KR200408503Y1 - Lighting Module for backlighting - Google Patents

Abstract

It is an object of the present invention to provide an optical module for backlight that is easy to replace and repair the module.

To this end, the present invention provides a PCB substrate in which a circuit pattern is woven, and at least one LED group including a red light emitting diode, a green light emitting diode, and a blue light emitting diode mounted on the PCB, the PCB is mounted on the PCB. Provided is an optical module for backlight including a connector for electrically connecting a substrate to a main substrate.

Light Emitting Diode, PCB, Connector, Lens

Description

Lighting module for backlighting

1 is a schematic plan view showing an optical module for a backlight according to an embodiment of the present invention.

2 is a schematic side view illustrating an optical module for a backlight according to an embodiment of the present invention.

3 is a schematic plan view showing an optical module for a backlight according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

10: optical module 11: PCB substrate

12,14 green light emitting diode 13 red light emitting diode

15 blue light emitting diode 16: light emitting diode group

17 connector 18 lens

19: epoxy 20: resistance

The present invention relates to an optical module for backlight used in an imaging device. In more detail, the present invention relates to a backlight optical module composed of Watt-level red, green, and blue light emitting diodes for image reproduction such as TFT-LCD.

As a light source of a conventional TFT-LCD backlight, a cold cathode fluorescent lamp (CCFL) has been mainly used. Increasingly, however, white light emitting diodes (LEDs) are being used in small LCD backlights such as mobile phones and PDFs.

The white light emitting diode has a longer lifespan and a smaller power consumption than a cold cathode fluorescent lamp used in the related art, and does not require an additional device such as an inverter, and can achieve a thinner product. It has the advantage of high color reproducibility and total escape from environmental harmful regulations, and its usage is gradually increasing.

Recently, backlights using red, blue, and green light emitting diodes instead of white light emitting diodes have been used in medium and large size TFT-LCDs because they have excellent color reproducibility compared to backlights using white light emitting diodes.

The red, blue, and green tri-color LEDs used for medium- and large-sized TFT-LCDs emit light from the side of the TFT-LCD, but in this case, not only the lighting guide is required to evenly distribute the three primary colors to the TFT-LCD surface. As the size of the LCD increases, the luminance of the center of the screen decreases. Accordingly, surface emitting backlights are being used in medium and large sizes.

The surface-emitting backlight is a three-watt LED of the primary class, and the red, green, and blue light emitting diodes are uniformly arranged in a metal order, and are used in a line arranged in a calculated order and interval.

However, in the case of the high-brightness LED of the conventional structure as described above, some distance is required between the diffusion sheets of the LCD so that the three primary colors may appear white due to interference, which causes the size of the module to increase.

In addition, as a plurality of light emitting diodes are mounted on one metal PCB, when some of the mounted light emitting diodes have a problem, the metal LEDs should be removed from the LCD to repair the light emitting diode.

In addition, when the LED is directly mounted in the form of a chip on board (COB) in order to facilitate heat dissipation in the metal PCB, sorting of the LED is difficult, and when a problem occurs in the LED, repairing is difficult and inconvenient.

The present invention has been made to solve the above problems, an object of the present invention is to provide an easy-to-repair and convenient optical module for backlight.

In addition, the present invention is to provide a backlight optical module that has a thin film structure to reduce the gap between the PCB and the diffusion sheet.

In order to achieve the above object, the optical module of the present invention includes at least one light emitting diode including a PCB patterned circuit board, a red light emitting diode, a green light emitting diode, and a blue light emitting diode mounted on the PCB. And a connector mounted on the PCB to electrically connect the PCB to the main board.

The PCB may be a metal core PCB or a ceramic PCB.

The metal core PCB substrate is composed of aluminum or copper and has an advantage of obtaining excellent thermal conductivity. The ceramic PCB substrate has a lower thermal conductivity than the metal core PCB substrate, but has a higher thermal conductivity than a general FR4 PCB substrate. The deformation of the form has the advantageous advantage.

In addition, the PCB may be mounted on a metal heat sink to facilitate heat dissipation.

In addition, the light emitting diode group has a relatively high luminance of green to express white color by a combination of three primary colors. For this purpose, the light emitting diode group may include at least one red light emitting diode, two green light emitting diodes, and one blue light emitting diode. have. More preferably, the light emitting diode group is configured such that the luminance of the blue light emitting diode and the red light emitting diode green light emitting diode is 1: 3: 6.

Here, each of the light emitting diodes constituting the light emitting diode group may be arranged in a square shape or in a line, and is not particularly limited in the arrangement structure.

In addition, it is preferable that each of the light emitting diodes is a Watt-class high brightness light emitting diode. This is to reduce the use of a large number of low brightness light emitting diodes with a small number of light emitting diodes.

In the backlight, the light source passes through the diffuser film, the polarizer and the color filter of the LCD panel, and the amount of light emitted to the outside is less than 10% of the initial light source. Therefore, a high brightness light emitting source is required, and a Watt class high brightness light emitting diode is used.

Watt-type high-brightness light emitting diodes used are 0.55mm thick, which can significantly reduce the thickness compared to conventional 5mm or more Watt-level light emitting diodes, which can reduce the distance to the diffusion sheet. This has the advantage of reducing the thickness of the LCD as a result.

In addition, the optical module is formed by molding an epoxy containing a silicon diffusion agent on the light emitting diode group of the PCB substrate to form a mixture of colors in the epoxy to emit white, or by mixing light to form a white to replace the epoxy The thickness of the LCD may be reduced by mounting a dispersible lens on the LED group.

On the other hand, the optical module comprises a large module by mounting a plurality of light emitting diode groups on one PCB according to the size and components of the image medium and a connector for connection with the main substrate on one side of the PCB. can do.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a schematic plan view showing an optical module for a backlight according to an embodiment of the present invention, Figure 2 is a schematic side view showing an optical module for a backlight according to an embodiment of the present invention.

According to the above drawings, the optical module 10 according to the present embodiment includes a PCB (PCB) 11 in which a necessary circuit pattern is woven, a red light emitting diode 13 mounted on the PCB 11, and green light emission. A light emitting diode group 16 including diodes 12 and 14 and a blue light emitting diode 15, a connector mounted on the PCB 11 and electrically connecting the PCB 11 to a main board ( 17) mounted on the PCB 11 and installed on the light emitting diode group 16 and a resistor 20 for preventing overcurrent of each of the light emitting diodes 12, 13, 14, and 15, and mixing and dispersing light. And a lens 18 to make it.

The PCB substrate 11 is a metal PCB substrate 11 is composed of aluminum, copper or a mixture thereof.

The PCB substrate 11 may be made of a ceramic PCB substrate composed of alumina, aluminum nitride, or a mixture thereof in addition to the metal PCB substrate, and may further use a PCB substrate connected by brazing a metal and a ceramic, and is excellent in heat dissipation. The material is not particularly limited.

In the present embodiment, the red, green, and blue light emitting diodes 15 are high power light emitting diodes, which are equivalent to watts, and use a metal frame for easy heat dissipation. An ultra-small light emitting diode of 1.8 mm and 3.2 mm height and 0.55 mm height is used.

In addition, the light emitting diode group 16 includes one red light emitting diode 13, one blue light emitting diode 15, and two green light emitting diodes 12 and 14, and four light emitting diodes are adjacent to each other. It is mounted on one side on the PCB substrate 11 in a shape arranged at each corner of the rectangle.

As shown in FIG. 1, when the green light emitting diode 12 is mounted on the upper left side of the drawing, another green light emitting diode 14 is mounted at a position at the lower right, and red light is emitted at the positions of the upper right and the lower left. Diode 13 or blue light emitting diode 15 is mounted, respectively.

That is, the two green light emitting diodes 12 and 14 are disposed in a diagonal direction, and the remaining red light emitting diodes 13 and the blue light emitting diodes 15 are disposed in a diagonal direction with each other at the remaining positions.

When white is produced using red, blue, and green light emitting diodes, the luminance of blue, red, and green should be approximately 1: 3: 6, and the green light emitting diodes 12 and 14 are prevented from being biased to one side. This is to obtain a natural white color.

In the present embodiment, the light emitted from each of the light emitting diodes is mixed and dispersed through the lens 18 positioned above the light emitting diode group 16 and emitted as white. The lens 18 is sized to cover the light emitting diode group 16 and is mounted on the light emitting diode group 16 and minimizes a distance from the light emitting diode group 16 so as to minimize the distance from the light emitting diode group 16. Minimize the thickness.

In addition, the optical module 10 molds an epoxy 19 in which a silicon diffusion agent is inserted onto the light emitting diode group 16 of the PCB substrate 11 in addition to the structure of mixing and dispersing light through the lens 18. In one structure, the white light may be emitted by mixing light through the epoxy 19.

On the other hand, the connector 17 is used as a male connector or a female connector without particular limitation, and is connected to each light emitting diode of the light emitting diode group 16 through a circuit pattern on the PCB (11).

When the male connector 17 is mounted from above, it is connected to the main board through a connecting cable provided with a female connector 17. It is connected to the main board.

Here, the male connector may be understood as a structure having a protruding pin, for example, and a female connector having a holder into which the pin is inserted.

The connector 17 is preferably made of a minimum size and height to minimize the size of the optical module 10.

As such, red, green, and blue light emitting diodes, which are used as light sources for backlights of medium- and large-sized displays, including TFT-LCDs, are formed on the light emitting diode group 16 and individually connected to the main board through the connector 17 as necessary. The assembly is simple and when a problem occurs, only the light emitting diode group 16 can be easily replaced and repaired.

Meanwhile, FIG. 3 illustrates a structure in which a plurality of light emitting diode groups 16 are mounted by enlarging the size of an optical module for a large area imaging apparatus as another embodiment of the present optical module.

According to the above drawings, the optical module 10 includes a red light emitting diode 13, a green light emitting diode 12, 14, and a blue light emitting diode 15 on a PCB substrate 11 extending in a bar shape. A plurality of diode groups 16 are arranged and spaced apart from each other, and a connector 17 for electrically connecting the PCB substrate 11 to the main substrate is mounted at the end of the PCB substrate 11. .

Each of the LED groups 16 is electrically connected to each other through a circuit pattern of the PCB.

In addition, although not shown, each LED group 16 includes a lens or epoxy for mixing and dispersing light and resistance to prevent overcurrent, as mentioned above.

As described above, according to the backlight module according to the present invention, it is possible to easily connect and assemble on the main board through the connector by modularizing the connector, and to replace only the corresponding module when a failure occurs, so that the module replacement and bad handwriting are easy. There is this.

In addition, sorting of the pre-mounted light emitting diode may be performed, thereby increasing white uniformity.

In addition, by using the light-emitting diode of the minimum Watt-class, it is possible to minimize the distance to the diffusion sheet, it is possible to increase the luminous efficiency.

In addition, heat dissipation can be easily performed by mounting a light emitting diode on a metal PCB and / or a ceramic PCB.

In addition, the distance to the diffusion sheet may be further reduced by molding with an epoxy including a silicon diffusion agent on the red, green, and blue light emitting diodes, or by mounting a lens.

Claims (7)

A PCB substrate in which a circuit pattern is woven; At least one light emitting diode group including a red light emitting diode, a green light emitting diode, and a blue light emitting diode mounted on the PCB; A connector mounted on the PCB and electrically connecting the PCB to the main board Optical module for a backlight comprising a. The method of claim 1, Wherein the PCB is a metal core PCB or / and a ceramic PCB. The method of claim 1, The light emitting diode group includes at least one red light emitting diode, at least two green light emitting diodes, and at least one blue light emitting diode. The method of claim 1, The light emitting diode is a light module of the power class for a backlight, characterized in that the Watt-class high power light emitting diode. The method of claim 3, wherein In the light emitting diode group, each light emitting diode is disposed in a quadrangular shape, and the green light emitting diode is disposed in a diagonal direction. The method of claim 1, An optical module for a backlight, characterized in that the epoxy is molded by inserting a silicon diffusion agent on the light emitting diode group of the PCB. The method of claim 1, The optical module for a backlight, characterized in that the lens is mounted on the light emitting diode group of the PCB to mix and disperse light.

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