KR200408148Y1 - Lighting apparatus for building - Google Patents

Lighting apparatus for building Download PDF

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Publication number
KR200408148Y1
KR200408148Y1 KR2020050032848U KR20050032848U KR200408148Y1 KR 200408148 Y1 KR200408148 Y1 KR 200408148Y1 KR 2020050032848 U KR2020050032848 U KR 2020050032848U KR 20050032848 U KR20050032848 U KR 20050032848U KR 200408148 Y1 KR200408148 Y1 KR 200408148Y1
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South Korea
Prior art keywords
chip
building
lighting device
case
light
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KR2020050032848U
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Korean (ko)
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양현식
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양현식
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Abstract

본 고안은 케이스(10) 내부에 LED나 저항 발광체 등과 같은 칩형 램프(30)를 탑재한 회로기판(20)을 내장하고, 이 칩형 램프(30)의 광원이 면광원 분포로 확산되도록 도광판(50)을 케이스(10) 내부에 고정시켜 칩형 램프(30)의 약한 조도를 도광의 원리로서 면광원 분포로 확산시키면서 출사될 수 있도록 하여 그 밝기를 훨씬 증대시킬 수 있도록 함과 동시에 슬림화 내지는 경단박소화에 크게 기여할 수 있는 건물용 조명장치(100)에 관한 것이다.The present invention incorporates a circuit board 20 equipped with a chip-shaped lamp 30 such as an LED or a resistive light emitting body, etc. in the case 10, and the light guide plate 50 so that the light source of the chip-shaped lamp 30 diffuses into a surface light source distribution. ) Is fixed inside the case 10 so that the weak illuminance of the chip-shaped lamp 30 can be emitted while spreading the surface light source distribution as the principle of light guiding, so that the brightness can be further increased, and at the same time slimming or light weight reduction It relates to a lighting device 100 for a building that can greatly contribute.

Description

건물용 조명장치{LIGHTING APPARATUS FOR BUILDING}Lighting equipment for buildings {LIGHTING APPARATUS FOR BUILDING}

도 1은 본 고안의 실시예에 따른 건물용 조명장치를 나타내는 단면도.1 is a cross-sectional view showing a lighting device for a building according to an embodiment of the present invention.

도 2는 본 고안의 다른 실시예에 따른 건물용 조명장치를 나타내는 단면도.2 is a cross-sectional view showing a lighting device for a building according to another embodiment of the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *       Explanation of symbols on the main parts of the drawings

10 : 케이스 20 : 회로기판10: case 20: circuit board

30 : 칩형 램프 41 : 반사판30: chip lamp 41: reflector

42 : 측면 반사판 50 : 도광판42: side reflector 50: light guide plate

100 : 건물용 조명장치100: building lighting device

본 고안은 건물용 조명장치에 관한 것으로, 보다 상세하게는 케이스 내부에 LED나 저항 발광체 등과 같은 칩형 램프를 탑재한 회로기판을 내장하고 칩형 램프의 광원이 면광원 분포로 확산되도록 도광판을 제공하여 칩형 램프의 약한 조도를 도광의 원리로서 극대화시킬 수 있도록 하면서 더욱 슬림화시킬 수 있는 건물용 조명장치에 관한 것이다.The present invention relates to a lighting device for a building, and more specifically, to a chip type by embedding a circuit board mounted with a chip type lamp such as an LED or a resistive light emitter in a case, and providing a light guide plate so that the light source of the chip type lamp is distributed in a surface light source distribution The present invention relates to a lighting device for buildings that can be made slimmer while maximizing the weak illumination of a lamp as a principle of light guiding.

일반적으로 조명은 광원(光源)을 이용하여 인간생활에 유용하도록 만드는 기술로서 사물과 그 주변을 비추어 보이도록 하는 것, 무대·쇼윈도·레스토랑 등의 분위기를 조성하는 것, 교통신호·네온사인·도로정보표시판 등 정보전달 수단으로 이용하는 것, 살균·가열·건조 등 자외선·적외선 등을 이용하는 것, 물고기나 곤충을 유인하거나 식물재배에 이용하는 등 인간 이외 것을 대상으로 하는 것 등이 있으며, 광원의 종류에 따라 크게 자연조명과 인공조명으로 나눌 수 있다.In general, lighting is a technology that makes light useful for human life by using a light source to illuminate objects and their surroundings, to create an atmosphere such as a stage, show window, restaurant, traffic signal, neon sign, road It is used as information transmission means such as information display boards, ultraviolet rays and infrared rays such as sterilization, heating and drying, etc., and targets other than humans such as attracting fish or insects or using them for plant cultivation. Therefore, it can be divided into natural lighting and artificial lighting.

자연조명에는 태양·달·별·생물발광 등에 의한 빛이 있으나 조명 광원으로 쓰이는 것은 태양뿐이며 이를 보통 자연광이라 하고, 통상적으로 창을 통해 건물 안으로 채광(採光)되곤 한다.Natural lighting includes light from the sun, moon, stars, bioluminescence, etc., but only the sun is used as an illumination light source, which is commonly called natural light, and is usually lighted into a building through a window.

인공조명에는 인공광원에 의한 것으로 보통 전등(電燈)에 의한 조명을 말한다. 모닥불·석유램프 등을 인공광원으로 삼았던 시대에는 야간에 사물을 보고자 한 것이었으나 현재는 밤낮의 구분없이 다양하게 쓰이고 있다. 대부분의 인공광원은 빛의 밝기가 안정되고 일정하므로 정확한 조명설계를 할 수 있다는 이점이 있다.Artificial lighting is caused by an artificial light source and usually means lighting by electric light. In the times when bonfires and oil lamps were used as artificial light sources, people wanted to see things at night, but now they are used in various ways regardless of day or night. Most artificial light sources have the advantage of being able to design precise lighting because the brightness of light is stable and constant.

한편, 인공조명은 인류가 불을 손에 넣음으로써 시작되었다. 긴 세월 동안 인류는 불의 제어법·이용법을 개발해 왔는데 그 과정에서 유지(油脂)가 들어 있는 나무를 태운 횃불, 동물성·식물성 기름을 쓴 램프, 파라핀을 이용한 양초 등이 만들어졌으며 현재 널리 쓰이고 있는 광원은 백열전구·방전등·형광등을 예로 들 수 있다.Artificial lighting, meanwhile, began when mankind took fire. For many years mankind has been developing fire control and use methods, in the process of which wood-burning torches containing oils, lamps with animal and vegetable oils, and candles using paraffin have been made. Examples include bulbs, discharge lamps, and fluorescent lamps.

그런데, 현재의 광원, 즉 백열전구·방전등·형광등과 같은 조명장치는 대부분 부피가 커서 경단박소화에 큰 어려움이 있었다.However, current light sources, that is, lighting devices such as incandescent lamps, discharge lamps, fluorescent lamps, etc., are large in size and have a great difficulty in reducing the short diameter.

이에, 본 고안은 상기 문제점을 극복하기 위하여 안출된 것으로, 그 목적으로 하는 바는 케이스 내부에 LED나 저항 발광체 등과 같은 칩형 램프를 탑재한 회로기판을 내장하고 이 칩형 램프의 광원이 면광원 분포로 확산되도록 도광판을 제공하여 칩형 램프의 약한 조도를 도광의 원리로서 극대화시킴과 동시에 그 부피를 크게 슬림화시킬 수 있는 건물용 조명장치를 제공함에 있다.Accordingly, the present invention has been made to overcome the above problems, and its purpose is to embed a circuit board mounted with a chip-shaped lamp such as an LED or a resistive light-emitting body in a case, and the light source of the chip-shaped lamp has a surface light source distribution. It is to provide a light guide plate to be diffused to maximize the weak illumination of the chip-shaped lamp as the principle of the light guide and at the same time to provide a building lighting device that can significantly reduce the volume.

상기 목적을 달성하기 위한 본 고안은,The present invention for achieving the above object,

케이스와,With the case,

상기 케이스에 내장된 회로기판과,A circuit board embedded in the case;

상기 회로기판에 탑재된 칩형 램프와,A chip lamp mounted on the circuit board,

상기 케이스에 고정되어 칩형 램프의 광원을 면광원 분포로 확산시키는 도광판을 포함하여 이루어지는 것을 그 기술적 구성상의 기본 특징으로 한다.It is a basic feature of the technical configuration that comprises a light guide plate fixed to the case to diffuse the light source of the chip-shaped lamp in the surface light source distribution.

상기 목적을 달성하기 위한 본 고안은,The present invention for achieving the above object,

케이스와,With the case,

상기 케이스에 내장된 회로기판과,A circuit board embedded in the case;

상기 회로기판에 연결된 칩형 램프들과,Chip lamps connected to the circuit board,

상기 칩형 램프들을 수용하는 미러 코팅층과,A mirror coating layer for receiving the chip lamps;

상기 케이스에 고정되어 칩형 램프의 광원을 면광원 분포로 확산시키는 도광판을 포함하여 이루어지는 것을 그 기술적 구성상의 다른 특징으로 한다.Another feature of the technical configuration is to include a light guide plate fixed to the case to diffuse the light source of the chip-shaped lamp in the surface light source distribution.

이하, 본 고안의 바람직한 실시예를 도면을 참조하여 상세하게 설명하기로 하고, 이들 실시예를 통하여 본 고안의 목적, 특징 및 이점들을 보다 더 잘 이해할 수 있게 된다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings, and through these embodiments, the objects, features, and advantages of the present invention can be better understood.

도 1은 본 고안의 실시예에 따른 건물용 조명장치(100)를 나타내는 단면도이다.1 is a cross-sectional view showing a lighting device 100 for a building according to an embodiment of the present invention.

본 고안의 실시예에 따른 건물용 조명장치(100)는 슬림화 및 컴팩트화를 가 능케 하는 구조로서 도 1에 도시된 바와 같이 케이스(10) 내부에 회로기판(20)을 내장하고, 이 회로기판(20)은 LED나 저항 발광체 등과 같은 칩형 램프(30)를 탑재하며, 칩형 램프(30)의 점광원이 면광원 분포로 확산되도록 케이스(10) 내부에 도광판(50)이 고정되는 구성을 이룬다.Building lighting device 100 according to an embodiment of the present invention is a structure that enables the slim and compact as shown in Figure 1 has a built-in circuit board 20 in the case 10, the circuit board 20 includes a chip type lamp 30 such as an LED or a resistive light emitter, and the light guide plate 50 is fixed inside the case 10 so that the point light source of the chip type lamp 30 is diffused into a surface light source distribution. .

LED나 저항 발광체 등과 같은 칩형 램프(30)는 점광원으로 조도가 약할 수밖에 없으므로 도광의 원리[LGP(Light Guide Principal); 일정한 빛의 광원을 도광판(Light Guide Plate(50); 본 고안에서는 도광판(50)의 구성이 되는 투명 합성수지를 통하여 빛을 원하는 범위만큼 펼치는 원리]에 따라 투명 합성수지로 된 도광판(50)을 통하여 면광원 분포로 자연스럽게 출사될 수 있도록 하고, 이러한 면광원 분포에 의하여 공기의 굴절율인 1에 비해 더 큰 굴절율(예를 들면 1.49)을 갖는 투명 합성수지로 된 도광판(50)에 의하여 출사될 수 있도록 함으로써 조도, 즉 빛의 밝기를 크게 증대시킬 수 있게 된다.The chip type lamp 30 such as an LED or a resistive light emitter has a weak illuminance as a point light source, so the principle of light guiding [LGP (Light Guide Principal); Light guide plate (Light Guide Plate (50); in the present invention is a light guide plate 50) in the present invention through the light guide plate 50 made of a transparent synthetic resin according to the principle of spreading the light to the desired range through the transparent synthetic resin that is composed Illuminance by allowing the light source to be emitted naturally, and by the surface light source distribution to be emitted by the light guide plate 50 made of a transparent synthetic resin having a larger refractive index (for example, 1.49) than the refractive index of air 1 That is, the brightness of the light can be greatly increased.

이때, 본 고안에 따른 건물용 조명장치(100)는 칩형 램프(30)를 제외한 회로기판(20)에 씌워지는 반사판(41)을 더 포함하면서, 케이스(10)의 측면에도 측면 반사판(42)을 더 포함시킬 수 있다.At this time, the building lighting device 100 according to the present invention further includes a reflecting plate 41 to be covered on the circuit board 20 except for the chip-shaped lamp 30, the side reflecting plate 42 also on the side of the case 10. May be further included.

회로기판(20)은 칩형 램프(30)에 안정된 전원을 공급하기 위하여 제공된 것으로 광원을 흡수하는 현상을 반사판(41)으로 방지하면서 역으로 도광판(50) 쪽으로 반사시켜 조도효율을 극대화시킬 수 있도록 하는 것이며, 특히 케이스(10)의 측면에도 측면 반사판(42)을 더 구비시켜 빛의 밝기를 최대한 보장할 수 있도록 하기 위한 것이다.The circuit board 20 is provided to supply a stable power to the chip lamp 30 to prevent the phenomenon of absorbing the light source with the reflecting plate 41 and reversely reflected toward the light guide plate 50 to maximize the illuminance efficiency. In particular, the side of the case 10 is further provided with a side reflector 42 to ensure the brightness of the light to the maximum.

도 2는 본 고안의 다른 실시예에 따른 건물용 조명장치를 나타내는 단면도이다.2 is a cross-sectional view showing a lighting device for a building according to another embodiment of the present invention.

본 고안의 다른 실시예에 따른 건물용 조명장치(100) 역시 슬림화 내지는 컴팩트화를 가능케 하는 구조로서 도 2에 도시된 바와 같이 케이스(10) 내부에 회로기판(20)을 내장하고, 이 회로기판(20)에 칩형 램프(30)들을 연결시키면서 미러 코팅층(MC)으로 칩형 램프(30)를 감쌀 수 있도록 하며, 칩형 램프(30)의 점광원이 면광원 분포로 확산되도록 도광판(50)이 씌워지는 구성으로 이루어진다.The building lighting device 100 according to another embodiment of the present invention also has a structure that enables slimming or compactness, and as shown in FIG. 2, the circuit board 20 is built in the case 10, and the circuit board While connecting the chip-shaped lamps 30 to the mirror-shaped coating layer (MC) to the chip-shaped lamp 30 can be wrapped, the light guide plate 50 is covered so that the point light source of the chip-shaped lamp 30 is diffused to the surface light source distribution Losing consists of

LED나 저항 발광체 등과 같은 칩형 램프(30)는 점광원으로 조도가 약할 수밖에 없으므로 도광의 원리에 따라 아크릴 합성수지판으로 된 도광판(50)을 통하여 면광원 분포로 자연스럽게 출사될 수 있도록 하고, 이러한 면광원 분포에 의하여 공기의 굴절율인 1에 비해 더 큰 굴절율을 갖는 아크릴 합성수지판으로 된 도광판(50)에 의하여 출사될 수 있도록 함으로써 조도, 즉 빛의 밝기를 더욱 크게 증대시킬 수 있게 된다.Since the chip type lamp 30 such as an LED or a resistive light emitter has a weak illuminance as a point light source, it can be naturally emitted as a surface light source distribution through the light guide plate 50 made of an acrylic synthetic resin plate according to the principle of light guiding. By the distribution can be emitted by the light guide plate 50 made of acrylic synthetic resin plate having a larger refractive index than the refractive index of 1, it is possible to increase the illuminance, that is, the brightness of the light even more.

이때, 칩형 램프(30)들을 광섬유(OF)로 연결시켜 칩형 램프(30) 이외의 위치에서도 빛의 효율을 높일 수 있도록 하고, 미러 코팅층(MC; Mirror Coating Layer)으로서 ITO(Indium Tin Oxide)을 적용하여 칩형 램프(30)의 점등시에는 빛을 투과시키는 작용을 하도록 하는 반면 칩형 램프(30)의 소등시에는 벽면 등에 설치되어 반사작용을 하는 거울의 기능을 수행토록 할 수 있다.At this time, by connecting the chip-shaped lamps 30 with an optical fiber (OF) to increase the efficiency of light even at positions other than the chip-shaped lamp 30, ITO (Indium Tin Oxide) as a mirror coating layer (MC) When the chip-shaped lamp 30 is turned on to transmit light, the chip-shaped lamp 30 may be installed on a wall or the like to perform a reflection function.

그리고, 칩형 램프(30)가 위치하는 부분의 도광판(50)의 표면에 볼록부(51) 를 더 제공하여 칩형 램프(30)의 점등시 발생되는 고열에 의한 도광판(50)의 변형을 미연에 방지할 수 있도록 함과 동시에 칩형 램프(30)로부터 제공된 빛을 다굴절(多屈折)시켜 조도효율을 더욱 극대화시킬 수 있도록 할 수 있다.Further, the convex part 51 is further provided on the surface of the light guide plate 50 at the portion where the chip lamp 30 is located, thereby preventing deformation of the light guide plate 50 due to the high heat generated when the chip lamp 30 is turned on. At the same time, the light provided from the chip-shaped lamp 30 can be multi-refractive to maximize the illuminance efficiency.

한편, 칩형 램프(30)는 극소형의 LED, 저항 발광체 또는 텅스텐 발광체 등을 활용하여 제품의 슬림화 및 컴팩트화에 기여할 수 있도록 한다.On the other hand, the chip-shaped lamp 30 can be used to contribute to the slimming and compactness of the product by using a very small LED, a resistive light emitter or a tungsten light emitter.

이상 살펴본 바와 같이 본 고안에 따른 건물용 조명장치(100)는 케이스(10) 내부에 LED나 저항 발광체 등과 같은 칩형 램프(30)를 탑재한 회로기판(20)을 내장하고, 이 칩형 램프(30)의 광원이 면광원 분포로 확산되도록 도광판(50)을 케이스(10) 내부에 고정시켜 칩형 램프(30)의 약한 조도를 도광의 원리로서 면광원 분포로 확산시키면서 출사될 수 있도록 하여 그 밝기를 훨씬 증대시킬 수 있음과 동시에 슬림화 내지는 경단박소화에 크게 기여할 수 있는 탁월한 효과가 있다.As described above, the building lighting device 100 according to the present invention includes a circuit board 20 mounted with a chip type lamp 30 such as an LED or a resistance light emitting body in the case 10, and the chip type lamp 30 The light guide plate 50 is fixed inside the case 10 so that the light source is diffused into the surface light source distribution so that the light intensity of the chip-shaped lamp 30 can be emitted while diffusing the surface light source distribution as the light guide principle. At the same time, there is an excellent effect that can greatly contribute to slimming or slimming.

그리고, 칩형 램프(30)를 제외한 회로기판(20)에 씌워지는 반사판(41)을 포함시키면서 케이스(10)의 측면에 측면 반사판(42)을 더 제공하여 빛의 반사에 의한 조도효율의 극대화를 도모할 수 있는 유용함이 있다.In addition, the side reflector 42 is further provided on the side of the case 10 while including the reflector plate 41 covered by the circuit board 20 except for the chip lamp 30, thereby maximizing illuminance efficiency due to light reflection. There is usefulness to plan.

또한, 칩형 램프(30)들을 광섬유(OF)로 연결시켜 칩형 램프(30) 이외의 위치에서도 빛의 효율을 더욱 극대화시킬 수 있도록 하며, 미러 코팅층(MC)으로서 ITO(Indium Tin Oxide)을 적용하여 칩형 램프(30)의 점등시에는 빛을 투과시키는 작용을 하도록 하는 반면 칩형 램프(30)의 소등시에는 벽면 등에 설치되어 반사작 용을 하는 거울의 기능을 수행토록 할 수 있는 이점이 있다.In addition, by connecting the chip-shaped lamp 30 with an optical fiber (OF) to further maximize the efficiency of the light in a location other than the chip-shaped lamp 30, by applying ITO (Indium Tin Oxide) as a mirror coating layer (MC) When the chip-shaped lamp 30 is turned on to transmit light, while the chip-shaped lamp 30 is turned off, there is an advantage that it can be installed on a wall or the like to perform the function of a mirror to perform a reflective operation.

그리고, 칩형 램프(30)가 위치하는 부분의 도광판(50)의 표면에 볼록부(51)를 더 제공하여 칩형 램프(30)의 점등시 발생되는 고열에 의한 도광판(50)의 변형을 미연에 방지할 수 있도록 함과 동시에 칩형 램프(30)로부터 제공된 빛을 다굴절시켜 조도효율을 극대화시킬 수 있는 유용함이 있다.In addition, the convex part 51 is further provided on the surface of the light guide plate 50 at the portion where the chip lamp 30 is located, thereby preventing deformation of the light guide plate 50 due to the high heat generated when the chip lamp 30 is turned on. At the same time it is possible to prevent the multi-refraction light provided from the chip-shaped lamp 30 is useful to maximize the illuminance efficiency.

이상 본 고안의 목적, 구성 및 작용효과를 통하여 알 수 있듯이 본 고안은 케이스(10) 내부에 LED나 저항 발광체 등과 같은 칩형 램프(30)를 탑재한 회로기판(20)을 내장하고 칩형 램프(30)의 광원이 면광원 분포로 확산되도록 도광판(50)을 케이스(10) 내부에 고정시켜 칩형 램프(30)의 약한 조도를 도광의 원리로서 면광원 분포로 확산시키면서 출사될 수 있도록 하는 것을 가장 큰 핵심구성으로 하고, 기타 변화 가능한 구성들은 다양한 경우의 수로서 이해될 수 있을 것이며, 본 고안에서는 이러한 변화 가능한 경우의 수를 모두 포함하며 실용신안등록청구범위의 해석 또한 이에 준하는 것으로 한다.As can be seen from the object, configuration and effect of the present invention as described above, the present invention incorporates a circuit board 20 equipped with a chip type lamp 30 such as an LED or a resistive light emitting body in the case 10 and the chip type lamp 30 The light guide plate 50 is fixed inside the case 10 so that the light source is diffused into the surface light source distribution so that the light intensity of the chip-shaped lamp 30 can be emitted while diffusing into the surface light source distribution as the principle of light guiding. As the core configuration, other changeable configurations may be understood as the number of various cases, and the present invention includes all the number of such changeable cases, and the interpretation of the utility model registration claims is also equivalent thereto.

Claims (11)

케이스(10)와,With the case 10, 상기 케이스(10)에 내장된 회로기판(20)과,A circuit board 20 embedded in the case 10, 상기 회로기판(20)에 탑재된 칩형 램프(30)와,A chip lamp 30 mounted on the circuit board 20; 상기 케이스(10)에 고정되어 칩형 램프(30)의 광원을 면광원 분포로 확산시키는 도광판(50)을 포함하여 이루어지는 것을 특징으로 하는 건물용 조명장치(100).The lighting device for a building (100), comprising a light guide plate (50) fixed to the case (10) to diffuse the light source of the chip-shaped lamp (30) into a surface light source distribution. 제 1 항에 있어서,The method of claim 1, 상기 칩형 램프(30)를 제외한 상기 회로기판(20)에 씌워지는 반사판(41)을 더 포함하여 이루어지는 것을 특징으로 하는 건물용 조명장치(100).The lighting device 100 for a building, characterized in that it further comprises a reflecting plate (41) to be covered on the circuit board 20 except for the chip-shaped lamp (30). 제 1 항에 있어서,The method of claim 1, 상기 케이스(10)의 측면에 부착된 측면 반사판(42)을 더 포함하여 이루어지는 것을 특징으로 하는 건물용 조명장치(100).Building lighting device (100), characterized in that it further comprises a side reflecting plate (42) attached to the side of the case (10). 제 1 항에 있어서,The method of claim 1, 상기 도광판(50)은 투명 합성수지인 것을 특징으로 하는 건물용 조명장치(100).The light guide plate 50 is a building lighting device, characterized in that the transparent synthetic resin. 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 4, 상기 칩형 램프(30)는 LED 또는 저항 발광체인 것을 특징으로 하는 건물용 조명장치(100).The chip-shaped lamp 30 is a lighting device for a building, characterized in that the LED or resistance light emitter. 케이스(10)와,With the case 10, 상기 케이스(10)에 내장된 회로기판(20)과,A circuit board 20 embedded in the case 10, 상기 회로기판(20)에 연결된 칩형 램프(30)들과,Chip lamps 30 connected to the circuit board 20, 상기 칩형 램프(30)들을 수용하는 미러 코팅층(MC)과,A mirror coating layer MC accommodating the chipped lamps 30; 상기 케이스(10)에 고정되어 칩형 램프(30)의 광원을 면광원 분포로 확산시키는 도광판(50)을 포함하여 이루어지는 것을 특징으로 하는 건물용 조명장치(100).The lighting device for a building (100), comprising a light guide plate (50) fixed to the case (10) to diffuse the light source of the chip-shaped lamp (30) into a surface light source distribution. 제 6 항에 있어서,The method of claim 6, 상기 칩형 램프(30)들은 광섬유(OF)로 연결되는 것을 특징으로 하는 건물용 조명장치(100).The chip lamp 30 is a lighting device for a building, characterized in that connected to the optical fiber (OF). 제 6 항에 있어서,The method of claim 6, 상기 미러 코팅층(MC) ITO(Indium Tin Oxide)로 이루어진 것을 특징으로 하는 건물용 조명장치(100).The mirror coating layer (MC) building lighting device 100, characterized in that made of indium tin oxide (ITO). 제 6 항에 있어서,The method of claim 6, 상기 도광판(50)은 아크릴 합성수지판인 것을 특징으로 하는 건물용 조명장치(100).The light guide plate 50 is a building lighting device, characterized in that the acrylic synthetic resin plate. 제 6 항 또는 제 9 항에 있어서,The method according to claim 6 or 9, 상기 칩형 램프(30)가 위치하는 부분의 상기 도광판(50)의 표면에 돌출된 볼록부(51)를 더 포함하는 것을 특징으로 하는 건물용 조명장치(100).Building lighting device (100), characterized in that it further comprises a convex portion (51) protruding on the surface of the light guide plate (50) of the portion where the chip-shaped lamp (30) is located. 제 6 항에 있어서,The method of claim 6, 상기 칩형 램프(30)는 LED, 저항 발광체 또는 텅스텐 발광체 중에서 선택되는 어느 하나인 것을 특징으로 하는 건물용 조명장치(100).The chip lamp 30 is a building lighting device, characterized in that any one selected from LED, resistive light emitter or tungsten light emitter.
KR2020050032848U 2005-11-21 2005-11-21 Lighting apparatus for building KR200408148Y1 (en)

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