KR20050080277A - Color filter array panel and manufacturing method thereof - Google Patents

Abstract

The color filter display panel according to the present invention includes a substrate, a plurality of first black matrices formed on the substrate, and a plurality of second black matrices and first black formed on the plurality of first black matrices in the same pattern as the first black matrix. And a color filter formed between the plurality of black matrices composed of the matrix and the second black matrix, wherein the first black matrix is a metal film and the second black matrix is a photoresist film. Therefore, the color filter display panel according to the present invention forms a first black matrix made of a metal film and a second black matrix made of an organic film, thereby maintaining the taper angles at both ends of the second black matrix vertically to provide sufficient optical for the second black matrix. The advantage is that the density value can be obtained.

Description

COLOR FILTER ARRAY PANEL AND MANUFACTURING METHOD THEREOF}

The present invention relates to a color filter display panel and a method of manufacturing the same.

Liquid crystal display (LCD), which has been in the spotlight as one of flat panel displays, has been widely used in small and medium-sized displays, monitors, and large-sized TVs due to recent intensive technology investment.

The liquid crystal display is one of the most widely used flat panel display devices. The liquid crystal display includes two display panels on which a field generating electrode is formed and a liquid crystal layer interposed therebetween. It is a display device which controls the transmittance | permeability of the light which passes through a liquid crystal layer by rearranging.

Among the liquid crystal display devices, a field generating electrode is provided in each of two display panels. Among them, a liquid crystal display device having a structure in which a plurality of pixel electrodes are arranged in a matrix form on one display panel and one common electrode covering the entire display panel on the other display panel is mainstream. The display of an image in this liquid crystal display device is performed by applying a separate voltage to each pixel electrode. To this end, a thin film transistor, which is a three-terminal element for switching a voltage applied to a pixel electrode, is connected to each pixel electrode, and a gate line for transmitting a signal for controlling the thin film transistor and a data line for transmitting a voltage to be applied to the pixel electrode are provided. Install on the display panel.

In addition, as a large area of a liquid crystal display panel is developed for the development of a large-scale TV using a liquid crystal display device and a manufacturing cost of the liquid crystal display device, the performance of the liquid crystal display panel and the cost reduction due to the enlargement of the size of the liquid crystal display panel Methods of manufacturing new liquid crystal display panels are constantly being developed.

Photolithography is used to form the red filter, the green filter photoresist pattern, the blue filter photoresist pattern, and the blue filter photoresist pattern for forming the red filter, the green filter, and the blue filter, which occupy the largest part of the manufacturing process of the color filter display panel of the liquid crystal display device. Doing.

The color filter is formed through the same process as the pattern forming method using a negative photoresist. The increase in the size of the glass substrate increases the amount of the color filter photoresist applied to the substrate, and the cost of materials used in other processes other than the exposure process. Problems such as the increase in size and the large area of the production line due to the enlargement of the equipment occurs.

Two methods of manufacturing a black matrix of a conventional color filter display panel are common. That is, there is a method of depositing a metal film, forming a positive photoresist thereon, and forming a metal black matrix through an etching process, and a method of depositing an organic material and forming an organic material directly into an organic black matrix.

The technical problem of the present invention is to provide a color filter display panel in which the line width of the black matrix is kept constant and a method of manufacturing the same.

The color filter display panel according to the present invention includes a substrate, a plurality of first black matrices formed on the substrate, a plurality of second black matrices formed on the plurality of first black matrices in the same pattern as the first black matrix, And a color filter formed between the plurality of black matrices comprising the first black matrix and the second black matrix, wherein the first black matrix is a metal film and the second black matrix is a photoresist film. .

In addition, it is preferable that the first black matrix is a double metal film having a lower layer as a CrOx layer and an upper layer as a Cr layer.

Moreover, it is preferable that the said CrOx layer is formed in the thickness of 300-500 GPa, and the Cr layer is 500-2,000 GPa.

In addition, the second black matrix is preferably a negative photoresist film.

In addition, the second black matrix is preferably formed to a thickness of 2 to 4㎛.

In addition, the method for manufacturing a color filter display panel according to the present invention comprises the steps of sequentially forming a CrOx layer and a Cr layer on a substrate, forming a photoresist film on the CrOx layer and the Cr layer, the photoresist using a patterned mask Exposing and developing a film to form a plurality of second black matrices, curing the second black matrix, and etching the CrOx layer and the Cr layer using the second black matrix as an etch stop layer to form a plurality of first black matrices. Forming a matrix, preferably forming a color filter between the plurality of black matrix consisting of a plurality of the first and second black matrix by an inkjet printing method.

In addition, the CrOx layer is preferably formed to a thickness of 300 to 500 kPa, Cr layer of 500 to 2,000 kPa.

In addition, the second black matrix is preferably formed of a negative photoresist film.

In addition, the second black matrix is preferably formed to a thickness of 2 to 4㎛.

In addition, the liquid crystal display includes a first substrate, a first signal line formed in a first direction on the first substrate, and a second signal formed in a second direction on the first substrate and insulated from and intersecting the first signal line. A thin film transistor connected to a signal line, the first signal line and the second signal line, a passivation layer formed on the second signal line and having a contact hole exposing a portion of the second signal line, and through the contact hole to the thin film transistor. A thin film transistor array panel including connected pixel electrodes; A color filter display panel facing the thin film transistor array panel; And a liquid crystal layer injected between the thin film transistor array panel and the color filter panel, wherein the color filter panel includes a second substrate, a plurality of first black matrices and a plurality of first black matrices formed on the second substrate. And a color filter formed between a plurality of second black matrices formed in the same pattern as the first black matrix, and a plurality of black matrices formed of the first black matrix and the second black matrix. It is preferable that the black matrix is a metal film and the second black matrix is a photoresist film.

Then, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like parts are designated by like reference numerals throughout the specification. When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the other part being "right over" but also another part in the middle. On the contrary, when a part is "just above" another part, there is no other part in the middle.

Now, a color filter display panel and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view of a color filter display panel according to an exemplary embodiment of the present invention, illustrating a state in which a color filter is formed by an inkjet printing method.

As shown in FIG. 1, the color filter display panel according to an exemplary embodiment of the present invention includes a substrate 210 and a plurality of first black matrices 221a and 222a formed on the substrate 210.

It is preferable that the first black matrices 221a and 222a be a metal film, the lower layer 221a be a CrOx layer, and the upper layer 222a be a double metal film. It is preferable that the CrOx layer 221a is formed to have a thickness of 300 to 500 GPa, and the Cr layer 222a is 500 to 2,000 GPa.

The plurality of second black matrices 223a are formed on the plurality of first black matrices 221a and 222a in the same pattern as the first black matrices 221a and 222a. The second black matrix 223a is a photoresist film, particularly preferably a negative photoresist film.

The second black matrix 223a is preferably formed to have a thickness of 2 to 4 μm. When the second black matrix 223a is manufactured to a thickness of 2 μm or less, the color filters 230R, 230G, and 230B are formed in the black matrix in which the first black matrix 221a and 222a and the second black matrix 223a are combined. There is a problem in that it cannot fully serve as a partition wall to be formed. In addition, when the second black matrix 223a is manufactured to a thickness of 4 μm or more, the second black matrix 223a may function as a partition wall, but the taper angle θ at both ends of the black matrix decreases, and thus the optical density (near the edge of the opening) Due to the non-uniformity of Optical Density (OD), residues and straightness defects are likely to occur.

When the first black matrices 221a and 222a and the second black matrices 223a are defined as black matrices, color filters 230R, 230G and 230B are formed between the plurality of black matrices.

A method of manufacturing a color filter display panel according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 to 7 are diagrams sequentially illustrating a manufacturing method of a color filter display panel according to an exemplary embodiment of the present invention.

First, as shown in FIG. 2, a CrOx layer 221 is formed on the cleaned substrate 210 in a metal sputtering process at a thickness of 300 to 500 kPa, preferably at a thickness of about 450 kPa, and thereafter, Cr layer 222 is formed to a thickness of 2,000 mm 3, preferably to about 1000 mm 3. The substrate 210 is preferably a glass substrate of about 0.7mm.

Next, as shown in FIG. 3, a negative photoresist film 223 on the CrOx layer 221 and the Cr layer 222 is 2 to 4 μm thick, preferably 2.6 μm thick. Form. When the second black matrix 223a is manufactured to a thickness of 2 μm or less, the color filters 230R, 230G, and 230B are formed in the black matrix in which the first black matrix 221a and 222a and the second black matrix 223a are combined. There is a problem in that it cannot fully serve as a partition wall to be formed. In addition, when the second black matrix 223a is manufactured to a thickness of 4 μm or more, the second black matrix 223a may function as a partition wall, but the taper angle θ at both ends of the black matrix decreases, and thus the optical density (near the edge of the opening) Due to the non-uniformity of Optical Density (OD), residues and straightness defects are likely to occur.

Next, as shown in FIG. 4, the negative photoresist film 223 is exposed to light in a wavelength range of 350 to 440 nm using the patterned mask 150, followed by 90 seconds at a temperature of about 110 ° C. FIG. Post Exposure Bake process is carried out. In this case, the portion 223a of the negative photoresist film exposed through the mask 150 remains through a developing process to be described later, and the portion 223b of the unexposed negative photoresist film is removed through a developing process.

Next, as shown in FIG. 5, the negative photoresist film 223b is developed using a 2.38% TMAH solution to form a photoresist pattern 223a having an inverse tapered shape. That is, the portion 223a of the exposed negative photoresist film becomes the photoresist pattern 223a, and the portion 223b of the unexposed negative photoresist film is removed to remain in the empty space 223c.

Next, as shown in FIG. 6, the photoresist pattern 223a is thermally cured at 220 ° C. for 180 seconds to form photoresist patterns 223a having vertical ends.

That is, the photoresist pattern 223a is thermally diffused by the thermosetting process. Accordingly, the photoresist pattern 223a having an inverse tapered shape is changed into a vertical photoresist pattern 223a, thereby forming a plurality of second black matrices 223a. ) Is completed.

Next, as shown in FIG. 7, the CrOx layer 221 and the Cr layer 222 are etched for 7 minutes using a chromium (Cr) etchant using the second black matrix 223a as an etch stop layer. A plurality of first black matrices 221a and 222a having the same pattern as the vertical second black matrix 223a is formed.

Next, as illustrated in FIG. 1, the color filters 230R, 230G, and 230B are formed by the inkjet printing method between the plurality of black matrices including the plurality of first and second black matrices 221a, 222a, and 223a. do. That is, color filters 230R, 230G, and the like are sprayed by a predetermined volume by spraying three color inks at a predetermined position between the plurality of black matrices 221a, 222a, and 223a through the plurality of nozzles 52 connected to the inkjet head 51. 230B).

In this case, the black matrices 221a, 222a, and 223a serve as partition walls that allow the color filters 230R, 230G, and 230B to be filled at predetermined positions.

When the color filter of the color filter display panel is formed by using the inkjet printing method, there is an advantage in that it is easy to reduce manufacturing costs, secure a process, and realize an eco-friendly process. That is, the inkjet printing method does not require coating, exposing and developing the photoresist film, which is an essential step in the manufacturing process of the conventional color filter display panel, that is, coating, exposing and developing the photoresist film for forming the color filter. Savings, process simplification and equipment size can be reduced.

The inkjet printing system for color filter formation includes an inkjet printing body, an inkjet printing head and a nozzle, and an organic material for an inkjet color filter. Organic control of these three components is required.

In order to form a color filter through the inkjet printing method, as shown in FIG. 1, three color inks are sprayed at a predetermined volume at predetermined positions through a plurality of nozzles 52 connected to the inkjet head 51. In this case, a black matrix must be formed to serve as a partition between the red filter 230R, the green filter 230G, and the blue filter 230B.

The black matrix for the inkjet color filter must ensure heat resistance and durability to sufficiently satisfy the light leakage prevention function, uniform transmission of light through the color filter opening, and process conditions for forming the color filter. Then, the characteristics of the black matrix upper surface should be adjusted to increase the smoothness of the upper surface of the black ink and the upper surface of the color ink filled between the black matrices. It should also be of a predetermined height so that the color ink can be filled between the plurality of black matrices.

Therefore, the thickness of the black matrix for inkjet color filters should be 2 to 3 µm in height, which is larger than the thickness of the conventional black matrix. Therefore, when the conventional black matrix is used as the black matrix for inkjet color filters, the height of 2 to 3 µm is used. The chromium black matrix is not applicable in view of cost or stress on the substrate. In addition, when the organic black matrix is formed by using a photolithography process with a thickness of 2 to 3 times higher than that of a conventional black matrix having a thickness of about 1.0 to 1.5 μm, the taper angles θ at both ends of the black matrix are decreased. Therefore, due to the non-uniform Optical Density (OD) near the edge of the opening, residues and linearity defects are generated.

Here, the optical density (OD) refers to the amount of light intensity of a certain wavelength having a constant intensity after passing through the solution, and then the light intensity becomes the constant intensity. That is, the degree to which light transmits through the solution.

FIG. 8 is a cross-sectional view of a conventional color filter display panel having an organic black matrix, and FIG. 9 illustrates optical density measured with light having a wavelength of 550 µm (A) and optical density with light having a wavelength of 350 nm to 750 nm. The graph which shows the average value (B) of the measured value according to the thickness of the organic black matrix is shown.

As shown in FIGS. 8 and 9, when the organic black matrix 220 having a thickness of 2 to 3 μm is formed, the higher the thickness of the organic black matrix 220 is, the higher the optical density value becomes, and the organic black matrix It is also difficult to raise the taper angle θ of both ends by 50 degrees or more.

As the taper angle θ of both ends of the organic black matrix 220 decreases, an area in which the desired optical density value can be uniformly secured within the organic black matrix 220 becomes narrower. That is, the center portion except for both ends of the organic black matrix 220 is narrowed. In order to prevent this problem, when the organic black matrix 220 is formed such that the effective line width (CD) of the organic black matrix 220 is wide, there is a disadvantage that the aperture ratio of the color filter is narrow.

In addition, in order to increase the taper angle θ, the structure and compounding ratio of the black pigment constituting the organic black matrix 220 and the photoinitiator may be changed, but in this case, it is difficult to secure a desired optical density value, and the linearity of the line width of the black matrix is difficult. This becomes bad. In addition, since the organic black matrix 220 is made of a material that reacts to a wavelength region used in a photolithography process, the organic black matrix 220 exhibits a light-sensitive reaction according to the structure or component ratio of the component. Difficulty controlling hydrophilicity when filling.

Patents forming such a black matrix for inkjet color filters include a case in which a molding method is applied (US6,063,527, US6,322,936, US6,426,166) and a case in which the characteristics of the partition wall are improved by a multi-layer. (US5,989,757, US6,145,981, US6,227,647, US6,331,384, US6,450,635, US6,468,702, JP2,001,298,085, JP2,002,091,889)

Such a conventional technique is to form a black matrix first and then to form a partition wall by stacking organic layers. In this case, when the organic layers are stacked, accurate positioning with the first formed black matrix is required, and the stacked organic layers are the color filter display panels. There is no specific mention as to whether the high temperature process conditions required for manufacturing can be maintained without distortion, i.e., maintained in a vertical pattern, to obtain the desired optical density value.

In order to solve this problem, the method for manufacturing a color filter display panel according to an exemplary embodiment of the present invention forms the black matrices 221a, 222a, and 223a for inkjet color filters having two layers as described above.

That is, a plurality of negative photoresist films are formed on the plurality of first black matrices 221a and 222a in which the lower layer 221a is a CrOx layer and the upper layer 222a is a Cr layer in the same pattern as the first black matrices 221a and 222a. Second black matrices 223a are formed.

The first black matrices 221a and 222a serve as total leakage prevention and contrast improvement, which are conventional black matrices, and the second black matrices 223a serve as a wall for filling color ink. It is formed so as to have a taper angle θ nearly close to vertical. That is, by forming the vertical second black matrix 223a, the uniform color filters 230R, 230G, and 230B may be formed when the color ink is filled between the plurality of vertical second black matrices 223a. .

In addition, when only the organic black matrix is formed by forming the first black matrices 221a and 222a and the second black matrices 223a, it is easy to solve a problem that it is difficult to sufficiently secure the optical density value due to the low taper angle θ. It is possible to form both ends vertically even in the second black matrix 223a having a high thickness by using light of a G line (450 nm to 460 nm) or I line (360 nm to 370 nm) wavelength region. Surface properties can be adjusted to increase wettability.

In addition, since the second black matrix 223a is formed using a high heat resistant negative photoresist, it is organic in color resist curing and ITO annealing process requiring a high temperature of 200 ° C. or higher during the color filter panel manufacturing process. The film, that is, the second black matrix 223a does not melt and flow to form a pattern to be implemented.

In addition, the process of forming the metal black matrix, that is, the CrOx layer and the Cr layer black matrix, requires a process of removing the positive photoresist after the metal etching process, but according to an embodiment of the present invention The process of manufacturing the black matrix is more than the process of forming the CrOx layer and the Cr layer black matrix because a high heat resistant negative photoresist is formed on the metal film and then used as the second black matrix without removing the negative photoresist. It also has the advantage of being small.

10 is a cross-sectional view of a liquid crystal display including a color filter display panel according to an exemplary embodiment of the present invention.

As illustrated in FIG. 10, a plurality of gate lines 121 and a plurality of storage electrode lines 131 are formed on the insulating substrate 110.

The gate line 121 and the storage electrode line 131 mainly extend in the horizontal direction and are separated from each other. The gate line 121 transmits a gate signal, and a portion of each gate line 121 protrudes up or down to form a plurality of gate electrodes 124. The storage electrode line 131 receives a predetermined voltage such as a common voltage, and includes the storage electrode 137 formed by an extension extending upward or downward.

The gate line 121 and the storage electrode line 131 include a conductive film formed of a silver-based metal such as silver (Ag) or a silver alloy having a low resistivity, or an aluminum-based metal such as aluminum (Al) or an aluminum alloy. In addition to conductive films, chromium (Cr), titanium (Ti), tantalum (Ta), molybdenum (Mo) and alloys thereof with good physical, chemical and electrical contact properties with other materials, in particular ITO or IZO [see: Molybdenum-Tungsten (MoW) alloy] may have a multilayer film structure including another conductive film. An example of the combination of the lower layer and the upper layer is chromium / aluminum-neodymium (Nd) alloy.

Sides of the gate line 121 and the storage electrode line 131 are inclined, and the inclination angle is in a range of about 30-80 ° with respect to the surface of the substrate 110.

A gate insulating layer 140 made of silicon nitride (SiNx) is formed on the gate line 121 and the storage electrode line 131.

A plurality of linear semiconductors 151 made of hydrogenated amorphous silicon (amorphous silicon is abbreviated a-Si) and the like are formed on the gate insulating layer 140. The linear semiconductor 151 extends mainly in the longitudinal direction, from which a plurality of extensions 154 extend toward the gate electrode 124.

A plurality of linear and island ohmic contacts 161 and 165 made of a material such as n + hydrogenated amorphous silicon doped with silicide or n-type impurities at a high concentration are formed on the semiconductor 151. have. The linear contact member 161 has a plurality of protrusions 163, and the protrusions 163 and the island contact members 165 are paired and positioned on the protrusions 154 of the semiconductor 151.

Side surfaces of the semiconductor 151 and the ohmic contacts 161 and 165 are also inclined, and the inclination angle is 30 to 80 degrees.

A plurality of data lines 171 and a plurality of drain electrodes 175 are formed on the ohmic contacts 161 and 165 and the gate insulating layer 140, respectively.

The data line 171 mainly extends in the vertical direction to cross the gate line 121 and transmit a data voltage. A plurality of branches extending from the data line 171 toward the drain electrode 175 forms a source electrode 173. The pair of source electrode 173 and the drain electrode 175 are separated from each other and positioned opposite to the gate electrode 123. The drain electrode 175 extends toward the extension portion 137 of the storage electrode line 131 and has an extension portion 177 overlapping the extension portion 137. The gate electrode 123, the source electrode 173, and the drain electrode 175 form a thin film transistor (TFT) together with the exposed portion 154 of the semiconductor 151, and a channel of the thin film transistor It is formed in the exposed portion 154 between the source electrode 173 and the drain electrode 175.

The data line 171 and the drain electrode 175 may also include a conductive film made of a silver metal or an aluminum metal. In addition to the conductive film, chromium (Cr), titanium (Ti), tantalum (Ta), and molybdenum (Mo) may be used. ) And other conductive films made of alloys thereof. Sides of the data line 171 and the drain electrode 175 are also inclined, and the inclination angle is in the range of about 30-80 ° with respect to the horizontal plane.

A passivation layer made of an organic insulating material, that is, an organic layer 180, is formed on the data line 171, the drain electrode 175, and the exposed semiconductor portion 154. The organic layer 180 has a contact hole 182 exposing a part 179 of the data line 171 and a contact hole 186 exposing a part of the drain electrode 175.

A plurality of pixel electrodes 190 and a plurality of contact assistants 82 made of ITO or IZO are formed on the organic layer 180. The thin film transistor array panel made of such a transparent pixel electrode is used in a transmissive liquid crystal display device.

The pixel electrode 190 is physically and electrically connected to the drain electrode 175 through the contact hole 186 to receive a data voltage from the drain electrode 175.

The pixel electrode 190 to which the data voltage is applied rearranges the liquid crystal molecules of the liquid crystal layer between the two electrodes by generating an electric field together with a common electrode (not shown) of the upper panel.

In addition, the pixel electrode 190 and the common electrode form a capacitor (hereinafter referred to as a liquid crystal capacitor) to maintain an applied voltage even after the thin film transistor is turned off. There are other capacitors connected in parallel, called storage electrodes. The storage capacitor is made of the overlap of the pixel electrode 190 and the storage electrode line 131 and the overlap of the pixel electrode 190 and the neighboring gate line 121 (which is referred to as a prior gate line). In order to increase the capacitance of the capacitor, that is, the storage capacitor, an expansion unit 137 extending the storage electrode line 131 is provided to increase the overlap area, while drain connected to the pixel electrode 190 and overlapping the expansion unit 137. An extension 177 of the electrode 175 is placed under the passivation layer 180 to close the distance between the two.

The contact auxiliary member 82 is connected to the end portion 179 of the data line 171 through the contact hole 182. The contact assisting member 82 is not essential to serve to protect adhesiveness between the end portion 179 of the data line 171 and an external device and to protect them, and application thereof is optional.

One end portion 129 of the gate line 121 is used to receive a signal transmitted from a gate driving circuit (not shown) and may have a width wider than the width of the gate line 121.

The organic layer 180 has a plurality of contact holes 181 exposing the end portion 129 of the gate line 121, and the contact hole 181 has an end portion 129 of the gate line 121. A plurality of contact assistant members 81 are in contact with each other. The contact auxiliary member 81 and the contact hole 181 may include a display panel 100 or a flexible circuit board (not shown) in the form of a chip in which a gate driving circuit (not shown) that supplies a signal to the gate line 121 is provided. Required if mounted on On the other hand, when the gate driving circuit is made of a thin film transistor or the like directly on the substrate 110, the contact hole 181 and the contact auxiliary member 81 are not required.

The first vertical alignment layer 11 is formed on the pixel electrode 190.

The color filter display panel is provided to face the thin film transistor array panel. The color filter display panel includes a substrate 210 and a plurality of first black matrices 221a and 222a formed on the substrate 210.

It is preferable that the first black matrices 221a and 222a be a metal film, the lower layer 221a be a CrOx layer, and the upper layer 222a be a double metal film. It is preferable that the CrOx layer 221a is formed to have a thickness of 300 to 500 GPa, and the Cr layer 222a is 500 to 2,000 GPa.

The plurality of second black matrices 223a are formed on the plurality of first black matrices 221a and 222a in the same pattern as the first black matrices 221a and 222a. The second black matrix 223a is a photoresist film, particularly preferably a negative photoresist film.

The second black matrix 223a is preferably formed to have a thickness of 2 to 4 μm.

When the first black matrices 221a and 222a and the second black matrices 223a are defined as black matrices, a color filter 230 is formed between the plurality of black matrices.

The common electrode 270 is formed on the black matrices 221a, 222a, and 223a and the color filter 230, and the second vertical alignment layer 21 is formed on the common electrode 270.

The liquid crystal layer 3 is injected between the thin film transistor array panel and the color filter display panel.

Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention.

The color filter display panel according to the present invention forms a first black matrix made of a metal film and a second black matrix made of an organic film, thereby maintaining the taper angles at both ends of the second black matrix vertically, thereby providing sufficient optical density values for the second black matrix. There is an advantage that can be secured.

Therefore, the line width of the black matrix can be kept constant during formation of the black matrix including the second black matrix by exposure and development.

1 is a cross-sectional view of a color filter display panel according to an embodiment of the present invention, illustrating a state in which a color filter is formed by an inkjet printing method.

2 to 7 are views sequentially showing a manufacturing method of a color filter display panel according to an embodiment of the present invention.

8 is a cross-sectional view of a color filter display panel having a conventional organic black matrix,

9 is a graph showing an average value (B) of the optical density measured with light of 550 μm wavelength (A) and the optical density measured with light of 350 nm to 750 nm wavelength according to the thickness of the organic black matrix. ,

10 is a cross-sectional view of a liquid crystal display including a color filter display panel according to an exemplary embodiment of the present invention.

Claims (10)

Board, A plurality of first black matrices formed on the substrate, A plurality of second black matrices formed on the plurality of first black matrices in the same pattern as the first black matrix, A color filter formed between the plurality of black matrices comprising the first black matrix and the second black matrix Including, The first black matrix is a metal film, and the second black matrix is a photoresist film. In claim 1, And the first black matrix is a double metal layer having a lower layer of CrOx and an upper layer of Cr. In claim 2, And a Cr layer having a thickness of 300 to 500 GPa and a Cr layer of 500 to 2,000 GPa. In claim 1, And the second black matrix is a negative photoresist film. In claim 4, The second black matrix has a thickness of 2 to 4 μm. Sequentially forming a CrOx layer and a Cr layer on the substrate, Forming a photoresist film on the CrOx layer and the Cr layer, Exposing and developing the photoresist film using a patterned mask to form a plurality of second black matrices, Curing the second black matrix, Etching the CrOx layer and the Cr layer using the second black matrix as an etch stop layer to form a plurality of first black matrices; Forming a color filter by an inkjet printing method between a plurality of black matrices comprising a plurality of the first and second black matrices Method of manufacturing a color filter display panel comprising a. In claim 6, The CrOx layer is 300 to 500 GPa, Cr layer is 500 to 2,000 두께 thickness manufacturing method of a color filter panel. In claim 6, And the second black matrix is formed of a negative photoresist film. In claim 6, The second black matrix is formed in a thickness of 2 to 4㎛ method of manufacturing a color filter display panel. First substrate, A first signal line formed on the first substrate in a first direction, A second signal line formed on the first substrate in a second direction and insulated from and intersecting the first signal line; A thin film transistor connected to the first signal line and the second signal line, A passivation layer formed on the second signal line and having a contact hole exposing a portion of the second signal line; A pixel electrode connected to the thin film transistor through the contact hole Thin film transistor array panel comprising a; A color filter display panel facing the thin film transistor array panel; A liquid crystal layer injected between the thin film transistor array panel and the color filter display panel Including, The color filter display panel is a second substrate, A plurality of first black matrices formed on the second substrate, A plurality of second black matrices formed on the plurality of first black matrices in the same pattern as the first black matrix, A color filter formed between the plurality of black matrices comprising the first black matrix and the second black matrix Including, The first black matrix is a metal film, and the second black matrix is a photoresist film.