KR20050019873A - Thermal interconnect and interface systems, methods of production and uses thereof - Google Patents

Abstract

The layered thermal component disclosed herein includes one or more thermal interface components and one or more heat spreader components coupled to the thermal interface components. A method of forming a layered thermal component disclosed herein includes a) providing one or more thermal interface components; b) providing one or more heat spreader components; And c) physically coupling the one or more thermal interface components and the one or more heat spreader components. One or more additional layers, including the substrate layer, may be bonded to the layered thermal component. The method of forming a thermal interface component disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) at least one to form a crosslinked rubber-resin mixture. Crosslinking the saturated rubber compound with at least one amine resin, d) adding one or more thermally conductive fillers to the crosslinked rubber-resin mixture, and e) adding a humectant to the crosslinked rubber-resin mixture. Steps. The method may further comprise adding one or more phase change materials to the thermal interface component. Suitable interface materials can be made that include one or more solder materials. Additionally, suitable interface materials can be made that include one or more solder materials and one or more resin parts.

Description

Thermal interconnection and interface systems, methods for their manufacture and uses {THERMAL INTERCONNECT AND INTERFACE SYSTEMS, METHODS OF PRODUCTION AND USES THEREOF}

The technical field of the present invention relates to thermal interconnection systems, thermal interface systems and interface materials in the field of electronic components, semiconductor components and other related layered components.

Electronic components are used in an increasing number of consumer and commercial electronic products. Examples of these consumer and commercial products include televisions, personal computers, Internet servers, cell phones, pagers, palm type organizers, portable radios, car stereos, or remote controls. As the demand for these consumer and commercial electronic products increases, they demand that these products become smaller, more functional, and more portable for consumers and businesses.

As a result of the reduction in the size of these products, the parts comprising the product must also be smaller. Examples of these components that need to be reduced in size include printed circuit or wiring boards, resistors, wiring, keyboards, touch pads, and chip packaging.

Therefore, the parts are analyzed and examined to determine if there is a better forming material and a way to allow these materials to be miniaturized to accommodate the demand for smaller electronic components. In layered parts, one goal is to reduce the number of layers while at the same time increasing the functionality and durability of the residual layer. However, this task is difficult because multiple layers and components of layers generally must be present to operate the device.

In addition, as electronic devices operate smaller and at higher speeds, the energy released in the form of heat increases dramatically. A useful practice in the art is to use thermal grease, or a material such as grease, alone or on a carrier in such a device to transfer excess heat delivered across the physical interface. The most common types of thermal interface materials are thermal greases, phase change materials, and elastomeric tapes. Thermal grease or phase change materials have lower thermal resistance than elastomeric tapes because of their ability to spread in thin layers and provide adjacent contact between adjacent surfaces. Typical thermal impedance values range from 0.2-1.6 ° C cm 2 / W. However, a serious disadvantage of thermal grease is that thermal performance deteriorates rapidly after thermal cycling, such as -65 ° C to 150 ° C, or after power cycling when used in VLSI chips. It is also known that the performance of these materials deteriorates when large variations in surface flatness cause gaps to form between mating surfaces in electronic devices or when large gaps between mating surfaces exist for other reasons, such as tolerances in manufacturing. When the heat transfer of these materials is disrupted, the performance of the electronic devices in which these materials are used is adversely affected.

Therefore, a) design and manufacture thermal interface materials and layered components that meet the requirements of consumer goods while minimizing the size of the device and the number of layers; b) manufacture more efficient and better designed materials and / or parts with respect to the compatibility requirements of the materials, parts or end products; c) develop a reliable method of manufacturing certain thermal interface materials and layered components, including expected thermal interfaces and layered materials; And d) there is a need to effectively reduce the number of manufacturing steps required for a package assembly resulting in lower cost ownership than other conventional layered materials, components and methods.

The layered thermal component described above includes one or more thermal interface components and one or more heat spreader components coupled to the thermal interface components. Methods of making the expected layered thermal component include; a) providing one or more thermal interface components; b) providing one or more heat spreader components; And c) physically coupling the one or more thermal interface components and the one or more heat spreader components. One or more additional layers, including the substrate layer, may be bonded to the layered thermal component.

The method of forming the thermal interface component described above may comprise a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) forming at least one crosslinked rubber-resin mixture. Crosslinking a saturated rubber compound with the at least one amine resin, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a humectant to the crosslinked rubber-resin mixture. It includes a step. The method may further comprise adding one or more phase change materials to the thermal interface component.

Suitable interface materials can be made that include one or more resin parts and one or more solder materials. Another suitable interface material can be made that includes one or more solder materials.

Various objects, features, aspects and advantages of the invention will be apparent from the detailed description of the preferred embodiments of the invention.

A series of thermal interface materials are disclosed that exhibit low thermal resistance over a wide range of interface conditions and requirements. Thermal interconnect materials and layers may also include suitable composites, metals, and metal alloys to meet the following design goals.

a) can be laminated in thin or very thin layers or patterns;

b) can conduct thermal energy better than conventional thermal adhesives;

c) has a fairly high deposition rate;

d) can be deposited on a surface or other layer without forming voids in the deposited layer; And

e) control of the movement of the underlying layer material.

The interface material is a metal and metal based base comprising PCM45 (where PCM = "phase transition material"), or a material made by Honeywell International Inc., which is a highly conductive phase transition material made by Honeywell International Inc. It may also include a material.

Suitable interface materials or components must conform to the mating surface ("wet" the surface), have low bulk thermal resistance, and have low contact resistance. Bulk thermal resistance can be expressed as a function of thickness, thermal conductivity and area of a material or part. Contact resistance is a measure of how well a material or part can contact a mating surface, layer or substrate. The thermal resistance of the interface material or component can be expressed as follows.

Θ Interface = t / kA + 2Θ _Contact Expression 1

Where Θ is the thermal resistance,

t is the material thickness,

k is the thermal conductivity of the material,

A is the area of the interface.

The term “t / kA” refers to the thermal resistance of the bulk material and “2Θ _contact ” refers to the thermal contact resistance at both surfaces. Suitable interface materials or components should have low bulk resistance and low contact resistance, ie at mating surfaces.

Many electronic and semiconductor applications require the interface material or component to accommodate the warpage of the component due to mismatches in the coefficient of thermal expansion (CTE) and / or variations in surface planarity caused during manufacturing.

Materials with low k values, such as thermal grease, perform well if the interface is thin, ie if the "t" value is low. If the interface thickness increases by 0.002 inches, thermal performance can drop dramatically. Also in this field, gaps between the mating parts cause the gap to expand and contract at each temperature or power cycle. This change in interface thickness can cause pumping of fluid interface material (such as grease) from the interface.

Interfaces with larger areas tend to deviate from the surface flatness of the fabricated state. In order to optimize thermal performance, the interface material must be able to conform to the non-planar surface thereby lowering the contact resistance.

Optimum interface materials and / or components have high thermal conductivity and high mechanical compliance and will elastically surrender for example when a force is applied. High thermal conductivity reduces the first term in Equation 1 and high mechanical compliance reduces the second term. The layered interface material and the individual parts of the layered interface material described above achieve these objects. The heat spreader component described above, when properly fabricated, touches the distance between the mating surface between the thermal interface material and the heat spreader component to allow a continuous high conductive path from one surface to the other.

The layered thermal component described above includes one or more thermal interface components that may be crosslinkable and one or more heat spreader components coupled to the one or more thermal interface components. The method of forming the expected layered thermal component includes; a) providing a thermal interface component that may be crosslinkable; b) providing a heat spreader component; And c) physically coupling the thermal interface component and the heat spreader component. One or more additional layers may be combined with the layered thermal components described above. One or more additional layers may comprise another interface material, surface, substrate, adhesive, a compliant fibrous component or any other suitable layer.

Suitable thermal interface components include materials that conform (wet) the surface to the mating surface and have low bulk thermal resistance and low contact resistance. The anticipated thermal interface component is made by combining one or more rubber compounds and one or more thermally conductive fillers. Another expected thermal interface component is made by combining one or more rubber compounds, one or more crosslinker moieties, a crosslinking compound or a crosslinking resin, and one or more thermally conductive fillers. These expected interface materials take the form of liquids or "soft gels". As used herein, "soft gel" means a colloid in which the dispersed phase is mixed with the continuous phase to form a product such as a viscous "jelly". The gel state or soft gel state of the thermal interface component is brought about through a crosslinking reaction between at least one rubber compound component and at least one crosslinker moiety, crosslinking compound or crosslinking resin. One or more crosslinker moieties, crosslinking compounds or crosslinking resins may have any suitable crosslinking function, such as amine resins or amine-based resins. More specifically, one or more crosslinker moieties, crosslinking compounds or crosslinking resins, such as amine resins, are bonded to the rubber component to crosslink the main hydroxy group to the rubber compound, forming a soft gel state. Therefore, it is expected that at least some of the rubber compounds will include one or more terminating hydroxyl groups. As used herein, “hydroxy group” means monovalent-OH that occurs in many inorganic and organic compounds that ionize in solution to produce OH radicals. In addition, "hydroxy group" is an alcohol characterization group. As used herein, the term "main hydroxy group" means that the hydroxy group is at the end position on the molecule or compound. The rubber compounds contemplated herein may include additional secondary, tertiary, or other internal hydroxyl groups that may undergo a crosslinking reaction with the amine resin. Such additional crosslinking may be desirable depending on the final gel state required for the product or part to which the gel is bound.

The rubber compound is expected to be self-crosslinking in that it can be intermolecularly crosslinked or intramolecularly crosslinked with other rubber compounds depending on different components of the composition. It is also contemplated that the rubber compound may crosslink with the amine resin compound and perform some self crosslinking activity with itself or with other rubber compounds.

In a preferred embodiment, the rubber composition or compound used may be saturated or unsaturated. Saturated rubber compounds are preferred herein because they are less susceptible to thermal oxidation degradation. Examples of saturated rubbers that may be used are ethylene-propylene rubber (EPR, EPDM), polyethylene / butylene, polyethylene-butylene-styrene, polyethylene-propylene-styrene, hydrogenated polyalkyldiene “mono-ols” (hydrogenated Polybutadiene mono-ols, hydrogenated polypropadiene mono-ols, hydrogenated polypentadiene mono-ols, and the like), hydrogenated polyalkyldiene "diols" (hydrogenated polybutadiene diols, hydrogenated polypropadiene diols, Hydrogenated polypentadiene diols and the like) and hydrogenated polyisoprene. However, if the compound is unsaturated, it is most preferred that the compound undergoes a hydrogenation process to destroy or remove at least some of the double bonds. As used herein, the term “hydrogenation process” refers to the fragmentation of an unsaturated organic compound by adding hydrogen directly to some or all of the double bonds, resulting in a saturated product (additional hydrogenation), or by breaking the entire double bond. ) Is reacted with hydrogen by reacting with hydrogen (hydrogen decomposition). Examples of unsaturated rubbers and rubber compounds include polybutadiene, polyisoprene, polystyrene-butadiene and other unsaturated rubbers, rubber compounds or mixtures / combinations of rubber compounds.

As used herein, the term "compliant" includes the properties of a material or part that is yieldable and moldable at about room temperature, as opposed to being solid and non-yielding at room temperature. As used herein, the term "crosslinkable" refers to a material or compound that is not yet crosslinked.

As used herein, the term “crosslinking” refers to a process in which two or more molecules, or two parts of a long molecule, are joined by chemical interaction. Such interactions may occur in many different ways, including formation of covalent bonds, formation of hydrogen bonds, hydrophobicity, hydrophilicity, ionic or electrostatic interactions. Moreover, the interaction of molecules is characterized by at least a temporary physical connection between the molecule and itself or between two or more molecules.

While one or more rubber compounds of each type are combined to form a thermal interface component, at one or more expected thermal interface components one or more rubber compounds or components will be saturated compounds. Olefin-containing or unsaturated thermal interface components, with suitable thermal fillers, exhibit thermal performance of about 0.5 cm 2 / W or less. Unlike thermal grease, the thermal performance of thermal interface components does not degrade after thermal cycling or flow cycling in IC devices, which is soft at thermal activation due to crosslinking of liquid olefins and liquid olefin mixtures (such as those containing amine resins). Because it forms a gel. Moreover, when applied to a thermal interface component, it does not squeeze out as thermal grease is used and does not exhibit interfacial delamination during thermal cycling.

Crosslinkers or crosslinking compounds, such as amines or amine based resins, are added to the rubber composition or mixture of rubber compounds mainly to facilitate the crosslinking reaction between the crosslinker and the main or terminating hydroxy groups in at least one rubber compound or Are integrated. Other resin materials or polymer materials may be added together with the amine resin or to replace the amine resin to facilitate the crosslinking reaction. The crosslinking reaction between the amine resin and the rubber compound forms a "soft gel" phase in the mixture instead of the liquid phase. The degree of crosslinking between the amine resin and the rubber composition and / or between the rubber compound itself will determine the consistency of the soft gel. For example, if the amine resin and the rubber compound undergo small scale crosslinking (about 10% of the crosslinking sites are actually used for the crosslinking reaction), the soft gel will be more liquid. However, if the amine resin and the rubber compound undergo a significant amount of crosslinking (about 40-60% of the crosslinking sites are actually used for the crosslinking reaction and possibly measurable intermolecular or intramolecular crosslinking between the rubber compound itself The bond is present), the gel will be thicker and more solid.

Amine and amino resins are resins that include one or more amine substituents in certain portions of the resin backbone. Amine and amino resins are synthetic resins derived from the reaction of urea, thiourea, melamine or related compounds with aldehydes, in particular formaldehyde. Common and expected amine resins are primary amine resins, secondary amine resins, tertiary amine resins, glycidyl amine epoxy resins, alkoxybenzyl amine resins, epoxy amine resins, melamine resins, alkylate melamine resins, and melamine acrylic resins. to be. The melamine resin is a) a ring structured compound, so that the ring contains 3 carbons and 3 nitrogen atoms, b) can easily bond with other compounds and molecules through a condensation reaction, c) prevents chain growth and crosslinking. Can react with other molecules and compounds to facilitate, d) are more water resistant and heat resistant than urea resins, e) can be used as water-soluble syrups or insoluble powders dispersible in water, and f) high melting points (325 ° C.). Above and considerably incombustible), which is particularly useful and preferred in the various embodiments contemplated herein. Alkylated melamine resins such as butyrate melamine resins, propylate melamine resins, pentylated melamine resins, hexylated melamine resins and the like are formed by incorporating alkyl alcohols during resin formation. These resins are soluble in paints and enamel solvents and surface coatings.

Thermal filler particles dispersed in a thermal interface component or mixture should advantageously have high thermal conductivity. Suitable filler materials include metals such as silver, gallium, copper, aluminum, and alloys thereof; Other compounds such as boron nitride, aluminum nitride, silver coated copper, silver coated aluminum, conductive polymers and carbon fibers. The thermal filler particles may include solder materials such as indium, tin, lead, antimony, tellurium, bismuth, or one or more of the aforementioned metals. Boron nitride and silver or a combination of boron nitride and silver / copper provide improved thermal conductivity. At least 20% by weight of boron nitride and at least about 60% by weight of silver are particularly useful. Preferably, fillers having a thermal conductivity of at least about 20, most preferably at least about 40 W / m ° C may be used. Optionally, it is desirable to have a filler having a thermal conductivity of at least about 80 W / m ° C.

Unless expressly indicated in this respect, all numerical representation amounts, such as component composition, reaction conditions, etc., used in the specification and claims are to be understood as being modified in all instances by the term "about." Thus, unless expressly stated to the contrary, the numerical variables set forth in the specification and claims are approximations that may vary depending upon the desired properties to be achieved by the subject matter disclosed herein. At the very least, in an attempt not to limit the application of the doctrine of equivalents of the claims, each numerical variable should be interpreted at least in terms of the number recorded and by applying conventional peripheral techniques. Notwithstanding that the numerical ranges and variables setting the ranges of the subject matter disclosed herein are approximations, the numerical values set in the specific examples are recorded as precisely as possible. However, all numerical values inherently contain certain errors which arise essentially from the standard deviation formed in each test measurement.

As used herein, the term "metal" refers to elements in the d- and f-groups of the Periodic Table of the Elements, along with elements with metallic properties such as silicon and germanium. As used herein, the term “d-group” refers to elements with electrons filling the 3d, 4d, 5d, and 6d orbitals surrounding the nucleus of an atom. As used herein, the term “f-group” refers to atoms with electrons filling the 4f and 5f orbitals surrounding the nucleus of atoms including lanthanides and actinides. Preferred metals include indium, silver, copper, aluminum, tin, bismuth, gallium and their alloys, silver coated copper, and silver coated aluminum. The term "metal" also includes alloys, metal / metal composites, metal ceramic composites, metal polymer composites, as well as other metal composites. As used herein, the term "compound" means a material having a certain composition that can be separated into elements by chemical processes.

It is a highly graphized type of carbon fiber by heat treatment or a specific type of carbon fiber, referred to as " VGCF, " such as available from Applied Sciences, Cedarville, Ohio. “Carbon microfibers” (thermal conductivity = about 1900 W / m ° C.) have particular efficacy. The addition of about 0.5% by weight carbon microfibers significantly increases thermal conductivity. Such fibers are available in varying lengths and diameters, ie from about 1 mm to several tens of cm in length and from about 0.1 or less to about 100 μm in diameter. Useful forms of VGCF have a diameter of about 1 μm or less and a length of about 50 to 100 μm and about 2 or 3 times the thermal conductivity of other conventional carbon fibers having a diameter of about 5 μm or more.

It is difficult to incorporate significant amounts of VGCF into interface components and systems, such as the hydrogenated rubber and resin combinations described above, and polymer systems. For example, when carbon microfibers of about 1 μm or less are added to a polymer, they are not mixed well, mainly because a large amount of fibers must be added to the polymer to achieve a significant improvement in thermal conductivity. However, Applicants have found that significant amounts of carbon microfibers can be added to polymer systems with significant amounts of other conventional fillers. Carbon microfibers can be added to the polymer alone and, when added with other fibers, a significant amount is added to the polymer, providing significant advantages with regard to improving the thermal conductivity of the thermal interface component. Preferably, the ratio of carbon microfibers to polymer ranges from about 0.05 to 0.50 by weight.

Once a thermal interface component is prepared that includes one or more rubber compounds, one or more crosslinkers or crosslinker compounds, and one or more thermally conductive fillers, the composition can determine whether additional phase change materials are required to alter certain physical properties of the composition. The risks must be compared with the need for electronic components, vendors, or electronic products. In particular, if the need of the part or product requires that the composition or interface material be in "soft gel" form or in any liquid form, no additional phase change material may need to be added. However, if the part, layered material or product requires that the composition or material be in solid form, one or more phase change materials must be added.

Phase transition materials contemplated herein include mixtures thereof, such as waxes, polymer waxes or paraffin waxes. Paraffin waxes are mixtures of solid hydrocarbons having the general formula C _n H _{2n + 2} and having a melting point in the range of about 20 ° C. to 100 ° C. Examples of certain expected melting points are about 45 ° C and 60 ° C. Thermal interface components having a melting point in the above range are PCM45 and PCM60HD, both of which are manufactured by Honeywell International Inc. Polymer waxes are generally polyethylene wax, polypropylene wax, and have a melting point in the range of about 40 ° C. to 160 ° C.

PCM45 has a thermal conductivity of about 3.0 W / mK, a thermal resistance of about 0.25 ° C./W (0.0038 ° C./W), and is generally applied to a thickness of about 0.0015 inch (0.04 mm) and is about 5 to 30 psi (plastic). Ductility). Typical characteristics of PCM45 are a) ultra high packing density of at least 80%, b) conductive filler, c) very low thermal resistance, and d) phase transition temperature of about 45 ° as described above. PCM60HD has a thermal conductivity of about 5.0 W / mK, a thermal resistance of about 0.17 ° C. cm / W (0.0028 ° C. cm / W), and is generally applied to a thickness of about 0.0015 inch (0.04 mm) and about 5 to 30 psi (plastic). Ductility). Typical characteristics of PCM60HD are a) ultra high packing density of at least 80%, b) conductive filler, c) very low thermal resistance, and d) a phase transition temperature of about 60 ° as described above. TM350 (a thermal interface component manufactured by Honeywell International, Inc. and containing no phase change material) has a thermal conductivity of about 3.0 W / mK and a thermal resistance of about 0.25 ° C. cm / W (0.0038 ° C. cm / W). It is generally applied to a thickness of about 0.0015 inches (0.04 mm) and includes a ductility of about 5 to 30 psi (under firing flow). Typical properties of TM350 are a) ultra high packing density of at least 80%, b) conductive fillers, c) very low thermal resistance, d) curing temperatures of 125 °, and e) dispersible non-silicone-based thermal gels.

However, paraffinic phase change materials have several disadvantages. They are very vulnerable and difficult to handle on their own. They tend to squeeze out in the gap from the device applied during thermal cycling much like grease. The above-described rubber-resin modified paraffin polymer wax system prevents these problems and provides significantly improved ease of treatment, can be made in flexible form or solid layer form, and does not pump out or discharge under pressure. Although the rubber-resin-wax mixtures have the same or nearly the same temperature, the melt viscosity is greater and these mixtures do not move easily. Moreover, the rubber-wax-resin mixture is designed to self-crosslink, ensuring the elimination of pump out problems in certain applications. Examples of anticipated phase change materials are malenized paraffin waxes, polyethylene maleic anhydride waxes, and polypropylene-maleic anhydride waxes. The rubber-resin-wax mixture will be functionally formed at a temperature in the range of about 50-150 ° C. to form a crosslinked rubber-resin network.

It is also desirable to incorporate additional fillers, materials such as filler particles or wetting agents or antioxidants into the thermal interface component. Substantially spherical filler particles may be added to the thermal interface component to maximize packing density. In addition, substantially spherical and the like provide some control of the thickness during filling. Typical particle sizes useful as fillers in rubber materials range from about 1-20 μm, about 21-40 μm, about 41-60 μm, about 61-80 μm, and about 81-100 μm and up to about 100 μm.

Dispersion of the filler particles can be facilitated by the addition of "wetting" agents or functional organometallic binders such as organosilanes, organotitanates, organozirconiums and the like. Organotitanate acts as a wetting enhancer to reduce paste viscosity and increase filler loading. Organic titanates that can be used are isopropyl triisostearyl titanate. The general structure of organotitanate is RO-Ti (OXRY), where RO is a hydrogenable group and X and Y are bonding functional groups.

Antioxidants may be added to prevent oxidation and thermal degradation of the cured rubber gel or solid thermal interface component. Generally useful antioxidants include amine form, Irganox 1076, phenol form or Irganox 565 (from about 0.01% to about 1% by weight) available from Ciba Giegy, Hawthorne, NY. Common cure accelerators include tertiary amines, such as didesilaneethylamine (at about 50 ppm-0.5 weight percent).

One or more catalysts may be added to the thermal interface component to promote crosslinking or chain reactions between one or more rubber compounds, one or more amine resins, one or more phase change materials, or all three. As used herein, the term "catalyst" refers to a substance or condition that significantly affects the rate of a chemical reaction without the catalyst itself being consumed or undergoing chemical change. The catalyst may be inorganic, organic or a combination of organic and metal halides. Although the catalyst is not a material, light and heat can act as a catalyst. In the expected example, the catalyst is an acid. In another expected embodiment, the catalyst is an organic acid such as carboxylic acid, acetic acid, benzoic acid, salicylic acid, dicarboxylic acid, oxalic acid, phthalic acid, sebacic acid, adipic acid, oleic acid, palmitic acid, amino acids and sulfonic acids.

The method of forming a thermal interface component disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one crosslinker or crosslinker compound, such as an amine resin, c) crosslinked rubber- Crosslinking at least one saturated rubber compound with at least one crosslinker or crosslinker compound to form a resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) Adding a humectant to the crosslinked rubber-resin mixture. The method may further comprise adding one or more phase change materials to the crosslinked rubber-resin mixture. As used herein, liquid and solid thermal interface components can be formed using the expected methods above with tapes, electronic components, semiconductor components, layered materials, and electronic and semiconductor products.

The anticipated thermal interface component may be provided as a dispersible liquid paste to be applied by a dispersion method (such as screen printing or stencil) and then cured as required. It may also be provided as a highly compliant cured elastomeric film or sheet for preliminary application on interface surfaces such as heat sinks. It may also be provided and prepared as a soft gel or liquid which may be applied to the surface by any suitable dispersing method. The thermal interface component can even be provided as a tape that can be applied directly to the interface surface or electronic component.

To illustrate various embodiments of thermal interface components, many examples have been prepared by mixing the components disclosed in Examples A-F. As indicated in the table above, the properties of the composition including viscosity, product form, thermal impedance, modulus of elasticity, and thermal conductivity are also recorded.

The illustrated embodiment includes one or more optional additives such as antioxidants, wetting enhancers, cure accelerators, viscosity reducers and crosslinking aids. The amount of such additives may vary, but they may be approximate (% by weight): up to about 95% filler in total (filler + rubber); About 0.1 to 1% (in total) wetting enhancer; About 0.01 to 1% (in total) antioxidant; About 50 ppm-0.5% (in total) of the curing accelerator; About 0.2 to 15% of a viscosity reducing agent; And about 0.1 to 2% crosslinking aid. It should be noted that addition of about 0.5% or more carbon fiber significantly increases thermal conductivity.

Composition (% by weight) A B C D E F Hydrogenated Polybutylene Mono-ol 7.5 6.3 10 11.33 5 18 Hydroxide Polybutadiene Diol radish radish 2 radish radish radish Paraffin wax 3.1 2.2 radish radish radish radish Alkylated Melamine Resin (Butylated) 1.7 0.4 1.33 2 One 4 Organotitanate 1.5 1.0 6.67 6.67 4 8 Sulfonic acid catalyst 0.1 radish radish radish radish radish Phenolic antioxidants 0.1 0.1 radish radish radish radish Aluminum powder 86 90 80 80 radish radish Silver powder radish radish radish radish 90 radish Boron nitride radish radish radish radish radish 70 Product form tape tape Liquid Liquid Liquid Liquid Thermal Impedance (℃ ㎠ / w) 0.25 0.18 0.25 0.25 0.3 0.35 Thermal Conductivity (wm / ℃) 3.0 5.0 2.8 2.8 2.3 2.0 Modulus of elasticity, Pa 300000 270000 500000 300000 280000 270000 Viscosity, Pa.s N / A N / A 200 160 150 220

Another suitable interface material may be prepared / prepared including one or more solder materials. The anticipated solder material is chosen to provide the desired melting point and heat transfer properties. The anticipated solder is selected to melt at temperatures in the range of about 40 ° C to about 250 ° C. In certain anticipated embodiments, the solder material comprises indium, tin, lead, silver, copper, antimony, gallium, tellurium, bismuth, or a pure metal such as bismuth, or an alloy comprising one or more of the aforementioned metals. In even more expected embodiments, pure indium has been selected as the solder material because it has a melting point of about 156 ° C. In these embodiments, indium can be readily electrodeposited from an electrolyte containing indium cyanide, indium fluorobarate, indium sulfamate and / or indium sulfate. Once indium is plated on the heat spreader, a layer of material, such as a noble metal and / or a low temperature silicide former, such as silver, platinum or palladium, may coat the indium layer to control indium oxidation when the indium is exposed to air. Platinum and palladium are good choices for such layer materials because they are cold silicide formers. Mixed silicides having lower formation temperatures, including platinum silicides, may be used in these examples. The material layer is understood as a "flash layer" on top of the bulk indium plating layer, and one or more of these "flash layers" may be bonded to the plating layer. The material layer can be bonded to the silicon when the solder material is reflowed to act as an oxide barrier and promote bonding at the silicon surface.

As mentioned above, other expected solder materials include alloys that are plated on the heat spreader. Alloy materials used in these anticipated examples may be dilute alloys and / or alloys that are silicide formers such as palladium, platinum, copper, cobalt, chromium, iron, magnesium, manganese, nickel and calcium in certain embodiments. It may be. The expected concentration of these alloys will be from about 100 ppm to about 5% of the alloy.

In other anticipated embodiments, the alloy includes elements, materials, compounds or compositions that improve the wettability of the alloy to the heat spreader. It is to be understood that improving the wettability of alloys in these applications involves reducing the amount of surface oxides. Suitable elements for improving wettability are gold, calcium, cobalt, chromium, copper, iron, manganese, magnesium, gallium, molybdenum, nickel, phosphorus, palladium, platinum, tin, tantalum, titanium, vanadium, tungsten, zinc and / or zirconium to be.

Solder or solder-based thermal materials include depositing the material as a paste or as a pure metal and depositing the material by plating, printing the solder in liquid form, or by adhering the preform of the material to the underlying substrate. Can be deposited in any suitable manner and in any number of forms.

It is understood that when the thermal interface layer is deposited, it will have a significantly higher thermal conductivity compared to conventional thermal adhesives and other thermal layers. Additional layers, such as metallized silicon dies, may be soldered directly to the thermal interconnect layer without the use of damaging materials, such as corrosive flux, which may be needed to remove oxides of materials such as nickel used to make heat spreaders.

Another suitable interface material can be prepared / prepared, including the resin mixture and one or more solder materials. The resin material may comprise any suitable resin material, but the resin material is preferably silicone-based, including one or more compounds such as vinyl silicone, vinyl Q resin, hydrogenated functional siloxane, and platinum-vinylsiloxane. Solder materials include any suitable solder material such as those described above, or metals including indium, silver, copper, aluminum, tin, bismuth, gallium and alloys thereof, silver coated copper, and silver coated aluminum, Preferably contains an indium or an indium compound.

The solder-based interface materials described above can be used for a) the interface material / polymer solder material to fill gaps of about 2 mm or less and very small gaps of about 2 mils or less, and b) the interface material / polymer solder material is the most conventional. Unlike solder material, it can efficiently transfer heat within a larger gap as well as a very small gap, and c) the interface material / polymer solder material can be easily integrated into micro parts, parts used for satellites, and small electronic parts. As can be seen, there are a number of advantages that are directly related to use and component engineering.

Resin-containing interface materials and solder materials, particularly those containing silicone resins that may have suitable thermal fillers, can exhibit thermal performance of about 0.5 cm 2 / w or less. Unlike thermal grease, the thermal performance of the material does not degrade after thermal cycling or flow cycling in the IC device because the liquid silicone resin crosslinks to form a soft gel upon thermal activation.

Polymer solders and interface materials including resins such as silicone resins will not "squeeze out" when thermal grease is used during thermal cycling and exhibits no interfacial delamination. The new material is provided in a dispersible liquid paste which is applied by the dispersion method and cured as required. It may also be provided as a crosslinkable elastomeric film or sheet for preliminary application of a cured and possibly interface surface such as a heat sink. Advantageously, fillers having a thermal conductivity of at least about 2 and preferably at least about 4 w / m ° C. will be used. Optionally, it is desirable to have a filler having a thermal conductivity of at least about 10 w / m ° C. The interface material improves thermal dispersion of high power semiconductor devices. The paste may be formulated as a mixture of functional silicone resin and thermal filler.

Vinyl Q resins are activated curable silicone rubbers having the following basic polymer structure.

Vinyl Q resins are an obvious reinforcing additive for further curing elastomers. Examples of vinyl Q dispersions having at least about 20% Q-resin are VQM-135 (DMS-V41 base), VQM-146 (DMS-V46 base), and VQX-221 (50% in xylene base).

As an example, the expected silicone resin mixture can be formed as follows.

ingredient weight% Note / function Vinyl Silicone Vinyl Q Resin Hydrogenated Functional Silica Platinum-Vinylsiloxane 75 (70-97 range) 20 (0-25 range) 5 (3-10 range) 20-200 ppm Vinyl Terminated Siloxone Reinforcing Additives

The resin mixture may be cured at room temperature or at an elevated temperature to form a compliant elastomer. The reaction takes place via hydrosilylation (addition cure) of vinyl functional siloxanes with hydrogenated functional siloxanes in the presence of catalysts such as platinum complexes or nickel complexes. Preferred platinum catalysts are SIP6830.0, SIP6832.0, and platinum-vinylsiloxane.

Expected examples of vinyl silicones include vinyl terminated polydimethyl siloxanes having a molecular weight of about 10000 to 50000. Expected examples of hydrogenated functional siloxanes include methylhydrosiloxane-dimethylsiloxane copolymers having a molecular weight of about 500 to 5000. Physical properties can vary from very soft gel materials at very low crosslink densities to tougher elastomeric networks of higher crosslink densities.

The aforementioned solder material dispersed in the resin mixture is expected to be any suitable solder material in certain applications. Various solder materials expected are indium tin (InSn) complexes, indium silver (InAg) complexes and alloys, indium based compounds, tin silver copper complexes (SnAgCu), tin bismuth complexes and alloys (SnBi), and aluminum based compounds and alloys. . Of these, particularly the expected solder material is a material comprising indium.

In connection with the thermal interface materials and components described above, thermal filler particles may be dispersed in the resin mixture. If thermal filler particles are present in the resin mixture, these filler particles should advantageously have high thermal conductivity. Suitable filler materials include silver, copper, aluminum, and alloys thereof; Boron nitride, aluminum spheres, aluminum nitride, silver coated copper, silver coated aluminum, copper fibers, and carbon fibers coated with metals, metal alloys, conductive polymers or other composite materials. Boron nitride and silver or a combination of boron nitride and silver / copper also provide improved thermal conductivity. Particularly useful are at least about 20 wt% boron nitride, at least about 70 wt% aluminum spheres, and at least about 60 wt% silver.

It is a highly graphized type of carbon fiber by heat treatment or a specific type of carbon fiber, referred to as " VGCF, " such as available from Applied Sciences, Cedarville, Ohio. “Carbon microfibers” (thermal conductivity = about 1900 W / m ° C.) have particular efficacy. The addition of about 0.5% by weight carbon microfibers significantly increases thermal conductivity. Such fibers are available in varying lengths and diameters, ie from about 1 mm to several tens of cm in length and from about 0.1 or less to about 100 μm in diameter. Useful forms of VGCF have a diameter of about 1 μm or less and a length of about 50 to 100 μm and about 2 or 3 times the thermal conductivity of other conventional carbon fibers having a diameter of about 5 μm or more.

It may be advantageous to incorporate substantially spherical filler particles to maximize packing density. In addition, substantially spherical and the like provide some control of the thickness during filling. Dispersion of the filler particles can be facilitated by the addition of wetting agents or functional organometallic binders such as organosilanes, organotitanates, organozirconiums and the like. Organometallic binders, especially organotitanates, may be used to facilitate melting of the solder material during the application process. Typical particle sizes useful as fillers in resin materials range from about 1-20 μm, up to about 100 μm.

To illustrate the invention, many examples have been prepared by mixing the components disclosed in Examples A-J below. Examples shown include one or more optional additives, for example, wetting enhancers. The amount of such additives may vary, but in general they are approximate (% by weight): up to about 95% of the total (filler + rubber) filler; About 0.1 to 5% (in total) wetting enhancer; And from about 0.01 to 1% (in total) of adhesion promoters. It should be noted that addition of about 0.5% or more carbon fiber significantly increases thermal conductivity. Examples show various physical-chemical measurements of the expected mixture.

Yes A B C D E F G H I J Silicone mixture 16 5 8 5 5 5 5 5 4 4 Organotitanate 4 3 0 3 3 3 3 3 3 3 InSn 92 92 82 InAg 63 In 63 SnAgCu 92 82 SnBi 83 68 Al 80 10 29 29 10 10 25 Coefficient (MPa) 25 15 25 15 20 23 25 30 20 25 Viscosity (poise) 1400 500 1200 450 1500 1600 500 750 650 1700 Thermal Impedance (㎠ ℃ / w) 0.3 0.15 0.4 0.14 0.14 0.12 0.16 0.17 0.18 0.10 Thermal conductivity (W / m ℃) 2.5 5.1 2.0 5.5 5.8 6.2 5.2 5.0 5.0 6.0

Component organotitanate, InSn, InAg, In, SnAgCu, SnBi, and Al are present in weight percent or weight percent.

Example A contains no solder material and is provided for reference purposes. The organotitanate functions as a wetting agent as well as a fluxing agent to facilitate melting of the solder material during the application process.

In these examples, the composition of the solder is as follows. InSn is about 52% In by weight and about 48% Sn by weight and has a melting point of about 118 ° C .; InAg is about 97% In (weight) and about 3% Ag (weight) and has a melting point of 143 ° C; In is about 100% indium by weight and the melting point is 157 ° C .; SnAgCu is about 94.5% tin (weight), about 3.5% silver (weight) and about 2% copper (weight) and has a melting point of about 217 ° C; SnBi is about 60% tin (weight) and about 40% bismuth (weight) and the melting point is about 170 ° C. It should be understood that other compositions comprising different percentages of components are derivable from the subject matter herein.

The process temperature is as follows. Example A-E is about 150 ° C. for about 30 minutes; Examples F, J and I are about 200 ° C. for about 30 minutes and about 150 ° C. for about 30 minutes; Examples G and H are about 240 ° C. for about 30 minutes and about 150 ° C. for about 30 minutes.

The heat spreader part or heat spreader part (the heat spreader and heat spreader are used interchangeably and have the same meaning) generally comprises one or more metal or metal based base materials such as nickel, aluminum, copper, or AlSiC. Any suitable metal or metal based base material can be used as the heat spreader as long as the metal or metal based base material can transfer some or all of the heat generated by the electronic component. Specific examples of anticipated heat spreader components are shown in the Examples section.

The heat spreader components are manufactured, eg rolled or stamped, to any suitable thickness as required by the electronic component, the vendor, and as long as the heat spreader component can perform sufficient work to remove some or all of the heat generated from the surrounding electronic components. Can be. Expected thicknesses include thicknesses ranging from about 0.25 mm to about 6 mm. Particularly preferred thicknesses of heat spreader components are in the range of about 1 mm to about 5 mm.

The method of forming the expected layered thermal component includes; a) providing one or more thermal interface components; b) providing one or more heat spreader components; And c) physically coupling the thermal interface component and the heat spreader component.

The thermal interface component and the heat spreader component are separately prepared and manufactured by using the method described above. The two parts are then physically combined to produce the layered interface material. As used herein, the term “interface” means a couple or bond that forms a common boundary between two parts of material or space. The interface is a physical attraction between two parts or parts or two parts, including binding forces such as covalent and ionic bonds, and non-bonding forces such as van der Waals, static electricity, coulombs, hydrogen bonds and / or magnetic attraction. Physical attachment or physical bonding of materials or components thereof. As mentioned above, the two parts may be physically joined by the action of applying one part to the surface of the other part.

The layered thermal component may be applied to a substrate, another surface, or another layered component. Expected electronic components include layered thermal components, substrate layers and one or more additional layers. The layered thermal component includes a heat spreader component and a thermal interface component. Substrates envisioned herein may comprise any desired substantially solid material. Particularly preferred substrate layers will comprise films, glass, ceramics, plastics, metals or coating metals, or composite materials. In a preferred embodiment, the substrate is a silicon or gallium arsenide die or wafer surface, a copper surface, via-wall or stiffener interface (“copper”) as found in a copper, silver, nickel or gold plated leadframe. Including bare copper and its oxides), polymeric packaging or board interfaces as found in polyimide-based flex packages, polymers such as lead or other metal alloy solder ball surfaces, glass and polyimide do. "Substrate" may be defined as another polymeric material when considering an adhesive interface. In a more preferred embodiment, the substrate comprises materials customary in the packaging and circuit board industry, such as silicon, copper, glass, and another polymer.

The additional layer of material may be coupled to the layered interface material to continue forming the layered component or printed circuit board. Additional layers include materials similar to those previously described, including metals, metal alloys, composites, polymers, monomers, organic compounds, inorganic compounds, organometallic compounds, resins, adhesives, and optional wave guide materials. It is expected.

A laminate material or coating material layer may be bonded to the layered interface material as required by the part. Laminates are generally considered fiber reinforced resin insulating materials. The coating material is a subset of the laminate produced when a metal such as copper or other metal is incorporated into the laminate. (1997 McGraw-Hill, New York), Second Edition, Harper, Charles A., Electronic Packaging and Interconnect Handbook.

Spin-on layers and materials may be added to the layered interface material or subsequent layers. Spin-on laminated films are described by Michael E. Thomas' Solid State Technology (July 2001), "Spin-on Laminated Films for Low k _eff Insulators."

Applications of the anticipated thermal interface components, layered interface materials, and heat spreader components disclosed herein include incorporating the material and / or components into another layered material, electronic component, or final electronic component. As expected, electronic components are generally considered to include certain layered components that can be used in electronic based products. Expected electronic components include circuit boards, chip packaging, separator sheets, insulated parts of circuit boards, printed wiring boards, and other printed circuit parts such as capacitors, inductors, and resistors.

Electronic base products are "finished" in that they are ready for use by industry or other consumers. Examples of end consumer products include televisions, computers, mobile phones, pagers, palm type organizers, portable radios, car stereos, and remote controls. Also contemplated are “middle” products such as printed circuit boards, chip packaging, and keyboards, which are potentially used in end products.

The electronic product may include sample components in the development stage from the conceptual model to the final scale-up / real model. The sample may or may not include all the actual parts intended for the final product, and the sample may have certain parts composed of composite material to negate the initial effects on other parts during the initial test.

Example

The following examples illustrate the basic procedure and test mechanism for preassembly of the various layered materials disclosed herein. Test parameters and discussion use nickel as the heat spreader component. However, it should be understood that any suitable heat spreader component may be used for the application and layered material. In addition, although PCM45 is used as a representative phase change material part in this embodiment, it should be understood that any suitable phase change material part may be used in accordance with the subject matter disclosed herein.

Example 1

Basic process for assembly

equipment

Heat tunnel, cooling device.

Appropriate equipment for positioning parts and pressing PCM materials.

Source

Latex, non-powder glove. Do not use (blue) nitrile gloves because they contaminate Ni plated surfaces.

Towel.

Isopropyl alcohol.

material

Heat spreader parts.

Pre-cut PCM material or appropriate phase change material as required by the vendor and / or manufacturer.

Equipment (specific equipment for parts and PCM materials, preferably nylon).

Safety and environment

safety glass

Always check your hands for any type of conveyor you are operating.

Guideline

Before applying the PCM material, sample 32 pieces of random parts to begin the inspection.

Use only phase change materials that pass inspection criteria similar to those discussed herein; It starts with a phase change material of normal temperature like PCM45. If the top and bottom release papers fall prematurely, the PCM material is mild at about 30 ° C. for at least about 0.5 hours.

Confirm that the substrate temperature is at least about 21 ° C.

Apply the phase change material to the part as instructed below.

Release paper (preferably short release paper) is removed to apply the material to the part to expose the phase change material.

Place the alignment jig on the part and apply phase change material with light acupressure.

Passing through a heat tunnel causes the combined portion to discharge temperatures in the range of about 48 to about 60 ° C. The residence time may be about 30 to about 60 seconds.

-A light shiatsu is applied to PCM45 to ensure full adhesion.

-Cool to below about -10 ° C for at least about 10 minutes.

-Remove the upper release paper.

-Visually inspect the combination for defects.

-Load it in the tray.

Quality requirements

Sampling Plan

After applying location and visual requirements, inspect each part.

Inspection instructions

At 1X ', 12 "-14" in the eye, the PCM material is visually inspected to ensure position and visual criteria.

Approval / Rejection Criteria

Visually inspect for any deformation around the edge of the material. The substrate is also retested for stains and / or scratches to the relevant quality standards for the part.

Note: If this failure occurs, the parts need to be left in the cooling unit longer.

Reworking the application of phase transition material parts

Phase change material parts that fail visual inspection can be immediately reprocessed.

Using a plastic scraper, the rejected phase change material is removed from the part.

Isopropyl alcohol and a towel are used to remove any adhesive.

Return to the second stage under the guidance that the phase change material part is provided.

Example 2

Basic process for assembly

equipment

Heat tunnel, cooling device.

Appropriate equipment for positioning parts and pressing PCM materials.

Source

Latex, non-powder glove. Do not use (blue) nitrile gloves because they contaminate Ni plated surfaces.

Towel.

Isopropyl alcohol.

material

Heat spreader parts.

Pre-cut polymer solder material as required by the vendor and / or manufacturer.

Equipment (specific equipment for parts and polymer solder materials, preferably nylon).

Safety and environment

safety glass

Always check your hands for any type of conveyor you are operating.

Guideline

Before applying the polymer solder material, sample 32 pieces of random parts to begin the inspection.

Use only polymeric solder materials that pass inspection criteria similar to those discussed herein; Disclosed is a polymer solder material at room temperature. If the top and bottom release papers fall prematurely, the polymer solder material is mildened at about 30 ° C. for at least about 0.5 hours.

Confirm that the substrate temperature is at least about 21 ° C.

Apply polymer solder material to the part as instructed below.

Release paper (preferably short release paper) is removed to apply the material to the part to expose the polymeric solder material.

-Place the alignment jig on the part and apply polymer solder material with light pressure.

Passing through a heat tunnel causes the combined portion to discharge temperatures in the range of about 48 to about 60 ° C. The residence time may be about 30 to about 60 seconds.

Light pressure is applied to the polymer solder material to ensure complete adhesion.

-Cool to below about -10 ° C for at least about 10 minutes.

-Remove the upper release paper.

-Visually inspect the combination for defects.

-Load it in the tray.

Quality requirements

Sampling Plan

After applying location and visual requirements, inspect each part.

Inspection instructions

At 1X ', 12 "-14" in the eye, the polymer solder material is visually inspected to ensure position and visual criteria.

Approval / Rejection Criteria

Visually inspect for any deformation around the edge of the material. The substrate is also retested for stains and / or scratches to the relevant quality standards for the part.

Note: If this failure occurs, the parts need to be left in the cooling unit longer.

Rework of polymer solder material parts

Polymer solder material parts that fail visual inspection can be immediately reworked.

Using a plastic scraper, the rejected polymer solder material is removed from the part.

Isopropyl alcohol and a towel are used to remove any adhesive.

The polymer solder material part returns to the second step under the instructions provided.

Example 3

Basic process for assembly

equipment

Heat tunnel, cooling device.

Appropriate equipment for positioning parts and pressing solder / solder paste materials.

Source

Latex, non-powder glove. Do not use (blue) nitrile gloves because they contaminate Ni plated surfaces.

Towel.

Isopropyl alcohol.

material

Heat spreader parts.

Precut solder or solder paste material as required by the vendor and / or manufacturer.

Equipment (specific equipment for parts and solder / solder paste materials, preferably nylon).

Safety and environment

safety glass

Always check your hands for any type of conveyor you are operating.

Guideline

Sample 32 pieces of random parts to begin inspection before applying solder / solder paste material.

Confirm that the substrate temperature is at least about 21 ° C.

Apply solder / solder paste material to the part as instructed below.

Place the alignment jig on the part and apply phase change material with light acupressure.

-Place a weight or clamp on top of the solder / solder paste material.

Passing through a heat tunnel (nitrogen atmosphere) causing the combined portion to an exhaust temperature in the range of about 170 to about 200 ° C. The residence time may be about 2 to about 5 minutes.

-Visually inspect the combination for defects.

-Load it in the tray.

Flux may or may not be used for solder / solder paste applications. If flux is used, a cleaning step must be added later to clean the flux from the part.

Quality requirements

Sampling Plan

After applying location and visual requirements, inspect each part.

Inspection instructions

At 1X ', 12 "-14" in the eye, the solder / solder paste material is visually inspected to ensure position and visual criteria.

Approval / Rejection Criteria

Visually inspect for any deformation around the edge of the material. The substrate is also retested for stains and / or scratches to the relevant quality standards for the part.

As disclosed herein, thermal interface systems, thermal interfaces and interface materials are beneficial for many reasons. The first reason is that the heat spreader component and the interface material have good wettability at the interface between the heat spreader component and the interface material, and this interface wettability can withstand extreme conditions. The second reason is that the heat spreader component / thermal interface material combination disclosed herein reduces the number of steps required for the package assembly by the customer and assumes that the customer checks its prefabricated quality before receiving it. The preassembly of parts also reduces the associated costs for the customer. The third reason is that the heat spreader component and the thermal interface material are designed to “work together” such that the interface thermal resistance can be minimized for a particular combination of heat spreader component and the thermal interface material.

Therefore, specific embodiments and applications of thermal interconnects and interface materials are disclosed. However, it will be apparent to those skilled in the art that many other modifications besides the embodiments described above are possible without departing from the scope of the present invention. Therefore, the gist of the present invention is not limited to the parts except the claims. Moreover, in understanding the specification and claims, all terms should be understood to the broadest scope consistent with the text. In particular, the terms “comprises” and “comprising” are to be understood to refer to an element, component, or step in a non-proprietary manner, in which the referenced element, component, or step is present, or does not exist or is used on a representational basis. It may be combined with other elements, components, or steps.

Claims (50)

One or more thermal interface components; And One or more heat spreader components coupled to the thermal interface component, Layered thermal parts. The method of claim 1, Wherein said at least one thermal interface component comprises a crosslinkable material, Layered thermal parts. The method of claim 1, Wherein said at least one thermal interface component comprises at least one rubber compound and at least one thermally conductive filler, Layered thermal parts. The method of claim 3, wherein Wherein said at least one thermal interface component further comprises at least one crosslinker moiety, at least one crosslinking compound or at least one crosslinking resin, Layered thermal parts. The method of claim 4, wherein Wherein said at least one crosslinker moiety, said at least one crosslinking compound or said at least one crosslinking resin comprises an amine resin or an amine based compound, Layered thermal parts. The method of claim 3, wherein Wherein said at least one rubber compound comprises at least one terminating hydroxyl group, Layered thermal parts. The method according to claim 3 or 6, wherein Wherein said at least one rubber compound comprises at least one secondary, tertiary or other internal hydroxyl group, Layered thermal parts. The method of claim 1, Said at least one thermal interface component comprising at least one solder material, Layered thermal parts. The method of claim 8, Wherein said at least one solder material comprises a paste, Layered thermal parts. The method of claim 8, The at least one solder material comprises at least one of indium, copper, silver, aluminum, gallium, tin or bismuth, Layered thermal parts. The method of claim 8, The at least one thermal interface component further comprises at least one resin component, Layered thermal parts. The method of claim 11, Wherein said at least one resin part comprises a silicone compound, Layered thermal parts. The method of claim 12, Wherein the silicone compound comprises vinyl Q resin or vinyl silicone, Layered thermal parts. The method of claim 11, The at least one solder material comprises at least one of indium, tin, silver, bismuth or aluminum, Layered thermal parts. The method of claim 11, Further comprising a crosslinking additive, Layered thermal parts. The method of claim 15, Wherein the crosslinking additive comprises a siloxane compound, Layered thermal parts. The method of claim 16, Wherein the siloxane compound comprises a hydrogenated functional siloxane compound, Layered thermal parts. The method of claim 1, Wherein the at least one heat spreader component comprises at least one metal or metal based base material, Layered thermal parts. The method of claim 18, Wherein said at least one metal or metal based base material comprises nickel, aluminum or copper, Layered thermal parts. The method of claim 19, Wherein said at least one metal or metal based base material comprises AlSiC, Layered thermal parts. The method of claim 1, The one or more heat spreader components having a thickness of about 0.25 mm to about 6 mm, Layered thermal parts. The method of claim 21, The one or more heat spreader components having a thickness of about 1 mm to about 5 mm, Layered thermal parts. As a method of forming a layered thermal component, Providing one or more thermal interface components; Providing one or more heat spreader components; And Coupling the one or more thermal interface components to the one or more heat spreader components, Method of forming layered thermal parts. The method of claim 23, Wherein said at least one thermal interface component comprises a crosslinkable material, Method of forming layered thermal parts. The method of claim 23, Wherein said at least one thermal interface component comprises at least one rubber compound and at least one thermally conductive filler, Method of forming layered thermal parts. The method of claim 25, Wherein said at least one thermal interface component further comprises at least one crosslinker moiety, at least one crosslinking compound or at least one crosslinking resin, Method of forming layered thermal parts. The method of claim 26, Wherein said at least one crosslinker moiety, said at least one crosslinking compound or said at least one crosslinking resin comprises an amine resin or an amine based compound, Method of forming layered thermal parts. The method of claim 25, Wherein said at least one rubber compound comprises at least one terminating hydroxyl group, Method of forming layered thermal parts. The method of claim 25 or 28, Wherein said at least one rubber compound comprises at least one secondary, tertiary or other internal hydroxyl group, Method of forming layered thermal parts. The method of claim 23, Said at least one thermal interface component comprising at least one solder material, Method of forming layered thermal parts. The method of claim 30, Wherein said at least one solder material comprises a paste, Method of forming layered thermal parts. The method of claim 30, The at least one solder material comprises at least one of indium, copper, silver, aluminum, gallium, tin or bismuth, Method of forming layered thermal parts. The method of claim 30, The at least one thermal interface component further comprises at least one resin component, Method of forming layered thermal parts. The method of claim 33, wherein Wherein said at least one resin part comprises a silicone compound, Method of forming layered thermal parts. The method of claim 34, wherein Wherein the silicone compound comprises vinyl Q resin or vinyl silicone, Method of forming layered thermal parts. The method of claim 33, wherein The at least one solder material comprises at least one of indium, tin, silver, bismuth or aluminum, Method of forming layered thermal parts. The method of claim 33, wherein Further comprising a crosslinking additive, Method of forming layered thermal parts. The method of claim 37, Wherein the crosslinking additive comprises a siloxane compound, Method of forming layered thermal parts. The method of claim 38, Wherein the siloxane compound comprises a hydrogenated functional siloxane compound, Method of forming layered thermal parts. The method of claim 23, Wherein the at least one heat spreader component comprises at least one metal or metal based base material, Method of forming layered thermal parts. The method of claim 40, Wherein said at least one metal or metal based base material comprises nickel, aluminum or copper, Method of forming layered thermal parts. 42. The method of claim 41 wherein Wherein said at least one metal or metal based base material comprises AlSiC, Method of forming layered thermal parts. The method of claim 23, The one or more heat spreader components having a thickness of about 0.25 mm to about 6 mm, Method of forming layered thermal parts. The method of claim 43, The one or more heat spreader components having a thickness of about 1 mm to about 5 mm, Method of forming layered thermal parts. An electronic component comprising the layered thermal component of claim 1. A semiconductor component comprising the layered thermal component of claim 1. An electronic component comprising the layered thermal component of claim 23. A semiconductor component comprising the layered thermal component of claim 23. 24. The method of forming a thermal interface component of claim 1 or 23, Providing at least one saturated rubber compound; Providing at least one amine resin; Crosslinking said at least one saturated rubber compound with said at least one amine resin to form a crosslinked rubber-resin mixture; Adding at least one thermally conductive filler to the crosslinked rubber-resin mixture; And Adding a humectant to the crosslinked rubber-resin mixture, How to form a thermal interface part. The method of claim 49, Further comprising adding one or more phase change materials to the thermal interface material, How to form a thermal interface part.