KR200422021Y1 - a sandpaper having a cushion - Google Patents

Abstract

The present invention relates to a buffered sandpaper, which is provided with an abrasive to form a buffer layer on the sanding layer that polishes the surface of the polished body, and the sanding layer is closely adhered to the polished body by pressurizing the buffer layer, thereby significantly improving polishing workability and polishing work. It relates to a buffer sandpaper that can be performed effectively.

Therefore, the buffer sandpaper of the present invention includes a sanding layer (110) having a powdery abrasive (111) in the bottom surface and polishing the abrasive (111) in close contact with the polishing object; An adhesive layer 120 formed in a layer form by applying an adhesive material on the sanding layer 110; Including a buffer layer 130 for forming a cushioning member 131 having a cushion to be bonded to the adhesive layer 120 to contact the abrasive 111 of the sanding layer 110 to the abrasive body by pressing the buffer member 131. Configure.

Abrasives, adhesives, buffer members

Description

Sandpaper having a cushion member {a sandpaper having a cushion}

1 is a perspective view showing a conventional sandpaper.

2 is a perspective view showing a sandpaper of the present invention.

3 is an exploded perspective view showing a sandpaper of the present invention.

Figure 4 is a bottom perspective view of the sandpaper of the present invention.

5 is a cross-sectional view showing a sandpaper of the present invention.

Explanation of symbols on the main parts of the drawings

100: buffer sandpaper 110: sanding layer

111: abrasive 120: adhesive layer

130: buffer layer 131: buffer member

The present invention relates to a buffered sandpaper, and more particularly, to form a cushioning layer having a cushion on the sanding layer in which the abrasive is formed, so that the abrasive of the sanding layer adheres to the working surface of the polished body and improves workability significantly. The present invention relates to a sandpaper having a cushioning member that can be effectively performed.

In general, sand paper for polishing the surface of the polished object is composed of a flat substrate made of paper or cloth and an abrasive applied to the flat substrate. Silicon carbide is mainly used as the abrasive, which is referred to as carborundum in the trade name. The chemical formula is SiC, and in 1891 EG Archerson discovered a sparkling substance when he heated a mixture of coke and clay with carbon arc to artificially make diamonds, meaning carborundum (a compound of carbon and corundum, or alumina). Carborundum Co., Ltd. was established and produced.

The main property of the abrasive is pure, colorless transparent hexagonal plate crystals, which have a melting point of 2,700 ° C or more and sublimate at 2,200 ° C. It is usually brown or black crystal due to impurities, and the hardness is between ruby and diamond and insoluble in water and acid. Chemically extremely inert, it oxidizes rapidly when heated to 1,750 ° C in air. It is stable to aqua regia, but is slowly decomposed by fusion alkali.

The manufacturing method of the said abrasive is made through the direct current through the mixture of silica SiO2, carbon, such as pitch coke or petroleum coke, and using the heat of resistance. The reaction time of SiO2 + 3C → SiC + 2CO is 10-30 hours, the temperature is 1800-1900 ° C, and when it is 2000 ° C or more, SiC decomposes again. After the reaction is completed, it is left to cool, pulverized and washed with water to obtain a product.

This sandpaper 1 has a predetermined thickness (t) as shown in Figure 1 and its shape forms a square including a square, one side of the sandpaper on the back surface of the processing surface (1a) coated with the abrasive 10 The printing surface which displays a manufacturing company etc. is formed.

Here, the grain size of the sand paper varies depending on the abrasive 10 and the particle size refers to the size of the abrasive 10.

Sandpaper 1 as described above has the advantage of excellent versatility without restrictions on use except to distinguish between metal and non-metal.

However, such sandpaper has caused an uncomfortable problem of gripping sandpaper, which needs to be carried out by gripping a portion of the back surface of sandpaper coated with abrasive material on a thin paper or cloth with the bottom of a worker's hand or finger.

In addition, since the abrasive is coated on a thin paper or cloth, when it is gripped by the bottom of the hand or finger, the processing surface of the sandper does not adhere to the polished body as a whole, but only the bottom of the hand or the finger of the worker adheres to the polishing work. There was a problem.

In addition, the bottom of the hand should hold the sandpaper with the back of the finger, so that the worker's hand slips frequently from the back during polishing, so that the grinding work is not smooth and the worker's hand does not slip from the back. In order to grab the back of the sand paper tightly, an uncomfortable problem occurred.

In this way, the processing surface of the sandpaper is not in close contact with the polished body as a whole, the operator's hand keeps sliding from the back side, the work time is slow and the work efficiency is deteriorated.

In addition, such sandpaper is formed of thin paper or cloth and dried during storage or polishing, so that the contact area between the sandpaper processing surface and the polished body is small and the working time is slow, and the sandpaper must be polished while spreading the dried sandpaper. As a result, the work efficiency was reduced and the grinding work was inconvenient.

Therefore, in the buffer sandpaper of the present invention for solving the above problems, when the operator presses the buffer layer by forming a cushioning layer having a cushion on the sanding layer formed abrasive, the abrasive is in close contact with the surface of the abrasive body to the surface of the abrasive body It is to provide a buffer sandpaper that can smoothly end the year.

Another object of the present invention is to provide a cushioning layer having a cushioning force in the sanding layer on which the abrasive is formed, so that the sanding layer does not slip out of the operator's hand during the polishing operation so as to smoothly polish the surface of the abrasive body. To provide.

Another object of the present invention is to provide a buffered sand paper which can smoothly polish the sanding layer during sandpaper storage or sanding during sandpaper storage of the sanding layer on which the abrasive is formed.

Another object of the present invention is to provide a buffered sandpaper that can grind and prevent the force of gripping the sanding layer and the fingers of the operator for a long time.

The buffer sandpaper of the present invention for achieving the above object comprises a sanding layer having a powder-like abrasive on the bottom surface and polishing the abrasive in close contact with the abrasive; An adhesive layer formed in a layer form by applying an adhesive material on the sanding layer; It characterized in that it comprises a buffer layer for forming a cushioning member having a cushion to be bonded to the adhesive layer on top of the adhesive layer to adhere the abrasive of the sanding layer to the polished body by pressing the buffer member.

Hereinafter, a sandpaper preferred embodiment of the present invention will be described in detail with reference to the drawings.

Figure 2 is a perspective view showing a buffer sandpaper of the present invention, Figure 3 is an exploded perspective view showing a buffer sandpaper of the present invention, Figure 4 is a bottom perspective view of the buffer sandpaper of the present invention, Figure 5 shows a buffered sandpaper of the present invention It is a cross section.

As shown in Figure 2 to Figure 5, the buffer sandpaper 100 of the present invention is provided with a sanding layer 110 for polishing the abrasive 111 in close contact with the abrasive to be provided with an abrasive 111 in the form of powder; An adhesive layer 120 formed in a layer form by applying an adhesive material on the sanding layer 110; Including a buffer layer 130 for forming a cushioning member 131 having a cushion to be bonded to the adhesive layer 120 to contact the abrasive 111 of the sanding layer 110 to the abrasive body by pressing the buffer member 131. Configure.

The sanding layer 110 is formed in a square, a square or the like in the same manner as the normal sand paper (1).
Here, the abrasive 111 in the form of a powder is formed on one surface of the sanding layer 110 so as to polish the object to be polished.
In addition, the particle size of the sanding layer 110 is determined according to the size of the abrasive 111.

The adhesive layer 120 is formed by applying an adhesive material having an adhesive force to the back surface of the sanding layer 110 on which the abrasive 111 is formed.

The buffer layer 130 forms a buffer member 131 having a predetermined cushion.
Here, the buffer member 131 is attached to the upper portion of the adhesive layer 120, in this case, it is preferable to form the same as the shape and size of the sanding layer (110).

Further, the buffer member 131 may be variously formed of rubber, foamed urethane, sponge, or the like, but is not limited thereto.

In addition, the cushioning member 131 may be laminated with a plurality of cushioning members 131 of different materials.

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The use state of the buffer sandpaper 100 of the present invention is as follows.

First, the operator selects the buffered sandpaper 100 in which the sanding layer 110 having a particle size suitable for the polishing operation of the abrasive is formed according to the material and the degree of processing of the abrasive.

Next, when the particle size of the sanding layer 110 is determined, the polishing operation of the surface to be polished is performed.

Here, the sanding layer 110 coated with the abrasive 111 by the buffer member 131 of the buffer layer 130 is in close contact with the surface of the polished body without being curled.
At this time, the sanding layer 110 is not curled so that the area where the abrasive 111 of the sanding layer 110 is in contact with the non-soft wave body is largely formed, and the operator applies a force to the buffer member 131 to reciprocate the surface of the polished body. Proceed with polishing while doing.
In addition, the adhesion of the operator's hand is improved by the buffer member 131, so that the operator's hand does not slip on the buffer sandpaper 100 and is polished.

The present invention can be substituted, modified and changed in various ways without departing from the technical spirit of the present invention for those of ordinary skill in the art to which the present invention pertains to the above-described embodiments and drawings It is not.

As described above, the sandpaper according to the present invention has a buffer member having a buffering force formed on the back surface of the sandpaper, and thus the operator's hand is in close contact with the buffer member.

In addition, even if an operator presses a portion of the cushioning member, the working surface of the sandpaper is closely adhered to the surface of the to-be-polished body by the buffering member, thereby producing an effect of smooth polishing.

In addition, since the operator's hand is in close contact with the cushioning member, the operator's hand is not slipped by the buffering force of the buffer member during the polishing operation, resulting in an smooth polishing operation.

In this way, the processing surface of the sand paper is in close contact with the to-be-polished body by the cushioning member, and the hand of the worker is not slipped, thereby improving the work efficiency and reducing the working time.

In addition, the cushioning member is formed on the back surface of the sand paper as a whole prevents the phenomenon of drying during storage or polishing, and also improves the work efficiency, thereby reducing the production cost of the abrasive.

In addition, the force required to grip the sandpaper by the buffering force of the buffer member is small, even if the grinding work for a long time, the force of the finger of the operator is small due to the buffering force of the buffer member.

Claims (1)

A sanding layer (110) provided with a powdered abrasive (111) on its bottom surface to bring the abrasive (111) into close contact with the abrasive to be polished; An adhesive layer 120 formed in a layer form by applying an adhesive material on the sanding layer 110; Including a buffer layer 130 for forming a cushioning member 131 having a cushion to be bonded to the adhesive layer 120 to contact the abrasive 111 of the sanding layer 110 to the abrasive body by pressing the buffer member 131. A buffered sandpaper comprising the same.

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