KR200474198Y1

KR200474198Y1 - Magazine for semiconductor

Info

Publication number: KR200474198Y1
Application number: KR2020130010842U
Authority: KR
Inventors: 김정엽
Original assignee: 코리아에이스테크놀로지(주)
Priority date: 2013-12-27
Filing date: 2013-12-27
Publication date: 2014-08-28

Abstract

The present invention relates to a magazine for loading semiconductors, and more particularly to a magazine for loading semiconductors, more particularly, to a magazine for loading semiconductors, more particularly to a magazine for semiconductor loading comprising a pair of side plates vertically erected and spaced apart from each other in parallel, an upper plate connecting the upper ends of the side plates, Wherein a plurality of loading slots are provided on the mutually facing surfaces of the pair of side plates in the horizontal direction and spaced apart at regular intervals in the vertical direction, A body having a guide groove formed therein; A horizontal plate folded at a right angle from the upper end of the vertical plate and seated on the upper surface of the upper plate; And a guide wing which is formed at an end of the guide plate and is formed with a guide protrusion which is inserted into the guide groove and slidable in the longitudinal direction of the guide groove. The body and the lid are all made of a magnesium alloy.
The present invention not only improves the abrasion resistance and vibration damping ability of the magazine but also enables recognition by a proximity sensor and excellent electromagnetic wave shielding performance so that it is not influenced by electromagnetic waves and a separate cover is attached to the body of the magazine, Thereby preventing the stacked semiconductor strip from deviating from the magazine to the outside.

Description

[0001] Magazine for semiconductor [0002]

The present invention relates to a magazine for loading semiconductors, and more particularly, a magazine for loading semiconductors composed of a body and a cover is made of a magnesium alloy.

BACKGROUND ART [0002] A magazine used in a manufacturing process of a semiconductor package is a kind of a case for stacking and storing a strip material (a printed circuit board, a circuit film, a lead frame, etc.) for manufacturing a semiconductor package, Lt; / RTI > for a while.

More particularly, the present invention relates to a process for attaching a semiconductor chip to a material and transferring a plurality of strip materials completed in a wire bonding process for connecting the semiconductor chip and a material to a post process (molding, trimming, forming, ink marking process, A magazine is used for stacking and storing a plurality of materials vertically.

Then, the magazine is disposed in a supply portion and a discharge portion of each process, and then a strip material accommodated in the magazine disposed in the supply portion is supplied to the process, and the finished strip material is stacked and housed in the magazine again.

Here, the strip material refers to a printed circuit board, a circuit film, a lead frame, and the like, in which semiconductor package regions each having a matrix array of 3x3, 4x4, etc. are arranged in one direction.

Meanwhile, such a magazine is made of aluminum or PCB (Polychlorinated Bin Phenyl). However, there is a problem that the stacked semiconductor strip is released to the outside through the opened front and rear sides of the magazine when the magazine is moved. In addition, since the aluminum and the PCB have poor nodal strength and vibration damping ability, the semiconductor package is affected by the vibration when the semiconductor strip is loaded or moved, and stress can be applied to the semiconductor strip. .

In addition, since the semiconductor may cause a malfunction due to electromagnetic waves, shielding of electromagnetic waves is an important factor in the manufacturing process. However, the aluminum or PCB has a problem in that electromagnetic wave shielding performance is poor and electromagnetic waves are hardly shielded.

In addition, the workers at the semiconductor production site are almost female, and the magazine is transported and handled in 5 to 6 boxes in a certain size. Repeating this process, it is seen that the musculoskeletal system of the wrist, cuff, shoulder, It was necessary to lighten the weight of the magazine because it complained about the disease.

In order to solve such a problem, the magazine for "semiconductor package" of the registered domestic patent registration No. 10-0477933 has been replaced with an injection product using an engineering plastic having electrical conductivity and heat resistance, thereby reducing cost and improving productivity And the permanent conductivity is imparted to the plastic raw material to improve the quality of the semiconductor production process and to reduce the weight of the magazine. However, since the proximity sensor in each equipment in the semiconductor assembly process is configured to detect only the metal, There is a problem in that the proximity sensor attached to each equipment in the assembly process can not recognize the plastic magazine, so that it is not applicable to the actual production line. In addition, there is a problem that wear resistance is poor and it is difficult to use for a long period of time.

KR 10-0477933 B1

Accordingly, the object of the present invention is to solve the problems of the above-described conventional magazine, and by making the body and the lid of the magazine be made of magnesium alloy, it is possible to improve wear resistance and vibration damping ability, And which is excellent in electromagnetic wave shielding performance and is not affected by electromagnetic waves.

In addition, by providing a separate cover on the front and back sides of the body of the magazine, it is possible to prevent the loaded semiconductor materials from deviating from the magazine to the outside.

To achieve the above object, the present invention provides a magazine for loading semiconductors, comprising: a pair of side plates vertically erected and spaced apart from each other in parallel; an upper plate connecting upper ends of the pair of side plates; Wherein a plurality of loading slots are provided on the mutually facing surfaces of the pair of side plates so as to be horizontally arranged and spaced apart at regular intervals in the vertical direction, A body having a guide groove formed therein; A horizontal plate folded at a right angle from the upper end of the vertical plate and seated on the upper surface of the upper plate; And a guide wing which is formed at an end of the guide plate and is formed with a guide protrusion which is inserted into the guide groove and slidable in the longitudinal direction of the guide groove. The body and the lid are all made of a magnesium alloy.

The magnesium alloy is characterized by containing magnesium (Mg) as a main component and aluminum (Al) and zinc (Zn), or zinc (Zn) and zirconium (Zr).

And an opening is formed on both sides in the front-rear direction of the upper plate, and the horizontal plate is formed to have a size capable of covering the entire opening.

The vertical plate is formed with a slot having a length in the vertical direction.

And the lid is provided in pairs so as to cover the front side and the rear side between the pair of side plates.

The present invention not only improves the abrasion resistance and vibration damping ability of the magazine but also enables recognition by a proximity sensor and excellent electromagnetic wave shielding performance so that it is not influenced by electromagnetic waves and a separate cover is attached to the body of the magazine, Thereby preventing the stacked semiconductor materials from being separated from the magazine to the outside.

1 is a perspective view of a magazine for loading a semiconductor according to the present invention.
FIGS. 2 to 5 are a perspective view, a front view, a plan view, and a side view of a body included in the semiconductor magazine according to the present invention.
6 and 7 are a cross-sectional perspective view and a cross-sectional view of the body cut along line AA shown in FIG.
8 and 9 are a cross-sectional perspective view and a cross-sectional view of the body cut along the line BB shown in FIG.
Figs. 10 to 13 are a rear perspective view, a front view, a side view, and a plan view of a cover included in the magazine for semiconductor loading according to the present invention. Fig.
Fig. 14 shows a process in which the cover is coupled to the body.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a magazine for semiconductor loading according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a semiconductor magazine according to the present invention.

A semiconductor strip or a substrate (hereinafter referred to as a " semiconductor material ") during the manufacturing process of a semiconductor or an LED is loaded and moved in a magazine. At this time, if an external shock or vibration occurs during the movement of the magazine, it affects the loaded semiconductor materials and causes a defect, and the electromagnetic waves generated from the outside also affect the loaded material.

Conventionally, the magazine for stacking semiconductors is made of aluminum and PCB, which has a disadvantage in that durability is poor, semiconductor packages mounted by external vibration are affected, and electromagnetic waves are not shielded.

The magazine for loading semiconductors is composed of a body 100 and a lid 200. The body 100 and the lid 200 are both made of a magnesium alloy .

That is, in the present invention, a magnesium alloy is used as the material of the body 100 and the lid 200, and the magazine has excellent light weight, abrasion resistance, vibration damping ability, and electromagnetic wave shielding performance. Further, since the magnesium alloy is a metal, a proximity sensor of a semiconductor production line can recognize the disadvantage of the conventional plastic magazine.

As the magnesium alloy used in the present invention, magnesium (Mg) and aluminum (Al) and zinc (Zn) or zinc (Zn) and zirconium (Zr) Or Mg + Zn + Zr) may be used, and any of them may have excellent physical properties as described above. As an example of such a magnesium alloy, any of AZ31B, AZ80A, AZ91D, and AZ61A in the ASTM standard can be used. In addition, the body 100 and the lid 200 may be made of magnesium alloy of different kinds (for example, the body 100 is made of AZ31B and the lid 200 is made of AZ80A) I never do that.

The AZ31B has a nominal composition of 2.5-3.5 wt.% Aluminum, 0.6-1.4 wt.% Zinc, a controlled and limited amount of impurities and the balance magnesium. The AZ80A has a nominal composition Wherein the AZ91D has a nominal composition of from 8.5 to 9.5 wt% aluminum, from 0.45 to 0.9 wt% zinc, from 0.2 to 0.8 wt% aluminum, from 0.2 to 0.8 wt% zinc, from a controlled and limited amount of impurities and the balance magnesium, Controlled and limited amounts of impurities and remainder are composed of magnesium, AZ61A is composed of about 6 wt.% Aluminum, about 1 wt.% Zinc, controlled and limited amounts of impurities, and the balance magnesium.

The characteristics of such a magnesium alloy are the lightest materials among the commercially available metal materials, and the specific gravity is small, so that the energy required for opening and closing the magazine when the magazine is applied to the magazine can be reduced. In addition, since the non-strength (strength / specific gravity) is excellent, sufficient strength can be ensured even in a small amount, excellent abrasion resistance, vibration damping ability is more than 10 times that of aluminum, The semiconductor package can be protected from electromagnetic waves because of its excellent stability, weldability, machinability, and easy processing and excellent electromagnetic wave shielding.

Particularly, alloys composed of magnesium, aluminum and zinc have excellent properties of magnesium and have characteristics of aluminum and zinc. Their mechanical properties are improved by aluminum, and corrosion resistance and strength are improved by zinc, . &Lt; / RTI > In addition, alloys composed of magnesium, aluminum and zirconium have excellent properties of magnesium and aluminum and zirconium, and the mechanical properties are improved by aluminum, and the strength is improved by zirconium, so that it can exhibit excellent performance as a magazine .

1, the magazine according to the present invention includes a pair of side plates 110 vertically erected and spaced parallel to each other, and a pair of side plates 110 connecting upper ends of the pair of side plates 110 And a lower plate (130) connecting the lower ends of the pair of side plates (110). The side plates (110) have a length in the horizontal direction and a length A body 100 in which a plurality of loading slots 112 are arranged spaced apart from each other and a guide groove 114 having a length in the vertical direction is formed on an outer surface of the side plate 110; A horizontal plate 220 bent perpendicularly from the upper end of the vertical plate 210 and seated on the upper surface of the upper plate 120; The side plates 110 are bent at right angles to both ends of the vertical plate 210 so as to cover a part of the outer side surfaces of the pair of side plates 110. The ends of the pair of side plates 110 are inserted into the guide grooves 114, And a cover 200 having a guide blade 230 on which a slidable receiving protrusion 232 is formed.

2 to 5, the body 100 of the magazine includes a pair of side plates 110, an upper plate 120, and a lower plate 120 to provide an internal space into which the material is inserted and loaded. . At this time, the side plates 110 are vertically erected and are spaced parallel to each other, thereby having a uniform width. The upper plate 120 and the lower plate 130 are coupled to the upper and lower sides of the side plate 110. At this time, the side plate 110, the upper plate 120, and the lower plate 130 are not limited in their joining methods, and may be welded, joined together through the coupling grooves and the coupling projections, Any of the conventionally known metal bonding methods may be used, which may be used.

As shown in FIG. 2, one or more grooves may be formed in the side plate 110 and the top plate 120. This may reduce the manufacturing cost of the magazine by reducing the amount of the magnesium alloy used, reduce the weight of the magazine, . 8 and 9, at least one ventilation hole may be provided in the lower plate 130 constituting the body 100. As shown in FIGS. This is because the ventilation holes formed in the lower plate 130 enable efficient convection circulation of hot air.

The side plate 110 is provided with a plurality of loading slots 112. The loading slots 112 have a length in the horizontal direction on the surfaces facing each other of the pair of side plates 110, Are spaced apart from each other. The loading slot 112 is an important component that inserts both ends of the material to be loaded on the magazine and prevents the loading slot 112 from catching the material and preventing the material from sagging and deviation. 7, a plurality of protrusions protruding from the inner surface of the side plate 110 are formed at equal intervals. The loading slots 112 are formed at regular intervals over the entire inner surface of the side plate 110, so that a large amount of material can be loaded.

At this time, the user inserts the semiconductor material into the magazine through the loading slot 112. In order to facilitate the insertion of the material, both ends of the loading slot 112 may be configured to have an extended structure.

In other words, as shown in Figs. 6 and 7, which cut the AA line in Fig. 4, and Fig. 8 and Fig. 9 in which the BB line in Fig. 5 is cut, both ends of the loading slot 112 are vertically So that the user can easily insert the material into the loading slot 112 and, on the contrary, can easily draw the material through the extended end. The stacking slots 112 may be formed by inserting one piece of each material into each of the stacking slots 112, so that the stacking slots 112 are preferably equally spaced.

A guide groove 114 having a length in the up and down direction is formed on the outer surface of the side plate 110. The guide groove 114 is formed in the guide protrusion 230 formed in the guide wing 230 of the lid 200, 232 are inserted and slid. That is, the lid 200 can be easily opened and closed through the guide groove 114.

That is, in the present invention, since the cover 200 is additionally provided in addition to the body 100 on which the semiconductor material is loaded, when the inserted or loaded semiconductor materials are impacted or not leveled while moving, To prevent the problem of being detached from the loading slot 112 through the rear side, as well as to push the semiconductor material more than necessary when inserting the semiconductor material into the loading slot 112, thereby preventing the material from being exposed to the outside through the rear side.

10 to 13, the lid 200 includes a vertical plate 210 for preventing the front plate 210 and the rear plate 220 from being separated from each other, A horizontal plate 220 mounted on the upper surface of the upper plate 120 and a pair of side plates 110 which are bent at right angles to both ends of the vertical plate 210 in the width direction, And a guide vane 230 which is inserted into the guide groove 114 and in which a lead-in protrusion 232 slidable in the longitudinal direction of the guide groove 114 is formed.

Here, the vertical plate 210 is formed so as to cover one side (front side or rear side) between the pair of side plates 110, and substantially prevents the materials inside the magazine from being deviated to the outside The upper plate 120 bent at a right angle from the upper end of the vertical plate 210 is seated on the upper plate 120 of the body 100 when the upper plate 120 is slidably engaged with the body 100, . The width of the horizontal plate 220 may be equal to the width of the upper plate 120 of the body 100 but may be as wide as the upper plate 120 of the body 100, ). In this case, the amount of magnesium alloy used can be reduced to reduce the manufacturing cost, and also to make the magazine more lightweight.

The guide vane 230 has a protrusion 232 formed at an end thereof to slide in the guide groove 114 of the body 100 so that the cover 200 can be stably engaged with the body 100. [ . The guide protrusion 232 formed at the end of the guide vane 230 has a size corresponding to that of the guide groove 114 because the guide protrusion 232 should be slid in the guide groove 114, Or may be formed only in a part of the upper end portion of the end portion. The present invention has a structure in which the lid 200 can be opened and closed in a stable manner even if a draw-in projection 232 is formed only on the lower side of the guide vane 230.

On the other hand, the lid 200 may be provided only on the rear side to serve as a stopper to prevent the material from being pushed in more than necessary when inserting the material, or to prevent the material from being displaced forward However, most preferably, the two lids 200 are provided in pairs so as to cover the front side and the rear side so as to perform both the stopper function and the departure preventing function at the time of vibration. That is, when the two lids 200 are provided as described above, a more stable magazine can be moved.

As shown in FIGS. 2 and 4, the opening 102 is formed on both sides of the upper plate 120 in the front-rear direction, thereby facilitating handling when inserting and withdrawing the material. In other words, if the opening 102 is not formed in the upper plate 120, a large amount of curled material is inserted through the loading slot 112 from the lower end of the magazine, and the empty space opened toward the upper end is reduced, When the opening 102 is formed, the hand holding the material through the opening 102 can be easily inserted and removed. On the contrary, when the uppermost material is drawn out even when the drawing is taken out, it is difficult to hold the end of the material with the hand if the opening 102 is not provided, so that the material can be easily grasped through the opening 102.

When the opening 102 is formed in the upper plate 120, the horizontal plate 220 of the lid 200 is formed to have a size capable of covering the entire opening 102, So that the material loaded on the machine is not affected. When the opening 102 is not covered by the horizontal plate 220 of the lid 200, the influence of the dust or the like on the outer surface of the lid 200 can be reduced, This is because not only the dust enters the inside of the magazine through the opening 102 but also the shielding performance of the electromagnetic wave is remarkably deteriorated.

10 and 11, a slot 212 having a length in the vertical direction may be formed in the vertical plate 210. The slot 212 may be formed in the vertical direction without opening the lid 200 through the slot 212, The state and the kind of the materials loaded on the apparatus can be confirmed. Here, it is possible to omit the formation of the slot 212 if the electromagnetic wave shielding performance of the magazine is desired.

14 shows a process of coupling the cover to the body. As shown in FIG. 14, a guide groove 114 formed in a side plate 110 of the body 100 is provided with a lead- The lid 200 is slid in the vertical direction along the guide groove 114 and the horizontal plate 220 of the lid 200 is coupled to the upper plate 120 of the body 100, The sliding operation is completed and the lid 200 is coupled to the body 100. When the lid 200 is lifted upwards, the lid 200 is slid upwardly along the guide groove 114 to separate the lid 200 from the body 200 So that it is easy to operate.

As described above, the magazine of the present invention is produced through the extrusion of a magnesium alloy. The magazine is capable of ensuring excellent physical properties due to the characteristics of a magnesium alloy. The magazine is provided with a cover 200 provided on the front and rear sides, So that it can move more stably.

While the present invention has been described in detail with reference to the preferred embodiments thereof, the scope of the present invention is not limited to the specific embodiments but should be construed in accordance with the appended claims. Those skilled in the art will appreciate that many modifications and variations are possible without departing from the scope of the present invention.

100: body 102: opening 110: side plate
112: loading slot 114: guide groove 120: top plate
130: lower plate
200: cover 210: vertical plate 212: slot
220: horizontal plate 230: guide wing 232:

Claims

A pair of side plates 110 vertically erected and spaced apart from each other in parallel to each other and an upper plate 120 connecting upper ends of the pair of side plates 110 and a lower plate 130 connecting the lower ends of the pair of side plates 110 A plurality of loading slots 112 are provided on the surfaces of the pair of side plates 110 facing each other in the horizontal direction and spaced apart at regular intervals in the vertical direction, A body 100 having a guide groove 114 having a length in a vertical direction on an outer surface thereof;
A horizontal plate 220 bent perpendicularly from the upper end of the vertical plate 210 and seated on the upper surface of the upper plate 120; The side plates 110 are bent at right angles to both ends of the vertical plate 210 so as to cover a part of the outer side surfaces of the pair of side plates 110. The ends of the pair of side plates 110 are inserted into the guide grooves 114, A lid 200 having a guide vane 230 on which a slidable receiving protrusion 232 is formed; The magazine for semiconductor loading according to claim 1,
Both the body 100 and the lid 200 are made of magnesium alloy,
At least one groove is formed in the side plate 110 and the top plate 120,
The loading slots 112 are formed at equal intervals over the entire inner surface of the side plate 110, both ends of the loading slots 112 are formed to have an extended structure,
Openings 102 are formed on both sides of the upper plate 120 in the front-rear direction. The horizontal plate 220 is formed to cover the entire openings 102,
Wherein the lid (200) is provided in pairs so as to cover the front side and the rear side between the pair of side plates (110).

The method according to claim 1,
Wherein the magnesium alloy comprises magnesium (Mg) and contains aluminum (Al) and zinc (Zn) or zinc (Zn) and zirconium (Zr).

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3. The method according to claim 1 or 2,
And a slot (212) having a length in a vertical direction is formed in the vertical plate (210).

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