals 220 are integrally formed is formed (see FIG. 6B).

Here, for convenience of description, only one of the plurality of housings 200 in which the circuit pattern 210 and the connection terminal 220 constituting the housing plate 2000 are integrally illustrated is illustrated, and FIG. 6B illustrates such a housing ( It should be noted that 200 is to be understood as a plurality of housing plate 2000 formed.

Subsequently, the bump 140 attached to the circuit pattern 210 formed at the other end of each housing 200 constituting the housing plate 200 and the bonding pad 120 formed at the periphery of the image sensor 100. ) Are bonded to each other (see FIG. 6C).

In this case, an adhesive member such as ACF or NCP may be used to enhance the bonding force between the circuit pattern 210 of each housing 200 and the bump 140 attached to the bonding pad 120 of the image sensor 100. There is also.

As described above, after the image sensor 100 is bonded to the other end of each housing 200 constituting the housing plate 2000, an infrared ray may be formed by using an epoxy resin or the like at a predetermined position of one end of the housing 200. The filter 300 is adhered and fixed. (See Figure 6d).

Here, the infrared filter 300 performs filtering on infrared wavelengths from incident light incident through the optical path and seals the inner space of the housing 200 from the external environment.

Thereafter, the housing 200 is separated from the housing plate 2000 by performing a dicing Saw process on the housing plate 2000 including the housing 200 as described above, and then the housing 200. An FPCB printed circuit board 400 that performs electrical connection with an external device is connected to the FPCB connection terminal 220 formed at the other end of the (see FIG. 6E).

Here, the FPCB printed circuit board 400 is connected to the FPCB connection terminal 220 formed at the other end of the housing 9200 to receive an electrical signal formed in the active region 110 of the image sensor 100. After receiving it through), and delivers it to a predetermined external device.

Thereafter, one or a plurality of lenses 510 for focusing incident light on the active region 110 of the image sensor 100 through a predetermined coupling member, more specifically, a screw thread or the like, formed at one end of the housing 200. By combining the holding lens holder 500, the final mobile camera lens module is formed (see FIG. 6F).

As described above, the present invention is a housing plate composed of a plurality of housings in which a circuit pattern for performing electrical connection with an image sensor and a flexible printed circuit board and an FPCB connection terminal are integrally formed. Direct bonding of the image sensor to the dicing operation is performed, thereby increasing the productivity and reducing the cost.

In addition, since the image sensor is directly bonded to the circuit pattern of the housing, thereby eliminating the use of a PCB substrate for mounting the image sensor, it also provides the effect of reducing the height of the camera lens module.

Herein, the present invention described above has been described with reference to preferred embodiments, but those skilled in the art can variously modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that this can be changed.

1 is a view showing the structure of a camera module according to the prior art.

2 is a view showing the structure of a camera module according to another prior art.

3 is a cross-sectional view showing the structure of a camera lens module for a mobile device according to the present invention.

4 is a top view illustrating an image sensor plate configured of a plurality of image sensors according to the present invention.

5A is a bottom view of a housing plate composed of a plurality of housings in which a circuit pattern and a connection terminal are integrally formed according to the present invention;

5B is a cross-sectional view of a housing in which a circuit pattern and a connection terminal are integrally formed according to the present invention;

6a to 6f is a manufacturing process diagram of a camera lens module for a mobile according to the present invention.

Explanation of symbols on the main parts of the drawings

       100: image sensor 110: active area

       120: bonding pad 130: wire

       140: bump 200: housing

       210: circuit pattern 220: FPCB connection terminal

       300 IR filter 400 Flexible printed circuit board (FPCB)

       500: lens holder 510: lens

       1000: image sensor plate 2000: housing plate

Claims (6)

An image sensor having an active region for performing photoelectric conversion and a bonding pad to which bumps for transmitting an electrical signal of the active region to the outside are formed in the periphery of the active region; One end is open in the direction of the optical path, the other end is a housing formed integrally with the circuit pattern and FPCB connection terminal for electrical connection with the bump formed on the bonding pad; A flexible printed circuit board (FPCB) connected to the FPCB connection terminal of the housing and transferring an electrical signal formed from an image sensor to an external device; And A lens holder which is inserted and fixed to one end of the housing and holds a lens for focusing an optical signal incident from the outside to an active area of the image sensor. Camera lens module for mobile, characterized in that configured to include. The method of claim 1, The upper side of the one end of the housing for filtering the infrared wavelength, the camera lens module for mobile, characterized in that integrally formed with an infrared filter for sealing the housing. The method of claim 1, Mobile camera lens module, characterized in that further comprising an adhesive member for strengthening the coupling between the circuit pattern of the housing and the bump attached to the bonding pad of the image sensor. The method of claim 3, wherein The adhesive member is a mobile camera lens module, characterized in that the AFC or NCP. A first step of manufacturing an image sensor having an active region for performing photoelectric conversion and a bonding pad attached to the active region and wire-bonded with a bump; A second step of manufacturing a housing plate having one end open and a circuit pattern for electrically connecting the image sensor and a plurality of housings integrally formed with FPCB connection terminals; Bonding each circuit pattern of each housing constituting the housing plate with the bumps attached to the bonding pads of the image sensor; A fourth step of attaching and fixing an IR filter to one end of each housing to perform a dicing process for each housing after a sealing treatment; A fifth step of connecting a flexible printed circuit board (FPCB) to an FPCB connection terminal formed at the other end of the housing separated by a dicing process; And A sixth step of inserting and mounting a lens holder having a lens holding at one end of the housing to focus incident light on the active area of the image sensor; Mobile camera lens module manufacturing method characterized in that it comprises a. The method of claim 4, wherein in the third step: The circuit pattern of the housing and the bump of the image sensor is a manufacturing method of a camera lens module for a mobile, characterized in that coupled through an adhesive member such as AFC or NCP to enhance the bonding force.