KR200489834Y1 - Main contact mechanism for thermal over current relay - Google Patents
Main contact mechanism for thermal over current relay Download PDFInfo
- Publication number
- KR200489834Y1 KR200489834Y1 KR2020150008709U KR20150008709U KR200489834Y1 KR 200489834 Y1 KR200489834 Y1 KR 200489834Y1 KR 2020150008709 U KR2020150008709 U KR 2020150008709U KR 20150008709 U KR20150008709 U KR 20150008709U KR 200489834 Y1 KR200489834 Y1 KR 200489834Y1
- Authority
- KR
- South Korea
- Prior art keywords
- contact
- main
- thin plate
- stage
- movable contact
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H61/00—Electrothermal relays
- H01H61/01—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/12—Means for adjustment of "on" or "off" operating temperature
- H01H37/26—Means for adjustment of "on" or "off" operating temperature by adjustment of abutment for "off" position of the movable contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
Abstract
The present invention is to provide a main contact device of the thermal overcurrent relay of the improved configuration that can exhibit a constant contact load between the main movable contact and the main fixed contact, the main contact device of the thermal overcurrent relay according to the present invention, the circuit A main stationary contact stand connected to; A main movable contact stage having a position during normal energization contacting the main fixed contact stage and a position when an overcurrent occurs separated from the main fixed contact stage, wherein the main movable contact stage includes: a thin plate contact stage to which the contact is attached; And a terminal unit which may be connected to a circuit and connected to the thin plate contact unit and in which a portion connected to the thin plate contact unit is inclined downward.
Description
The present invention relates to a thermal overcurrent relay, and more particularly to a main movable contact device of the thermal overcurrent relay having an improved configuration to provide a constant contact load.
Thermal overcurrent relays protect circuits and load devices (e.g. motors) from overcurrent by breaking the circuit using the bi-metal thermal deformation characteristics connected to the circuit when the overcurrent flows. It is a low voltage power device.
In general, thermal overcurrent relay (also known as thermal overload relay) forms a magnetic switch together with a magnetic contactor, which is a switch (switch) that starts or stops the motor depending on whether a control signal is applied. It is widely used for operation control and overcurrent protection.
The outer shape of the thermal overcurrent relay may refer to the thermal
On the other hand with reference to Figure 2 will be described the internal configuration of the thermal
The upper end of the
Accordingly, the
The lower end of the
The
The auxiliary
A
The end of the sheet contact point of the auxiliary
On the upper portion of the auxiliary
The auxiliary
In the upper part of the
The display lever 20 includes a body portion extending in a vertical direction, a power receiving portion formed to extend from one side of the body portion to one side (left side in the drawing) and connected to the
Position fixing of the
In the lower part of the
The main
The main
The operation of the thermal
In FIG. 2, when an overcurrent flows in the circuit, the
Then, the
As the
Then, the
Accordingly, the lower end (see the lower end of
Since the thin plate portion of the auxiliary
At this time, the
In addition, the display lever 20 having one side connected to the
Closing between displays or communication means such as power or display lamps, displays, buzzers, communication units or communication means by auxiliary
For a description of a more detailed configuration and operation of the thermal overcurrent relay according to the prior art as described above can refer to the following patent documents granted to the applicant of the present application.
(Patent Document 1) KR10-0689321 B1
On the other hand, in the thermal overcurrent relay according to the related art, which is constructed and operated as described above, the detailed configuration of the main
The main movable contact assembly is configured to include a thin plate contact stage, a
The thin plate contact stage is bent and extended at a predetermined angle from the first thin plate contact portion 18a2 and the first thin plate contact portion 18a2 connected to the
The purpose of bending the second thin plate contact portion 18a1 at a predetermined angle from the first thin plate contact portion 18a2 is the main
However, in order to obtain a desired contact load, the main movable contact assembly according to the prior art has to be manufactured in a state where the sheet contact stage is bent at a predetermined angle, so that the sheet contact is very thin for each thermal overcurrent relay in manufacturing. Since it is not easy to produce a constant bending angle of the stand, it was difficult to secure the energization reliability between the main movable contact and the main fixed contact.
Therefore, the present invention solves the problems of the prior art described above, and an object of the present invention is to provide a main contact device of a thermal overcurrent relay having an improved configuration capable of exerting a constant contact load between a main movable contact and a main fixed contact. It is.
Another object of the present invention is to provide a main contact device of a thermal overcurrent relay capable of exhibiting a constant contact load between a main movable contact and a main fixed contact while improving productivity of the main fixed contact.
One object of the present invention, in the main contact device of the thermal overcurrent relay,
Main fixed contact stand connected to the circuit;
A main movable contact stage having a position at normal energization contacting the main fixed contact stage and a position at the time of occurrence of an overcurrent separated from the main fixed contact stage,
The main movable contact stand,
Thin plate contact stand for attaching contacts; And
The thermal over-current relay according to the present invention, characterized in that it comprises a terminal portion which can be connected to the circuit, connected to the thin contact point, the portion connected to the thin contact point is inclined downward Can be achieved by providing a primary contact device.
Another object of the present invention, the terminal portion has a thickness thicker than the thin plate contact stage, the main fixed contact stage is a thermal overcurrent according to the present invention, characterized in that the thickness of the portion attached to the terminal portion and the contact is the same This can be achieved by providing a main contact device of the relay.
According to a preferred aspect of the present invention, the thin plate contact stage is composed of a flat conductive sheet.
The main contact device of the thermal overcurrent relay according to the present invention is a thin plate contact stage to which the main movable contact unit attaches a contact point, and a portion connected to the thin plate contact unit and connected to the thin plate contact unit is inclined downwardly Since it is configured to include a terminal portion, it is possible to provide the effect of maintaining a constant contact load between the main movable contact and the main fixed contact without the need to bend the thin plate contact stage.
Since the main contact device of the thermal overcurrent relay according to the present invention has a thickness thicker than that of the thin plate contact terminal with the terminal, and the main fixed contact stage has the same thickness as the terminal part and the part to which the contact is attached, The thickness of the part where the terminal part and the contact part are attached can be integrally formed in the same way as the terminal part, so that the process of connecting the terminal part and the contact part with rivets is unnecessary, thereby improving productivity and extending the life of the main fixed contact stand. Can provide a beneficial effect.
According to a preferred aspect of the present invention, since the thin plate contact stage is composed of a flat conductive plate, it is possible to produce a constant contact contact load without having to bend all of the thin plate contact stages at a constant bending angle during mass production of the relay. There is an effect that can be obtained.
1 is an external perspective view showing the external configuration of a thermal overcurrent relay to which the prior art or the technology of the present invention can be applied;
Figure 2 is a longitudinal cross-sectional view of a thermal overcurrent relay showing the internal configuration of the thermal overcurrent relay to which the prior art or the technology of the present invention can be applied,
3 is a side view showing the configuration of the main movable contact assembly of the thermal overcurrent relay according to the prior art,
Figure 4 is a side view showing the configuration of the main movable contact assembly of the thermal overcurrent relay according to an embodiment of the present invention,
5 is a perspective view obliquely looking down from the top of the main movable contact assembly of the thermal overcurrent relay according to an embodiment of the present invention;
6 is a partial longitudinal cross-sectional view of a thermal overcurrent relay showing a thermal overcurrent relay to which a main movable contact assembly is applied according to a preferred embodiment of the present invention;
7 is a perspective view showing the configuration of the main fixed contact assembly of the main contact device according to the prior art,
8 is a perspective view showing the configuration of the main fixed contact assembly of the main contact device according to an embodiment of the present invention.
The purpose of the present invention and the constitution and effect of the present invention to achieve the same will be more clearly understood by the following description of the preferred embodiment of the present invention with reference to the accompanying drawings.
In the present invention, the configuration of the thermal overcurrent relay excluding the main contact device, that is, the main movable contact and the main fixed contact, is the same as that of the thermal overcurrent relay described above with reference to FIG. 2. In order to avoid the description will be omitted.
4 to 6 will be described the configuration of the main movable contact assembly of the thermal over-current relay according to a preferred embodiment of the present invention.
The main movable contact assembly of the thermal overcurrent relay according to the preferred embodiment of the present invention is for a thermal overcurrent relay having a main fixed contact stage (see
The main
The main
The
According to a preferred aspect of the present invention, the thin
The
The
Since the
On the other hand, the thin plate contact stage according to the prior art has a bending process for forming the first thin plate contact portion 18a2 and the second thin plate contact portion 18a1 by bending at a predetermined angle by manual operation using a special machine or tool. It has to be added and it is very difficult to mold a large number of sheet contact strips according to the prior art at constant bending angles.
In addition, since the
Meanwhile, the configuration of the main contact device according to the preferred embodiment of the present invention in the main contact device (main contact mechanism) and the main contact device according to the preferred embodiment of the present invention with reference to FIGS.
The configuration of the main movable contact stand in the main contact device according to the preferred embodiment of the present invention shown in Figures 6 and 8 is as described above with reference to Figure 4 mainly.
That is, the main contact device according to a preferred embodiment of the present invention has a position at normal energization contacting the main fixed
The main
The
Moreover, the
The thin
Meanwhile, the configuration of the main fixed contact stand according to the prior art according to FIG. 7 will be described to be comparable with the main fixed contact stand according to the present invention.
As can be seen in Fig. 7, the main fixed
The
Main fixed contact stand according to a preferred embodiment of the present invention is configured as can refer to FIG.
In other words, the main fixed contact table 19 includes a
According to a preferred aspect of the present invention, the thickness of the
When manufacturing the main fixed
The operation of the thermal overcurrent relay including the main contact device or the main movable contact assembly configured as described above will be described with reference to FIG.
When an overcurrent flows in the circuit, the bimetal (see
Then, the
Then, the
In response to this, the lower end of the
Since the thin plate portion of the auxiliary
At this time, the
As described above, the main movable contact assembly of the thermal overcurrent relay according to the present invention has a thin
10: bimetal 11: shifter
12: power transmission plate 13: auxiliary lever
14: auxiliary movable contact 15: spring
16: auxiliary fixed contact 17: auxiliary holder
17a, 17b: pincer stone part
17c: main contact operation part 18: main movable contact
18a: thin plate contact
18a1: 2nd thin plate contact loan 18a2: 1st thin plate contact loan
18b: terminal section 18b1: thin plate connection
18c: contact
19: main
19a-1: contact section
19b:
Claims (3)
Main fixed contact stand connected to the circuit;
A main movable contact stage having a position at normal energization contacting the main fixed contact stage and a position at the time of occurrence of an overcurrent separated from the main fixed contact stage,
The main movable contact stand,
Thin plate contact stand for attaching contacts; And
And a thin plate connecting portion to which the thin plate contact stage is connected, the terminal portion being connected to the circuit.
The thin plate contact stage extends in a straight line from one end portion in the longitudinal direction to the other end portion opposite to the one end portion in the longitudinal direction, and is formed in a flat plate shape having a rectangular cross section in the longitudinal direction,
The thin plate connecting portion is inclined downward at a predetermined angle,
When the thin plate contact stage is connected to the thin plate connecting portion, the thin plate contact stage is disposed to be inclined downward at the predetermined angle,
And the terminal portion has a thickness thicker than the thin contact point.
The thin plate contact stage is a main contact device of a thermal overcurrent relay, characterized in that consisting of a thin plate-like conductive material.
The main fixed contact unit is the main contact device of the thermal over-current relay, characterized in that the thickness of the terminal portion and the portion to which the contact is attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR2020150008709U KR200489834Y1 (en) | 2015-12-31 | 2015-12-31 | Main contact mechanism for thermal over current relay |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR2020150008709U KR200489834Y1 (en) | 2015-12-31 | 2015-12-31 | Main contact mechanism for thermal over current relay |
Publications (2)
Publication Number | Publication Date |
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KR20170002503U KR20170002503U (en) | 2017-07-10 |
KR200489834Y1 true KR200489834Y1 (en) | 2019-08-19 |
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Family Applications (1)
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KR2020150008709U KR200489834Y1 (en) | 2015-12-31 | 2015-12-31 | Main contact mechanism for thermal over current relay |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200386836Y1 (en) * | 2005-03-21 | 2005-06-16 | 엘에스산전 주식회사 | A Thermal Overload Relay |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200208216Y1 (en) * | 1998-08-21 | 2001-01-15 | 이종수 | Combined structure of thermal overload relay terminal block |
KR100689321B1 (en) * | 2005-05-13 | 2007-03-08 | 엘에스산전 주식회사 | Thermal overload relay |
KR101052715B1 (en) * | 2009-12-28 | 2011-07-29 | 주식회사 대륙 | Thermal Overload Relay |
-
2015
- 2015-12-31 KR KR2020150008709U patent/KR200489834Y1/en active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200386836Y1 (en) * | 2005-03-21 | 2005-06-16 | 엘에스산전 주식회사 | A Thermal Overload Relay |
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KR20170002503U (en) | 2017-07-10 |
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