KR20050094418A - Optical device and method for fabricating the same - Google Patents

Abstract

A waveguide device and input / output optical fiber modules are formed using a same SOI (silicon on insulator) substrate to make them enable to be aligned easily and accurately without expensive alignment device. The insulating layer of the SOI substrate can be an etch stopper to make U grooves to install optical fibers, and the core layer for the waveguide is formed after etching a part of the substrate to make the heights of all elements same.

Description

Optical device and method for manufacturing the same

The present invention relates to an optical element used in an optical communication system and a method of manufacturing the same.

In general, optical communication systems include optical parts such as optical active / passive devices such as laser diode (LD) / photodiode (PD) / filter / lens for transmitting optical signals, or components using optical waveguides for manufacturing integrated devices. Similarly, an optical element for connecting with an optical fiber is used.

Optical devices used in connection with an optical fiber should be connected exactly in the center of the optical fiber and the center of the optical device to achieve a smooth optical signal transmission.

However, the connection technology between the optical fiber and the optical element not only requires very precision but also requires an expensive alignment or connection assistance device.

These demands pose the biggest obstacle to mass production of optical components at low cost.

For example, FIG. 1 is a view illustrating a general method of connecting an optical waveguide device and an optical fiber. First, as shown in FIG. 1, an optical waveguide device and an input / output optical fiber block are fabricated, respectively.

Here, the optical fiber block usually has a groove having a V-shaped or U-shaped or other type of optical fiber, and the optical fiber is mounted on the groove.

In the optical waveguide device and the input / output optical fiber block manufactured as described above, the surfaces to be joined to each other are wrapped and polished, respectively, and then precisely connected to each other using an alignment station.

In the case of using the alignment device, first, the input optical fiber block in which one optical fiber is fixed is aligned with the input surface of the optical waveguide element.

Subsequently, the alignment device finely moves the input optical fiber block to align the core of the input optical waveguide with the core of the input optical fiber when the intensity of light output from the input optical fiber through the input optical waveguide of the optical waveguide element is maximum.

The output optical fiber block, on which one or more output optical fibers are fixed, is aligned with the optical waveguide element and the output surface.

The alignment device then finely moves the output optical fiber block to center the output optical waveguide of the optical waveguide element and the core of the output optical fiber when the intensity of light output from the input optical fiber through the one or more output optical fibers is maximum.

At this time, the input optical fiber and the input optical waveguide and the output optical waveguide and the output optical fiber are connected by using an epoxy, a laser, or an adhesive.

However, this conventional connection method does not have a reference point for matching the axis of the optical waveguide formed in the optical waveguide element with the axis of the optical fiber mounted in the optical fiber block. In order to determine the optimal connection to the shaft center depending on the size, special equipment is required, and a lot of time is required for fixing using epoxy. Accordingly, a lot of expensive equipment is required or mass production is inferior.

In addition, since the optical waveguide devices and the input / output optical fiber blocks that are currently produced are fabricated in a batch process and diced on different silicon wafers, many devices and blocks are produced at once.

However, in the assembly process of connecting the optical waveguide elements and the input / output optical fiber blocks made from different silicon substrates to each other, at least a considerable working time is required for one connection and several expensive alignment devices are required. It is a major obstacle to cost reduction and mass production of devices.

Recently, in order to solve these problems, a structure in which an optical fiber block is coupled to an optical waveguide device has been proposed. Examples of such a structure include those disclosed in Japanese Patent No. 2,982,861.

In other words, by fabricating the optical waveguide element and the optical fiber block integrally using a single substrate, it was possible to simply connect the optical waveguide and the optical fiber core in a short time without the need for expensive precision alignment equipment.

However, the optical device in which the optical fiber block is integrated requires a lot of mask processes and etching processes in its fabrication process, so that the overall manufacturing process is rather complicated.

Due to this, there is a disadvantage in that the process price increases and the market price of the device is expensive.

1 is a view showing a general method for connecting the optical waveguide device and the input / output optical fiber block according to the prior art.

2 to 10 are process perspective views showing a manufacturing process of an optical device according to an embodiment of the present invention.

11 is a cross-sectional view illustrating a connection state between an optical fiber and an optical waveguide in an optical device according to an exemplary embodiment of the present invention.

Disclosure of Invention The present invention has been made to solve these problems, and an object thereof is to provide an optical device capable of mass production and integration, and cost reduction, and a method of manufacturing the same.

Another object of the present invention is to provide a method for manufacturing an optical device having a simple manufacturing process.

In order to achieve the above object, in the present invention, an optical device such as an optical component such as an optical active / passive element such as a LD (photodiode) / PD (photodiode) / filter / lens or an optical component such as a component using an optical waveguide, The input / output optical fiber block is manufactured by using a single silicon on insulator (SOI) substrate, but by using a feature of the SOI substrate to etch a part of the upper silicon layer, it is possible to form a groove for mounting an optical fiber simply and accurately. By forming a lower clad layer after etching a portion of the upper silicon layer when forming a to reduce the cause of the error it is possible to easily and accurately connect the optical waveguide and the optical fiber without expensive alignment device.

That is, the optical device according to the present invention, a first optical fiber having a first sub-substrate made of a substrate consisting of a lower silicon layer, an intermediate insulating film, an upper silicon layer and at least one first optical fiber mounted on the first sub-substrate A second optical fiber block having a second sub substrate manufactured using the same substrate as the first optical fiber block and at least one second optical fiber mounted on the second sub substrate, the same substrate as the first and second optical fiber blocks An optical element block having a third sub-substrate fabricated using the first sub-substrate and connected to the first and second optical fiber blocks, wherein the first and second sub-substrates of the first and second optical fiber blocks are respectively a first optical fiber And a first groove and a second groove for mounting the second optical fiber, wherein the first and second grooves are formed by removing upper silicon layers of the first and second sub-substrates. Here, the first and second grooves may be formed by removing the intermediate insulating film together with the upper silicon layers of the first and second sub-substrates, and have a U-shape, and the first and second optical fibers may be formed at both edges of the cross section. It is preferable that the bottom is fixed to contact the inner surfaces of the first and second grooves each formed in a U shape.

The optical element block may be an optical waveguide block having at least one optical waveguide, wherein the first and second optical fiber blocks are disposed on both sides of the optical waveguide block so that the optical axis of the optical waveguide and the optical axis of the optical fiber coincide with each other. Each of the optical waveguide blocks includes a lower clad layer formed on the third sub substrate, wherein the sum of the thicknesses of the lower silicon layer, the intermediate insulating layer, the upper silicon layer, and the lower clad layer of the third sub substrate is the first and second. It is preferable that the sum of the thicknesses of the lower silicon layer, the intermediate insulating film, and the upper silicon layer of the sub-substrate is substantially the same. In the same thickness as the upper silicon layer may be formed in the removed portion.

On the other hand, the optical device block includes one of a passive device in the form of a three-dimensional structure including a filter, a lens, a mirror that can be fabricated by planar optical devices, LD, PD, micromachining using SiO 2 or a polymer material.

Another optical device according to the present invention, a first optical fiber block having a first sub-substrate fabricated using a substrate consisting of a lower silicon layer, an intermediate insulating film, the upper silicon layer and at least one first optical fiber mounted on the first sub-substrate, A second sub-substrate manufactured by using the same substrate as the first optical fiber block and a second optical fiber block having at least one second optical fiber mounted on the second sub-substrate, by using the same substrate as the first and second optical fiber blocks An optical waveguide block having a third sub substrate to be fabricated, a lower clad layer formed on the third sub substrate, and an optical waveguide formed on the lower clad layer, wherein the lower silicon layer, the intermediate insulating film, the upper silicon layer, and the lower part of the third sub substrate The sum of the thicknesses of the cladding layer is configured to be substantially equal to the sum of the thicknesses of the lower silicon layer, the intermediate insulating film, and the upper silicon layer of the first and second sub substrates.

Here, the lower clad layer may be formed on a portion where the upper silicon layer is removed to have a thickness substantially the same as that of the upper silicon layer removed by removing a portion of the upper silicon layer of the third sub-substrate, and the optical axis of the optical waveguide and the optical fiber The first and second optical fiber blocks are connected to both side surfaces of the optical waveguide block so that the optical axes of the optical axes of the first and second optical fiber blocks are respectively connected, and the first and second sub-substrates of the first and second optical fiber blocks respectively connect the first optical fiber and the second optical fiber. It is preferable to have a first groove and a second groove for mounting, and the first and second grooves are formed by removing the upper silicon layer or the upper silicon layer and the intermediate insulating film of the first and second sub substrates, respectively.

On the other hand, in the method of manufacturing the optical device according to the present invention, the first and second optical fiber blocks having at least one optical fiber are connected to both sides of the first element block having at least one first device used in connection with the optical fiber, respectively. A method of manufacturing an optical device, comprising: preparing a substrate having a lower silicon layer, an intermediate insulating film, and an upper silicon layer, the substrate having first, second, and third regions, wherein a predetermined region of the first and second regions of the substrate is prepared. Removing the upper silicon layer to form at least one first groove and a second groove, respectively, forming at least one first element in a third region of the substrate, and arranging optical fibers in the first and second grooves, respectively. It includes a step.

Here, the first device includes at least one of a planar optical device using SiO 2 or a polymer material, a passive device in the form of a three-dimensional structure including a filter, a lens, and a mirror, which may be manufactured by LD, PD, and micromachining, In the forming of the first and second grooves, the intermediate insulating layer of the predetermined region of the substrate may be removed together with the upper silicon layer of the predetermined region of the first and second regions of the substrate.

Another method of manufacturing an optical device according to the present invention is a method of manufacturing an optical device in which first and second optical fiber blocks each having at least one optical fiber are connected to both sides of an optical waveguide device having at least one optical waveguide. Preparing a substrate having a first layer, an intermediate insulating layer, and an upper silicon layer, the substrate having first, second, and third regions; removing a portion of the upper silicon layer in the third region of the substrate; Forming a portion of the substrate, removing a portion of the lower clad layer to expose the upper silicon layers of the first and second regions of the substrate, forming at least one optical waveguide on the lower clad layer, and forming the first and second substrates. Forming at least one first and second groove in each of the two regions, and arranging optical fibers in the first and second grooves, respectively.

Here, the first and second grooves may be formed by removing the upper silicon layer of a predetermined region among the first and second regions of the substrate, or by removing the intermediate insulating layer together with the upper silicon layer.

Another method of manufacturing an optical device according to the present invention is a method of manufacturing an optical device in which first and second optical fiber blocks each having at least one optical fiber are connected to both sides of an optical waveguide device having at least one optical waveguide. Preparing a substrate having a silicon layer, an intermediate insulating film, and an upper silicon layer, the substrate having first, second, and third regions; removing a portion of the upper silicon layer in the third region of the substrate; Forming a layer, removing a portion of the lower clad layer so that the upper silicon layers of the first and second regions of the substrate are exposed, forming a core layer on the front surface of the substrate, patterning the core layer at least in the third region Forming a pattern for forming first and second grooves in one optical waveguide and the first and second regions, respectively, and an upper silicon layer in the first and second regions using the first and second groove forming patterns Etch And forming a open the first and second grooves.

Here, after forming the first and second grooves, forming an upper clad layer on the entire surface of the substrate and removing the upper clad layer and the first and second groove forming patterns of the first and second regions. It may further include a, wherein the intermediate insulating film of the first and second regions may be removed together.

Meanwhile, after removing the upper clad layer and the first and second groove forming patterns, the interface between the first and second grooves and the optical waveguide is etched to a predetermined depth to form third and fourth grooves, respectively. Next, after arranging optical fibers in the first and second grooves, connecting the optical fibers to the optical waveguide, or removing the upper clad layer and the first and second groove forming patterns, the first, second, Dicing the substrate so that the second and third regions are separated from each other to form a first sub substrate having a first region, a second sub substrate having a second region, and a third sub substrate having a third region. And arranging optical fibers in the first and second grooves, respectively, and then lapping and polishing, and lapping and polishing, both sides of the third sub substrate and one side of the first and second sub substrates, respectively. First sides on both sides of the third sub-substrate such that the sides face each other; The second sub substrates may be aligned and connected respectively.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to an embodiment of the present invention, a passive optical device in the form of a three-dimensional structure including a filter, a lens, and a mirror, which may be manufactured by a planar optical device using a SiO 2 or a polymer material, a laser diode (LD), a photodiode (PD), and micro machining. By fabricating optical devices and input / output optical fiber blocks that connect with optical fibers such as devices using a single silicon on insulator (SOI) substrate, grooves for mounting optical fibers cannot be formed simply and accurately, and optical waveguides can be made without an alignment device. And optical fiber can be connected easily and accurately. In the following embodiment, an optical waveguide element is described as an example of an optical element connected to an optical fiber.

First, the structure of an optical device according to an embodiment of the present invention will be described. An optical waveguide device according to an embodiment of the present invention is shown in FIGS. 10 and 11, respectively, FIG. 10 is a perspective view, and FIG. 11 is a cross-sectional view illustrating a connection state between an optical fiber and an optical waveguide device. In FIG. 11, the part to the left of the dashed-dotted line shows the cross section cut in the axial direction of the optical fiber, and the part to the right shows the cross section of the part where the optical fiber and the optical waveguide are connected.

As shown in Fig. 10, the optical device of the present invention is divided into three regions: first, second, and third. The first and second regions are formed of optical fiber blocks on which optical fibers 510, 520, and 530 are mounted, and the third region is an optical waveguide block in which an optical waveguide 310 (see FIG. 11) is formed.

Each region is made of the same SOI substrate 100, and the SOI substrate 100 includes a lower silicon layer 110, an intermediate insulating layer 120, and an upper silicon layer 130.

In the optical fiber block to which the optical fibers 510, 520, and 530 are mounted, grooves for mounting the optical fibers 510, 520 and 530 are formed. The groove for mounting the optical fiber is formed in a U-shape, and is formed in a shape in which the intermediate insulating film 120 and the upper silicon layer 130 of the SOI substrate 100 are removed.

Meanwhile, referring to FIG. 11, the lower cladding layer 200 and the upper cladding layer 400 are formed in the optical waveguide block in which the optical waveguide is formed. The lower and upper cladding layers 200 and 400 surround the optical waveguide 310 and allow the light to be totally reflected at the interface between the optical waveguide 310 and the lower and upper cladding layers 200 and 400 so that the optical waveguide 310 is totally reflected. It plays a role to ensure good light transmission through. Therefore, the lower and upper cladding layers 200 and 400 are formed using a material having a lower refractive index than the optical waveguide 310.

11, the height of the upper portion of the substrate 100 in the optical fiber block, that is, the upper silicon layer 130 and the height of the lower clad layer 200 in the optical waveguide block are substantially the same. . That is, the optical waveguide 310 is formed at the same height as the substrate height of the optical fiber block on which the optical fibers 510, 520, and 530 are mounted. The optical fibers 510, 520, and 530 are aligned such that the optical waveguide 310 and the optical axis thereof coincide with each other.

Now, a manufacturing process of an optical device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 2 to 10.

According to an embodiment of the present invention, an SOI substrate is used as a substrate on which an optical device is manufactured. First, a silicon layer is etched to a predetermined thickness, and then a lower clad layer is formed, and an SOI is formed when forming a groove for mounting an optical fiber. An intermediate oxide film of the substrate is used as an etch stop film.

First, as shown in FIG. 2, an SOI substrate 100 having a third region in which an optical waveguide is to be formed and a first region and a second region in which an optical fiber is arranged is prepared. The SOI substrate 100 includes an intermediate insulating layer 120 and an upper silicon layer 130 made of an oxide film such as a lower silicon layer 110 and SiO 2.

Next, as shown in FIG. 3, after patterning using a photolithography process, the upper silicon layer 110 in the third region of the substrate 100 is wet or dry etched to a predetermined depth. The etching depth of the upper silicon layer 110 is determined in consideration of the thickness of the lower cladding layer to be formed in the etched portion, which is usually about several tens of micrometers.

After forming the oxide film (SiO 2) to form the lower clad layer on the entire surface of the upper portion of the substrate 100 as shown in FIG. 3, chemical mechanical polishing (see FIG. 3) to reveal the upper silicon layer 130 of the first and second regions. A chemical mechanical polishing (CMP) process is performed. Then, as shown in FIG. 4, the lower clad layer 200 having the same height as the silicon layer 130 of the first and second regions is formed in the third region of the substrate 100. Here, the lower clad layer 200 is formed to have a lower refractive index than the core layer to be formed later, as described above, so that the light is totally reflected at the interface surface so that the light is guided well through the optical waveguide.

Next, a core layer for forming a core pattern is formed on the entire surface of the upper portion of the substrate 100 as shown in FIG. Like the lower clad layer 200, the core layer may be formed of an oxide film such as SiO 2, and may have a thickness of several to several tens of micrometers.

After forming the core layer, a metal layer (not shown) for patterning the core layer is formed, and the metal layer is patterned using a photolithography process. The core layer is patterned using the patterned metal layer as a mask. The pattern formed at this time is, as shown in FIG. 5, the pattern for forming the first and second grooves for mounting the optical fiber to be formed in the first and second regions of the substrate 100 in addition to the core pattern 310 ( 320, 330). 5 shows a state after removing the metal layer after patterning the core layer using the metal layer as a mask. The core pattern 310 formed in the third region of the substrate 100 becomes an optical waveguide for transferring light incident from the input optical fiber to the output optical fiber. In the drawings, the case of the simplest two-channel optical waveguide is shown as an example, but the optical waveguide may be formed in various patterns, and in particular, when the number of channels increases and the channel spacing is narrowed, the method of the present invention may be stably mounted. Very advantageous.

Now, using the optical fiber mounting groove forming patterns 320 and 330 formed together with the core pattern 310 as a mask, dry etching the upper silicon layer 130 of the substrate 100 to dry the first and second grooves for mounting the optical fibers. Form. The dry etching is possible because the selectivity between the silicon oxide (SiO 2) and the upper silicon layer forming the core layer is excellent. That is, the selection ratio when using the current silicon dry etching equipment is silicon: silicon oxide # 150: 1. For this reason, when the upper silicon layer 130 is etched, the intermediate insulating film 120 of the SOI substrate 100 may be used as an etch stop layer, thereby enabling etching of a uniform depth. Therefore, if the SOI substrate 100 is prepared to have the upper silicon layer 130 having a thickness corresponding to the desired etching depth after first determining the desired etching depth, it is possible to easily and accurately form the first and second grooves having a uniform depth. have. 6 is a diagram illustrating a state after etching the upper silicon layer 130. As the upper silicon layer 130 is dry etched, it can be seen that a U-shaped groove is formed.

Next, the silicon oxide film 400 used as the upper clad layer is formed on the entire surface of the substrate as shown in FIG. 6, and the upper clad layer 400 of the first and second regions of the substrate 100 is subjected to a photolithography process. ). At this time, the core layer formed on the upper silicon layer 130 of the first and second regions of the substrate 100 formed together with the core pattern 310 used as the optical waveguide is removed together. In this case, the intermediate insulating layer 120 under the portion where the first and second grooves for mounting the optical fibers in the first and second regions of the substrate 100 may be removed together. Therefore, as described above, when determining the thickness of the upper silicon layer 130 of the substrate 100 by determining the depth of the groove, the upper silicon in consideration of the removal of the intermediate insulating film 120 proceeded in the step shown in FIG. It is desirable to determine the thickness of layer 130.

Next, as shown in FIG. 9, the connection portion between the optical waveguide 310 and the optical fiber block is half-processed by dry and wet etching, by a dicing saw, laser machining and / or a combination thereof, and by micromachining or the like. Half cutting to form the third and fourth grooves. Here, the reason for forming the third and fourth grooves is to make the center of the optical waveguide and the center of the optical fiber smoothly aligned.

10, the optical fibers 510, 520, 530 are mounted on the first and second grooves, and the optical waveguide 310 and the optical fibers 510, 520, 530 are connected by using epoxy or the like. By doing so, the optical device in which the optical fiber array block is integrated is manufactured.

FIG. 11 is a cross-sectional view illustrating an optical fiber 510 and an optical waveguide 310 aligned in an optical device as shown in FIG. 10. As shown in FIG. 11, the optical fiber 510 is mounted and connected so that the center of the optical fiber 510 coincides with the center of the optical waveguide 310. At this time, since the optical waveguide 310 is formed on the lower cladding layer 200 which is CMP to be equal to the height of the substrate 100, the cause of the height error of the optical fiber 510 may be caused by the error of the optical fiber itself and the light. Only the thickness error of the core layer 310 constituting the waveguide becomes. That is, since the error of the lower clad layer 200 is reduced, the alignment of the optical fiber 510 can be easily and accurately made. In addition, three parts of the optical fiber (both edges and bottom surface) touch the U-shaped grooves, so that the optical fiber can be fixed in the grooves very stably.

On the other hand, in the above-described embodiment, after completing the first and second grooves and the optical waveguide device region for mounting the optical fiber, the third and fourth grooves are formed in the connecting portion to mount and connect the optical fibers. Similar to the method, after dicing the substrate so that the first, second, and third regions are separated, the cross sections may be wrapped and polished and connected again.

In addition, although the embodiment of the present invention has been described using an optical waveguide device as an example, the idea of the present invention is a planar optical device using SiO 2 or a polymer material, LD, PD, a micromachining filter, as described above, The same may be applied to passive elements in the form of a three-dimensional structure including a lens and a mirror.

The present invention has been described in detail with reference to preferred embodiments, but the scope of the present invention is not limited thereto and should be interpreted by the following claims. In addition, it will be understood by those skilled in the art that various modifications or changes may be made without departing from the spirit of the present invention.

As described above, according to the present invention, since the optical waveguide and the optical fiber can be accurately connected in a simple process without an expensive alignment device, the manufacturing process time and the process cost can be drastically reduced and the error occurrence factor is minimized. It can increase the reliability.

Claims (23)

A first optical fiber block having a first sub substrate fabricated using a substrate made of a lower silicon layer, an intermediate insulating film, and an upper silicon layer, and at least one first optical fiber mounted on the first sub substrate; A second optical fiber block having a second sub substrate manufactured by using the same substrate as the first optical fiber block and at least one second optical fiber mounted on the second sub substrate; An optical element block having a third sub-substrate fabricated using the same substrate as the first and second optical fiber blocks, and used in connection with the first and second optical fiber blocks; The first and second sub-substrates of the first and second optical fiber blocks have first and second grooves for mounting the first and second optical fibers, respectively, wherein the first and second grooves are respectively And removing the upper silicon layer of the first and second sub-substrates. The optical device of claim 1, wherein the first and second grooves are formed by removing the intermediate insulating layer of the first and second sub-substrates together with the upper silicon layer of the first and second sub-substrates, respectively. The optical device of claim 1, wherein the first and second grooves have a U shape. The method of claim 3, wherein And the first and second optical fibers are fixed so that both edges and bottoms of the cross sections are in contact with inner surfaces of the first and second grooves each having a U shape. The optical device block according to claim 1, wherein the optical device block is an optical waveguide block having at least one optical waveguide, and the first and second sides of the optical waveguide block are disposed on both sides of the optical waveguide block so that the optical side of the optical waveguide and the optical axis of the optical fiber coincide with each other. Optical element to which two optical fiber blocks are connected, respectively. The optical waveguide block of claim 5, wherein the optical waveguide block includes a lower cladding layer formed on the third sub-substrate, wherein the lower silicon layer, the intermediate insulating layer, the upper silicon layer, and the lower cladding layer have a thickness. And a sum is substantially equal to a sum of thicknesses of the lower silicon layer, the intermediate insulating film, and the upper silicon layer of the first and second sub-substrates. The optical device of claim 6, wherein the lower clad layer is formed on a portion of the third sub-substrate with the upper silicon layer removed, and having a thickness substantially the same as that of the removed upper silicon layer. The optical device block of claim 1, wherein the optical device block comprises one of a planar optical device using SiO 2 or a polymer material, a passive device in the form of a three-dimensional structure including a filter, a lens, and a mirror, which may be manufactured by LD, PD, or micromachining. Optical device comprising. A first optical fiber block having a first sub substrate fabricated using a substrate made of a lower silicon layer, an intermediate insulating film, and an upper silicon layer, and at least one first optical fiber mounted on the first sub substrate; A second optical fiber block having a second sub substrate manufactured by using the same substrate as the first optical fiber block and at least one second optical fiber mounted on the second sub substrate; An optical waveguide block having a third sub substrate manufactured using the same substrate as the first and second optical fiber blocks, a lower clad layer formed on the third sub substrate, and an optical waveguide formed on the lower clad layer; The sum of the thicknesses of the lower silicon layer, the intermediate insulating film, the upper silicon layer, and the lower clad layer of the third sub substrate is equal to the thickness of the lower silicon layer, the intermediate insulating film, and the upper silicon layer of the first and second sub substrates. Optical element substantially equal to the sum. 10. The optical device of claim 9, wherein the lower clad layer is formed on a portion from which the upper silicon layer is removed and a portion of the upper silicon layer is substantially the same thickness as the removed upper silicon layer. 10. The optical device of claim 9, wherein the first and second optical fiber blocks are connected to both sides of the optical waveguide block so that the optical axis of the optical waveguide and the optical axis of the optical fiber coincide with each other. The method of claim 9, wherein the first and second sub-substrates of the first and second optical fiber blocks have first and second grooves for mounting a first optical fiber and a second optical fiber, respectively. And the second groove is formed by removing the upper silicon layer or the upper silicon layer and the intermediate insulating layer of the first and second sub substrates, respectively. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks having at least one optical fiber are respectively connected to both sides of the first element block having at least one first element used in connection with the optical fiber, Preparing a substrate including a lower silicon layer, an intermediate insulating film, and an upper silicon layer, the substrate having first, second, and third regions. Removing the upper silicon layer in a predetermined region of the first and second regions of the substrate to form at least one first groove and a second groove, respectively; Forming at least one first element in a third region of the substrate, And arranging optical fibers in the first and second grooves, respectively. The device of claim 13, wherein the first device comprises at least one of a planar optical device using SiO 2 or a polymer material, a passive device in the form of a three-dimensional structure including a filter, a lens, and a mirror, which may be manufactured by LD, PD, or micromachining. Optical device manufacturing method comprising a. The method of claim 13, wherein the forming of the first and second grooves together with the upper silicon layer of the predetermined region of the first and second regions of the substrate is performed together with the intermediate insulating layer of the predetermined region of the substrate. Optical device manufacturing method. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate including a lower silicon layer, an intermediate insulating film, and an upper silicon layer, the substrate having first, second, and third regions, Removing a portion of the upper silicon layer in the third region of the substrate, Forming a lower clad layer on the entire surface of the substrate, Removing a portion of the lower clad layer to expose the upper silicon layer of the first and second regions of the substrate, Forming at least one optical waveguide on the lower clad layer; Forming at least one first and second groove in each of the first and second regions of the substrate, And arranging optical fibers in the first and second grooves, respectively. The optical device of claim 16, wherein in the forming of the first and second grooves, the first and second grooves are formed by removing the upper silicon layer of a predetermined region from among the first and second regions of the substrate. Manufacturing method. 18. The optical device of claim 17, wherein in the forming of the first and second grooves, the intermediate insulating film of the predetermined region is removed together with the upper silicon layer of the predetermined region of the first and second regions of the substrate. Manufacturing method. In the manufacturing method of an optical element, wherein the first and second optical fiber blocks each having at least one optical fiber are connected to both sides of the optical waveguide element having at least one optical waveguide. Preparing a substrate including a lower silicon layer, an intermediate insulating film, and an upper silicon layer, the substrate having first, second, and third regions, Removing a portion of the upper silicon layer in the third region of the substrate, Forming a lower clad layer on the entire surface of the substrate, Removing a portion of the lower clad layer to expose the upper silicon layer of the first and second regions of the substrate, Forming a core layer on the entire surface of the substrate, Patterning the core layer to form a pattern for forming at least one optical waveguide in the third region and forming first and second grooves in the first and second regions, respectively, And etching the upper silicon layer in the first and second regions by using the first and second groove formation patterns to form first and second grooves. 20. The method of claim 19, wherein after forming the first and second grooves, Forming an upper clad layer on the entire surface of the substrate, And removing the upper clad layer and the first and second groove forming patterns of the first and second regions. 21. The method of claim 20, wherein the removing of the upper clad layer and the first and second groove forming patterns comprises removing the intermediate insulating films of the first and second regions together. 21. The method of claim 20, after removing the upper clad layer and the first and second groove forming patterns, Etching the interface between the first and second grooves and the optical waveguide to a predetermined depth to form third and fourth grooves, respectively; Arranging optical fibers in the first and second grooves, respectively, and connecting the optical fiber to the optical waveguide. 21. The method of claim 20, after removing the upper clad layer and the first and second groove forming patterns, Dicing the substrate so that the first, second, and third regions of the substrate are separated, respectively, a first sub substrate having the first region, a second sub substrate having the second region, and the third Forming a third sub substrate having an area, Arranging optical fibers in the first and second grooves, respectively; Lapping and polishing both sides of the third sub substrate and one side of the first and first sub substrates, respectively; And aligning and connecting the first and second sub-substrates to both sides of the third sub-substrate so that the wrapped and polished sides face each other.