KR200465474Y1 - Led lighting module - Google Patents

Led lighting module Download PDF

Info

Publication number
KR200465474Y1
KR200465474Y1 KR2020110006025U KR20110006025U KR200465474Y1 KR 200465474 Y1 KR200465474 Y1 KR 200465474Y1 KR 2020110006025 U KR2020110006025 U KR 2020110006025U KR 20110006025 U KR20110006025 U KR 20110006025U KR 200465474 Y1 KR200465474 Y1 KR 200465474Y1
Authority
KR
South Korea
Prior art keywords
guide plate
light guide
led
light
plate
Prior art date
Application number
KR2020110006025U
Other languages
Korean (ko)
Other versions
KR20130000245U (en
Inventor
최현욱
Original Assignee
(주)엘이디스튜디오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)엘이디스튜디오 filed Critical (주)엘이디스튜디오
Priority to KR2020110006025U priority Critical patent/KR200465474Y1/en
Publication of KR20130000245U publication Critical patent/KR20130000245U/en
Application granted granted Critical
Publication of KR200465474Y1 publication Critical patent/KR200465474Y1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/236—Light guides characterised by the shape of the light guide
    • F21S43/239—Light guides characterised by the shape of the light guide plate-shaped
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/242—Light guides characterised by the emission area
    • F21S43/245—Light guides characterised by the emission area emitting light from one or more of its major surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
    • F21S43/235—Light guides
    • F21S43/249—Light guides with two or more light sources being coupled into the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0091—Positioning aspects of the light source relative to the light guide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging

Abstract

본 고안은 인쇄회로기판(PCB) 상에 일렬로 실장된 다수의 엘이디(LED)에서 발생되는 빛을 모두 도광판으로 유도하여 전체 면조명이 균일하고 높은 휘도를 갖도록 구조를 개선한 엘이디 조명모듈에 관한 것으로써,
다수의 엘이디(LED)가 실장되고 각 엘이디를 점등하기 위한 배선이 형성되어 있는 인쇄회로기판과, 상기 엘이디로부터 입사된 빛을 균일한 평면광으로 변환시켜주는 도광판(Light Guide Plate)과, 상기 도광판의 측면에 위치하며 상기 엘이디로부터 입사한 빛을 도광판 방향으로 반사시키는 반사판(Reflector)을 포함하되,
상기 반사판의 반사면에는 상기 엘이디로부터 입사한 빛을 도광판 방향으로 난반사시키는 사각뿔 돌기가 매트릭스 구조로 배치되며, 상기 반사판의 하부면에는 상기 인쇄회로기판에 형성된 홈에 압입 결합되는 기판 고정돌기가 다수 형성되며, 상기 반사판에서 도광판과 결합되는 위치에 상기 도광판에 형성된 홈과 체결 결합되는 도광판 고정돌기가 형성되는 것을 특징으로 한다.The present invention is directed to an LED lighting module that improves the structure of the entire surface lighting to have a uniform and high brightness by inducing all the light generated from a plurality of LED (LED) mounted in a line on a printed circuit board (PCB) to the light guide plate By
A printed circuit board on which a plurality of LEDs are mounted and wires for lighting each LED are formed, a light guide plate for converting light incident from the LED into uniform planar light, and the light guide plate Located at the side of the reflector (Reflector) for reflecting the light incident from the LED in the direction of the light guide plate,
Square pyramidal protrusions for diffusely reflecting light incident from the LED in the direction of the light guide plate are disposed on the reflective surface of the reflective plate, and a plurality of substrate fixing protrusions are press-fitted to grooves formed in the printed circuit board on the lower surface of the reflective plate. And a light guide plate fixing protrusion coupled to a groove formed in the light guide plate at a position where the light guide plate is coupled to the light guide plate.

Description

엘이디 조명모듈{LED LIGHTING MODULE}LED lighting module {LED LIGHTING MODULE}

본 고안은 엘이디 조명모듈에 관한 것으로, 더욱 상세하게는 인쇄회로기판(PCB) 상에 일렬로 실장된 다수의 엘이디(LED)에서 발생되는 빛을 모두 도광판으로 유도하여 전구간에 걸쳐 균일하고 높은 휘도를 갖도록 구조를 개선한 엘이디 조명모듈에 관한 것이다.The present invention relates to an LED lighting module, and more particularly, to induce a light guide plate all the light generated from a plurality of LED (LED) mounted in a line on a printed circuit board (PCB) to uniform and high brightness across the entire The present invention relates to an LED lighting module having an improved structure.

본 고안의 기술적 사상은 차량의 시그널 램프를 포함한 각종 인테리어 분야의 조명에 적용이 가능하다.
The technical idea of the present invention can be applied to lighting of various interior fields including a signal lamp of a vehicle.

일반적으로 차량에는 후진등, 미등(Taillamp), 주차등, 차폭등, 방향지시등, 비상점멸표시등, 브레이크등과 같은 시그널 램프가 장착된다. In general, vehicles are equipped with signal lamps such as reversing lights, taillamps, parking lights, vehicle lights, turn signals, emergency flashing lights and brake lights.

상기 차량의 시그널 램프는 통상적으로 필라멘트 방식의 전구로 이루어지며, 전원이 인가됨에 따라 필라멘트가 가열되고 이에 따라 온도방사가 이루어져 발광하게 된다. 그러나 필라멘트 방식의 시그널 램프는 점등에 따른 응답성이 떨어지는 것은 물론이며 고온 점등으로 인하여 램프 수명이 짧은 단점이 있다.The signal lamp of the vehicle is generally made of a filament-type light bulb, and the filament is heated as the power is applied, thereby causing the temperature radiation to emit light. However, the filament-type signal lamp has a disadvantage in that the response of the lighting is poor and the lamp life is short due to the high temperature lighting.

또한, 필라멘트 가열 방식의 시그널 램프는 단일 색상의 표현만 가능하기 때문에, 각기 다른 용도에 맞는 색상을 구현하기 위해서는 램프 표면이나 케이스 자체를 착색해야 하는 단점이 있다.In addition, the signal lamp of the filament heating method can only express a single color, there is a disadvantage that the color of the lamp surface or the case itself must be colored in order to implement a color for different applications.

상기와 같은 문제점을 해결하기 위하여 최근에는 고휘도 엘이디(LED;발광다이오드)를 이용한 시그널 램프가 사용되고 있다.In order to solve the above problems, a signal lamp using a high brightness LED (LED) is recently used.

종래 기술에 의한 엘이디를 이용한 차량용 시그널 램프는 칩으로 된 엘이디 램프가 종횡으로 매트릭스 구조로 배열되어 프레임에 장착되는 구조로서, 각각의 엘이디 램프에서 조사된 빛이 하나의 발광을 이루도록 구현된다. The vehicle signal lamp using the LED according to the prior art is a structure in which the LED lamps made of chips are arranged in a matrix structure in a vertical and horizontal direction and mounted on a frame, and the light irradiated from each LED lamp achieves one light emission.

상기와 같은 엘이디를 이용한 차량용 시그널 램프는 점등 동작의 응답성이 뛰어나며 필라멘트 방식의 것에 비하여 수명이 길다는 장점이 있다.The vehicle signal lamp using the LED as described above has an advantage in that the response of the lighting operation is excellent and the service life is longer than that of the filament method.

그러나 종래의 엘이디가 매트릭스 형태로 배열되는 시그널 램프는 각각의 엘이디에서 발생되는 빛의 밝기가 다를 수 있기 때문에 전체 면조명으로 볼 때 휘도가 균일하지 않게 되는 문제점이 있다.However, the signal lamps in which the conventional LEDs are arranged in a matrix form have a problem in that luminance is not uniform when viewed in the entire surface light because the brightness of light generated from each LED may be different.

또한, 매트릭스 형태로 배열되는 시그널 램프 구조에서는 다른 운전자나 보행자에게 직접적으로 빛이 방사되며, 이러한 것이 차량 사고의 원인이 될 수도 있다.
In addition, in the signal lamp structure arranged in a matrix form, light is emitted directly to other drivers or pedestrians, which may cause a vehicle accident.

본 고안은 상기한 종래 기술의 내용을 토대로 그 문제점을 해결하기 위하여 안출된 것으로서, 그 목적은 인쇄회로기판(PCB) 상에 실장된 각 엘이디(LED)에서 발생되는 빛을 도광판으로 유도하여 전체 면조명이 균일하고 높은 휘도를 갖도록 하는 엘이디 조명모듈을 제공하는데 있다.The present invention has been made to solve the problem based on the above-described prior art, the purpose is to guide the light generated from each LED (LED) mounted on a printed circuit board (PCB) to the light guide plate, the entire surface An object of the present invention is to provide an LED lighting module that enables illumination to have a uniform and high luminance.

또한, 본 고안의 다른 목적은 엘이디에서 발생된 빛을 도광판으로 유도하는 반사판의 형상을 개선하여 난반사가 이루어지도록 하여 더욱 높은 휘도를 갖도록 하는 엘이디 조명모듈을 제공하는데 있다.In addition, another object of the present invention is to provide an LED lighting module having a higher brightness by improving the shape of the reflector to guide the light generated by the LED to the light guide plate to achieve diffuse reflection.

또한, 본 고안의 또 다른 목적은 도광판의 내부에 메탈릭파우더(metallic powder)를 함유하도록 하여 반사입자로서 작용하여 난반사가 이루어져 조명효율을 높일 수 있도록 하는 엘이디 조명모듈을 제공하는데 있다.In addition, another object of the present invention is to provide an LED lighting module to contain a metallic powder (metallic powder) in the light guide plate to act as reflecting particles to diffuse the reflection to increase the lighting efficiency.

그러나 본 고안의 목적은 상기에 언급된 목적으로 제한되지 않으며, 언급되지 않은 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.
However, the object of the present invention is not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

상기의 목적을 달성하기 위한 본 고안의 특징에 따르면,According to a feature of the present invention for achieving the above object,

다수의 엘이디(LED)가 실장되고 각 엘이디를 점등하기 위한 배선이 형성되어 있는 인쇄회로기판과,A printed circuit board on which a plurality of LEDs are mounted, and wirings for lighting each LED are formed;

상기 엘이디로부터 입사된 빛을 균일한 평면광으로 변환시켜주는 도광판(Light Guide Plate)과,A light guide plate for converting light incident from the LED into uniform plane light;

상기 도광판의 측면에 위치하며 상기 엘이디로부터 입사한 빛을 도광판 방향으로 반사시키는 반사판(Reflector)을 포함하여 구성되는 것을 특징으로 하는 엘이디 조명모듈을 제공한다.The LED lighting module is positioned on the side of the light guide plate and comprises a reflector (Reflector) for reflecting the light incident from the LED in the direction of the light guide plate.

이때, 본 고안의 부가적인 특징에 따르면, 상기 도광판의 내부에는 메탈릭파우더(metallic powder)로 이루어진 반사입자가 함유되며, At this time, according to an additional feature of the present invention, the light guide plate contains a reflective particle made of a metallic powder (metallic powder),

상기 도광판의 후면에는 요철 또는 v자 홈이 가공되어 난반사를 일으키는 것이 바람직하다.It is preferable that irregularities or v-shaped grooves are processed on the rear surface of the light guide plate to cause diffuse reflection.

이때, 본 고안의 부가적인 특징에 따르면, 상기 반사판의 반사면에는 상기 엘이디로부터 입사한 빛을 도광판 방향으로 난반사시키는 사각뿔 돌기가 매트릭스 구조로 배치되며,At this time, according to an additional feature of the present invention, a square pyramidal protrusion for diffusely reflecting light incident from the LED in the direction of the light guide plate is disposed on the reflective surface of the reflective plate,

상기 반사판의 하부면에는 상기 인쇄회로기판에 형성된 홈에 압입 결합되는 기판 고정돌기가 다수 형성되며,A plurality of substrate fixing protrusions are press-fitted into grooves formed in the printed circuit board on the lower surface of the reflecting plate,

상기 반사판에서 도광판과 결합되는 위치에 상기 도광판에 형성된 홈과 체결 결합되는 도광판 고정돌기가 형성되는 것이 바람직하다.
The light guide plate fixing protrusion coupled to the groove formed in the light guide plate may be formed at a position where the light guide plate is coupled to the light guide plate.

이상과 같은 본 고안의 엘이디 조명모듈을 적용하면, 인쇄회로기판(PCB) 상에 실장된 각 엘이디(LED)에서 발생되는 빛을 도광판으로 유도하여 전체 면조명이 균일하고 높은 휘도를 갖도록 하는 효과가 있다.Applying the LED lighting module of the present invention as described above, by inducing the light generated in each LED (LED) mounted on a printed circuit board (PCB) to the light guide plate has the effect that the entire surface illumination has a uniform and high brightness have.

또한, 엘이디에서 발생된 빛을 도광판으로 유도하는 반사판의 형상을 개선하여 난반사가 이루어지도록 하여 더욱 높은 휘도를 갖도록 하는 효과가 있다.In addition, by improving the shape of the reflector to guide the light generated by the LED to the light guide plate has the effect of having a higher luminance by the diffuse reflection is made.

또한, 도광판의 내부에 반사입자를 함유하도록 하여 난반사가 이루어져 조명효율을 높일 수 있도록 하는 효과가 있다.
In addition, there is an effect that can be reflected by the reflection particles contained in the light guide plate to increase the lighting efficiency.

도 1 내지 도 3은 본 고안의 바람직한 실시예에 의한 엘이디 조명모듈의 구성을 설명하기 위한 도면이다.
도 4는 본 고안의 바람직한 실시예에서 반사판의 구조를 설명하기 위한 도면이다.
도 5는 본 고안에 의한 엘이디 조명모듈가 차량용 미등(taillamp)에 적용된 상태를 나타내는 도면이다.1 to 3 is a view for explaining the configuration of the LED lighting module according to a preferred embodiment of the present invention.
4 is a view for explaining the structure of the reflector in a preferred embodiment of the present invention.
5 is a view showing a state in which the LED lighting module according to the present invention is applied to a taillamp for a vehicle.

이하, 본 고안의 목적 달성을 위한 실시예를 상세히 설명하고자 한다.Hereinafter, embodiments for achieving the purpose of the present invention will be described in detail.

그러나, 본 고안의 명세서에서 제시되는 실시예에 의하여 본 고안의 범위가 한정되는 것은 아니며, 본 고안이 속하는 기술분야에서 통상의 지식을 가진 자에 의하여 본 고안의 기술사상과 아래에 기재될 특허청구범위의 균등범위 내에서 다양한 수정 및 변형 가능한 것으로 이해되어야 할 것이다.However, the scope of the present invention is not limited by the embodiments presented in the specification of the present invention, and the technical idea of the present invention and claims to be described below by those skilled in the art to which the present invention belongs. It is to be understood that various modifications and variations are possible within the scope of equivalents.

첨부도면 도 1 내지 도 3은 본 고안의 바람직한 실시예에 의한 엘이디 조명모듈의 구성을 설명하기 위한 도면이고, 도 4는 본 고안의 바람직한 실시예에서 반사판의 구조를 설명하기 위한 도면이며, 도 5는 본 고안에 의한 엘이디 조명모듈가 차량용 미등(taillamp)에 적용된 상태를 나타내는 도면이다.1 to 3 are views for explaining the configuration of the LED lighting module according to a preferred embodiment of the present invention, Figure 4 is a view for explaining the structure of the reflector in a preferred embodiment of the present invention, Figure 5 Is a view showing a state in which the LED lighting module according to the present invention is applied to the taillight of the vehicle.

상기 각 첨부도면에 도시된 바와 같이, 본 고안의 바람직한 실시예에 의하면 엘이디 조명모듈은, 인쇄회로기판(PCB)(10), 엘이디(LED)(20), 도광판(30) 및 반사판(40) 등을 포함하여 구성된다.As shown in the accompanying drawings, according to a preferred embodiment of the present invention, the LED lighting module, a printed circuit board (PCB) 10, LED (LED) 20, the light guide plate 30 and the reflecting plate 40 And the like.

상기 인쇄회로기판(10)에는 다수의 엘이디(20)가 실장되기 위한 홀(hole)과 배선이 형성되어 있다. 상기 인쇄회로기판(10)에 대하여는 일반적인 것을 이용하는 것이 가능하므로 그 설명을 생략한다.The printed circuit board 10 is provided with holes and wirings for mounting a plurality of LEDs 20. Since the printed circuit board 10 can be used in general, description thereof will be omitted.

또한, 상기 엘이디(20)는 칩 엘이디(chip LED)를 사용하는 것이 바람직하나, 일반적인 엘이디의 사용도 가능하다. 상기 엘이디(20)에 대하여도 일반적인 것을 이용하는 것이 가능하므로 그 설명을 생략한다.In addition, the LED 20 is preferably a chip LED (chip LED), it is also possible to use a general LED. Since the general thing can be used also about the said LED 20, the description is abbreviate | omitted.

상기 도광판(Light Guide Plate)(30)은 엘이디(20)로부터 입사된 빛을 균일한 평면광으로 변환시켜주는 역할을 하며, 주로 플라스틱 재질을 사용하는데 흔히 아크릴이라고 부르는 폴리메타크릴산메틸(PMMA : polymethyl methacrylate)을 사용하는 것이 가장 바람직하나, PC(poly carbonate)의 사용도 가능하다.The light guide plate 30 converts the light incident from the LED 20 into uniform plane light, and mainly uses a plastic material. Polymethyl methacrylate (PMMA: It is most preferable to use polymethyl methacrylate, but it is also possible to use polycarbonate (PC).

첨부도면에 도시된 바와 같이, 상기 도광판(30)에서 휘도가 높아지도록 하기 위하여 메탈릭파우더(metallic powder)로 이루어진 반사입자(35)를 함유하도록 하여 난반사가 이루어지도록 한다.As shown in the accompanying drawings, in order to increase the brightness in the light guide plate 30 to contain the reflective particles 35 made of metallic powder (reflective reflection) is to be made.

본 고안의 다른 실시예에 의하면, 상기 도광판(30)에서 난반사가 이루어지도록 하기 위한 방식으로써, 상기 도광판(30)의 하부에 난반사용 잉크를 인쇄하여 난반사를 일으키는 인쇄방식과, 상기 도광판(30)의 후면에 요철을 만들어 난반사를 일으키는 금형방식과, 상기 도광판(30)의 후면에 v자 홈을 가공하여 난반사를 일으키는 v-cut방식이 모두 적용 가능하다.According to another embodiment of the present invention, a method for causing diffuse reflection in the light guide plate 30, a printing method for causing diffuse reflection by printing ink for use under the light guide plate 30, and the light guide plate 30 The mold method of making irregular reflection on the rear surface of the mold and the v-cut method of processing the v-shaped groove on the rear surface of the light guide plate 30 to produce diffuse reflection are applicable.

또한, 본 고안의 다른 실시예에 의하면, 상기 도광판(30)은 투명 아크릴에 다양한 색상을 넣어서 사용이 가능하며, 문자 등을 음각 또는 양각으로 넣어서 문자가 발광할 수 있도록 하여 다양한 효과를 연출할 수 있다.In addition, according to another embodiment of the present invention, the light guide plate 30 can be used by putting a variety of colors in the transparent acrylic, it is possible to produce a variety of effects by allowing the characters to emit light by engraved or embossed letters. .

상기 반사판(Reflector)(40)은 상기 도광판(30)의 측면에 위치하며, 엘이디(20)로부터 입사한 빛을 도광판(30) 방향으로 반사시켜 광이용 효율을 높여 주며, 또한 입사광 전체의 반사량을 조절하여 상기 도광판(30)의 출광면 전체가 균일한 휘도분포를 가지도록 하는 역할을 한다.The reflector 40 is positioned at the side of the light guide plate 30, and reflects light incident from the LED 20 in the direction of the light guide plate 30 to increase the light utilization efficiency and to increase the reflection of the entire incident light. By adjusting it serves to make the entire light emitting surface of the light guide plate 30 has a uniform luminance distribution.

이때, 상기 반사판(40)의 반사면에는 사각뿔 돌기(42)가 매트릭스 구조로 배치되어 난반사를 통해 휘도를 높이도록 한다.At this time, the square pyramid protrusion 42 is arranged in a matrix structure on the reflecting surface of the reflecting plate 40 to increase luminance through diffuse reflection.

또한, 상기 반사판(40)에서 상기 인쇄회로기판(10)과 대향되는 면에는 기판 고정돌기(44)가 다수 형성되어 상기 인쇄회로기판(10)에 형성된 홈에 압입 결합된다.In addition, a plurality of substrate fixing protrusions 44 may be formed on a surface of the reflective plate 40 that faces the printed circuit board 10, and may be press-fit to a groove formed in the printed circuit board 10.

또한, 상기 반사판(40)에는 도광판(30)과 결합되는 도광판 고정돌기(46)가 형성되어 상기 도광판(30)에 형성된 홈과 체결 결합되도록 함으로써 상기 반사판(40)과 도광판(30)이 서로 지지되도록 한다.In addition, the reflective plate 40 is formed with a light guide plate fixing protrusion 46 coupled to the light guide plate 30 to be coupled to a groove formed in the light guide plate 30 so that the reflective plate 40 and the light guide plate 30 support each other. Be sure to

상기와 같이 구성된 본 고안의 엘이디 조명모듈을 차량용 미등에 적용하는 경우에 첨부도면 도 5에 도시된 바와 같이, 다수의 엘이디 조명모듈을 배치하여 구성할 수 있다. 이 경우에 다수의 엘이디가 차량의 상태에 따라 점등되는 개수가 변경되어 그 밝기가 달라질 수 있다.When the LED lighting module of the present invention configured as described above is applied to a tail light for a vehicle, as shown in FIG. 5, a plurality of LED lighting modules may be disposed. In this case, the number of lights of the plurality of LEDs is changed according to the state of the vehicle, and the brightness thereof may be changed.

상기와 같은 구성을 갖는 본 고안에 의한 엘이디 조명모듈의 동작을 설명하면 다음과 같다.Referring to the operation of the LED lighting module according to the present invention having the configuration as described above are as follows.

먼저, 상기 인쇄회로기판(10)에 실장된 다수의 엘이디(20)에 전원이 인가됨에 따라 엘이디(20)의 점등이 이루어진다. 이때, 상기 엘이디(20)는 상기 도광판(30) 하부에 위치하는 것과 그 영역을 벗어나는 것으로 구분된다.First, the LED 20 is turned on as power is applied to the plurality of LEDs 20 mounted on the printed circuit board 10. In this case, the LED 20 is classified into being positioned below the light guide plate 30 and out of the area.

상기 도광판(30) 하부에 위치하는 엘이디(20)로부터 발생된 빛은 직접 상기 도광판(30)으로 진행되고, 상기 도광판(30)의 영역을 벗어나는 엘이디(20)로부터 발생된 빛은 상기 반사판(40)을 거쳐 상기 도광판(30)으로 진행된다.The light generated from the LED 20 positioned below the light guide plate 30 is directly directed to the light guide plate 30, and the light generated from the LED 20 outside the light guide plate 30 is transferred to the reflector plate 40. ) And proceeds to the light guide plate 30.

상기 도광판(30)에서는 반사입자(35)에 의해 난반사가 이루어져 그 휘도를 더 높이게 된다.In the light guide plate 30, diffuse reflection is performed by the reflective particles 35 to further increase the luminance.

상기 반사판(40)에서의 동작을 좀더 설명하면, 상기 도광판(30)의 영역을 벗어나는 엘이디(20)는 상기 인쇄회로기판(10)에 납땜으로 실장이 이루어지는데 소정 높이 만큼 돌출되게 되고, 그 엘이디(20)로부터 발생된 빛은 위쪽으로 진행하게 되는데 상기 반사판(40)에 의해 도광판(30)의 측면 방향으로 90도 반사되게 된다.The operation of the reflective plate 40 will be described in more detail. The LED 20 outside the region of the light guide plate 30 is mounted on the printed circuit board 10 by soldering, and the LED 20 protrudes by a predetermined height. Light generated from the 20 is directed upward and is reflected by the reflecting plate 40 by 90 degrees in the lateral direction of the light guide plate 30.

이때, 상기 도광판(30)으로 입사된 빛은 그 내부에서 진행되면서 광이용 효율을 높여 주게 되는데 다양한 효과가 연출된다.At this time, the light incident on the light guide plate 30 proceeds therein to increase the light utilization efficiency, and various effects are produced.

또한, 상기 반사판(40)의 사각뿔 돌기(42)에 의해 난반사가 이루어져 휘도를 더욱 높이게 된다.In addition, diffuse reflection is made by the square pyramid protrusion 42 of the reflector 40 to further increase the luminance.

한편, 상기 반사판(40)의 기판 고정돌기(44)는 상기 인쇄회로기판(10)에 형성된 홈에 압입 결합되어 고정시키는 기능을 수행하게 되는데, 분리가 가능하기 때문에 특정 엘이디(20)의 고장시 수리가 용이하게 된다.On the other hand, the substrate fixing projections 44 of the reflecting plate 40 performs a function of press-fitting and fixing the grooves formed in the printed circuit board 10, since it is possible to separate the failure of the specific LED 20 Repair is easy.

또한, 상기 반사판(40)의 도광판 고정돌기(46)는 상기 도광판(30)에 형성된 홈과 체결 결합되어 상기 반사판(40)과 도광판(30)이 서로 지지되도록 한다.
In addition, the light guide plate fixing protrusion 46 of the reflector plate 40 is coupled to a groove formed in the light guide plate 30 so that the reflector plate 40 and the light guide plate 30 are supported by each other.

Claims (3)

다수의 엘이디(LED)가 실장되고 각 엘이디를 점등하기 위한 배선이 형성되어 있는 인쇄회로기판과, 상기 엘이디로부터 입사된 빛을 균일한 평면광으로 변환시켜주는 도광판(Light Guide Plate)과, 상기 도광판의 측면에 위치하며 상기 엘이디로부터 입사한 빛을 도광판 방향으로 반사시키는 반사판(Reflector)을 포함하는 엘이디 조명모듈에 있어서,
상기 반사판의 반사면에는 상기 엘이디로부터 입사한 빛을 도광판 방향으로 난반사시키는 사각뿔 돌기가 매트릭스 구조로 배치되며,
상기 반사판의 하부면에는 상기 인쇄회로기판에 형성된 홈에 압입 결합되는 기판 고정돌기가 다수 형성되며,
상기 반사판에서 도광판과 결합되는 위치에 상기 도광판에 형성된 홈과 체결 결합되는 도광판 고정돌기가 형성되는 것을 특징으로 하는 엘이디 조명모듈.
A printed circuit board on which a plurality of LEDs are mounted and wires for lighting each LED are formed, a light guide plate for converting light incident from the LED into uniform planar light, and the light guide plate In the LED lighting module comprising a reflector (Reflector) positioned on the side of the reflecting light incident from the LED in the direction of the light guide plate,
Square pyramidal protrusions for diffusely reflecting light incident from the LED in the direction of the light guide plate are arranged on the reflective surface of the reflective plate in a matrix structure.
A plurality of substrate fixing protrusions are press-fitted into grooves formed in the printed circuit board on the lower surface of the reflecting plate,
LED lighting module, characterized in that the light guide plate fixing projection which is coupled to the groove formed in the light guide plate is coupled to the light guide plate in the reflection plate is formed.
제 1 항에 있어서,
상기 도광판의 내부에는 메탈릭파우더(metallic powder)로 이루어진 반사입자가 함유되며,
상기 도광판의 후면에는 요철 또는 v자 홈이 가공되어 난반사를 일으키는 것을 특징으로 하는 엘이디 조명모듈.
The method of claim 1,
Inside the light guide plate contains reflective particles made of metallic powder (metallic powder),
LED lighting module, characterized in that irregularities or v-shaped grooves are processed on the rear surface of the light guide plate to cause diffuse reflection.
삭제delete
KR2020110006025U 2011-07-01 2011-07-01 Led lighting module KR200465474Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020110006025U KR200465474Y1 (en) 2011-07-01 2011-07-01 Led lighting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020110006025U KR200465474Y1 (en) 2011-07-01 2011-07-01 Led lighting module

Publications (2)

Publication Number Publication Date
KR20130000245U KR20130000245U (en) 2013-01-09
KR200465474Y1 true KR200465474Y1 (en) 2013-02-20

Family

ID=51356196

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020110006025U KR200465474Y1 (en) 2011-07-01 2011-07-01 Led lighting module

Country Status (1)

Country Link
KR (1) KR200465474Y1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000258749A (en) 1999-03-08 2000-09-22 Nitto Denko Corp Surface light source device and liquid crystal display device
JP4717874B2 (en) 2006-09-21 2011-07-06 シャープ株式会社 Backlight device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000258749A (en) 1999-03-08 2000-09-22 Nitto Denko Corp Surface light source device and liquid crystal display device
JP4717874B2 (en) 2006-09-21 2011-07-06 シャープ株式会社 Backlight device

Also Published As

Publication number Publication date
KR20130000245U (en) 2013-01-09

Similar Documents

Publication Publication Date Title
EP3076069B1 (en) Light device of vehicle
CN1738991A (en) Lamp for vehicle
US10060590B2 (en) Light ring structure for vehicle lamp
KR20220123190A (en) Light device of vehicle
KR100860401B1 (en) rear lamp for leading vehicles using LED
CN112208460A (en) Luminous vehicle logo
JP3162954U (en) Light emitting module
KR20110088130A (en) The two-sided illumination led lenses and led modules and led two-sided illuminating systems which use this
KR102497470B1 (en) Lighting package and Automobile lamp using the same
CN202065739U (en) LED (Light-Emitting Diode) panel lamp
KR200465474Y1 (en) Led lighting module
KR102130164B1 (en) LED traffic surface emitting lights with high efficiency and visibility
CN213930761U (en) Vehicle lamp module with directly packaged flexible chip
KR100801923B1 (en) A light apparatus for vehicle
US20130135853A1 (en) Light-guiding element, light-emitting diode lamp tube and illumination lamp
CN102635798A (en) LED plane light source
JP2023517557A (en) Lighting module and lighting device provided with the same
KR100777779B1 (en) Lamp for automobile
CN201302123Y (en) Illuminating module structure
CN216346023U (en) Lighting lamp and lighting system
CN103672725A (en) Illuminating shade and lighting device
KR200413480Y1 (en) Illuminator for a automobile
CN211780864U (en) Lens assembly and illuminating lamp
CN217273896U (en) Ellipsoidal light module with softened double light gradients
CN110914587A (en) Multi-surface light-emitting illumination member and three-dimensional illumination device using same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20151203

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20161209

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20171201

Year of fee payment: 6